JPS57200550A - Plating method - Google Patents
Plating methodInfo
- Publication number
- JPS57200550A JPS57200550A JP8737281A JP8737281A JPS57200550A JP S57200550 A JPS57200550 A JP S57200550A JP 8737281 A JP8737281 A JP 8737281A JP 8737281 A JP8737281 A JP 8737281A JP S57200550 A JPS57200550 A JP S57200550A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- electroless plating
- liquid
- plating method
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To raise a precipitating speed, in an electroless plating method, by supplying current into a plating liquid.
CONSTITUTION: At least two electrodes are separately thrown into an electroless plating liquid and current is supplied between these electrodes to carry out electroless plating. By chemical plating under current supply as described above, a precipitating speed is raised remarkably. The reason of this phenomenon is not made sure but it is considered that H or a H2 gas generated from the electrodes promotes reduction of a metal ion and excitation of the liquid is generated by electric energy.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8737281A JPS57200550A (en) | 1981-06-05 | 1981-06-05 | Plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8737281A JPS57200550A (en) | 1981-06-05 | 1981-06-05 | Plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57200550A true JPS57200550A (en) | 1982-12-08 |
Family
ID=13913058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8737281A Pending JPS57200550A (en) | 1981-06-05 | 1981-06-05 | Plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57200550A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4592808A (en) * | 1983-09-30 | 1986-06-03 | The Boeing Company | Method for plating conductive plastics |
JPH03207885A (en) * | 1989-10-30 | 1991-09-11 | Sky Alum Co Ltd | Production of zinc type plated aluminum sheet |
JPH04110471U (en) * | 1991-03-14 | 1992-09-25 | 重孝 柏木 | Decorative body for pseudo hook |
KR100454634B1 (en) * | 2001-11-06 | 2004-11-05 | 재단법인서울대학교산학협력재단 | Fabricating method of Copper film |
JP2019183179A (en) * | 2018-03-31 | 2019-10-24 | 名古屋メッキ工業株式会社 | Copper plating method of fiber |
US10508351B2 (en) * | 2017-03-16 | 2019-12-17 | Lam Research Corporation | Layer-by-layer deposition using hydrogen |
-
1981
- 1981-06-05 JP JP8737281A patent/JPS57200550A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4592808A (en) * | 1983-09-30 | 1986-06-03 | The Boeing Company | Method for plating conductive plastics |
JPH03207885A (en) * | 1989-10-30 | 1991-09-11 | Sky Alum Co Ltd | Production of zinc type plated aluminum sheet |
JPH04110471U (en) * | 1991-03-14 | 1992-09-25 | 重孝 柏木 | Decorative body for pseudo hook |
KR100454634B1 (en) * | 2001-11-06 | 2004-11-05 | 재단법인서울대학교산학협력재단 | Fabricating method of Copper film |
US10508351B2 (en) * | 2017-03-16 | 2019-12-17 | Lam Research Corporation | Layer-by-layer deposition using hydrogen |
JP2019183179A (en) * | 2018-03-31 | 2019-10-24 | 名古屋メッキ工業株式会社 | Copper plating method of fiber |
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