JPS55161096A - Continuous electroplating method - Google Patents

Abstract

PURPOSE:To improve the quality of plated layer and to increase the efficiency of the plating, by increasing more and more the interval between the anode and the material to be plated at places from the central part to the end part of the plating vessel, and by returning the plating soln. flowing out of the lower end of the anode chamber after it is separated from suspensoid. CONSTITUTION:A portion of plating soln. is exhausted from discharge apertures 11, 11' at the lower end of an anodic chamber 6 to a solid-liquid separator 12, where it is separated from suspensoid so as to be clarified, then it is circulated through a liquid storage tank 8 to a cathodic chamber 7. The overflow soln. having flowed out through overflow apertures 10, 10' is circulated to the tank 8 without passing through the separator 12. The anodes 2 connected to positive power source inclines downward from the center of the plating vessel 3 to the ends of the vessel, hence the electric resistance between the electrodes is greater at the ends than at the central part of the vessel 3. However, because the electric resistance of the material to be plated becomes greater at places nearer to the central part, both resistance are counterbalanced and the current density is made uniform over whole surface of the material to be plated. The uniform current density, the cleanness, and suitable flow of the plating soln. make possible high quality plating at a high efficiency.