JPH04346698A - Plating device - Google Patents

Abstract

PURPOSE:To prevent contamination with a plating liquid and to facilitate concn. management by separating anode plates and a cathode plate by a membrane and filtering the plating liquid on the separated anode side, thereby removing the undissolved matter generated from the anode plates at all times. CONSTITUTION:The anode plates 3 and cathode plate A installed in a plating cell 1 are separated by the membrane 7. The anode plates 3 dissolve to maintain the specified concn. of the metal in the plating liquid 2 when a current flows from the anode plates 3 to the cathode plate 4. Since the undissolved matter of the anode plates 3 is formed in the plating liquid 2 on the anode 3 side, this plating liquid 2 is filtered with a filter 5 to remove the undissolved matter. This liquid is then returned into the plating liquid 2 on the cathode plate 4 side.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus, and more particularly to a plating apparatus that performs electrolytic plating.

0002

[Prior art] The structure of the plating tank of the conventional plating equipment is as follows:
As shown in FIG. 2, when a cathode plate 4 as an object to be plated is plated in a plating bath 1, a current flows from an anode plate 3 to a cathode plate 4. At this time, the anode plate 3 is dissolved to maintain the metal concentration in the plating solution 2, and the insoluble matter generated from the anode plate 3 is prevented from flowing into the plating solution 2 on the cathode plate 4 side by the anode bag 6. It had a structure. Also, plating solution 2
The plating solution 2 on the cathode plate 4 side is purified by the filter 5A.
was being circulated.

0003

[Problems to be Solved by the Invention] In the structure of this conventional plating tank, insoluble matter from the anode plate 3 accumulates in the anode bag 6 surrounding the anode plate 3. This had the disadvantage that the anode bag 6 enclosing the plate 3 was clogged with undissolved matter from the anode plate 3. As a result, the following problems occurred.

First, in order to replace the clogged anode bag 6, it is necessary to stop the plating apparatus, which requires a long time until the plating operation can be restarted.

Second, since the proportion of metal ions eluted from the anode plate 3, which should be a source of supply of metal ions into the plating solution, accumulates in the anode bag 6, it is necessary to maintain an appropriate concentration of metal ions in the plating solution. In order to maintain this value, it was necessary to replenish the plating solution from outside.

Third, the voltage between the anode and the cathode becomes high (overvoltage), and as a result, insoluble matter increases in the anode bag 6 and overflows from the anode bag 6 into the plating solution 2. There were cases of contamination of 2. Therefore, purification of the plating solution is required, which requires a large number of man-hours.

[0007] The above-mentioned problem occurred due to a structural defect in that the inside of the anode bag 6 could not be purified or filtered because the anode bag 6 was used.

[0008]

[Means for Solving the Problems] The plating apparatus of the present invention includes:
A plating tank filled with a plating solution, an anode plate and a cathode plate installed in the plating tank, a diaphragm separating the anode plate and the cathode plate, and a plating solution on the anode plate side separated by the diaphragm. and a filter for filtering.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a schematic cross-sectional view of one embodiment of the present invention.

In FIG. 1, the plating apparatus includes a plating tank 5 filled with a plating solution, an anode plate 3 and a cathode plate 4 installed in the plating tank 5, and a diaphragm 7 separating the anode plate 3 and the cathode plate 4. and a filter 5 that filters the plating solution on the anode plate side.

When plating the cathode plate 4, which is the object to be plated, a current flows from the anode plate 3 to the cathode plate 4. At this time, the anode plate 3 is dissolved to keep the metal concentration in the plating solution 2 constant, but undissolved matter of the anode plate 3 is generated in the plating solution 2 on the anode plate 3 side. Insoluble matter in the plating solution on the anode plate 3 side is filtered by a filter 5 and returned to the plating solution 2 on the cathode plate 4 side.

As described above, in this embodiment, the anode plate 3 and the cathode plate 4 are partitioned by the diaphragm 7 to divide the tank into two, and the plating solution 2 on the anode plate 3 side is filtered. Since the insoluble matter generated from the anode plate 3 is constantly removed and the filtrate flows from the cathode plate 4 side to the anode plate 3 side, the insoluble matter generated from the anode plate 3 flows back into the plating solution 2 on the cathode plate 4 side. This can be prevented.

[0013]

Effects of the Invention As explained above, the present invention separates the anode plate side and the cathode plate side into tanks with a diaphragm, and constantly filters the plating solution on the anode plate side, thereby eliminating insoluble matter generated from the anode plate. Since metal ions dissolved from the anode plate can be removed at all times, the metal ions dissolved from the anode plate can be mixed efficiently, so that the amount of plating solution replenishment can be reduced when managing the plating solution concentration. Furthermore, not only is there no contamination of the plating bath by undissolved matter on the anode plate, but there is also no need to replace the anode bag, which was previously necessary. Furthermore, it has the effect of reducing the time required for purifying the plating solution.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view of one embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of a conventional plating apparatus.

[Explanation of symbols]

1 Plating tank 2 Plating solution 3 Anode plate 4 Cathode plate 5,5A filter machine 6 Anode bag 7 Diaphragm

Claims (1)

[Claims] 1. A plating tank filled with a plating solution, an anode plate and a cathode plate installed in the plating tank, a diaphragm separating the anode plate and the cathode plate, and the anode plate separated by the diaphragm. A plating device comprising a filter for filtering a plating solution on the side.