CN101550582A - Electroplating device and electroplating method - Google Patents
Electroplating device and electroplating method Download PDFInfo
- Publication number
- CN101550582A CN101550582A CNA2009101272163A CN200910127216A CN101550582A CN 101550582 A CN101550582 A CN 101550582A CN A2009101272163 A CNA2009101272163 A CN A2009101272163A CN 200910127216 A CN200910127216 A CN 200910127216A CN 101550582 A CN101550582 A CN 101550582A
- Authority
- CN
- China
- Prior art keywords
- electroplate
- electroplating
- mentioned
- pair
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to an electroplating device and electroplating method, even though the simultaneous electroplating areas on the inner and outer surfaces of an electroplated panel of tellite or the like are different, a nominal pattern for adjusting the electroplating thickness is not formed on the electroplating panel and the undercurrent required by the electroplating treatment is eliminated and the electroplating film of the required film thickness is simply obtained and the cost is reduced. Electroplating films are respectively formed on the inner and outer surfaces of the electroplated panel and respectively opposite and paralleled to a pair of anode plates (6,6) connected with the power supply anode and dipped in the electroplating liquid (2) and between the anode plates (6,6) and a pair of electroplated panels (4,4) respectively connected with the power supply cathode are dipped in the electroplating liquid (2) in way that the inner surfaces of the electroplated panels (4,4) face with each other and a clearance is set between the two electroplated panels, and an auxiliary anode plate (7) connected with the anode of the power supply is dipped in the electroplating liquid between the electroplated panels (4,4) to perform the electroplating treatment.
Description
Technical field
The present invention relates to electroplanting device and electro-plating method, in particular, the present invention relates to simultaneously to printed base plate etc. by the interior outside of electroplate, carry out the electroplanting device and the electro-plating method of part metallide respectively.
Background technology
In the past, be to carry out on the printed base plate occasion of parcel plating, have metalliding and non-electrolytic plating method substantially.
The advantage of non-electrolytic plating method is: a plurality of substrates can be installed on side by side and handle on the same plating frame (electroplating clamp), even electroplate under the different situation of area the outside in being, still separate out the electronplate of uniform thickness.In contrast, compare with metalliding, speed of separating out is slow, is not suitable for separating out than heavy back.In addition, require tighter liquid management.In addition, compare, have, can't be used to be applied with the shortcoming of the substrate of stress in bending because of bad mechanical strength with metallide.
On the other hand, be favourable aspect metalliding is fast at speed of separating out, physical strength is good, to be used widely thus, this metalliding is also adopted in plating of the present invention.As the prior art relevant with this metalliding, people know have such as, patent documentation 1, patent documentation 2 etc.
Patent documentation 1: TOHKEMY 2005-68481 document
Patent documentation 2: Japanese kokai publication hei 3-173494 document
Summary of the invention
But, though it is fast that above-mentioned metalliding has speed of separating out, the advantage that physical strength is good, but, be to carry out the occasion of parcel plating respectively simultaneously on the interior outside of printed base plate, such as, employing is arranged one group of frame and is electroplated at the frame shown in the above-mentioned patent documentation 1 between electrode of opposite.In the method, have and to arrange the problem of productivity difference according to the mode that a plurality of substrates are overlapped.
In addition, in metalliding, electroplate the different occasion of area, at the face of electroplating the less side of area, current concentration in interior outside.Thus, shown in above-mentioned patent documentation 2, on substrate, form the dummy pattern of parcel plating thickness adjustment usefulness, must make in interior outside and electroplate the area unanimity, but, owing to electronplate is separated out, so, have the big shortcoming of waste aspect cost particularly in the occasion of the precious metal of electrogilding etc. at the position of not wanting.
So, produced the following technical task that should solve, even promptly at the galvanized area that the interior outside by electroplate of tellite etc. is carried out simultaneously than under the different situation in interior outside, on by electroplate, do not form electroplating thickness adjustment dummy pattern, and the necessary undercurrent of elimination electroplating processes, obtain the plating of required film thickness simply, the objective of the invention is to solve this problem.
The present invention proposes to achieve these goals, and technical scheme 1 described invention provides a kind of electroplanting device, and it forms electroplating film respectively on by the interior outside of electroplate, and this device comprises the plating tank that can hold electroplate liquid; A pair of positive plate, it is connected with power anode respectively, and between have the gap, face abreast, the dipping and be arranged in the above-mentioned electroplate liquid; Dipping and be arranged at electroplating clamp between the interior above-mentioned a pair of positive plate of above-mentioned electroplate liquid in the face of ground, this electroplating clamp comprises holding member, this holding member is a pair ofly faced between the inner face of electroplate according to making respectively, and between the gap is set mode releasably keep this to by electroplate; With the above-mentioned energising mechanism that is connected with power cathode by electroplate; The supplementary anode plate, it is connected with power anode, and above-mentioned a pair ofly be provided with in the face of ground between by electroplate.
According to this scheme, if with such as, the larger side that carries out galvanized area is the outside, and above-mentionedly be connected with power cathode respectively by electroplate with a pair of, it is arranged on the holding member, then and this in by the gap between the electroplate, the supplementary anode plate that is connected with power cathode is set.In addition,, between a pair of positive plate of holding member in plating tank, impregnated in the electroplate liquid, then can carry out metallide and handle if at this state.In this electroplating processes, electric current by circulation between each is by electroplate, via through hole circulation to the electric current of opposing face (inner face) etc. and the electric current of supplying with from the supplementary anode plate, can two side by side, even and electroplating under the different situation of area, still do not form the dummy pattern of parcel plating thickness adjustment usefulness, on relative opposing face (inner face), carry out the plating of basic identical thickness respectively with exterior side.
According to this scheme, the larger side of the area by will forming electroplating film is installed toward the outer side, the inboard by the face between the electroplate (inner face) on, compare with the outside (outside), do not produce concentrating of electric current, do not form the dummy pattern of parcel plating thickness adjustment usefulness, also side by side carry out electroplating processes than little face and the outside (outside) electroplating area.
According to this scheme, when the area ratio that has inside and outside electroplating film changes, can be by only taking off the supplementary anode plate, the mode of being replaced by best plate is tackled.
It is a kind of on by the interior outside of electroplate that technical scheme 4 described inventions provide, form the electro-plating method of electroplating film respectively, in the method, the a pair of positive plate that is connected with power anode is respectively faced in parallel to each other, impregnated in the electroplate liquid, and between this antianode plate, with a pair of above-mentionedly being faced between the inner face of electroplate according to this of being connected with power cathode respectively by electroplate, and the mode that the gap is set betwixt impregnated in the electroplate liquid, and this in this electroplate liquid is between by electroplate, dipping and the supplementary anode plate be connected with power anode is set carries out electroplating processes.
According to this method, electric current by circulation between each is by electroplate, via through hole circulation to the electric current of opposing face (inner face) etc. and the electric current of supplying with from the supplementary anode plate, can two side by side, even electroplating under the different situation of area, still do not form the dummy pattern of parcel plating thickness adjustment usefulness, on relative opposing face (inner face), carry out the plating of basic identical thickness respectively with exterior side.
According to this method, the larger side of the area by will forming electroplating film toward the outer side, install, the inboard by the face between the electroplate (inner face) on, compare with the outside (outside), do not produce concentrating of electric current, do not form the dummy pattern of parcel plating thickness adjustment usefulness, also, side by side carry out electroplating processes with the outside (outside) to electroplating area than little face.
In technical scheme 1 described invention, even because can be simultaneously two and electroplating under the different situation of area, do not form parcel plating thickness adjustment dummy pattern yet, respectively on relative opposing face (inner face), carry out the plating with the essentially identical thickness of exterior side, so productivity improves.In addition, owing to can not form the dummy pattern of parcel plating thickness adjustment usefulness, handling, so there is not galvanized waste, also is favourable aspect cost.
In technical scheme 2 described inventions, the inboard by the face between the electroplate (inner face) on, compare with the outside (outside), not concentrating of electric current produces, do not form the dummy pattern of parcel plating thickness adjustment usefulness, can side by side also carry out electroplating processes than little face with the outside (outside), thus electroplating area, the effect of the scheme that not only possesses skills 1 described invention, and can seek reducing of productive raising and cost.
In technical scheme 3 described inventions, because when the area of the electroplating film of outside is than change in having, can carry out correspondence by only the supplementary anode plate being replaced by optimal plate, so the effect of not only possess skills scheme 1 or 2 described inventions also can be guaranteed versatility.
In technical scheme 4 described inventions, even with can two whiles and electroplating under the different situation of area, do not form the mode of the dummy pattern of parcel plating thickness adjustment usefulness yet, respectively on relative opposing face (inner face), carry out plating with the essentially identical thickness of exterior side, like this, productivity improves.In addition, do not handle with dummy pattern owing to can forming the adjustment of parcel plating thickness, so there is not galvanized waste, the cost aspect also is favourable.
In technical scheme 5 described inventions, the inboard by the face between the electroplate (inner face) on, to compare with the outside (outside), not concentrating of electric current produces, do not form the mode of the dummy pattern of parcel plating thickness adjustment usefulness, can side by side also carry out electroplating processes than little face with the outside (outside), like this electroplating area, the effect of the scheme that not only possesses skills 4 described inventions, and can seek the reduction of productive raising and cost.
Description of drawings
Fig. 1 is the simplified side view of the electroplanting device represented as one embodiment of the present of invention;
Fig. 2 is the simplification front view of the holding member that above-mentioned electroplanting device adopted.
Embodiment
In order to realize following purpose, even that is: at the galvanized area that printed base plate etc. is carried out on by the interior outside of electroplate simultaneously than under the different situation in interior outside, on by electroplate, do not form electroplating thickness adjustment dummy pattern, and eliminate the necessary undercurrent of electroplating processes, obtain required film thickness simply and electroplate.Realize that by following manner it relates to a kind of electroplanting device that forms electroplating film respectively on by the interior outside of electroplate, this device comprises the plating tank that can hold electroplate liquid; A pair of positive plate, it is connected with power anode respectively, and between have the gap, abreast in the face of ground dipping and be arranged in the above-mentioned electroplate liquid; Dipping and be arranged at electroplating clamp between the interior above-mentioned a pair of positive plate of above-mentioned electroplate liquid in the face of ground, this electroplating clamp comprises holding member, this holding member is a pair ofly faced between the inner face of electroplate according to making respectively, and between the gap is set mode releasably keep this to by electroplate; With the above-mentioned energising mechanism that is connected with power cathode by electroplate; The supplementary anode plate, it is connected with power anode, above-mentioned a pair of by electroplate between, in the face of ground is provided with.
Embodiment
With preferred embodiment, electroplanting device of the present invention and electro-plating method are described below.Fig. 1 is for representing the side-view of an embodiment of electroplanting device of the present invention and electro-plating method in a schematic way.
In the drawings, electroplanting device 1 comprises the plating tank 3 that holds electroplate liquid 2; Keep a pair of by the holding member 5 of electroplate 4,4; A pair of positive plate 6,6, it is respectively with parallel and be provided with in the face of ground by electroplate 4,4; Supplementary anode plate 7, its above-mentioned a pair of by the gap between the electroplate 4,4 in, with above-mentioned a pair of parallel and be provided with in the face of ground by electroplate 4,4; Power supplier 8, it is used for current supply positive plate 6,6 and supplementary anode plate 7.
In addition, present embodiment is printed base plate by electroplate 4,4.In addition, this material by electroplate 4 is not particularly limited, and the various metals formation of nickel, iron, aluminium, titanium, copper or their alloy etc. can be passed through in outside in it.In addition, be not limited to printed base plate, also can be used for forming the occasion of common Metal plating film by electroplate 4.
Above-mentioned holding member 5 is according to impregnated in the inside of the electroplate liquid 2 of plating tank 3 with the essentially identical height of the liquid level of this electroplate liquid 2, shown in the image pattern 2 like that, have and electroplated retainer 9.This is electroplated the isolator of retainer 9 by plastics etc. and is formed, and it is tabular that integral body is, and in the centre, the peristome 10 of bigger quadrangle form is set, and forms as support body.On the top of retainer 9, the energized components (mechanism of switching on) 11 be connected with the power cathode of power supplier 8 is set, on two faces, according to about and the mode left respectively up and down, 4 base board fastener pins 12,12,12,12 are installed respectively.This each base board fastener pin (12,12,12,12), (12,12,12,12) are connected with the power cathode of power supplier 8 via energized components 11.
In addition, form following scheme, wherein, be arranged at above-mentioned 4 the base board fastener pins (12 on each face of being electroplated retainer 9 respectively, 12,12,12), (12,12,12,12) releasably keep respectively by electroplate 4, by these base board fastener pins (12,12,12,12), (12,12,12,12) respectively being electroplated on the two sides of retainer 9, install by electroplate 4,4, can be simultaneously to this to being electroplated by electroplate 4,4.
In addition, above-mentioned electroplated retainer 9 about in the middle of, be installed on a pair of on these two faces being electroplated retainer 9 by the gap between the electroplate 4,4 in, install and this above-mentioned supplementary anode plate 7 that is provided with being faced according to certain interval abreast by electroplate 4,4.This supplementary anode plate 7 is installed on this in mode removably and is electroplated on the retainer 9, can exchange.In addition, on the top of this supplementary anode plate 7, the energized components (energising mechanism) 13 that is connected with the power anode of power supplier 8 is set.
What above-mentioned a pair of positive plate 6 and holding member 5 kept is arranged at the inside of plating tank 3 abreast by each of electroplate 4,4 according to certain interval.On the top of this positive plate 6, the energized components (energising mechanism) 14 that is connected with the power anode of power supplier 8 is set.
Following mask body describes an example of the electro-plating method that adopts the electroplanting device that is formed by such scheme.At first, before electroplating processes, the outside at plating tank 3, be arranged at the interior exterior side of being electroplated retainer 9 with a pair of respectively by electroplate 4,4, adopt base board fastener pin 12 in addition, 12..., electroplated on the retainer 9 at this, this is to removably being fixed according to the mode of facing according to a determining deviation in parallel to each other by electroplate 4,4.In this occasion, be the outside according to the larger side that carries out galvanized area, smaller side is installed for the mode of inboard stands facing each other respectively.In addition, electroplated on the retainer 9 if be installed on by electroplate 4,4, then supplementary anode plate 7 according to by the gap between the electroplate 4,4 in, and relatively should be by electroplate 4,4 determining deviations and the right mode of parallel surface is provided with at interval.In addition, for this supplementary anode plate 7, corresponding to by the value of carrying out galvanized area and the position of electroplate 4,4, be replaced by area or the height location that electrode exposes face 7a and install, use for the plate of the best.
Then, like this, electroplated on the retainer 9, is installing a pair ofly by electroplate 4,4, holding member 5 impregnated in the electroplate liquid 2 in the plating tank 3, be arranged between a pair of positive plate 6,6, respectively in the face of this is set to by electroplate 4,4 and this positive plate 6,6.In addition, if at this state, by positive plate 6,6, supplementary anode plate 7 and energized components 11 flow through electric current, then begin electroplating processes from power supplier 8.
Thus, can by a pair of by electroplate 4,4 between the electric current of circulation, via not shown through hole, a pair of by the mutual relative inner face of electroplate 4,4 on the electric current supplied with of electric current etc. and the supplementary anode plate 7 of circulation, on by each inner face of electroplate 4,4, electroplating film is set at this.
So, in the past,, can only be handled by electroplate, but carry out galvanized occasion at the electroplanting device that adopts present embodiment to 1 by 1 holding member, owing to can handle 2 simultaneously, so productivity also is 2 times substantially.
In addition, be provided with each by the larger side of the area of the electroplating film of electroplate 4,4 as the outside, be installed on the holding member 5, thus, constitute inboard by electroplate 4, on the face between 4 (inner face), compare, do not produce concentrating of electric current with outer side, so, do not form the dummy pattern of parcel plating thickness adjustment usefulness etc., also can simultaneously area be handled than little face, like this, also not separating out plated material at unwanted position, is favourable for the cost aspect.
Also have,, also can guarantee versatility even under the situation of the area that inside and outside electroplating film is set, can only supplementary anode plate 7 be replaced by best plate than change.
Have, only otherwise break away from spirit of the present invention, the present invention can carry out various changes again, and in addition, the present invention relates to the scheme of this change certainly.
Claims (5)
1. electroplanting device, it forms electroplating film respectively on by the interior outside of electroplate, it is characterized in that this device comprises:
The plating tank that can hold electroplate liquid; A pair of positive plate, it is connected with power anode respectively, and between have the gap, face abreast, the dipping and be arranged in the above-mentioned electroplate liquid; Dipping and be arranged at electroplating clamp between the interior above-mentioned a pair of positive plate of above-mentioned electroplate liquid in the face of ground, this electroplating clamp comprises holding member, this holding member is according to making this a pair ofly be faced between the inner face of electroplate respectively, and between the gap is set mode releasably keep this to by electroplate; With the above-mentioned energising mechanism that is connected with power cathode by electroplate; The supplementary anode plate, it is connected with power anode, and above-mentioned a pair ofly be provided with in the face of ground between by electroplate.
2. electroplanting device according to claim 1 is characterized in that the larger side with the area that forms above-mentioned electroplating film is an exterior side, is inner face side with the smaller side of area, is installed on the above-mentioned holding member by electroplate above-mentioned.
3. electroplanting device according to claim 1 and 2 is characterized in that above-mentioned supplementary anode plate is installed on the above-mentioned holding member in mode removably.
4. electro-plating method that forms electroplating film on by the interior outside of electroplate respectively is characterized in that:
The a pair of positive plate that is connected with power anode is respectively faced in parallel to each other, impregnated in the electroplate liquid, and between this antianode plate, with a pair of above-mentionedly being faced between the inner face of electroplate according to this of being connected with power cathode respectively by electroplate, and the mode that the gap is set betwixt impregnated in the electroplate liquid, and this in this electroplate liquid be between by electroplate, and dipping and the supplementary anode plate that is connected with power anode is set carries out electroplating processes.
5. electro-plating method according to claim 4 is characterized in that the larger side with the area that forms above-mentioned electroplating film is an exterior side, is inner face side with the smaller side of area, and this to being faced by electroplate, is carried out electroplating processes.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008096534A JP2009249659A (en) | 2008-04-02 | 2008-04-02 | Electroplating device and electroplating method |
| JP2008096534 | 2008-04-02 | ||
| JP2008-096534 | 2008-04-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101550582A true CN101550582A (en) | 2009-10-07 |
| CN101550582B CN101550582B (en) | 2012-07-18 |
Family
ID=41155063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101272163A Expired - Fee Related CN101550582B (en) | 2008-04-02 | 2009-03-09 | Electroplating device and electroplating method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2009249659A (en) |
| CN (1) | CN101550582B (en) |
| HK (1) | HK1132307A1 (en) |
| TW (1) | TWI381070B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337577A (en) * | 2010-07-22 | 2012-02-01 | 富葵精密组件(深圳)有限公司 | Electroplating device |
| CN102373497A (en) * | 2010-08-16 | 2012-03-14 | 富葵精密组件(深圳)有限公司 | Electroplating apparatus and electroplating method thereof |
| CN105297096A (en) * | 2015-11-30 | 2016-02-03 | 中国华能集团公司 | Electroplating device and electroplating method for electrodepositing different platings on double sides |
| CN105297121A (en) * | 2015-10-21 | 2016-02-03 | 胜宏科技（惠州）股份有限公司 | Electrocoppering bath titanium basket maintenance method |
| CN107513741A (en) * | 2017-09-07 | 2017-12-26 | 延康汽车零部件如皋有限公司 | A kind of electro-plating method for improving machining long workpieces copper coating uniformity |
| CN112701072A (en) * | 2021-03-25 | 2021-04-23 | 西安奕斯伟硅片技术有限公司 | Wafer processing apparatus and wafer defect evaluation method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5366787B2 (en) * | 2009-12-18 | 2013-12-11 | 株式会社中央製作所 | Continuous vertical transfer plating equipment |
| US10262960B2 (en) * | 2015-04-06 | 2019-04-16 | Mitsubishi Electric Corporation | Semiconductor element having a warped surface and production method thereof |
| CN116419991B (en) * | 2021-06-01 | 2024-03-01 | 株式会社荏原制作所 | Plating apparatus and plating method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4490230A (en) * | 1983-03-10 | 1984-12-25 | At&T Technologies, Inc. | Electroplating apparatus |
| JPS63293193A (en) * | 1987-05-26 | 1988-11-30 | Matsushita Electric Works Ltd | Electroplating |
| JPH06116799A (en) * | 1992-10-01 | 1994-04-26 | Hitachi Chem Co Ltd | Electroplating method |
| JP3062911B2 (en) * | 1994-03-14 | 2000-07-12 | 富士通株式会社 | Plating equipment |
| JP3352081B2 (en) * | 2001-02-01 | 2002-12-03 | 株式会社アスカエンジニアリング | Printed circuit board copper plating equipment |
| CN2466167Y (en) * | 2001-02-09 | 2001-12-19 | 吴德兴 | Rim electroplating device |
| DE10342512B3 (en) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region |
| CN2732766Y (en) * | 2004-05-12 | 2005-10-12 | 重庆渝安创新科技(集团)有限公司 | Durionising device capable of saving electric energy and equipment accessory |
| JP4711805B2 (en) * | 2005-11-08 | 2011-06-29 | 上村工業株式会社 | Plating tank |
| US8177945B2 (en) * | 2007-01-26 | 2012-05-15 | International Business Machines Corporation | Multi-anode system for uniform plating of alloys |
-
2008
- 2008-04-02 JP JP2008096534A patent/JP2009249659A/en active Pending
-
2009
- 2009-01-15 TW TW98101303A patent/TWI381070B/en not_active IP Right Cessation
- 2009-03-09 CN CN2009101272163A patent/CN101550582B/en not_active Expired - Fee Related
- 2009-11-13 HK HK09110651.0A patent/HK1132307A1/en not_active IP Right Cessation
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337577A (en) * | 2010-07-22 | 2012-02-01 | 富葵精密组件(深圳)有限公司 | Electroplating device |
| CN102337577B (en) * | 2010-07-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Electroplating device |
| CN102373497A (en) * | 2010-08-16 | 2012-03-14 | 富葵精密组件(深圳)有限公司 | Electroplating apparatus and electroplating method thereof |
| CN102373497B (en) * | 2010-08-16 | 2014-05-21 | 富葵精密组件(深圳)有限公司 | Electroplating apparatus and electroplating method thereof |
| CN105297121A (en) * | 2015-10-21 | 2016-02-03 | 胜宏科技（惠州）股份有限公司 | Electrocoppering bath titanium basket maintenance method |
| CN105297096A (en) * | 2015-11-30 | 2016-02-03 | 中国华能集团公司 | Electroplating device and electroplating method for electrodepositing different platings on double sides |
| CN105297096B (en) * | 2015-11-30 | 2017-12-19 | 中国华能集团公司 | A kind of electroplanting device and electro-plating method of two-sided electro-deposition xenogenesis coating |
| CN107513741A (en) * | 2017-09-07 | 2017-12-26 | 延康汽车零部件如皋有限公司 | A kind of electro-plating method for improving machining long workpieces copper coating uniformity |
| CN112701072A (en) * | 2021-03-25 | 2021-04-23 | 西安奕斯伟硅片技术有限公司 | Wafer processing apparatus and wafer defect evaluation method |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1132307A1 (en) | 2010-02-19 |
| TW200942648A (en) | 2009-10-16 |
| JP2009249659A (en) | 2009-10-29 |
| CN101550582B (en) | 2012-07-18 |
| TWI381070B (en) | 2013-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101550582B (en) | Electroplating device and electroplating method | |
| KR900005082B1 (en) | Process for producing copper-clad laminate | |
| US20100006445A1 (en) | Electroplating method and apparatus | |
| EP2544282A1 (en) | Surface treatment method for copper foil, surface treated copper foil and copper foil for negative electrode collector of lithium ion secondary battery | |
| KR101569185B1 (en) | An insoluble anode and apparatus for producing electrolytic copperfoil having the same | |
| US20060151328A1 (en) | Method of electroplating a workpiece having high-aspect ratio holes | |
| JP2006249450A (en) | Plating method and plating device | |
| CN102732938A (en) | Electroplating device for dynamically adjusting anode power-supply area and method thereof | |
| JP2614359B2 (en) | Electroplating tank anode | |
| CN112331566A (en) | Manufacturing equipment and manufacturing method for surface roughness of lead frame | |
| JP2004190128A (en) | Partial plating method and its apparatus | |
| CN1455027A (en) | Combined-box plating apparatus of crystallizer copper plate for continuous caster | |
| CN207861311U (en) | A kind of feeding line positioning wheel construction | |
| CN213266769U (en) | Anode structure applied to electroplating of alkaline zinc-nickel alloy | |
| CN220265895U (en) | Sheet metal belt pulley transmission clamping processing tool | |
| CN117265623A (en) | Cylinder inner hole slotless electroplating device | |
| CN214937878U (en) | Ultrathin film electroplating device | |
| CN220952132U (en) | Water electroplating equipment | |
| CN218372603U (en) | Insoluble material anode plate | |
| CN220433041U (en) | Double-sided electroplating auxiliary device and electroplating system | |
| CN215593229U (en) | Electroplating conductive clamp | |
| CN214327940U (en) | Continuous local tinning stack | |
| CN218621094U (en) | Independent electroplating device for hardware workpiece | |
| CN215713466U (en) | Auxiliary jig for electroplating substrate | |
| CN116145218A (en) | Single-sided rack plating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1132307 Country of ref document: HK |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1132307 Country of ref document: HK |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120718 Termination date: 20190309 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |