CN116145218A

CN116145218A - Single-sided rack plating device

Info

Publication number: CN116145218A
Application number: CN202211103870.2A
Authority: CN
Inventors: 易泉秀; 冯科; 王水根; 薛雯娟; 陈欣; 郑思婷
Original assignee: CISDI Research and Development Co Ltd
Current assignee: CISDI Research and Development Co Ltd
Priority date: 2022-09-09
Filing date: 2022-09-09
Publication date: 2023-05-23

Abstract

The invention relates to a single-sided hanging plating device, which belongs to the technical field of hanging plating devices, and comprises a cathode hanging frame, wherein a hanging structure is arranged at the upper part of the cathode hanging frame so as to hang the cathode hanging frame on a plating bath, a U-shaped plating piece mounting groove is arranged at the lower part of the cathode hanging frame, and a plurality of non-conductive bolts are connected with two sides of the plating piece mounting groove in a threaded manner so as to clamp the plating piece, so that flexible hanging of the plating piece in different plating baths can be realized, and further waste of plating solution caused by placing a product with a smaller size in a larger plating bath for plating is avoided; meanwhile, the plating piece is connected with the power supply negative electrode of the electroplating through the conductive copper foil on the back and the external lead, so that the plating surface of the plating piece can be prevented from being directly contacted with a plating device to leave plating marks; in addition, the hanging plating device is connected with the electroplating bath in a hanging manner, so that the same hanger can be applied to a plurality of electroplating baths, and the use flexibility of the hanging plating device is improved.

Description

Single-sided rack plating device

Technical Field

The invention belongs to the technical field of a rack plating device, and relates to a single-sided rack plating device.

Background

The electroplating is to immerse the workpiece in metal salt solution and plate a layer of bright metal or alloy on the surface of the workpiece by utilizing the electrolysis principle, so as to prevent oxidation (such as rust) of the metal, improve the wear resistance, conductivity, reflectivity, corrosion resistance, beautiful appearance and the like. The conventional hanging plating device clamps a workpiece on a hanger to be placed in electroplating liquid for plating when the conventional hanging plating device is used in electroplating, and the hanging plating device is suitable for common-size parts and hardware which is easy to scratch and deform.

However, when electroplating a block plating, there is a hidden danger that the plating falls due to unstable fixation of the hanging part caused by lack of proper hanging points. In addition, when the existing hanging plating device clamps and fixes a workpiece to carry out electroplating, the problems of obvious defects, hanging marks and hanging marks exist near clamping points, even the hanging points are required to be moved frequently to improve scraping marks, and the hanging plating device is not suitable for plating parts with high requirements on the surface quality of plating layers.

Patent document CN201410734626.5 discloses a single-sided electroplating device and electroplating process thereof, including a plating bath for containing electroplating solution, the rotating shaft, the first guide shaft, the second guide shaft and the fixing frame for isolating the surface which is not required to be electroplated, the single-sided electroplating process is effectively carried out on the substrate, the waste of the electroplating solution caused by double-sided electroplating on the substrate is avoided, and the manufacturing cost is saved. But the device's plating bath size is fixed and the space is great, when electroplating the product of less size, the inside of plating bath also needs to be full of plating solution, causes the very big waste of plating solution, has increased electroplating cost, has produced more electroplating waste liquid simultaneously, has increased later stage waste liquid treatment's work load.

Disclosure of Invention

Therefore, the present invention is directed to a single-sided rack plating apparatus, which can flexibly hang plating parts in different plating tanks, so as to avoid waste of plating solution caused by placing plating parts with smaller size in a larger plating tank for plating.

In order to achieve the above purpose, the present invention provides the following technical solutions:

the utility model provides a single face rack plating device, includes the cathode hanger, and the upper portion of cathode hanger is equipped with suspended structure in order to hang the cathode hanger on the plating bath, and the lower part of cathode hanger is equipped with and is the piece mounting groove that plates of U type, and the both sides threaded connection of plating piece mounting groove has a plurality of nonconductive bolts in order to centre gripping to plate the piece.

Optionally, the plating device further comprises a conductive copper foil connected with the back of the plating piece, wherein the conductive copper foil is connected with a power negative electrode of the plating through an external lead, and a power positive electrode of the plating is connected with an anode arranged in the plating bath through the external lead.

Optionally, the hanging structure comprises two right-angle hooks respectively arranged at two ends of the upper part of the cathode hanger.

Optionally, the cathode hanger comprises a base plate and a U-shaped plate arranged on one side of the lower part of the base plate, and the opening of the U-shaped plate is upwards fixed on the base plate to form a plating piece mounting groove with a U-shaped shape; the hanging structure is arranged on the upper part of one side of the base plate far away from the U-shaped plate.

Optionally, the back of the plating is oriented toward and supported on the substrate.

Optionally, 3 bolts are arranged on two sides of the plating part mounting groove, and the bolts on two sides are oppositely arranged.

The invention has the beneficial effects that: the plating piece is fixed in the plating piece mounting groove of the cathode hanging frame through two rows of bolts, and the cathode hanging frame is hung on the plating tank through the hanging structure, so that flexible hanging of the plating piece in different plating tanks is realized, and further, the phenomenon of plating solution waste caused by that a product with a smaller size is placed in a larger plating tank for plating can be avoided; meanwhile, the plating piece is connected with the power supply negative electrode of the electroplating through the conductive copper foil on the back and the external lead, so that the plating surface of the plating piece can be prevented from being directly contacted with a plating device to leave plating marks; in addition, the hanging plating device is connected with the electroplating bath in a hanging manner, so that the same hanger can be applied to a plurality of electroplating baths, and the use flexibility of the hanging plating device is improved.

Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objects and other advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the specification.

Drawings

For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in the following preferred detail with reference to the accompanying drawings, in which:

fig. 1 is a schematic structural diagram of a single-sided rack plating apparatus:

FIG. 2 is a schematic diagram of a single-sided rack plating apparatus;

fig. 3 is a schematic structural view of a single-sided rack plating apparatus.

Reference numerals: the device comprises a conductive copper foil 1, a right-angle hook 2, a cathode hanger 3, a plating piece mounting groove 4, a bolt 5, a plating piece 6, a waterproof adhesive tape 7, an electroplating bath 8, an anode 9, a power supply 10 and a wire 11.

Detailed Description

Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the illustrations provided in the following embodiments merely illustrate the basic idea of the present invention by way of illustration, and the following embodiments and features in the embodiments may be combined with each other without conflict.

Wherein the drawings are for illustrative purposes only and are shown in schematic, non-physical, and not intended to limit the invention; for the purpose of better illustrating embodiments of the invention, certain elements of the drawings may be omitted, enlarged or reduced and do not represent the size of the actual product; it will be appreciated by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numbers in the drawings of embodiments of the invention correspond to the same or similar components; in the description of the present invention, it should be understood that, if there are terms such as "upper", "lower", "left", "right", "front", "rear", etc., that indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but not for indicating or suggesting that the referred device or element must have a specific azimuth, be constructed and operated in a specific azimuth, so that the terms describing the positional relationship in the drawings are merely for exemplary illustration and should not be construed as limiting the present invention, and that the specific meaning of the above terms may be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 1 to 3, a single-sided rack plating apparatus includes a cathode hanger 3, a hanging structure is disposed on an upper portion of the cathode hanger 3 to hang the cathode hanger 3 on a plating tank 8, a U-shaped plating member mounting groove 4 is disposed on a lower portion of the cathode hanger 3, and a plurality of non-conductive bolts 5 are screwed on two sides of the plating member mounting groove 4 to clamp a plating member 6.

Optionally, the plating device further comprises a conductive copper foil 1 connected with the back of the plating piece 6, wherein the conductive copper foil 1 is connected with the negative electrode of an electroplating power supply 10 through an external lead 11, and the positive electrode of the electroplating power supply 10 is connected with an anode 9 arranged in the electroplating bath 8 through the external lead 11; the hanging structure comprises two right-angle hooks 2 which are respectively arranged at two ends of the upper part of the cathode hanger 3; the cathode hanger 3 comprises a base plate and a U-shaped plate arranged on one side of the lower part of the base plate, the opening of the U-shaped plate is upwards fixed on the base plate to form a plating part mounting groove 4,U shaped like a U, and the U-shaped plate and the base plate can be designed into an integrated structure; the hanging structure is arranged at the upper part of one side of the base plate far away from the U-shaped plate; the back of the plating piece 6 faces to the substrate and is supported on the substrate, and the substrate and the U-shaped plate are made of non-conductive materials; the two sides of the plating part mounting groove 4 are respectively provided with 3 bolts 5, and the bolts 5 on the two sides are oppositely arranged; the bolts 5 are plastic bolts.

Examples

Referring to fig. 1-3, the single-sided hanging plating device comprises a cathode hanging frame 3, right-angle hooks 2 are symmetrically arranged at two ends of the upper part of the cathode hanging frame 3, a plating piece installation groove 4 is arranged below the cathode hanging

frame

3, 3 threaded holes and plastic bolts matched with the threaded holes are uniformly distributed on two sides of the plating piece installation groove 4, and a plating piece 6 is clamped between the two rows of plastic bolts. The plating piece 6 is fixed on the cathode hanging frame 3 through a plating piece mounting groove 4 and two rows of plastic bolts 5, and the cathode hanging frame 3 is hung on the electroplating bath 8 through a fixed right-angle hook 2. The back of the plating piece 6 is stuck with a conductive copper foil 1, the conductive copper foil 1 is connected with the negative electrode of the electroplating power supply 10 through a lead 11, and the positive electrode of the electroplating power supply 10 is connected with the anode 9 through the lead 11.

During electroplating, the plating piece 6 is fixed on the cathode hanging frame 3 through a U-shaped plating piece mounting groove 4 and two rows of plastic bolts, and the cathode hanging frame 3 is hung on the electroplating bath 8 through a fixed right-angle hook 2; the back and four sides of the plating member 6 and the conductive copper foil 1 are adhered with waterproof tapes 7 to prevent the non-plating surface from contacting the plating solution to deposit metal; the plating member 6 is connected to the negative electrode of the power source 10 through the conductive copper foil 1 and the wire 11 to prevent the plating surface of the plating member 6 from directly contacting the plating apparatus to leave a plating mark.

On the premise of ensuring that single-sided electroplating is normally carried out, the invention can realize independent disassembly of the rack plating device and the electroplating tank 8, thereby avoiding the waste of plating solution caused by placing a product with a smaller size in the larger electroplating tank 8 for electroplating. Meanwhile, the plating piece 6 is connected with the negative electrode of the electroplating power supply 10 through the conductive copper foil 1 and the external lead 11 on the back, so that the plating surface of the plating piece 6 can be prevented from being directly contacted with a plating device to leave plating marks. In addition, the hanging plating device is hung with the electroplating tank 8, so that the same hanger can be applied to a plurality of electroplating tanks 8, and the use flexibility of the hanging plating device is improved. Compared with the prior art, the rack plating device has the advantages of simple structure, simple and flexible use, uniform electroplating and no rack plating trace of the plated piece 6.

Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention, which is intended to be covered by the claims of the present invention.

Claims

1. A single-sided rack plating device, which is characterized in that: the electroplating device comprises a cathode hanging frame, wherein a hanging structure is arranged on the upper portion of the cathode hanging frame so as to hang the cathode hanging frame on an electroplating bath, a plating piece installation groove which is U-shaped is arranged on the lower portion of the cathode hanging frame, and a plurality of nonconductive bolts are connected with two sides of the plating piece installation groove in a threaded manner so as to clamp a plating piece.

2. A single-sided rack plating apparatus according to claim 1, wherein: the plating piece is characterized by further comprising a conductive copper foil connected with the back of the plating piece, wherein the conductive copper foil is connected with a power supply negative electrode of the plating through an external lead.

3. A single-sided rack plating apparatus according to claim 1, wherein: the hanging structure comprises two right-angle hooks which are respectively arranged at two ends of the upper part of the cathode hanger.

4. A single-sided rack plating apparatus according to claim 1, wherein: the cathode hanger comprises a base plate and a U-shaped plate arranged on one side of the lower part of the base plate, and the opening of the U-shaped plate is upwards fixed on the base plate to form a plating part mounting groove with a U shape; the hanging structure is arranged on the upper part of one side of the base plate far away from the U-shaped plate.

5. The single-sided rack plating apparatus according to claim 4, wherein: the back of the plating member faces the substrate and is supported on the substrate.

6. A single-sided rack plating apparatus according to claim 1, wherein: the both sides of plating piece mounting groove all are equipped with 3 bolts, and the both sides bolt is relative setting.