HK1132307A1 - Electroplating device and method for electroplating - Google Patents
Electroplating device and method for electroplatingInfo
- Publication number
- HK1132307A1 HK1132307A1 HK09110651.0A HK09110651A HK1132307A1 HK 1132307 A1 HK1132307 A1 HK 1132307A1 HK 09110651 A HK09110651 A HK 09110651A HK 1132307 A1 HK1132307 A1 HK 1132307A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electroplating
- electroplating device
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008096534A JP2009249659A (en) | 2008-04-02 | 2008-04-02 | Electroplating device and electroplating method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1132307A1 true HK1132307A1 (en) | 2010-02-19 |
Family
ID=41155063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09110651.0A HK1132307A1 (en) | 2008-04-02 | 2009-11-13 | Electroplating device and method for electroplating |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2009249659A (en) |
CN (1) | CN101550582B (en) |
HK (1) | HK1132307A1 (en) |
TW (1) | TWI381070B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5366787B2 (en) * | 2009-12-18 | 2013-12-11 | 株式会社中央製作所 | Continuous vertical transfer plating equipment |
CN102337577B (en) * | 2010-07-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Electroplating device |
CN102373497B (en) * | 2010-08-16 | 2014-05-21 | 富葵精密组件(深圳)有限公司 | Electroplating apparatus and electroplating method thereof |
US10262960B2 (en) * | 2015-04-06 | 2019-04-16 | Mitsubishi Electric Corporation | Semiconductor element having a warped surface and production method thereof |
CN105297121A (en) * | 2015-10-21 | 2016-02-03 | 胜宏科技(惠州)股份有限公司 | Electrocoppering bath titanium basket maintenance method |
CN105297096B (en) * | 2015-11-30 | 2017-12-19 | 中国华能集团公司 | A kind of electroplanting device and electro-plating method of two-sided electro-deposition xenogenesis coating |
CN107513741A (en) * | 2017-09-07 | 2017-12-26 | 延康汽车零部件如皋有限公司 | A kind of electro-plating method for improving machining long workpieces copper coating uniformity |
CN112701072B (en) * | 2021-03-25 | 2021-10-22 | 西安奕斯伟硅片技术有限公司 | Wafer processing apparatus and wafer defect evaluation method |
JP7161646B1 (en) * | 2021-06-01 | 2022-10-26 | 株式会社荏原製作所 | Plating equipment and plating method |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4490230A (en) * | 1983-03-10 | 1984-12-25 | At&T Technologies, Inc. | Electroplating apparatus |
JPS63293193A (en) * | 1987-05-26 | 1988-11-30 | Matsushita Electric Works Ltd | Electroplating |
JPH06116799A (en) * | 1992-10-01 | 1994-04-26 | Hitachi Chem Co Ltd | Electroplating method |
JP3062911B2 (en) * | 1994-03-14 | 2000-07-12 | 富士通株式会社 | Plating equipment |
JP3352081B2 (en) * | 2001-02-01 | 2002-12-03 | 株式会社アスカエンジニアリング | Printed circuit board copper plating equipment |
CN2466167Y (en) * | 2001-02-09 | 2001-12-19 | 吴德兴 | Rim electroplating device |
DE10342512B3 (en) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region |
CN2732766Y (en) * | 2004-05-12 | 2005-10-12 | 重庆渝安创新科技(集团)有限公司 | Durionising device capable of saving electric energy and equipment accessory |
JP4711805B2 (en) * | 2005-11-08 | 2011-06-29 | 上村工業株式会社 | Plating tank |
US8177945B2 (en) * | 2007-01-26 | 2012-05-15 | International Business Machines Corporation | Multi-anode system for uniform plating of alloys |
-
2008
- 2008-04-02 JP JP2008096534A patent/JP2009249659A/en active Pending
-
2009
- 2009-01-15 TW TW98101303A patent/TWI381070B/en not_active IP Right Cessation
- 2009-03-09 CN CN2009101272163A patent/CN101550582B/en not_active Expired - Fee Related
- 2009-11-13 HK HK09110651.0A patent/HK1132307A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN101550582B (en) | 2012-07-18 |
JP2009249659A (en) | 2009-10-29 |
TWI381070B (en) | 2013-01-01 |
TW200942648A (en) | 2009-10-16 |
CN101550582A (en) | 2009-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20190309 |