CN221071716U - Horizontal continuous electroplating production line - Google Patents

Abstract

The utility model relates to the technical field of electroplating equipment, and discloses a horizontal continuous electroplating production line, which comprises the following steps: a frame; the electroplating tank is arranged on the frame, and an anode plate is arranged at the tank bottom of the electroplating tank; the ion membrane is arranged in the electroplating bath and is positioned above the anode plate, and is suitable for blocking bubbles generated at the anode plate from floating to the liquid surface right above the anode plate; the bubble guide plate is arranged on two sides of the plating bath in the width direction of the processed plate, the upper surface of the bubble guide plate is positioned on the liquid level, the lower end of the bubble guide plate is inclined towards the direction close to the center line of the processed plate and is positioned between the edge of the ion membrane and the liquid level.

Description

Horizontal continuous electroplating production line

Technical Field

The utility model relates to the technical field of electroplating equipment, in particular to a horizontal continuous electroplating production line.

Background

Electroplating is a process of plating a layer of other metals or alloys on a metal surface by using an electrolysis principle. In modern industry, electroplating technology is widely applied, for example, in the electroplating process of PCB boards, it is necessary to unwind a board roll, then continuously convey and continuously electroplate the board, and finally wind up the board roll with a coating film.

In the related art, during the processing, a plate is clamped by a clamp and advances along with a conveying device, and when the plate passes through a plating tank containing plating solution, the clamp and a bottom plate of the plating tank apply voltage between the plate and the electrolyte, so that metal cations in the electrolyte are transferred to the surface of the plate to form a plating layer.

However, in the plating process, bubbles are easily generated in the bottom plate of the plating tank as an anode during operation, the bubbles rise to the liquid surface of the plating solution and then break, plating droplets are splashed during breaking, and the surrounding structure is contaminated, and particularly, if the droplets splash onto the jig, metal crystals are formed, resulting in the jig scratching the plate to be processed, a decrease in the conductive effect, and the like.

Disclosure of utility model

In view of the above, the present utility model provides a horizontal continuous electroplating production line, so as to solve the problem of droplet splashing and pollution to peripheral structures caused by bubble breakage generated during anode operation.

The utility model provides a horizontal continuous electroplating production line, which comprises the following steps: a frame; the electroplating tank is arranged on the rack, and an anode plate is arranged at the tank bottom of the electroplating tank; the ion membrane is arranged in the electroplating bath and is positioned above the anode plate, and is suitable for blocking bubbles generated at the anode plate from floating to the liquid surface right above the anode plate; the bubble guide plate is arranged in the electroplating bath and positioned at two sides of the processed plate in the width direction, the upper surface of the bubble guide plate is positioned above the liquid level, and the lower end of the bubble guide plate is inclined towards the direction close to the center line of the processed plate and positioned between the edge of the ion membrane and the liquid level.

The beneficial effects are that: by the characteristic that the ion membrane can block bubbles and allow metal cations to pass through, the rising bubbles are blocked by the ion membrane, so that the bubbles are prevented from directly rising to the liquid level and being broken, and the situation that liquid drops splash is generated. Meanwhile, when the bubbles move to the side of the ion membrane, the bubbles are further guided to the side position of the electroplating bath through the bubble guide plate, splash liquid drops generated by bubble breakage are blocked by the part of the bubble guide plate above the liquid level, the splash range of the liquid drops is controlled, and the pollution to important parts is avoided.

In an alternative embodiment, the bubble guide comprises an inclined guide plate and a baffle plate, wherein the inclined guide plate is arranged at the bottom end of the baffle plate and is positioned between the edge of the ion membrane and the liquid level, and the baffle plate longitudinally extends out of the liquid level.

The beneficial effects are that: the slope baffle that the slope set up is favorable to carrying out more efficient guide to the bubble, and the baffle upper surface stretches out the liquid level, promotes the protection scope, more effectual control liquid drop splashes the scope.

In an alternative embodiment, the ion membrane is mounted closer to the side of the bubble guide plate than to the middle.

The beneficial effects are that: through the setting of the high middle low of ionic membrane both sides, make the bubble that the anode plate produced by the ionic membrane in the ascending process, also by the side guide of ionic membrane to the plating bath when being blocked, help the bubble in the discharge plating bath of more quick, avoid influencing the electroplating effect.

In an alternative embodiment, the frame is provided with a pair of wringing rollers and a pair of conductive rollers, the wringing rollers and the conductive rollers are both positioned at one end of the electroplating bath in the length direction of the processed plate, the conductive rollers are positioned at one side of the wringing rollers away from the conductive rollers, and the splash guard is arranged at the lower side of the conductive rollers on the frame.

The beneficial effects are that: when the plate to be processed is electroplated and leaves the electroplating bath, the surface of the plate to be processed is extruded by the paired wringing rollers, the liquid moving along with the plate to be processed is isolated at one side of the wringing rollers facing the electroplating bath, the conductive roller is used as a part of the cathode of an electroplating circuit, voltage is applied to the plate to be processed in the electroplating process, the splash guard protects the lower side of the conductive roller, and the liquid is prevented from dripping from the wringing rollers and other positions and rebounds to the conductive roller, so that the circuit is broken, or the possibility that metal crystals damage the surface of the plate to be processed occurs.

In an alternative embodiment, the tank bottom of the electroplating tank is provided with a surge-preventing partition board, the surge-preventing partition board is located at the outlet of the electroplating tank, the board surface of the surge-preventing partition board is located at the lower side of the liquid level, and the surge-preventing partition board is connected with the tank bottom of the electroplating tank through a plurality of supporting parts.

The beneficial effects are that: the height of the processed plate is increased when the processed plate leaves the plating bath, so that the liquid level is disturbed, liquid in the plating bath is fluctuated, the flow direction of the plating solution is unstable, or the processed plate is contacted with unstable conditions, the processing quality is affected, and the liquid at the outlet of the plating bath is layered along the depth by arranging the surge-preventing partition plate, so that the liquid surge amplitude is greatly reduced, and the processing quality is improved.

In an alternative embodiment, auxiliary supporting plates are arranged on two sides of the plating tank in the width direction of the processed plate, and the auxiliary supporting plates are suitable for supporting the processed plate.

The beneficial effects are that: through the setting of auxiliary support plate, after the panel that is processed leaves the electroplating liquid level, thereby the position of the panel that is processed is adjusted fast to the auxiliary support plate support from the below, is convenient for transport anchor clamps to the centre gripping of panel and transport.

In an alternative embodiment, the auxiliary pallet is provided with a plurality of meshes.

The beneficial effects are that: through setting up the mesh, reduce the blocking of auxiliary support board to cation flow, and then avoid influencing the effect of electroplating technology.

In an optional implementation manner, the anti-oxidation device further comprises an anti-oxidation groove arranged on the frame, a liquid inlet is formed in the groove wall of the anti-oxidation groove, an anti-surge frame is arranged on the groove wall of the anti-oxidation groove, the anti-surge frame is arranged at the liquid inlet in a semi-surrounding mode, and openings are formed in the upper end and the lower end of the anti-surge frame.

The beneficial effects are that: the antioxidation liquid medicine needs to be continuously filled into the antioxidation tank, so that the effect of the liquid medicine in the antioxidation tank is ensured, the liquid medicine enters the antioxidation tank from the liquid inlet, however, the concentrated entering position of the liquid medicine is accelerated due to the speed of the liquid flow, the liquid level at the liquid inlet is easy to surge, the contact between the processed plate and the liquid medicine is insufficient, and liquid drops are splashed. The liquid inlet is surrounded by the anti-surge frame, so that the liquid medicine firstly enters the anti-surge frame and then enters the anti-oxidation groove from the openings at the upper end and the lower end, the liquid medicine is layered, surge is greatly reduced, and the anti-oxidation treatment effect is improved.

In an alternative embodiment, a stabilizer plate is arranged on the outer side wall of the bottom end of the anti-surge frame, and the stabilizer plate extends towards the middle of the antioxidant groove.

The beneficial effects are that: the water flow at the opening at the lower end of the anti-surge frame is distributed and guided through the flow stabilizing plate, so that the surge of liquid is further reduced, and the effect of stabilizing the liquid level is improved.

In an optional implementation manner, the device further comprises a plurality of washing tanks which are sequentially arranged along the movement direction of the processed plate, each washing tank comprises a first tank body and a second tank body which are mutually communicated, overflow holes are formed between every two adjacent washing tanks, the formed heights of the overflow holes are sequentially reduced along the movement direction of the processed plate, and two adjacent overflow holes are respectively formed in the tank walls of the first tank body and the second tank body.

The beneficial effects are that: because the overflow holes are alternately arranged on the first tank body and the second tank body, and the height of the overflow holes in the moving direction of the processed plate is sequentially reduced, a snake-shaped water channel is formed at the positions of the plurality of washing tanks, clear water enters from the washing tank at the forefront side and is discharged from the washing tank at the rearmost side, the processed plate moves gradually from the washing tank at the front side to the washing tank at the rear side, and surface cleaning is sequentially carried out, so that the multistage utilization of water is realized, and water resources are saved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a horizontal continuous plating line for embodying a plating tank and a bubble guide plate according to an embodiment of the present utility model;

FIG. 2 is an enlarged schematic view of the portion A in FIG. 1;

FIG. 3 is a schematic diagram of a horizontal continuous electroplating line for showing the position structures of a conductive roller and a wringing roller at the outlet of an electroplating tank according to an embodiment of the present utility model;

FIG. 4 is a schematic cross-sectional view of the conductive roller and splash guard of FIG. 3;

FIG. 5 is a schematic view of a horizontal continuous plating line for embodying an oxidation resistant tank according to an embodiment of the present utility model;

FIG. 6 is an enlarged schematic view of the portion B of FIG. 5;

FIG. 7 is a schematic diagram of a horizontal continuous plating line for implementing a rinse tank structure in accordance with an embodiment of the present utility model.

Reference numerals illustrate:

100. A frame; 200. plating bath; 201. an anode plate; 202. an auxiliary supporting plate; 2021. a mesh; 300. a bubble guide plate; 301. an inclined guide plate; 302. a baffle; 303. a mounting ear; 401. a wringing roller; 402. a conductive roller; 403. a splash shield; 500. anti-surge baffle plates; 501. a support part; 600. an antioxidant tank; 601. an anti-surge frame; 602. a steady flow plate; 603. a liquid inlet; 700. a washing tank; 701. a first tank body; 702. a second tank body; 703. and an overflow hole.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In order to increase the yield of plated sheet material, most of the raw material of sheet material of small thickness is usually stored and transported in the form of coils, and unreeled and continuously plated in the plating process, and rewound after plating is completed to form coils of plated sheet material.

In the actual production process, the electroplating process generally comprises the steps of discharging, immersing in electroplating solution, washing, antioxidation, drying and rewinding, wherein an anode plate is arranged in an electroplating bath to be connected with a power supply anode, and a processed plate is connected with a power supply cathode through contact of a conductive roller, a clamp and other structures, so that metal cations in the electroplating solution are adsorbed on the surface of the processed plate to form a coating. However, in the processing process, bubbles are generated at the anode plate connected with the positive electrode of the power supply, the bubbles float to the liquid level and then break to generate splashed electroplating liquid drops, the electroplating liquid drops are splashed to other structures to easily cause pollution, and when the electroplating liquid is splashed to a part electrically connected with the negative electrode of the power supply, metal cations in the liquid drops can be adsorbed on the surface of the part to form metal crystals, so that the surface of the processed plate is damaged.

In addition, when the liquid level of the processed plate is affected by plate disturbance, liquid flow and the like, surging occurs, so that the processed plate is not contacted with the liquid stably, and liquid drops splash, and the processing quality of the processed plate is affected.

The application provides a scheme for controlling liquid drop splashing and reducing liquid surging for the condition of influencing the processing quality, which is beneficial to improving the processing quality and avoiding the production of product defects.

Embodiments of the present utility model are described below with reference to fig. 1 to 7.

According to an embodiment of the present utility model, there is provided a horizontal continuous electroplating line, referring to fig. 1 to 2, a rack 100; plating bath 200, which is arranged on frame 100, and anode plate 201 is arranged at the bottom of plating bath 200; an ion membrane (not shown) disposed in the electroplating tank 200 and above the anode plate 201, and adapted to block bubbles generated at the anode plate 201 from floating to a liquid surface directly above the anode plate 201; bubble guide plates 300 are arranged on two sides of the plating tank 200 in the width direction of the processed plate, the upper surfaces of the bubble guide plates 300 are positioned on the liquid surface, and the lower ends of the bubble guide plates are inclined towards the direction close to the center line of the processed plate and are positioned between the edges of the ion membranes and the liquid surface.

Specifically, the top of the bubble guide 300 is provided with a mounting lug 303, and is mounted on the top end of the side wall of the plating tank 200 through the cooperation of the mounting lug 303 and a fastener, a gap is left between the bubble guide 300 and the side wall of the plating tank 200, bubbles are guided by the ion membrane and the bubble guide 300to the back floating liquid surface in the gap between the bubble guide 300 and the tank wall of the plating tank 200, and are broken in the gap, and the bubble guide 300 and the side wall of the plating tank 200 jointly block splashing of liquid drops.

It should be noted that, the specific arrangement manner of the bubble guide 300 is not limited in this embodiment, the bubble guide 300 may include a baffle 302 and an inclined guide 301 disposed at the bottom of the baffle 302, and in some embodiments not shown, the bubble guide 300 may be a plate disposed in a whole inclined manner, or may be an arc panel with an upper end bent away from the center of the plating tank 200, and the specific form of the bubble guide 300 is within the scope of the present embodiment.

It should be further noted that, the specific installation mode of the ion membrane is not limited in this embodiment, and the ion membrane may be installed at the bottom of the plating tank 200 through a bracket, or may be installed at two ends of the plating tank 200 along the length direction of the plate to be processed, or may be installed in other manners.

In this embodiment, the rising air bubbles are blocked by the ion membrane by the characteristic that the ion membrane can block the air bubbles and allow the metal cations to pass through, and the air bubbles are prevented from directly rising to the liquid surface and being broken, so that the liquid drops are prevented from splashing. Meanwhile, when the bubbles move to the side of the ion membrane, the bubbles are further guided to the side position of the electroplating bath 200 through the bubble guide plate 300, and splash liquid drops generated by bubble breakage are blocked by the part of the bubble guide plate 300 above the liquid level, so that the splash range of the liquid drops is controlled, and the pollution to important parts is avoided.

In one embodiment, bubble guide 300 comprises a sloped guide 301 and a baffle 302, where sloped guide 301 is disposed at the bottom end of baffle 302 between the edge of the ion membrane and the liquid surface, and baffle 302 extends longitudinally beyond the liquid surface.

In this embodiment, the inclined guide plate 301 is disposed obliquely, which is favorable for guiding bubbles more efficiently, the upper surface of the baffle 302 extends out of the liquid level, the protection range is lifted, and the splashing range of liquid drops is controlled more effectively.

In one embodiment, the ion membrane is mounted closer to the side of bubble guide 300 than to the middle.

Specifically, the anode plate 201 is disposed at the bottom of the electroplating tank 200 in an arc shape with a concave surface facing upwards, the ion membrane is disposed above the anode plate 201, the specific shape of the ion membrane is not limited in this embodiment, the ion membrane may be attached to the anode plate 201 and configured to be an arc shape attached to the anode plate 201, in some embodiments not shown, the ion membrane may also be installed at the bottom of the electroplating tank 200 through a bracket structure and configured to be in a V-shape, and the shape of the ion membrane is within the protection scope of this embodiment.

In this embodiment, through the arrangement of the high middle and low sides of the ion membrane, the air bubbles generated by the anode plate 201 are blocked by the ion membrane and guided to the side of the electroplating bath 200 by the ion membrane in the ascending process, which is helpful for rapidly discharging the air bubbles in the electroplating bath 200 and avoiding affecting the electroplating effect.

Referring to fig. 3 to 4, in one embodiment, a pair of wringing rollers 401 and a pair of conductive rollers 402 are disposed on a frame 100, the wringing rollers 401 and the conductive rollers 402 are located at one end of the plating tank 200 in the length direction of the processed plate, the conductive rollers 402 are located at one side of the wringing rollers 401 away from the conductive rollers 402, and a splash guard 403 is disposed on the lower side of the conductive rollers 402 on the frame 100.

In this embodiment, when the plate to be processed completes plating and leaves the plating tank 200, the surface of the plate to be processed is first extruded by the pair of wringing rollers 401, the liquid moving along with the plate to be processed is isolated at the side of the wringing rollers 401 facing the plating tank 200, and the conductive roller 402 is used as a part of the negative electrode of the plating circuit, a voltage is applied to the plate to be processed during the plating process, and the splash guard 403 protects the underside of the conductive roller 402, prevents the liquid from dripping from the wringing rollers 401 and other positions and bouncing onto the conductive roller 402, causing circuit breaking, or the possibility of metal crystallization damaging the surface of the plate to be processed occurs.

In one embodiment, the bottom of plating cell 200 is provided with a surge baffle 500, the surge baffle 500 is located at the outlet of plating cell 200 and the plate surface is located below the liquid surface, and the surge baffle 500 is connected to the bottom of plating cell 200 by a plurality of support portions 501.

In this embodiment, since the height of the processed plate material is increased when leaving the plating tank 200 and the liquid level is disturbed, the liquid in the plating tank 200 generates surge, so that the flow direction of the plating solution is unstable or the processed plate material is not contacted stably, and the processing quality is affected.

In one embodiment, auxiliary pallets 202 are provided on both sides of the plating tank 200 in the width direction of the plate to be processed, and the auxiliary pallets 202 are adapted to hold up the plate to be processed.

In this embodiment, by setting the auxiliary supporting plate 202, after the processed plate leaves the plating liquid surface, the auxiliary supporting plate 202 supports the processed plate from below, so as to quickly adjust the position of the processed plate, and facilitate the clamping and conveying of the processed plate by the conveying clamp.

In one embodiment, the auxiliary pallet 202 is provided with a plurality of holes 2021.

In this embodiment, by providing the mesh 2021, the blocking of the flow of cations by the auxiliary pallet 202 is reduced, thereby avoiding affecting the effect of the electroplating process.

Referring to fig. 5 to fig. 6, in an embodiment, the anti-oxidation device further includes an anti-oxidation tank 600 disposed on the frame 100, a liquid inlet 603 is disposed on a wall of the anti-oxidation tank 600, a surge prevention frame 601 is mounted on the wall of the anti-oxidation tank 600, the surge prevention frame 601 is disposed at the liquid inlet 603 in a semi-surrounding manner, and openings are disposed at upper and lower ends of the surge prevention frame 601.

Specifically, the anti-flooding frame 601 is a semi-surrounding structure surrounded by three plates, the open end faces the liquid inlet 603 of the anti-oxidation groove 600, and the plate opposite to the open end of the anti-flooding frame 601 may be parallel to the side wall of the anti-oxidation groove 600 or may be inclined relative to the side wall of the anti-oxidation groove 600, so that other components are abducted.

In this embodiment, the antioxidant liquid medicine needs to be continuously filled into the antioxidant tank 600, so as to ensure the effect of the liquid medicine in the antioxidant tank 600, and the liquid medicine enters the antioxidant tank 600 from the liquid inlet 603, however, the liquid medicine concentrated entering position is accelerated due to the liquid flow rate, so that the liquid level at the liquid inlet 603 is easy to surge, the contact between the processed plate and the liquid medicine is insufficient, and the liquid drops are splashed. The liquid inlet 603 is surrounded by the anti-surge frame 601, so that liquid medicine firstly enters the anti-surge frame 601, then enters the anti-oxidation tank 600 from the openings at the upper end and the lower end, and the liquid medicine is layered, thereby greatly reducing surge and improving the anti-oxidation treatment effect.

In one embodiment, a stabilizer 602 is disposed on the outer sidewall of the bottom end of the anti-flooding frame 601, and the stabilizer 602 extends toward the middle of the anti-oxidation tank 600.

Specifically, the stabilizer 602 may extend horizontally toward the middle of the oxidation resistant tank 600, and in some embodiments, not shown, the stabilizer 602 may also extend obliquely toward the middle of the oxidation resistant tank 600.

In this embodiment, the current at the opening at the lower end of the anti-surge frame 601 is distributed and guided by the current stabilizer 602, so as to further reduce the surge of liquid and improve the effect of stabilizing the liquid level.

Referring to fig. 7, in an embodiment, the device further includes a plurality of rinsing tanks 700 sequentially disposed along a moving direction of the processed board, the rinsing tanks 700 include a first tank body 701 and a second tank body 702 which are mutually communicated, overflow holes 703 are respectively formed between adjacent rinsing tanks 700, the opening heights of the plurality of overflow holes 703 are sequentially reduced along the moving direction of the processed board, and two adjacent overflow holes 703 are respectively formed on the tank walls of the first tank body 701 and the second tank body 702.

In particular, the overflow aperture 703 may be a kidney-shaped aperture extending in a direction parallel to the liquid surface, so that a smoother flow of water is obtained at the overflow aperture 703, and in some embodiments not shown, the overflow aperture 703 may also be circular, rectangular or the like.

In this embodiment, since the overflow holes 703 are alternately provided in the first tank 701 and the second tank 702, and the overflow holes 703 are opened in the moving direction of the processed sheet material and the heights thereof are sequentially reduced, so that serpentine channels are formed at the plurality of washing tanks 700, clean water enters from the front-most washing tank 700 and is discharged from the rear-most washing tank 700, and the processed sheet material is gradually moved from the front-side washing tank 700 to the rear-side washing tank 700 to sequentially perform surface cleaning, thereby realizing multi-stage utilization of water and saving water resources.

Although embodiments of the present utility model have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the utility model, and such modifications and variations fall within the scope of the utility model as defined by the appended claims.

Claims (10)

1. A horizontal continuous electroplating production line, comprising:

A frame (100);

An electroplating bath (200) arranged on the frame (100), wherein an anode plate (201) is arranged at the bottom of the electroplating bath (200);

The ion membrane is arranged in the electroplating bath (200) and is positioned above the anode plate (201) and is suitable for blocking bubbles generated at the anode plate (201) from floating to the liquid level right above the anode plate (201);

And the bubble guide plate (300) is arranged in the electroplating bath (200) and is positioned at two sides of the width direction of the processed plate, the upper surface of the bubble guide plate (300) is positioned above the liquid level, and the lower end of the bubble guide plate is inclined towards the direction close to the center line of the processed plate and is positioned between the edge of the ion membrane and the liquid level.

2. The horizontal continuous plating line according to claim 1, wherein the bubble guide plate (300) comprises an inclined guide plate (301) and a baffle plate (302), the inclined guide plate (301) is disposed at the bottom end of the baffle plate (302) and is located between the edge of the ion membrane and the liquid surface, and the baffle plate (302) extends out of the liquid surface in the longitudinal direction.

3. The horizontal continuous plating line according to claim 1, wherein the ion membrane is installed at a higher level near the side of the bubble guide plate (300) than in the middle.

4. The horizontal continuous plating line according to claim 1, wherein a pair of wringing rollers (401) and a pair of conductive rollers (402) are provided on the frame (100), the wringing rollers (401) and the conductive rollers (402) are both located at one end of the plating tank (200) in the length direction of the processed sheet, the conductive rollers (402) are located at one side of the wringing rollers (401) away from the conductive rollers (402), and a splash-proof plate (403) is provided on the frame (100) at the lower side of the conductive rollers (402).

5. The horizontal continuous plating line according to claim 1, wherein a surge prevention baffle (500) is provided at the bottom of the plating tank (200), the surge prevention baffle (500) is located at the outlet of the plating tank (200) and the plate surface is located at the lower side of the liquid surface, and the surge prevention baffle (500) is connected to the bottom of the plating tank (200) through a plurality of support portions (501).

6. The horizontal continuous plating line according to claim 1, wherein auxiliary pallets (202) are provided on both sides of the plating tank (200) in the width direction of the plate to be processed, and the auxiliary pallets (202) are adapted to hold up the plate to be processed.

7. The horizontal continuous plating line according to claim 6, wherein the auxiliary pallet (202) is provided with a plurality of meshes (2021).

8. The horizontal continuous electroplating production line according to claim 1, further comprising an antioxidant groove (600) arranged on the frame (100), wherein a liquid inlet (603) is formed in the groove wall of the antioxidant groove (600), a surge prevention frame (601) is arranged on the groove wall of the antioxidant groove (600), the surge prevention frame (601) is arranged at the liquid inlet (603) in a semi-surrounding mode, and openings are formed in the upper end and the lower end of the surge prevention frame (601).

9. The horizontal continuous electroplating production line according to claim 8, wherein a current stabilizer (602) is arranged on the outer side wall of the bottom end of the anti-surge frame (601), and the current stabilizer (602) extends towards the middle of the antioxidant tank (600).

10. The horizontal continuous electroplating production line according to claim 1, further comprising a plurality of rinsing tanks (700) sequentially arranged along the movement direction of the processed plate, wherein each rinsing tank (700) comprises a first tank body (701) and a second tank body (702) which are mutually communicated, overflow holes (703) are respectively formed between every two adjacent rinsing tanks (700), the opening heights of the overflow holes (703) are sequentially reduced along the movement direction of the processed plate, and two adjacent overflow holes (703) are respectively formed on the tank walls of the first tank body (701) and the second tank body (702).