CN215163261U - Promote PCB and electroplate floating frame structure of homogeneity - Google Patents
Promote PCB and electroplate floating frame structure of homogeneity Download PDFInfo
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- CN215163261U CN215163261U CN202120945476.8U CN202120945476U CN215163261U CN 215163261 U CN215163261 U CN 215163261U CN 202120945476 U CN202120945476 U CN 202120945476U CN 215163261 U CN215163261 U CN 215163261U
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Abstract
The utility model discloses a promote PCB and electroplate floating frame structure of homogeneity, it is including setting up in backplate (1) of floating frame both sides, just set firmly many screws (2) in proper order along the length direction who floats the frame on two curb plates (6) of floating frame, backplate (1) are gone up and have welded a plurality of connecting plates (3) corresponding with screw (2) along its length direction, guide way (4) have all been seted up on the terminal surface of every connecting plate (3), guide way (4) vertical setting, connecting plate (3) hang on the screw rod of screw (2) through guide way (4), the bottom portion of backplate (1) sets up in the below of curb plate (6). The utility model has the advantages that: compact structure, can be suitable for the production of boards with different sizes and improve the uniformity of an electroplated layer.
Description
Technical Field
The utility model relates to a technical field that PCB electroplated, especially a promote PCB and electroplate homogeneity's floating frame structure.
Background
In the production flow of the printed circuit board, the uniformity of the electroplated layer is always a great problem for restricting the width uniformity of the circuit layer on the printed electroplated board. Meanwhile, because the electroplated layer is not uniform, more printed circuit boards are scrapped, and therefore equipment manufacturers of the printed circuit boards are also vigorously optimized. The important parts influencing the thickness uniformity of the electroplated layer are floating frames, two ends of each floating frame are respectively arranged on two sides of the electroplating bath in a floating mode through semicircular bayonets, and the two floating frames in the electroplating bath have two main functions, wherein one function is to fix the printed circuit board entering the electroplating bath, so that the lower end part of the printed circuit board cannot swing left and right under the resistance of electroplating liquid medicine, and the printed circuit board is prevented from being burnt due to the fact that the printed circuit board is close to an anode basket (the anode basket is arranged in the electroplating bath); the other function is to shield the excessive floating power lines at the bottom of the anode basket, namely to prevent the power lines from entering the floating frame from the bottom of the floating frame, and the power lines entering the floating frame cause the electroplated layer at the lower end of the printed circuit board to be thicker, thereby causing the uneven thickness of the electroplated layer, finally causing film clamping, incomplete etching, increased material consumption and the like.
The total height of the existing electroplating bath is 660 mm-680 mm, the effective use height is 580 mm-600 mm during actual electroplating, when a printed circuit board with the length of 580 mm-620 mm is to be electroplated, the upper end of the printed circuit board is clamped and fixed on a target (the target is arranged on a lifting mechanism, the lifting mechanism is arranged right above the electroplating bath), then the lifting mechanism drives the target to move downwards, the target drives a clamped printed circuit board to move downwards, the bottom end of the printed circuit board is pressed on a bottom supporting beam of a floating frame, the floating frame is pressed and then sunk into the electroplating solution, when the target moves to the limit state, the bottom of the printed circuit board is lower than the bottom of an anode basket, two side plates of the floating frame support the electric power line downwards, so that the electric power line is prevented from entering the floating frame, and the uniformity of the electroplating layer is improved.
When will be less than 580 mm's printed circuit board to length when electroplating, fix printed circuit board's upper end centre gripping on the frisbee earlier, make elevating system drive the frisbee downstream afterwards, the frisbee drives by centre gripping printed circuit board downstream, printed circuit board's bottom end presses on the bottom supporting beam of floating frame, sink in the plating solution after the floating frame pressurized, when the frisbee moves extreme condition equally, this printed circuit board's bottom is higher than the bottom of anode basket, have more power line this moment and penetrate the floating frame in from the floating frame bottom, and then lead to the inhomogeneous of thickness of plating layer.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's shortcoming, provide a compact structure, can be applicable to not unidimensional board the production, improve the floating frame structure of promotion PCB electroplating uniformity of plating layer homogeneity.
The purpose of the utility model is realized through the following technical scheme: the utility model provides a promote PCB and electroplate superficial structure of homogeneity, it is including setting up in the backplate of floating frame both sides, has set firmly many screws on two curb plates of floating frame in proper order and along the length direction who floats the frame, and it has a plurality of connecting plates corresponding with the screw to weld on the backplate and along its length direction, has all seted up the guide way on the terminal surface of every connecting plate, and the guide way is vertical to be set up, and the connecting plate hangs on the screw rod of screw through the guide way, and the bottom portion of backplate sets up in the below of curb plate.
The floating frame comprises a supporting beam and two side plates, the two side plates are arranged on the left side and the right side of the supporting beam respectively, a plurality of connecting frames arranged at intervals are welded between the side plates and the supporting beam, and a plurality of window holes arranged at intervals are formed in the side plates.
The distance between two adjacent screws is equal.
And a plurality of threaded holes corresponding to the screws are formed in the side plates along the length direction of the side plates, and the screws are in threaded connection with the threaded holes.
The two guard plates are symmetrically arranged about the floating frame.
The thickness of the guard plate is 0.5-0.8 mm, the length of the guard plate is equal to that of the side plate, and the inner end face of the guard plate is in contact with the outer end face of the side plate.
A plurality of round holes with the diameter of 10-15 mm are formed in the two guard plates.
The utility model has the advantages of it is following: the utility model has compact structure, can be suitable for the production of boards with different sizes, reduces the electroplating high-area effect and improves the uniformity of electroplated layers.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a left side view of FIG. 1;
FIG. 4 is a cross-sectional view A-A of FIG. 1;
in the figure, 1-protective plate, 2-screw, 3-connecting plate, 4-guide groove, 5-supporting beam, 6-side plate, 7-connecting frame, 8-window hole and 9-round hole.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
as shown in fig. 1 to 4, a floating frame structure for improving the electroplating uniformity of a PCB comprises guard plates 1 disposed on two sides of a floating frame, wherein the two guard plates 1 are symmetrically disposed with respect to the floating frame, a plurality of screws 2 are sequentially and fixedly disposed on two side plates 6 of the floating frame along the length direction of the floating frame, and the intervals between two adjacent screws 2 are equal. On backplate 1 and along its length direction welding have a plurality of connecting plates 3 corresponding with screw 2, connecting plate 3 and backplate 1 integrated into one piece, connecting plate 3 sets up on backplate 1's the top surface, has all seted up guide way 4 on every connecting plate 3's the terminal surface, and the vertical setting of guide way 4, connecting plate 3 hang on the screw rod of screw 2 through guide way 4, and the bottom portion of backplate 1 sets up in the below of curb plate 6. And a plurality of threaded holes corresponding to the screws 2 are formed in the side plate 6 along the length direction of the side plate, and the screws 2 are in threaded connection with the threaded holes.
The floating frame comprises a supporting beam 5 and two side plates 6, the two side plates 6 are respectively arranged on the left side and the right side of the supporting beam 5, a plurality of connecting frames 7 arranged at intervals are welded between the side plates 6 and the supporting beam 5, and window holes 8 arranged at intervals are formed in the side plates 6. The thickness of the guard plate 1 is 0.5-0.8 mm, the length of the guard plate 1 is equal to that of the side plate 6, and the inner end face of the guard plate 1 is in contact with the outer end face of the side plate 6. A plurality of round holes 9 with the diameter of 10-15 mm are formed in the two guard plates 1.
The working process of the utility model is as follows:
when electroplating the printed circuit board with the length of 620mm, the upper end of the printed circuit board is clamped and fixed on the flying target, then the lifting mechanism drives the flying target to move downwards, the flying target drives the clamped printed circuit board to move downwards, the bottom end of the printed circuit board is pressed on the bottom supporting beam 5 positioned on the floating frame, the floating frame sinks into the electroplating solution after being pressed, meanwhile, the floating frame drives the two protection plates 1 to sink synchronously, when the bottom end of the protection plate 1 contacts the bottom of the electroplating bath firstly, the screw 2 on the floating frame slides downwards along the guide groove 4, when the flying target moves to a limit state, the bottom surface of the floating frame is just parallel and level with the bottom surface of the protection plate 1, at the moment, the power line cannot enter the floating frame, and therefore the uniformity of the electroplated layer is improved.
When the printed circuit board with the length of 580 mm-620 mm is to be electroplated, the steps are repeated, and when the flying target moves to the limit state, the power line cannot enter the floating frame, so that the uniformity of the electroplated layer is improved.
When electroplating printed circuit board less than 580mm in length, fix printed circuit board's upper end centre gripping on the frisbee earlier, make the frisbee move extreme condition afterwards, printed circuit board's bottom is higher than the bottom of positive pole basket this moment, and backplate 1 hangs on screw 2 through connecting plate 3, and backplate 1's bottom extends in the bottom below of positive pole basket, and backplate 1 props the electric power line downwards to prevented in the electric power line entering floating frame, and then improved the homogeneity of plating layer.
Therefore, the floating frame structure can be suitable for electroplating production of printed circuit boards with different sizes, and compared with the traditional floating frame, the uniformity of an electroplated layer is greatly improved, the product quality is further improved, and the technical defects of film clamping, incomplete etching, increased material consumption and the like are further overcome.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a promote PCB and electroplate homogeneity's floating frame structure which characterized in that: it is including setting up in backplate (1) of floating frame both sides, the length direction who just follows the floating frame on two curb plates (6) of floating frame has set firmly many screws (2) in proper order, on backplate (1) and along its length direction welding have a plurality of connecting plates (3) corresponding with screw (2), guide way (4) have all been seted up on the terminal surface of every connecting plate (3), guide way (4) vertical setting, connecting plate (3) hang on the screw rod of screw (2) through guide way (4), the bottom portion of backplate (1) sets up in the below of curb plate (6).
2. The floating frame structure for improving PCB electroplating uniformity of claim 1, wherein: the floating frame comprises a supporting beam (5) and two side plates (6), the two side plates (6) are respectively arranged on the left side and the right side of the supporting beam (5), a connecting frame (7) with a plurality of intervals is welded between the side plates (6) and the supporting beam (5), and window holes (8) with a plurality of intervals are formed in the side plates (6).
3. The floating frame structure for improving PCB electroplating uniformity of claim 1, wherein: the distance between two adjacent screws (2) is equal.
4. The floating frame structure for improving PCB electroplating uniformity of claim 1, wherein: and a plurality of threaded holes corresponding to the screws (2) are formed in the side plate (6) along the length direction of the side plate, and the screws (2) are in threaded connection with the threaded holes.
5. The floating frame structure for improving PCB electroplating uniformity of claim 1, wherein: the two guard plates (1) are symmetrically arranged relative to the floating frame.
6. The floating frame structure for improving PCB electroplating uniformity of claim 1, wherein: the thickness of backplate (1) is 0.5~0.8mm, and the length of backplate (1) equals with the length of curb plate (6), and the interior terminal surface of backplate (1) contacts with the outer terminal surface of curb plate (6).
7. The floating frame structure for improving PCB electroplating uniformity of claim 1, wherein: a plurality of round holes (9) with the diameter of 10-15 mm are formed in the two guard plates (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120945476.8U CN215163261U (en) | 2021-05-06 | 2021-05-06 | Promote PCB and electroplate floating frame structure of homogeneity |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120945476.8U CN215163261U (en) | 2021-05-06 | 2021-05-06 | Promote PCB and electroplate floating frame structure of homogeneity |
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| Publication Number | Publication Date |
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| CN215163261U true CN215163261U (en) | 2021-12-14 |
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| CN202120945476.8U Active CN215163261U (en) | 2021-05-06 | 2021-05-06 | Promote PCB and electroplate floating frame structure of homogeneity |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113564672A (en) * | 2021-07-30 | 2021-10-29 | 苏州浪潮智能科技有限公司 | Promote PCB board electroplating uniformity's tool and plating bath of sheltering from |
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2021
- 2021-05-06 CN CN202120945476.8U patent/CN215163261U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113564672A (en) * | 2021-07-30 | 2021-10-29 | 苏州浪潮智能科技有限公司 | Promote PCB board electroplating uniformity's tool and plating bath of sheltering from |
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