JP2004277783A - Plating device for printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a continuous type plating device for a printed circuit board where shielding boards can be lifted and positioned in accordance with the dimensions in the height direction of a work without requiring a large space. <P>SOLUTION: In the continuous type plating device for a printed circuit board, the upper end of a printed circuit board as a work is clamped by a clamper, and is continuously transferred in a vertical posture to the direction same as the plane of the work. Shielding boards 9 on the work side are provided in the positions across the lower end part of the work in the plating tank body 1 so as to be confronted. The shielding boards 9 are fitted to a shielding board lifting frame 13 so as to freely be lifted. The plating tank body 1 is provided with a winding mechanism consisting of a gear motor 20 lifting the shielding board lifting frame 13 by winding or unwinding a thread 14 fixed to the shielding board lifting frame 13, and a winding pulley 24. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a plating apparatus for a printed wiring board, which can prevent a current from being concentrated on a lower end portion of a work and causing a burn even when plating printed wiring boards having different dimensions in a height direction. .
[0002]
[Prior art]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2000-17494
Generally, when plating a flat work such as a printed wiring board, current is concentrated at the end of the work, especially at the lower end, and burning occurs. As a means for preventing such burning, the anode and the end of the work are used. It is known to provide a shielding plate between them. As a plating apparatus for a printed wiring board, a continuous plating apparatus that continuously transfers a printed wiring board in the vertical direction and in the same direction as a work surface is often used without a jig and capable of high-speed plating. In such a continuous plating apparatus, the work is transported with the upper end clamped, but current concentrates on the end of the work and burns occur. Is the same as that of the plating apparatus.
[0004]
Even in the continuous plating apparatus, the lower end is prevented from burning by a conventionally known method of providing a shielding plate between the anode and the end of the work, but works having different dimensions in the height direction are required. In some cases, the height of the lower end of the work fluctuates. In this case, it is necessary to raise and lower the shielding plate in accordance with the size of the work. Elevating and lowering a mechanism in a plating tank has been conventionally performed. For example, Japanese Patent Application Laid-Open No. 2000-17494 discloses an automatic plating apparatus that raises and lowers a rail or a feed roller for maintenance. However, the shielding plate is rarely raised and lowered automatically, and the lifting device is generally a cylinder. It is difficult to position the shielding plate at an arbitrary position, and the lifting device is lifted up or down the plating tank. There is a problem that a large installation space for the device is required.
[0005]
[Problems to be solved by the invention]
The present invention solves the above-mentioned problems, and provides a continuous-type plating apparatus for a printed wiring board, which can raise and lower a shielding plate in accordance with a dimension in a height direction of a work without requiring a large space. It was done for.
[0006]
[Means for Solving the Problems]
In order to solve the above problem, the printed wiring board plating apparatus of the present invention clamps an upper end of a printed wiring board, which is a work, by a clamper and continuously transfers the work in a vertical posture in the same direction as the plane of the work. A work-side shield plate is provided opposite to a position sandwiching a work lower end in a plating tank body for performing electroplating, and the work-side shield plate is moved up and down by a shield plate elevating frame. The plating tank body is provided with a take-up mechanism for raising and lowering the shield plate lifting frame by winding or rewinding the hanging thread fixed to the shield plate lifting frame so as to be movable up and down. .
[0007]
Here, an anode-side shield plate is provided inside the anode disposed along the inner wall of the plating tank main body so as to be able to move up and down, and the hanging thread fixed to the anode-side shield plate is wound up or down to thereby raise and lower the shield plate lifting frame. Can be provided on the plating tank body, and the work-side shielding plate is divided in the length direction, and each part of the divided work-side shielding plate is separately provided on the shielding plate lifting frame. The plating tank body is provided with a take-up mechanism that can be individually moved up and down and moved up and down individually by lifting or unwinding the hanging thread fixed to each shield plate lifting frame. Is preferred.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an embodiment of a plating apparatus for printed wiring boards of the present invention will be specifically described with reference to the drawings.
FIG. 1 is a longitudinal sectional view of a plating tank viewed from the traveling direction of the work, and FIG. 2 is a partial plan view of the plating tank. In FIG. 1, the work advances from the center to the front in the drawing. In No. 2, it progresses from top to bottom as indicated by the arrow. A large number of nozzles 2 and 2 for spraying a plating solution from both sides of the work toward the work are provided in the plating tank main body 1 side by side in the vertical direction and the traveling direction.
[0009]
The plating tank main body 1 determines the size in the length direction according to the required plating thickness. Although not shown, the front and rear side walls of the plating tank main body 1 are used in a conventional continuous plating apparatus. A liquid leakage prevention device is provided similarly to the plating tank to be used. At the bottom of the plating tank body 1, a partition plate 4 is provided above the bottom plate 3 in parallel with the bottom plate 3, and a plating solution circulating section 5 is provided between the bottom plate 3 and the partition plate 4. The supply pipes 6, 6 and the plating solution discharge pipes 7, 7 are attached, and the plating solution supply pipes 6, 6 are provided in the plating solution circulation section 5, and the plating solution discharge pipes 7, 7 are provided above the partition plate 4 of the plating tank body 1. Each part is in communication.
[0010]
The plurality of nozzles 2, 2 are mounted on nozzle mounting bases 8, 8 divided in the longitudinal direction, and the nozzle mounting bases 8, 8 have plating solution supply passages therein for supplying a plating solution to the nozzles 2, 2. Is provided. The nozzle mounting bases 8 and 8 are fixed to the partition plate 4, and the plating solution supply passages of the nozzle mounting bases 8 and 8 are communicated with the plating solution flowing section 5. Thus, when the plating solution is supplied from the plating solution supply pipes 6, 6, the supplied plating solution is jetted from the nozzles 2, 2 via the plating solution distribution section 5 and the nozzle mounting bases 8, 8, thereby partitioning the plating tank body 1. The portion above the plate 4 is filled and discharged from the plating solution discharge pipes 7,7.
[0011]
Work side shielding plates 9 are provided on both sides of the lower end of the work, and the lower ends of the work side shielding plates 9 are fixed to a shielding plate support plate 10. Also, a large number of guide shafts 11, 11 are arranged vertically on a line sandwiching the work on the shielding plate support plate 10, and a plurality of guide disks 12, 12 are respectively rotated on each of the guide shafts 11, 11. The work is guided freely while being pivoted freely to prevent the lower part of the work from swinging. The shield plate support plate 10 is provided on a horizontal portion 13a of a pair of shield plate lift frames 13 each including a horizontal portion 13a in a direction orthogonal to the work surface and vertical portions 13b, 13b erected from both sides of the horizontal portion 13a. Suspension strings 14, 14 are fixed to the upper portions of the vertical portions 13b, 13b of the shielding plate elevating frame 13, respectively. It is preferable to use a chemical-resistant synthetic resin material such as a polyamide resin as the hanging threads 14 and 14.
[0012]
Anodes 15, 15 are provided along the side walls in the plating tank body 1, and anode-side shielding plates 16, 16 are provided inside the anodes 15, 15. The anode-side shield plates 16, 16 are fixed to shield plate elevating rods 17, which can be moved up and down, and hanging strings 18, 18 are fixed on the upper portions of the shield plate elevator rods 17, 17. Fixed shielding plates 19, 19 are provided upright from the partition plate 4 inside the anode-side shielding plates 16, 16. Although not shown, the fixed shielding plates 19, 19 are provided with a shielding plate elevating frame 13, and guide members for the shielding plate elevating rods 17, 17, so that the work side shielding plates 9, 9 and the anode side shielding plates 16, 16 can be raised and lowered. Is preferably configured to be performed smoothly. As the anodes 15, 15, for example, conventionally used ones in which copper balls are put into a net made of an insoluble metal can be used.
[0013]
Geared motors 20 and 21 are provided on the flange of the plating tank body 1, and take-up pulleys 24, 24, 25 and 25 are attached to output shafts 22 and 23 of the geared motors 20 and 21 to provide a winding mechanism. It is composed. Pulleys 26, 26 and 27, 27 are provided on the upper extensions of the suspending threads 14, 14, 18 and 18, respectively, and the pulleys 26, 26 and 27, 27 provide directions of the suspending threads 14, 14 and 18, 18 respectively. , And are wound by winding pulleys 24, 24 and 25, 25, respectively. Position measuring rods 28, 28 and 29, 29 are attached to the vertical portions 13b, 13b of the shielding plate elevating frame 13 and the shielding plate elevating rods 17, 17, respectively, and are provided by sensors such as limit switches and photoelectric switches (not shown). By detecting the positions, the positions of the work-side shielding plates 9 and 9 and the anode-side shielding plates 16 and 16 can be controlled.
[0014]
The horizontal portion 13a of the shielding plate support plate 10 is arranged in a gap between the nozzle mounting bases 8, 8 formed by dividing the nozzle mounting bases 8, 8, so that the horizontal portion 13a can freely move up and down. When the plating tank main body 1 is long in the length direction, the work-side shield plates 9 and 9, the shield plate support plate 10 and the anode-side shield plates 16 and 16 are divided into appropriate lengths, and each divided portion is divided. An elevating mechanism consisting of geared motors 20 and 21 attached to the horizontal portion 13a of the shielding plate elevating frame 13 and the shielding plate elevating rods 17 and 17 for moving the shielding plate elevating frame 13 and the shielding plate elevating rods 17 and 17 individually. Is preferably provided. FIG. 2 mainly shows one divided portion.
[0015]
3 and 4 show examples of shapes of the upper ends of the work-side shielding plates 9 and 9 viewed from the side. FIG. 3 shows a triangular wavy shape, and FIG. The round holes are arranged side by side to make them transparent. In particular, by making the upper end portions of the work-side shielding plates 9 and 9 close to the work into such a shape, the degree of shielding of the current at the lower end portion of the work by the current shielding plate gradually changes. Has the effect of making the distribution of the plating thickness uniform. If the upper end portions of the anode-side shielding plates 16 and 16 also have such a shape, an effect that the distribution of the plating thickness becomes more uniform can be expected.
[0016]
The plating bath configured as described above is arranged according to the processing steps together with a pre-treatment bath, a washing bath, a post-treatment bath, and the like (not shown) to constitute a plating apparatus for a printed wiring board, and a transfer device (not shown) for transferring a work W is provided. . A conventionally known configuration can be used for the transfer device. In the plating tank, a plating solution is supplied from a storage tank to a plating solution supply pipe 6, the plating solution discharged from a plating solution discharge pipe 7 is returned to the storage tank, and power is supplied from a plating power supply device. Further, necessary processing liquids are supplied to the other processing tanks in accordance with the processing steps, and circulating, stirring and the like are performed as necessary.
[0017]
The work W is clamped at the upper end, enters the plating tank main body 1 through a pretreatment step, is guided by the guide disks 12 and 12 and is transported as shown by the arrow, and the lower end of the work W is the work-side shielding plate 9. Move between nine. When the dimension of the work W in the height direction is reduced, the lower end of the work W moves upward, and the lower end of the work W is not sufficiently covered by the work-side shielding plates 9, 9, resulting in plating burn. Is more likely to occur. Then, when the geared motors 20 and 20 are operated to wind the suspension yarns 14 and 14 by the winding pulleys 24 and 24, the shield plate lifting frame 13 is lifted and the shield plate support plate fixed to the shield plate lifting frame 13 is lifted. The work-side shielding plates 9 and 9 are raised together with 10, so that the lower end portion of the work W is more largely covered, and the occurrence of plating burn at the lower end portion of the work W is prevented.
[0018]
When the dimension of the work W in the height direction increases, the lower end of the work W moves downward, and the portion of the lower end of the work W that needs to be plated is covered with the work-side shielding plates 9 and 9 and plated. Some parts will not be created. Then, if the geared motors 22 and 22 are operated to reverse the winding pulleys 24 and 24 and rewind the hanging strings 14 and 14, the shielding plate elevating frame 13 descends by its own weight, and is fixed to the shielding plate elevating frame 13. The work-side shield plates 9 and 9 also descend together with the shield plate support plate 10 that is present. Thus, the work W-side shield plates 9 and 9 can cover the lower end of the work W properly so that the plating can be performed without causing plating burn. In addition, since the guide disks 12, 12 also descend at the same time, the lower end of the work W is reliably guided.
[0019]
The positions of the work-side shielding plates 9, 9 can be controlled in accordance with the height dimension of the work W by detecting the positions of the position measuring rods 28, 28, 29, 29 with a sensor. , 24 can also be controlled by detecting rotation of the output shaft 22 to which the output shaft 22 is attached. When the dimension of the work W in the height direction changes, the position of the work-side shielding plates 9 cannot be changed until the processing of the work W currently being processed is completed. It is necessary to provide a space of the same length as that of the plating tank between the work W. On the other hand, when the work-side shield plates 9 and 9 and the shield plate support plate 10 are divided, the length of the divided work-side shield plates 9 and 9 is set between the previous work W and the next work W. There is an advantage that it is sufficient if there is enough space, and waste when switching the work W is reduced.
[0020]
Generally, by providing the work-side shielding plates 9 and 9 and moving them, it is possible to prevent the burning of plating at the lower end portion of the work and to make the plating thickness uniform, but the anode-side shielding plates 16 and 16 are provided. By adjusting the position, a further uniform plating thickness can be realized. In this case, a desired degree of uniform plating thickness can be obtained by moving the work-side shield plates 9 and 9 and the anode-side shield plates 16 and 16 without moving them individually and without changing their mutual positional relationship. In such a case, the take-up pulley 25 may be attached to the output shaft 22 of the geared motor 20 without providing the geared motor 21.
[0021]
【The invention's effect】
As apparent from the above description, the present invention mounts the work-side shield plate on the shield plate elevating frame so as to be movable up and down, and winds up the suspension thread fixed to the shield plate elevating frame by the winding mechanism provided in the plating tank body. Alternatively, since the shield plate lifting frame is raised and lowered by rewinding, the work-side shield plate can be positioned at an arbitrary position, and there is an advantage that a large space such as a lifting device using a cylinder is not required. is there. Therefore, it is extremely important to provide the plating apparatus for printed wiring boards which solves the conventional problems to the industry.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a main part showing an embodiment of the present invention.
FIG. 2 is a plan view of a main part showing the embodiment of the present invention.
FIG. 3 is a diagram showing an example of a shape of an upper end portion of a shielding plate as viewed from a side.
FIG. 4 is a diagram showing another example of the shape of the upper end portion of the shielding plate as viewed from the side.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Plating tank main body 2 Nozzle 3 Bottom plate 4 Partition plate 5 Plating solution circulation part 6 Plating solution supply tube 7 Plating solution discharge tube 8 Nozzle mounting base 9 Work side shielding plate 10 Shielding plate support plate 11 Guide shaft 12 Guide disk 13 Descending and descending shielding plate Frame 14 Suspension thread 15 Anode 16 Anode side shield plate 17 Shield plate lifting rod 18 Suspension thread 19 Fixed shield plate 20, 21 Geared motor 22, 23 Output shaft 24, 25 Take-up pulley 26, 27 Pulley 28, 29 Position measuring rod

Claims (3)

A continuous plating apparatus for printed wiring boards that clamps the upper end of a printed wiring board, which is a work, with a clamper and continuously transfers the work in the vertical direction in the same direction as the plane of the work. A work side shield plate is provided opposite to a position sandwiching the lower end portion of the work inside, and the work side shield plate is attached to a shield plate elevating frame so as to be movable up and down, and a hanging thread fixed to the shield plate elevating frame is wound or A plating apparatus for a printed wiring board, wherein a winding mechanism for raising and lowering a shielding plate lifting frame by rewinding is provided in a plating tank body. An anode-side shield plate is provided movably up and down inside the anode arranged along the inner wall of the plating tank main body, and the suspension plate fixed to the anode-side shield plate is wound up or down to raise and lower the shield plate lifting frame. The plating apparatus for a printed wiring board according to claim 1, wherein the winding mechanism is provided on the plating tank main body. Divide the work-side shield plate in the length direction, attach each part of the divided work-side shield plate to the shield plate elevating frame, make it individually movable up and down, and wind up the hanging thread fixed to each shield plate elevating frame 3. The plating apparatus for a printed wiring board according to claim 1, wherein a winding mechanism for individually raising and lowering each shielding plate lifting frame by rewinding is provided in the plating tank body.

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