JPH02243800A - Production of lead terminal - Google Patents
Production of lead terminalInfo
- Publication number
- JPH02243800A JPH02243800A JP6422689A JP6422689A JPH02243800A JP H02243800 A JPH02243800 A JP H02243800A JP 6422689 A JP6422689 A JP 6422689A JP 6422689 A JP6422689 A JP 6422689A JP H02243800 A JPH02243800 A JP H02243800A
- Authority
- JP
- Japan
- Prior art keywords
- noble metal
- layer
- base
- metal layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title description 4
- 229910000510 noble metal Inorganic materials 0.000 claims abstract description 41
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 239000011810 insulating material Substances 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 50
- 229910052759 nickel Inorganic materials 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 abstract description 29
- 239000000758 substrate Substances 0.000 abstract description 14
- 238000007796 conventional method Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000002411 adverse Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 208000001840 Dandruff Diseases 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔概要〕
接続部に貴金属層を設りたソー１端子の中間部に、該貴
金属層の下に被着したニッケル層を表呈ゼしめたバリヤ
を形成するための方法に関し、経済的に伝れると共に、
貴金属層の品位を損なうことなく該バリヤを形成させる
ことを目的とし、導電材料にてなる棒状基体の表面に被
着したニッケル層の上に貴金属層を被着し、該ニッケル
層の一部分が鉢巻状に表呈するように該貴金属層の中間
部を除去するに際して、
電解装置電源のプラス電極に接続した該基体を該貴金属
層の電解剥１ｉｉｌｔ液に浸漬し、絶縁材料にてなり該
中間部より一方および他方の該基体を囲う遮蔽体には、
該中間部の導出される開口より奥に該基体に向けて突出
する突起を設け、
該電解２．１１ Ｑ’ｄ液の中て該遮峨体より表呈する
該中間部の少なくともほぼ対称の２力向には、該電源の
マイナス電極に接続された電極板を対向せしめ、該基体
と該電極板とに電解電流を印加することを特徴とし構成
する。[Detailed Description of the Invention] [Summary] A barrier for forming a barrier in which a nickel layer deposited under the noble metal layer is exposed at the middle part of a saw 1 terminal in which a noble metal layer is provided at the connection part. Regarding the method, it can be transmitted economically and
In order to form the barrier without impairing the quality of the noble metal layer, a noble metal layer is deposited on a nickel layer deposited on the surface of a rod-shaped substrate made of a conductive material, and a portion of the nickel layer is formed into a headband. When removing the middle part of the noble metal layer so that a shape appears, the base connected to the positive electrode of the electrolyzer power supply is immersed in an electrolytic stripping solution for the noble metal layer, and an insulating material is removed from the middle part. The shields surrounding the one and other bases include:
A protrusion protruding toward the base body is provided deeper than the opening from which the intermediate portion is led out, and at least a substantially symmetrical two of the intermediate portion is exposed from the barrier in the electrolytic 2.11 Q'd liquid. In the direction of force, an electrode plate connected to the negative electrode of the power source is opposed to each other, and an electrolytic current is applied to the base and the electrode plate.
ヤが必要である。Ya is necessary.
一般に、貴金属層はその密Ｚｉ力をも■保するためニッ
ケル層を下地として形成されるが、前記ハリ・）・はニ
ッケル層の一部分を表呈さ−Ｕるごとにより形成可能で
ある。Generally, the noble metal layer is formed using a nickel layer as a base to maintain its density, but the above-mentioned hardness can be formed by exposing a part of the nickel layer.
本発明は導電性棒状基体の表面に被着せしめた貴金属層
の一部を除去し、貴金属層の下に形成したニッケル層の
一部分を表呈せしめ、はんだに対するニッケルバリヤを
有するリード端子の製造方法に関する。The present invention is a method for manufacturing a lead terminal having a nickel barrier against solder by removing a part of a noble metal layer deposited on the surface of a conductive rod-shaped substrate to expose a part of a nickel layer formed under the noble metal layer. Regarding.
電子機器の小型化と共に、配線基板に実装される電子部
品は小型化しリード端子も微細化し、電子部品本体部お
よび電子部品を実装する配線との接続媒体となるリード
端子の表面には、金等の貴金属層が形成されるが、はん
だにて該リード端子と配線基板の導体パターンとを接続
したとき、はんだが貴金属層に悪影響を及ぼすことがあ
るため、リート端子の表面には該悪影響を遮断させるハ
リ〔従来の技術〕
第２図は表面実公用電子部品の−・部を示す斜視図であ
り、混成集積回路１は本体基板２にほぼＬ字形をした複
数本のリード端子３を２列に設り、各リード端子３の下
辺は配線基板の導体パターンに当接させた状態ではんだ
により接続される。As electronic devices become smaller, the electronic components mounted on wiring boards become smaller and the lead terminals become finer, and the surface of the lead terminal, which is the connection medium between the electronic component body and the wiring on which the electronic component is mounted, is coated with gold, etc. However, when the lead terminal and the conductor pattern of the wiring board are connected with solder, the solder may have an adverse effect on the noble metal layer. [Prior art] Fig. 2 is a perspective view showing the front side of an electronic component for public use.The hybrid integrated circuit 1 has two rows of a plurality of lead terminals 3 each having an approximately L-shape on a main body substrate 2. The lower side of each lead terminal 3 is connected by solder while being in contact with the conductor pattern of the wiring board.
かかるリード端子３は、銅合金等の導電祠料をプレス加
工て櫛歯状の連結部材に形成し、連続めっきで所定の表
面処理を施すのが普通である。Such lead terminals 3 are usually formed into a comb-like connecting member by pressing a conductive abrasive material such as a copper alloy, and then subjected to a predetermined surface treatment by continuous plating.
第３図は第２図に示すリード端子の拡大断面図であり、
リード端子３は、例えば燐青銅にてなる基体４の表面に
電気めっきによるニッケル層５を形成し、ニッケル層５
の上には基板２のバッドに接続する金等の貴金属層６と
、配線基板９の導体パターン１０にはんだ１１にて接続
される金等の貴金属層７とを形成し、電気めっきによる
９金属層６と７は、はんだ１１による貴金属Ｎ６の悪影
響を防止するため、ニッケル層５の一部が表呈するバリ
ヤ８を形成してなる。FIG. 3 is an enlarged sectional view of the lead terminal shown in FIG.
The lead terminal 3 is formed by forming a nickel layer 5 by electroplating on the surface of a base 4 made of, for example, phosphor bronze.
A noble metal layer 6 such as gold, which is connected to the pads of the board 2, and a noble metal layer 7, such as gold, which is connected to the conductive pattern 10 of the wiring board 9 with solder 11 are formed on the top, and 9 metal layers are formed by electroplating. Layers 6 and 7 form a barrier 8 in which part of the nickel layer 5 is exposed, in order to prevent the adverse effects of the noble metal N6 on the solder 11.
第４回（イ）〜（ハ）はニッケルバリヤを形成する第１
の従来方法の説明図、第５図（イ） 、 （ＩＩ）はニ
ッケルバリヤを形成する第２の従来方法の説明図である
。Part 4 (a) to (c) are the first steps to form a nickel barrier.
FIGS. 5(A) and 5(II) are explanatory diagrams of a second conventional method for forming a nickel barrier.
第４圓において、マスクを使用しバリヤ部に貴金属層が
被着しないようにする第１の従来方法は、基体４にニッ
ケル層５を形成し、その上にマスク１２を形成したのち
、貴金属層６を形成させる。次いで、マスク１２を除去
して別のマスク１３を形成し、貴金属Ｎ７を形成したの
ち、マスク１３を除去してリード端子３が完成する。In the fourth circle, the first conventional method of using a mask to prevent the noble metal layer from adhering to the barrier part is to form the nickel layer 5 on the base 4, form the mask 12 on it, and then form the noble metal layer. Form 6. Next, the mask 12 is removed and another mask 13 is formed to form the noble metal N7, and then the mask 13 is removed to complete the lead terminal 3.
第５ズにおいて、責丘属層の一部を除去してバリヤを形
成させる第２の従来方法は、基体４にニッケルＮ５を形
成し、その上に貴金属層１４を形成したのち、バリヤを
形成すべき基体４の中間部が表呈するように、該中間部
より一方および他方を遮皓体１７にて囲い、該中間部に
向はノズル１５より剥離液１６を噴射するごとによりバ
リヤ８を形成すると共に、貴金属層６と７が形成される
。In the fifth step, the second conventional method of forming a barrier by removing a part of the metal layer is to form nickel N5 on the base 4, form the noble metal layer 14 thereon, and then form the barrier. In order to expose the middle part of the substrate 4 to be removed, one side and the other side are surrounded by a shielding body 17 from the middle part, and a barrier 8 is formed by spraying the stripping liquid 16 from the nozzle 15 towards the middle part. At the same time, noble metal layers 6 and 7 are formed.
ニッケルバリヤを形成する前記第１の従来方法は、マス
ク１２．１３を利用し貴金属層６と７を別工程で形成す
るため、経済的に不利であるという問題点がある。The first conventional method for forming the nickel barrier has a problem in that it is economically disadvantageous because the noble metal layers 6 and 7 are formed in separate steps using masks 12 and 13.
ニッケルバリヤを形成する前記第２の従来方法は、第１
の従来方法より生産的に（Ｅれるがニッケルバリヤの幅
を揃えることが困難であり、貴金属層６および７の品位
が、剥離液１６の飛着によって損なわれ易いという問題
点があった。The second conventional method of forming a nickel barrier includes the first method of forming a nickel barrier.
Although this method is more productive than the conventional method, it is difficult to make the width of the nickel barrier uniform, and the quality of the noble metal layers 6 and 7 is easily damaged by the stripping liquid 16 flying onto the surface.
本発明の目的は、経済的に価れ貴金属層の品位を（員な
うことなく、ニッケルバリヤを形成する新規方法を提供
することである。It is an object of the present invention to provide a new method for forming a nickel barrier economically and without compromising the integrity of the precious metal layer.
［課頴を解決するだめの手段〕
上記口約は本発明の実施例を示す第１図によれば、
導電材料にてなる棒状基体４の表面に被着した二・７ケ
ル層５の上に貴金属層１４を被着し、基体４に対しニッ
ケル層５の一部分が鉢巻状に表呈するように負金属層１
４の中１；））部を除去するに際して、電解装置電源の
プラス電極に接続した基体４を貴金属層１４の電解ヱリ
離液２３に浸漬し、絶縁材料にてなり該中間部より一方
および他方の該基体を囲う遮蔽体２Ｌ２２には、該中間
部の導出される開口２１ａ、２２ａより奥に基体４に向
けて突出する突起２１ｂ、２２ｂを設け、
電解剥離液２３の中で遮蔽体２Ｌ２２より表呈する該中
間部の対称２方向には、該電源のマイナス電極に接続さ
れた電極板２４を対向せしめ、そこで、基体４と電極板
２４とに電解電流を印加すると、遮蔽体２Ｌ２２より表
呈する基体４の中間部では貴金属層１４が除去されて下
地のニッケル層５が表呈しバリヤが形成されると共に、
バリヤの上方および下方には貴金属層が形成される。[Failure to solve the problem] The above statement is based on the 2.7 Kel layer 5 adhered to the surface of the rod-shaped substrate 4 made of a conductive material, according to FIG. 1 showing an embodiment of the present invention. A noble metal layer 14 is deposited on the negative metal layer 1 so that a part of the nickel layer 5 appears in a headband shape with respect to the base 4.
When removing the part 1; The shielding body 2L22 surrounding the other base body is provided with protrusions 21b and 22b that protrude toward the base body 4 deeper than the openings 21a and 22a from which the intermediate portion is led out, and the shielding body 2L22 is provided in the electrolytic stripper 23. An electrode plate 24 connected to the negative electrode of the power source is opposed to the two symmetrical directions of the intermediate portion, which is more exposed, and when an electrolytic current is applied to the base 4 and the electrode plate 24, the shielding body 2L22 is exposed. In the middle part of the substrate 4, the noble metal layer 14 is removed to expose the underlying nickel layer 5, forming a barrier.
A noble metal layer is formed above and below the barrier.
７Ｓ、解剥湘液と基体の中間部を表呈せしめる遮ａｙ体
とを使用し、該基体中間部の導出される開口を有する該
遮蔽体には該開口より奥に該基体に向けて突出する突起
を具えセしめ、基体に被着させた貴金属層の一部を除去
し、Ｍｉ金属層の下地として被着させたニッケル層の一
部を表呈させてバリヤとする上記手段によれば、前述し
た第１の従来方法より工程が少なくて済み、電解方法を
採用するに際して、非ヱリ離部分を保護する遮蔽体を基
体に密着させるとその境界部分に生じる剥離の不完全性
（剥離片の不分離等）を、遮蔽体の基体中間部の導出口
より奥に基体に開けて突出する突起を設けたことによっ
て、電解剥離液の淀みおよび弱電解領域ができ該不完全
性をなくすようになり、前述した第２の従来方法より残
存貴金属層の品位を高めた効果が得られる。7S, using a demolition liquid and a shield that exposes the middle part of the base, and the shield having an opening from which the middle part of the base is led out has a part that protrudes toward the base deeper than the opening. According to the above method, a part of the noble metal layer deposited on the substrate is removed, and a part of the nickel layer deposited as a base of the Mi metal layer is exposed to serve as a barrier. , it requires fewer steps than the first conventional method mentioned above, and when adopting the electrolytic method, incomplete peeling (peeling By providing a protrusion that protrudes from the outlet in the intermediate part of the base of the shielding body, the electrolytic stripping solution stagnates and the weak electrolytic area is created. Thus, the effect of improving the quality of the remaining precious metal layer compared to the second conventional method described above can be obtained.
以下に、図面を用いて本発明の詳細な説明する。 The present invention will be explained in detail below using the drawings.
第１閲は本発明の一実施例によるリード端子の製造方法
の説明図である。The first view is an explanatory diagram of a method for manufacturing a lead terminal according to an embodiment of the present invention.
前出図と共通部分乙こ同一符号を使用した第１Ｔ：３に
おいて、二、ケル層５と貴金属層１４とを形成し電解装
置電源のプラス′電極に接続した基体４は、ニッケルバ
リヤを形成丁べき中間部より上方を囲う遮Ｑ体２１と、
該中間部より下方を囲う遮蔽体２２に収容し、貴金属Ｎ
６の電解剥離液２３に浸漬する。In the 1st T: 3, which uses the same reference numerals as those in the previous figure, 2. The substrate 4 formed with the Kel layer 5 and the noble metal layer 14 and connected to the positive electrode of the electrolyzer power supply forms a nickel barrier. A shield Q body 21 that surrounds the upper part of the middle part,
The noble metal N
It is immersed in the electrolytic stripping solution 23 of No. 6.
例えば貴金属層１４が金にてなるとき電解剥離液２３に
は、ノアンベース （ＫＣＮ、Ｎａ ＣＮ）等の電解剥
離液にレヘリング剤（Ｎａ ＣＯ，等）を混ぜて使用す
る。For example, when the noble metal layer 14 is made of gold, the electrolytic stripper 23 is a mixture of an electrolytic stripper such as Noanbase (KCN, Na CN) and a lehering agent (Na CO, etc.).
電解′１．１］ Ｋｉ液２３に対する耐性を有する絶縁
材料にてなる遮蔽体２１ 、２２は、基体４の中間部が
導出される開口２１ａ、２２ａより奥に基体４に向けて
突出する突起２１ｂ、 ２２ｂを具えてなる。Electrolysis '1.1] The shields 21 and 22 made of an insulating material having resistance to the Ki solution 23 have protrusions 21b that protrude toward the base 4 deeper than the openings 21a and 22a through which the intermediate portions of the base 4 are led out. , 22b.
また、電解剥離液２３には電解装置電源のマイナス電極
に接続さセた一対の電極板２４を浸漬し、対の電極板２
４は遮蔽体２１，２２より表呈する基体４の中間部を挟
むようにする。In addition, a pair of electrode plates 24 connected to the negative electrode of the electrolytic device power source are immersed in the electrolytic stripper 23, and the pair of electrode plates 24 is
4 sandwich the intermediate portion of the base 4 exposed from the shields 21 and 22.
このようにしたのち、基体４と電極板２４とに適当な電
！４７＋電流を印加すると、ｊ１金属層１４は該中間部
に被着する部分が除去され、第４図および第５図に示す
バリヤ８が形成されると井に、貴金属層６と７が形成さ
れるが、遮蔽体２Ｌ２２の開口２１ａ。After doing this, apply a suitable voltage to the base 4 and the electrode plate 24. When a 47+ current is applied, the portion of the j1 metal layer 14 that adheres to the intermediate portion is removed, forming the barrier 8 shown in FIGS. 4 and 5, and forming the noble metal layers 6 and 7 in the well. However, the opening 21a of the shielding body 2L22.
２２ａ部には電解剥離液２３の流通が滞る溜りができる
と共に、電極板２４に対する影になって弱電解領域がで
きる。そのため、バリーｔ−８の境界における貴金属層
６と７の密着力は、バリヤ８の形成に係わらず確保され
る。In the portion 22a, a pool is formed where the flow of the electrolytic stripper 23 is hindered, and a weak electrolytic region is formed as a shadow against the electrode plate 24. Therefore, the adhesion between the noble metal layers 6 and 7 at the boundary of the burr t-8 is ensured regardless of the formation of the barrier 8.
以上説明したように本発明方法によれば、貴金属層の下
地として被着させたニッケル層の一部壱表呈させるバリ
ヤを有するリード端子に対し、バリヤの形成が容易であ
り、遮蔽体に囲われた貴金属層の品位の損なわれること
がなく、バリヤを形成した境界部番こおける貴金属層の
密名力が川なわれないという効果を有する。As explained above, according to the method of the present invention, it is easy to form a barrier for a lead terminal having a barrier that exposes a portion of the nickel layer deposited as the base of the noble metal layer, and is surrounded by a shield. This has the effect that the quality of the noble metal layer is not impaired, and the secret strength of the noble metal layer at the boundary where the barrier is formed is not lost.
第１図は本発明の一実施例によるリード端子の製造方法
の説明図、
第２図は表面実装用電子部品の斜視図、第３図は第２図
に示すリード端子の拡大断面図、第４図はニッゲルハリ
ャを形成する第１の従来方法の説明図、
第５図はニソケルハリャを形成する第２の従来方法の説
明図、
である。
図中において、
３はリード端子、
４は基体、
５は二・フケ１１層、
６．７．１４は貴金属層、
８はバリヤ、
２１．２２は遮蔽体、
２１ａ、２２．、ζＪ閉開口
２ｔｂ、２２ｂは突起、
２３は電解、／、１１月１液、
２４は電極板、
を示ず。FIG. 1 is an explanatory diagram of a method for manufacturing a lead terminal according to an embodiment of the present invention, FIG. 2 is a perspective view of a surface mounting electronic component, and FIG. 3 is an enlarged sectional view of the lead terminal shown in FIG. FIG. 4 is an explanatory diagram of the first conventional method for forming Niggel Harya, and FIG. 5 is an explanatory diagram of the second conventional method for forming Niggel Harya. In the figure, 3 is a lead terminal, 4 is a base, 5 is a second layer and 11 layers of dandruff, 6.7.14 is a noble metal layer, 8 is a barrier, 21.22 is a shield, 21a, 22. , ζJ closed opening 2tb, 22b is a protrusion, 23 is electrolysis, /, November 1 liquid, 24 is an electrode plate, and is not shown.
Claims (1)
ケル層（５）の上に貴金属層（１４）を被着し、該基体
（４）に対し該ニッケル層（５）の一部分が鉢巻状に表
呈するように該貴金属層（１４）の中間部を除去するに
際して、 電解装置電源のプラス電極に接続した該基体（４）を該
貴金属層（１４）の電解剥離液（２３）に浸漬し、絶縁
材料にてなり該中間部より一方および他方の該基体を囲
う遮蔽体（２１、２２）には、該中間部の導出される開
口（２１ａ、２２ａ）より奥に該基体（４）に向けて突
出する突起（２１ｂ、２２ｂ）を設け、該電解剥離液（
２３）の中で該遮蔽体（２１、２２）より表呈する該中
間部の少なくともほぼ対称の２方向には、該電源のマイ
ナス電極に接続された電極板（２４）を対向せしめ、 該基体（４）と該電極板（２４）とに電解電流を印加す
ることを特徴とするリード端子の製造方法。[Claims] A noble metal layer (14) is deposited on a nickel layer (5) deposited on the surface of a rod-shaped base (4) made of a conductive material, and the nickel layer is deposited on the base (4). When removing the middle part of the noble metal layer (14) so that a part of (5) appears in the shape of a headband, the base (4) connected to the positive electrode of the electrolyzer power source is used to electrolyze the noble metal layer (14). The shields (21, 22), which are immersed in a stripping liquid (23) and are made of an insulating material and surround the one and the other base from the intermediate part, have openings (21a, 22a) led out from the intermediate part. Protrusions (21b, 22b) protruding toward the base (4) are provided at the back, and the electrolytic stripper (
An electrode plate (24) connected to the negative electrode of the power source is opposed to at least two substantially symmetrical directions of the intermediate portion exposed from the shield (21, 22) in the base (23); 4) and applying an electrolytic current to the electrode plate (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6422689A JPH02243800A (en) | 1989-03-16 | 1989-03-16 | Production of lead terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6422689A JPH02243800A (en) | 1989-03-16 | 1989-03-16 | Production of lead terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02243800A true JPH02243800A (en) | 1990-09-27 |
Family
ID=13251982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6422689A Pending JPH02243800A (en) | 1989-03-16 | 1989-03-16 | Production of lead terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02243800A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004152750A (en) * | 2002-10-10 | 2004-05-27 | Matsushita Electric Works Ltd | Soldering terminal and treatment method of surface of soldering terminal |
| WO2008072418A1 (en) * | 2006-12-13 | 2008-06-19 | Nikko Fuji Electronics Co., Ltd. | Male terminal, and its manufacturing method |
| WO2015060975A1 (en) * | 2013-10-24 | 2015-04-30 | United Technologies Corporation | Method for creating airfoil leading and trailing edges |
| JP2015149448A (en) * | 2014-02-07 | 2015-08-20 | ローム株式会社 | Light emitting module, light emitting device and method of manufacturing light emitting module |
| US10090448B2 (en) | 2014-02-07 | 2018-10-02 | Rohm Co., Ltd. | Light-emitting module, light-emitting device and method of making light-emitting module |
-
1989
- 1989-03-16 JP JP6422689A patent/JPH02243800A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004152750A (en) * | 2002-10-10 | 2004-05-27 | Matsushita Electric Works Ltd | Soldering terminal and treatment method of surface of soldering terminal |
| WO2008072418A1 (en) * | 2006-12-13 | 2008-06-19 | Nikko Fuji Electronics Co., Ltd. | Male terminal, and its manufacturing method |
| WO2015060975A1 (en) * | 2013-10-24 | 2015-04-30 | United Technologies Corporation | Method for creating airfoil leading and trailing edges |
| EP3060703A4 (en) * | 2013-10-24 | 2017-08-09 | United Technologies Corporation | Method for creating airfoil leading and trailing edges |
| US10675697B2 (en) | 2013-10-24 | 2020-06-09 | Raytheon Technologies Corporation | Method for creating airfoil leading and trailing edges |
| JP2015149448A (en) * | 2014-02-07 | 2015-08-20 | ローム株式会社 | Light emitting module, light emitting device and method of manufacturing light emitting module |
| US10090448B2 (en) | 2014-02-07 | 2018-10-02 | Rohm Co., Ltd. | Light-emitting module, light-emitting device and method of making light-emitting module |
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