CN105274608B - Electroplating connector and electroplating equipment - Google Patents
Electroplating connector and electroplating equipment Download PDFInfo
- Publication number
- CN105274608B CN105274608B CN201510015554.3A CN201510015554A CN105274608B CN 105274608 B CN105274608 B CN 105274608B CN 201510015554 A CN201510015554 A CN 201510015554A CN 105274608 B CN105274608 B CN 105274608B
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- China
- Prior art keywords
- electroplating
- conductance
- cable
- value
- sectional area
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- 238000009713 electroplating Methods 0.000 title claims abstract description 78
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 5
- 239000010936 titanium Substances 0.000 abstract description 5
- 229910052719 titanium Inorganic materials 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 7
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 5
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 101100493711 Caenorhabditis elegans bath-41 gene Proteins 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000002048 anodisation reaction Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 208000019901 Anxiety disease Diseases 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating connector and electroplating equipment, wherein the electroplating connector comprises a conductive frame, a conductive joint and a plurality of conductive switching columns, the conductive joint is arranged on the conductive frame and is connected with a cable, the cable is provided with a cable core, the conductivity of the material of the cable core is taken as the first conductivity, the conductivity of the material of the conductive joint is taken as the second conductivity, the value obtained by multiplying the minimum sectional area of the cable by the first conductivity is taken as a dividend value, and the quotient obtained by dividing the value obtained by multiplying the second conductivity by the number of the conductive switching columns by the divisor value is smaller than or equal to the minimum sectional area of the conductive joint. By the electroplating connector and the electroplating equipment with the electroplating connector, the condition that the electroplating connector is burnt can be reduced, and further, the unnecessary use amount of titanium materials can be reduced, so that the equipment cost is reduced.
Description
Technical field
The present invention is related to a kind of electroplating connector and the electroplating device with the electroplating connector.
Background technology
Tradition such as flash copper（FCP）Deng electroplating device, often using rectifier control electric current and voltage, and by cable by electricity
It is delivered on insoluble anode electroplate.And conduction is carried out because anodization plate must be immersed in copper sulfate solution, to produce
Galvanic action, therefore anodization plate is generally using the making of titanium material.However, the core of cable can not but be soaked in sulphur for a long time
In sour copper liquid, therefore in order to solve this problem, it will usually which anodization plate is made into particular design, the position of importing electric current will be needed
Put the region that no copper sulfate solution immersion is extended to column or strip entity（Such as extend on copper sulfate solution liquid level）, then by cable
It is conductively connected with copper tip, the problem of being soaked between can not being grown with the core for overcoming cable in copper sulfate solution.
But, above-mentioned design can still cause the usage amount of titanium material to increase, and easily cause extended position because of difficulty
Burnt with bearing electric current, therefore also produce the anxiety of increase equipment cost.
The content of the invention
It is a primary object of the present invention to provide a kind of electroplating connector and electroplating device, to be connected to a cable and one
Between galvanic anode plate.
The present invention provides a kind of electroplating connector, and to be connected between a cable and a galvanic anode plate, cable has
Cable core, and using the conductance of the material of cable core as the first conductance；Electroplating connector includes a conduction rack, located at leading
One conductive contact of electric frame and multiple conductance connecting columns, conductive contact have a terminals to be electrically connected with the cable, and
Using the conductance of the material of conductive contact as the second conductance, and each conductance connecting column is then electrically connected with galvanic anode plate；Wherein,
The value that the minimum sectional area of cable is multiplied by the first conductance is dividend value, and the quantity of conductance connecting column is multiplied by with the second conductance
Value be divided by for divider value after, the quotient value obtained is less than or equal to the minimum sectional area of conductive contact.
In order to reach above-mentioned purpose, the present invention also provides a kind of electroplating device, a workpiece to be electroplated；Plating
Equipment include a power supply source, an electroplating bath, a galvanic anode plate and multiple electroplating connectors, power supply source have electrode cable with
Negative pole cable, negative pole cable is electrically connected with workpiece, electroplating bath into a holding part, to accommodate electroplate liquid and immerse electricity for workpiece
In plating solution, galvanic anode plate is placed in electroplating bath and relative to workpiece either side, and is electrically connected with electrode cable, and power supply source
Electrode cable has cable core, and using the conductance of the material of cable core as the first conductance, and each electroplating connector connects
It is connected between electrode cable and galvanic anode plate, electroplating connector is transferred comprising a conduction rack, a conductive contact and multiple conductances
Post, conductive contact is respectively arranged on conduction rack with each conductance connecting column, and is led using the conductance of the material of conductive contact as second
Electric rate；Wherein, the value that the minimum sectional area of electrode cable is multiplied by the first conductance is dividend value, and electricity is multiplied by with the second conductance
The value for leading the quantity of connecting column is that the quotient value obtained is less than or equal to the smallest cross-sectional of conductive contact after divider value is divided by
Product.
Present invention has the advantage that：
By means of electroplating connector provided by the present invention and the electroplating device with the electroplating connector, plate bonding can be reduced
The situation that device burns, and then unnecessary titanium materials'use amount can be reduced, to reduce equipment cost.
Brief description of the drawings
Fig. 1 is the three-dimensional appearance schematic diagram of electroplating connector of the present invention.
Fig. 2 is the planar appearance schematic diagram of electroplating connector of the present invention.
Fig. 3 is Fig. 2 2A-2A cross-section cutaway views.
Fig. 4 is Fig. 2 2B-2B cross-section cutaway views.
Fig. 5 is Fig. 2 2C-2C cross-section cutaway views.
Fig. 6 is Fig. 2 2D-2D cross-section cutaway views.
Fig. 7 is the planar appearance schematic diagram that electroplating connector of the present invention connects galvanic anode plate.
Fig. 8 is the planar appearance schematic diagram of another embodiment of electroplating connector of the present invention.
Fig. 9 is the planar appearance schematic diagram of the another embodiment of electroplating connector of the present invention.
Figure 10 is electroplating device of the present invention in the floor map laterally set.
Figure 11 is that electroplating device of the present invention is in the floor map uprightly set.
In figure：
1- electroplating connectors；
10- conduction racks；
100- adapters；
The faying faces of 101- first；
102- engaging members；
11- conductive contacts；
110- terminals；
111- change-over terminals；
The faying faces of 112- second；
12- conductance connecting columns；
2- cables；
20- electrode cables；
200- cable cores；
21- negative pole cables；
3- galvanic anode plates
4- workpiece；
40- power supply sources；
41- electroplating baths；
410- holding parts；
411 electroplate liquids.
Embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, so that those skilled in the art can be with
It is better understood from the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
Fig. 1, Fig. 2 and Fig. 7 are referred to, respectively the three-dimensional appearance schematic diagram of electroplating connector of the present invention, planar appearance are shown
Intention and electroplating connector connect the planar appearance schematic diagram of galvanic anode plate.The present invention provide a kind of electroplating connector and
Electroplating device, the electroplating connector 1 is to be connected between a cable 2 and a galvanic anode plate 3, to provide electroplating device to one
Workpiece 4 is electroplated；The electroplating connector 1 includes a conduction rack 10, a conductive contact 11 and multiple conductance connecting columns 12, its
In：
The conduction rack 10 can be in an elongate posts to connect above-mentioned conductive contact 11 and each conductance connecting column 12, conduction rack 10
Body or long strip-board shape body, in order to conductive contact 11 and each conductance connecting column 12 can along the body of rod of conduction rack 10 or plate extension
Direction is set respectively.
The conductive contact 11 has a terminals 110 so that the cable 2 is made electrically to connect on above-mentioned conduction rack 10
Connect；Wherein, the cable 2 has cable core 200（As shown in Figure 2）, after the insertion terminals 110 of cable 2 are interior, i.e., by exposed
Cable core 200 and reached with conductive contact 11 in electrical contact.And the present invention for embodiment in, above-mentioned conduction rack 10
An adapter 100 is provided with, adapter 100 can be integrally formed on conduction rack 10, the side of adapter 100 has one first to combine
Face 101, and conductive contact 11 then has more a change-over terminal 111, change-over terminal 111 is located at one end mutually remote with terminals 110
On, and the side of change-over terminal 111 has one second faying face 112, change-over terminal 111 implies that institute by being laterally incorporated on adapter 100
State the first faying face 101 and after the second faying face 112 fits, and with an engaging member 102 by first faying face 101,
Second faying face 112 and combine adapter 100 and change-over terminal 111, whereby conductive contact 11 can be enable to be connected with conduction rack 10
Connect.And the engaging member 102 can be a bolt.
The conductance connecting column 12 is respectively arranged on above-mentioned conduction rack 10, to make electrically to connect with the galvanic anode plate 3.And
The present invention for embodiment in, the quantity n of each conductance connecting column 12 can be set up according to the demand of actual electroplating activity, i.e., such as
Shown in Fig. 8 or Fig. 9.
Accordingly, also referring to shown in Fig. 2, Fig. 3 and Fig. 4, the present invention is essentially consisted in the material of the cable core 200
Conductance be the first conductance ρ 1, the conductance of the material of the conductive contact 11 is the second conductance ρ 2, and the cable 2 is most
Small cross-sectional area A1（As shown in Figure 3）The value for being multiplied by the first conductance ρ 1 is dividend value X, and the conductance is multiplied by with the second conductance ρ 2
The quantity n of connecting column 12 value is that the quotient value Z obtained is less than or equal to the conductive contact 11 most after divider value Y is divided by
Small cross-sectional area A2（As shown in Figure 4）.Its formula is：
（A1·ρ1）/（n·ρ2）≤A2；
Imply that：X/Y=Z, Z≤A2
And by the present invention for embodiment in, also pass through the adapter between above-mentioned conduction rack 10 and conductive contact 11
100 connection, therefore the quotient value Z of the acquisition again smaller than or equal to adapter 100 minimum sectional area A3（As shown in Figure 5）.Together
Reason, the quotient value Z obtained is also smaller than or equal to the minimum sectional area A4 of the conduction rack 10（As shown in Figure 6）And the business obtained
Numerical value Z is also smaller than or equal to the minimum sectional area of the conductance connecting column 12.
In addition, being a preferred embodiment of electroplating device provided by the present invention as shown in Figure 10.Electroplating device is to incite somebody to action
One workpiece 4 is electroplated, and including a power supply source 40, an electroplating bath 41 and multiple above-mentioned electroplating connectors 1；Wherein：
The power supply source 40 has electrode cable 20 and negative pole cable 21, and negative pole cable 21 is electrically connected with the workpiece 4,
And the electrode cable 20 is then such as foregoing cable 2, also with cable core 200（As shown in Figure 2）, and with the cable core 200
Material conductance be the first conductance ρ 1.
A holding part 410 is formed in the electroplating bath 41, to accommodate such as copper sulphate electroplate liquid 411, and the workpiece 4 is supplied
It is immersed in electroplate liquid 411, to carry out electroplating activity.
The galvanic anode plate 3 is placed in above-mentioned electroplating bath 41, with relative to the either side of workpiece 4（To be electroplated
Surface）, and be electrically connected with electrode cable 20.
The electroplating connector 1 is then same as the features such as foregoing construction（As shown in Fig. 1 to Fig. 9 etc.）, it is arranged at positive pole electricity
Between cable 20 and galvanic anode plate 3, and using the conductance of the material of conductive contact 11 as the second conductance ρ 2.Whereby, by upper
State formula：
（A1·ρ1）/（n·ρ2）≤A2；
The value that the minimum sectional area A1 of the electrode cable 20 is multiplied by the first conductance ρ 1 is dividend value X, is led with second
It is that the quotient value Z obtained is less than or equal to after divider value Y is divided by that electric rate ρ 2, which is multiplied by the quantity n of the conductance connecting column 12 value,
The minimum sectional area A2 of the conductive contact 11.
And in the embodiment shown in fig. 10, the galvanic anode plate 3 of electroplating device is furnished in level；In addition, as shown in figure 11
Embodiment, the galvanic anode degree 3 of electroplating device also can be in upright ornaments.
Therefore, by above-mentioned contexture, you can obtain electroplating connector of the present invention and electroplating device.
Therefore, the electroplating device by means of electroplating connector provided by the present invention and with the electroplating connector, by above-mentioned
Relational expression（A1·ρ1）/（n·ρ2）≤ A2, can reduce the situation that electroplating connector burns, and then can reduce unnecessary titanium
Usage amount is expected, to reduce equipment cost.
Embodiment described above is only the preferred embodiment to absolutely prove the present invention and being lifted, protection model of the invention
Enclose not limited to this.Equivalent substitute or conversion that those skilled in the art are made on the basis of the present invention, in the present invention
Protection domain within.Protection scope of the present invention is defined by claims.
Claims (10)
1. a kind of electroplating connector, to be connected between a cable and a galvanic anode plate, it is characterised in that the cable tool
There is cable core, and using the conductance of the material of the cable core as the first conductance；The electroplating connector includes：
One conduction rack；
One conductive contact, on the conduction rack, and with a terminals so that the cable is electrically connected with, and with the conduction
The conductance of the material of joint is the second conductance；And
Multiple conductance connecting columns, are respectively arranged on the conduction rack, and are electrically connected with the galvanic anode plate；
Wherein, the value that the minimum sectional area of the cable is multiplied by first conductance is dividend value, conductive with described second
It is that the quotient value obtained is less than or equal to the conductive contact after divider value is divided by that rate, which is multiplied by the value of the quantity of the conductance connecting column,
Minimum sectional area.
2. electroplating connector according to claim 1, it is characterised in that wherein the conduction rack is provided with an adapter, and
The conductive contact then has a change-over terminal, and the change-over terminal is by being laterally incorporated on the adapter, and the quotient value of the acquisition is small
In or equal to the adapter minimum sectional area.
3. electroplating connector according to claim 2, it is characterised in that wherein the adapter is shaped in the conduction rack
On.
4. electroplating connector according to claim 2, it is characterised in that wherein the adapter side has one first to combine
Face, and the change-over terminal side then has one second faying face, and first faying face, the second faying face are passed through with an engaging member
And combine the adapter and the change-over terminal.
5. electroplating connector according to claim 2, it is characterised in that wherein the change-over terminal is located at mutually remote with the terminals
From one end on.
6. electroplating connector according to claim 1, it is characterised in that the quotient value obtained in it is less than or equal to should
The minimum sectional area of conduction rack.
7. electroplating connector according to claim 1, it is characterised in that the quotient value obtained in it is less than or equal to should
The minimum sectional area of conductance connecting column.
8. a kind of electroplating device, a workpiece to be electroplated；It is characterised in that it includes：
One power supply source, with electrode cable and negative pole cable, the negative pole cable is electrically connected with the workpiece, and the electrode cable has
There is cable core, and using the conductance of the material of the cable core as the first conductance；
A holding part is formed in one electroplating bath, the electroplating bath, to accommodate electroplate liquid and immerse the electroplate liquid for the workpiece
In；
One galvanic anode plate, is placed in the electroplating bath and relative to the workpiece either side, and be electrically connected with the electrode cable；With
And
Multiple electroplating connectors, are connected between the electrode cable and the galvanic anode plate, and the electroplating connector is conductive comprising one
Frame, a conductive contact and multiple conductance connecting columns, the conductive contact are respectively arranged on the conduction rack with the conductance connecting column, and with
The conductance of the material of the conductive contact is the second conductance；
Wherein, the value that the minimum sectional area of the electrode cable is multiplied by first conductance is dividend value, with described second
It is that the quotient value obtained is less than or equal to the conduction after divider value is divided by that conductance, which is multiplied by the value of the quantity of the conductance connecting column,
The minimum sectional area of joint.
9. electroplating device according to claim 8, it is characterised in that wherein the galvanic anode plate is furnished in level.
10. electroplating device according to claim 8, it is characterised in that wherein the galvanic anode plate is in upright ornaments.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103124458 | 2014-07-16 | ||
| TW103124458A TWI546421B (en) | 2014-07-16 | 2014-07-16 | Plating connector and plating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105274608A CN105274608A (en) | 2016-01-27 |
| CN105274608B true CN105274608B (en) | 2017-09-22 |
Family
ID=55144410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510015554.3A Active CN105274608B (en) | 2014-07-16 | 2015-01-13 | Electroplating connector and electroplating equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105274608B (en) |
| TW (1) | TWI546421B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108301033A (en) * | 2018-02-26 | 2018-07-20 | 安徽达胜电子有限公司 | A kind of PCB electroplanting devices and application method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DD291423A5 (en) * | 1990-01-04 | 1991-06-27 | Mansfeld-Kombinat Wilhelm Pieck,De | DEVICE FOR ELECTRICALLY CONTACTING TITANIUM NUTS |
| CN2164125Y (en) * | 1993-08-13 | 1994-05-04 | 林东明 | Safety plug |
| CN2316727Y (en) * | 1997-11-03 | 1999-04-28 | 郑文宗 | Fast conducting device for power-line |
| JP2003119596A (en) * | 2001-10-12 | 2003-04-23 | Cmk Corp | Feeding method and feeding carrier for electroplating |
| CN2641061Y (en) * | 2003-08-09 | 2004-09-15 | 冯国东 | Solid aluminum calcining appts. for aluminum electrolyzer |
| CN101403128B (en) * | 2008-11-04 | 2010-09-15 | 南车戚墅堰机车车辆工艺研究所有限公司 | Anode and plating pen for threaded electro-brush plating |
-
2014
- 2014-07-16 TW TW103124458A patent/TWI546421B/en active
-
2015
- 2015-01-13 CN CN201510015554.3A patent/CN105274608B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201604331A (en) | 2016-02-01 |
| TWI546421B (en) | 2016-08-21 |
| CN105274608A (en) | 2016-01-27 |
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