CN104342742A - Electrode configuration structure of galvanization electroplating bath - Google Patents
Electrode configuration structure of galvanization electroplating bath Download PDFInfo
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- CN104342742A CN104342742A CN201310335991.4A CN201310335991A CN104342742A CN 104342742 A CN104342742 A CN 104342742A CN 201310335991 A CN201310335991 A CN 201310335991A CN 104342742 A CN104342742 A CN 104342742A
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- master tape
- anode
- cell body
- electroplating bath
- electroplating cell
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- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention relates to an electrode configuration structure, in particular to an electrode configuration structure of a galvanization electroplating bath. The electrode configuration structure comprises an electroplating bath body, wherein an insulation column is arranged in the center of the electroplating bath body; an upper anode master tape is arranged in the insulation column; a cathode master tape is arranged at the outer side of the electroplating bath body; the two sides of the upper anode master tape are connected with two lead tapes; the two lead tapes downwards extend along the outer side of the insulation column, then are horizontally turned, and finally are fixed on an anode block base in the electroplating bath body; an immersed anode zinc block is arranged above the zinc tapes on the anode block base; the cathode master tape is connected with a cathode copper bar; the cathode copper bar extends from the two sides to the middle of the electroplating bath body; and the upper anode master tape and the cathode master tape are connected with an external direct-current power supply machine. The electrode configuration structure of the galvanization electroplating bath can balance the pressure drop of the anode lead tapes, can improve the galvanization production efficiency, and can be suitable for a steel wire zinc electroplating process more than 60 wires.
Description
Technical field
The present invention relates to a kind of electrode configuration, particularly a kind of electrode configuration of zinc-plated plating tank.
Background technology
Existing design tradition is plating tank both sides while be negative electrode master tape, opposite side is anode master tape,. g., lead tape jointed anode master tape from left to right, negative electrode copper bar connects negative electrode master tape from right to left, this design zinc bath should not be too wide, and line radical is generally at about 24, and major defect is that the volts lost of anode. g., lead tape is too large, and causing plating upper zinc amount side height opposite side low, upper zinc amount error is at ± 3 grams/m.
Therefore usual steel wire electroplating zinc wire number 24-30 root, if will electroplate more than 60 lines, traditional anode and cathode layout can not adapt to, and as built two production lines, occupation of land is many, and with two cover direct supply and retractable line equipment, yield poorly, labour productivity is low.
Summary of the invention
In order to solve the problem of prior art, the invention provides a kind of electrode configuration of zinc-plated plating tank, it can balance the pressure drop of anode. g., lead tape, improves zinc-plated production efficiency, and can be applicable to the steel wire electroplating zinc technology of more than 60 lines.
The technical solution adopted in the present invention is as follows:
A kind of electrode configuration of zinc-plated plating tank, comprise electroplating cell body, described electroplating cell body central authorities are provided with insulated column, upper anode master tape is set in described insulated column, described electroplating cell body arranged outside negative electrode master tape, upper anode master tape both sides are connected with two. g., lead tape, two described. g., lead tape prolong insulated column lateral downward-extension then level turn to, finally be fixed on the anode block base that arranges in described electroplating cell body, immerseable anode spelter is set above the. g., lead tape on described anode block base, described negative electrode master tape is connected with negative electrode copper bar, described negative electrode copper bar extends in the middle of electroplating cell body two side direction, described upper anode master tape is connected outside direct supply complete machine with negative electrode master tape.
Electroplating cell body internal frame is provided with connecting copper pipe.
In electroplating cell body, both sides form two shunt circuits.
The beneficial effect that technical scheme provided by the invention is brought is:
By anode master tape is arranged on the insulated column in the middle part of electroplating cell body, as upper anode, about anode. g., lead tape two, extend respectively to left and right outside again to electroplating cell body bottom vertically downward; Negative electrode master tape is in the left and right outside of electroplating cell body, and the left and right lateral groove meta from electroplating cell body after negative electrode copper bar is connected with negative electrode master tape extends, and makes an electroplating cell body form two shunt circuits.
If the present invention needs to carry out 60 bethanizings, the cell body of 1.4 meters wide, the length of cathode and anode is less than 0.7 meter, because this reducing the pressure drop 50% of. g., lead tape, make zinc amount on each section of line uniform and stable, simultaneously owing to forming two shunt circuits, a coating bath plates 60 lines, makes output promote 100%, the direct supply configured, retractable cable, only with a set of, thoroughly avoids the long voltage range of decrease of. g., lead tape large, the defect that upper zinc amount is uneven simultaneously.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the electrode configuration of a kind of zinc-plated plating tank of the present invention.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
Embodiment one
Comprise and suitably widening, the electroplating cell body 1 of 64 steel wires can be held, electroplating cell body central authorities erect insulated column 3, for setting up upper anode master tape 7, two. g., lead tape (8A, 8B) of drawing are vertically connected in upper anode master tape 7 both sides, in electroplating cell body 1, arrange anode block base 2. g., lead tape extends respectively to arranged on left and right sides. g., lead tape is arranged immerseable anode spelter (4A, 4B).
Negative electrode master tape (5A, 5B) outside electroplating cell body 1, be connected with negative electrode copper bar (6A, 6B), from a left side, right two side direction central authorities extend, an electroplating cell body forms two shunt circuits, completely eliminate the volts lost brought because. g., lead tape is long, simultaneously due to two-way the moon, anode arrangement, the electric voltage equalization of each section, reach and improve the uniform object of zinc amount on electro-galvanizing, make a plating tank can plate 64 steel wires, and still with a set of direct current unit, a set of receipts, pay-off equipment, article one, the personnel of line realize the production capacity of two production lines, reach energy-conservation, consumption reduction, operating rate improves the effect of 100%.
Electroplating cell body 1 internal frame is provided with connecting copper pipe 9.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. the electrode configuration of a zinc-plated plating tank, comprise electroplating cell body, described electroplating cell body central authorities are provided with insulated column, upper anode master tape is set in described insulated column, described electroplating cell body arranged outside negative electrode master tape, it is characterized in that, described upper anode master tape both sides are connected with two. g., lead tape, two described. g., lead tape prolong insulated column lateral downward-extension then level turn to, finally be fixed on the anode block base that arranges in described electroplating cell body, immerseable anode spelter is set above the. g., lead tape on described anode block base, described negative electrode master tape is connected with negative electrode copper bar, described negative electrode copper bar extends in the middle of electroplating cell body two side direction, described upper anode master tape is connected outside direct supply complete machine with negative electrode master tape.
2. the electrode configuration of a kind of zinc-plated plating tank according to claim 1, is characterized in that, described electroplating cell body internal frame is provided with connecting copper pipe.
3. the electrode configuration of a kind of zinc-plated plating tank according to claim 1, is characterized in that, in described electroplating cell body, both sides form two shunt circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310335991.4A CN104342742B (en) | 2013-08-02 | 2013-08-02 | A kind of electrode configuration of zinc-plated electroplating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310335991.4A CN104342742B (en) | 2013-08-02 | 2013-08-02 | A kind of electrode configuration of zinc-plated electroplating bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104342742A true CN104342742A (en) | 2015-02-11 |
| CN104342742B CN104342742B (en) | 2016-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310335991.4A Active CN104342742B (en) | 2013-08-02 | 2013-08-02 | A kind of electrode configuration of zinc-plated electroplating bath |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105199864A (en) * | 2015-09-30 | 2015-12-30 | 江苏耀兴安全玻璃有限公司 | Preparation method of glassware cleaning agent for experimental use |
| CN108441910A (en) * | 2018-05-11 | 2018-08-24 | 无锡市新科冶金设备有限公司 | Bethanizing slot |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3017079A1 (en) * | 1980-05-03 | 1981-11-05 | Thyssen AG vorm. August Thyssen-Hütte, 4100 Duisburg | DEVICE FOR ELECTROPLATING |
| CA2403217C (en) * | 2000-03-17 | 2008-09-23 | Nippon Steel Corporation | Plated metal wire and production method and production device therefor |
| CN201296799Y (en) * | 2008-09-19 | 2009-08-26 | 贵州钢绳股份有限公司 | Horizontal electrogalvanizing zinc anode device for steel wire |
| CN103215625A (en) * | 2012-04-25 | 2013-07-24 | 安徽恒晶电缆集团有限公司 | Armoured cable steel band electrogalvanizing production technology |
-
2013
- 2013-08-02 CN CN201310335991.4A patent/CN104342742B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105199864A (en) * | 2015-09-30 | 2015-12-30 | 江苏耀兴安全玻璃有限公司 | Preparation method of glassware cleaning agent for experimental use |
| CN108441910A (en) * | 2018-05-11 | 2018-08-24 | 无锡市新科冶金设备有限公司 | Bethanizing slot |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104342742B (en) | 2016-12-28 |
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