CN202543364U - Sectional striking current electroplating bath - Google Patents
Sectional striking current electroplating bath Download PDFInfo
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- CN202543364U CN202543364U CN2012201786696U CN201220178669U CN202543364U CN 202543364 U CN202543364 U CN 202543364U CN 2012201786696 U CN2012201786696 U CN 2012201786696U CN 201220178669 U CN201220178669 U CN 201220178669U CN 202543364 U CN202543364 U CN 202543364U
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Abstract
The utility model discloses a sectional striking current electroplating bath, belonging to the technical field of electroplating baths. The technical scheme is that the sectional striking current electroplating bath comprises a bath body which is provided with anodes at two sides, wherein a cathode is arranged between the anodes at two sides and is driven to move within the bath body along a length direction through a driving device; the anodes at two sides are composed of a plurality of sections of anode bars arranged at intervals; the cathode comprises a plurality of sections of cathode bars arranged at intervals; the anode bars at two sides are in one-to-one correspondence to the cathode bars at the middle; the corresponded anode bars and cathode bars form a plurality of individual copper plating sections; and rectifiers are connected between the corresponded anode bars and the cathode bars. The sectional striking current electroplating bath disclosed by the utility model is reasonable in structure, convenient to use, is lower in cost of processing and good in electroplating effect and is especially suitable for electroplating low-capacity PCB (printed circuit board) plates. The sectional striking current electroplating bath is suitable for electroplating the low-capacity PCB plate.
Description
Technical field
The utility model relates to a kind of plating tank of wiring board processing usefulness, more particularly, relates in particular to a kind of plating tank that electric current is beaten in a small amount of segmentation of electroplating processing that is fit to.
Background technology
In the electroplating process of printed electronic circuit board industry; Generally, as long as in same copper plating groove, all be negative electrode and the anode construction that the same row of design links to each other; The RF of institute's outward current is same or many and links to each other; Copper plating groove is implemented wholely to beat electric current and come the manufacturing PCB plank, and its technical process is: last 30～50 plating plate of accompanying, specifically quantity is decided according to copper groove total length.Get into and be covered with open RF → electroplated pcb board behind the whole copper groove and electroplate immediately following accompanying the plating plate to get into the copper groove → accomplish and then go up after pcb board is electroplated 30～50 accompany plating plate → accompany plating to begin copper plating groove promptly to begin to close or turn down electric current → completion for first section and electroplate out copper plating groove.
Adopt above-mentioned electroplating technology, less when being plated pcb board, promptly not enough when being covered with the cathode area of a copper groove, use big electric current to make must to adopt and accompany the plating plate to be covered with whole negative electrode to be plated the zone and then can cause cost to waste; Use little electric current to make that then current loss can be very big, be difficult to the control thickness of coating and satisfy the thickness of coating requirement of MI.Especially the copper plating groove of VCP (Vertical Continuous Plating, i.e. vertical continuous plating line) is as a whole, promptly is equivalent to a copper cylinder of planer-type plating line, and pcb board transmits operation continuously through the driven by motor chain in cylinder.Because the length of general VCP copper plating groove is about 30m, as adopts 1～2 RF to carry out electric current output, then need the very big RF of design current, voltage and power, be difficult to realize the industrialization operation.And adopt many RFs to link to each other; And make whole negative electrode, anode become as a whole, and then production efficiency there is very big influence, could open RF because have only after pcb board is covered with whole plating tank; Needing last tens and accompany the plating plate, also is a kind of huge waste to production cost.
Summary of the invention
The purpose of the utility model be to provide a kind of rational in infrastructure, easy to use, tooling cost is lower and electroplating effect is good, especially is fit to the plating tank that electric current is beaten in the galvanized segmentation of pcb board in a small amount.
The technical scheme of the utility model is achieved in that a kind of segmentation makes the plating tank of electric current; Comprise cell body; Be provided with anode in the cell body both sides, between the anode of both sides, be provided with negative electrode, described negative electrode moves in cell body through drive device drives along its length; The anode of wherein said both sides is made up of the spaced anode rod of plurality of sections respectively; Described negative electrode is made up of the spaced cathode rod of plurality of sections, and the anode rod of said both sides and intermediary cathode rod are corresponding one by one, and anode rod that each is corresponding and cathode rod form some independently copper facing sections; Be connected with RF between said each corresponding anode rod and the cathode rod.
Above-mentioned a kind of segmentation is beaten in the plating tank of electric current, and the length of said each copper facing section is 2～4m; Further, the length of said each copper facing section is preferably 3m.
Above-mentioned a kind of segmentation is beaten in the plating tank of electric current, and described each rectifier circuit is connected with control unit.
After the utility model adopted said structure, through original whole section negative electrode and anode are replaced to spaced anode rod section and cathode rod section, and each corresponding anode rod and cathode rod were controlled by RF independently respectively.Use whole mode of beating electric current to compare with existing, have more flexibility ratio, can greatly make things convenient for actually operating, also help the lifting of cost control and production efficiency.Electric current is beaten in segmentation need not go up the too much plating plate of accompanying, and helps the control of quality yet, can reach the electric current of normal pcb board of accurate control, big, the inaccurate factor of output bias is transferred to accompanied on the plating plate.Therefore, this method can use minimum number accompany the plating plate, minimum to production capacity loss, farthest guaranteed the copper facing quality of pcb board.
Description of drawings
Below in conjunction with the embodiment in the accompanying drawing the utility model is done further to specify, but do not constitute any restriction the utility model.
Fig. 1 is the two dimensional structure synoptic diagram of the utility model.
Fig. 2 is the facade structures synoptic diagram of the utility model.
Among the figure: cell body 1, anode rod 2, cathode rod 3, RF 4, control unit 5, accompany plating plate 6, pcb board 7.
Embodiment
Consult Fig. 1, shown in Figure 2, the plating tank of electric current is made in a kind of segmentation of the utility model, comprises cell body 1, and the length of cell body 1 is 30m in the present embodiment.Be provided with anode in cell body 1 both sides; Between the anode of both sides, be provided with negative electrode; Described negative electrode moves in cell body 1 through drive device drives along its length; The anode of wherein said both sides is made up of the spaced anode rod 2 of plurality of sections respectively, links to each other with anode titanium plate or titanium net below the anode rod 2; Described negative electrode is made up of the spaced cathode rod 3 of plurality of sections, below the cathode rod with pcb board or accompany the plating plate to link to each other; The anode rod 2 of said both sides is corresponding one by one with intermediary cathode rod 3, and each corresponding anode rod 2 forms some independently copper facing sections with cathode rod 3; Be connected with RF 4 between said each corresponding anode rod 2 and the cathode rod 3, the quantity of RF 4 can be decided according to concrete processing situation, and quantity is generally 1～3, and each RF 4 circuit is connected with control unit 5.In the present embodiment, the length of said each copper facing section is 2～4m, and preferred length is 3m.Simultaneously, the copper facing section in the present embodiment is divided into ten sections, and every segment length is three meters, and every section RF 4 that two platform independent are set connects anode rod 2 and cathode rod 3 in this section of control.
During concrete the use, in the pcb board front of electroplated the full one section copper facing segment length of dossal accompany plating plate 6, accompany about 5～8 of the quantity of plating plate, accompany plating plate 6 isometric with the pcb board 7 of electroplated, accompany after the plating plate 6 followed by the pcb board 7 that begins to hang electroplated.When waiting to accompany 6 operations of plating plate and being covered with first section copper facing segment length, open first section RF 4.When accompanying plating plate 6 to get into second and third section copper plating groove successively, open the RF 4 of corresponding control section respectively, after accompanying plating plate 6 to move to final stage copper facing section, open whole RFs 4, realize the continuous electroplating of pcb board 7.
When accomplishing the making of all pcb boards, in the end and then a pcb board is hung accompanying of about 5～8 about one section copper facing segment length afterwards and is plated plate 6.When these accompany plating plate 6 to shift out first section copper facing section, can close the RF of first section copper facing section; When accompanying plating plate 6 to shift out second and third section copper facing section, can close the RF 4 of second and third section copper facing section, until accompanying plating plate 6 all to shift out final stage copper facing section, with closeall RF 4.
Claims (4)
1. the plating tank of electric current is made in a segmentation; Comprise cell body (1), be provided with anode, between the anode of both sides, be provided with negative electrode in cell body (1) both sides; Described negative electrode moves in cell body (1) through drive device drives along its length; It is characterized in that the anode of said both sides is made up of the spaced anode rod of plurality of sections (2) respectively, described negative electrode is made up of the spaced cathode rod of plurality of sections (3); Anode rod of said both sides (2) and intermediary cathode rod (3) are corresponding one by one, and each corresponding anode rod (2) and cathode rod (3) form some independently copper facing sections; Be connected with RF (4) between said each corresponding anode rod (2) and the cathode rod (3).
2. the plating tank of electric current is made in a kind of segmentation according to claim 1, it is characterized in that, the length of said each copper facing section is 2～4m.
3. the plating tank of electric current is made in a kind of segmentation according to claim 2, it is characterized in that, the length of said each copper facing section is 3m.
4. the plating tank of electric current is made in a kind of segmentation according to claim 1, it is characterized in that, described each RF (4) circuit is connected with control unit (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201786696U CN202543364U (en) | 2012-04-24 | 2012-04-24 | Sectional striking current electroplating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201786696U CN202543364U (en) | 2012-04-24 | 2012-04-24 | Sectional striking current electroplating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202543364U true CN202543364U (en) | 2012-11-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201786696U Expired - Fee Related CN202543364U (en) | 2012-04-24 | 2012-04-24 | Sectional striking current electroplating bath |
Country Status (1)
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| CN (1) | CN202543364U (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106968008A (en) * | 2017-04-07 | 2017-07-21 | 江门崇达电路技术有限公司 | It is a kind of to accompany plating plate and preparation method thereof applied to graphic plating VCP techniques |
| CN106968007A (en) * | 2017-04-07 | 2017-07-21 | 江门崇达电路技术有限公司 | It is a kind of to accompany plating plate and preparation method thereof applied to graphic plating VCP techniques |
| CN107815723A (en) * | 2017-10-24 | 2018-03-20 | 高德（无锡）电子有限公司 | A kind of method that plating plate is accompanied on reduction VCP plating lines |
| CN107904649A (en) * | 2017-11-29 | 2018-04-13 | 惠州市特创电子科技有限公司 | A kind of VCP copper facing improving productivity method |
| CN108251885A (en) * | 2018-01-29 | 2018-07-06 | 东莞市鑫弘机械科技有限公司 | A kind of mode of connection for improving electroplating evenness |
| CN110804757A (en) * | 2019-11-27 | 2020-02-18 | 镇江耐丝新型材料有限公司 | A copper grain levels frock for in copper facing tank |
| CN111254483A (en) * | 2020-03-11 | 2020-06-09 | 大连崇达电路有限公司 | Method for improving VCP electroplating line material number switching efficiency |
| CN112760701A (en) * | 2020-12-16 | 2021-05-07 | 景旺电子科技(珠海)有限公司 | Vertical continuous electroplating equipment |
| CN112899759A (en) * | 2021-01-20 | 2021-06-04 | 珠海松柏科技有限公司 | Electroplating production line and switching process of multiple plate types |
| CN112921383A (en) * | 2021-01-20 | 2021-06-08 | 珠海松柏科技有限公司 | Electroplating production equipment and instant starting method of rectifier |
| CN114775023A (en) * | 2022-05-26 | 2022-07-22 | 枣庄睿诺光电信息有限公司 | Electroplating device |
| CN115505996A (en) * | 2022-11-04 | 2022-12-23 | 昆山东威科技股份有限公司 | Electroplating device |
| CN116657203A (en) * | 2023-06-09 | 2023-08-29 | 江苏博敏电子有限公司 | HDI board blind hole electroplating process |
-
2012
- 2012-04-24 CN CN2012201786696U patent/CN202543364U/en not_active Expired - Fee Related
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106968007A (en) * | 2017-04-07 | 2017-07-21 | 江门崇达电路技术有限公司 | It is a kind of to accompany plating plate and preparation method thereof applied to graphic plating VCP techniques |
| CN106968008A (en) * | 2017-04-07 | 2017-07-21 | 江门崇达电路技术有限公司 | It is a kind of to accompany plating plate and preparation method thereof applied to graphic plating VCP techniques |
| CN107815723A (en) * | 2017-10-24 | 2018-03-20 | 高德（无锡）电子有限公司 | A kind of method that plating plate is accompanied on reduction VCP plating lines |
| CN107904649A (en) * | 2017-11-29 | 2018-04-13 | 惠州市特创电子科技有限公司 | A kind of VCP copper facing improving productivity method |
| CN107904649B (en) * | 2017-11-29 | 2019-07-19 | 惠州市特创电子科技有限公司 | A kind of VCP copper facing improving productivity method |
| CN108251885A (en) * | 2018-01-29 | 2018-07-06 | 东莞市鑫弘机械科技有限公司 | A kind of mode of connection for improving electroplating evenness |
| CN108251885B (en) * | 2018-01-29 | 2019-08-23 | 东莞市鑫弘机械科技有限公司 | A kind of mode of connection improving electroplating evenness |
| CN110804757B (en) * | 2019-11-27 | 2024-02-20 | 镇江耐丝新型材料有限公司 | Copper particle leveling tool used in copper plating tank |
| CN110804757A (en) * | 2019-11-27 | 2020-02-18 | 镇江耐丝新型材料有限公司 | A copper grain levels frock for in copper facing tank |
| CN111254483A (en) * | 2020-03-11 | 2020-06-09 | 大连崇达电路有限公司 | Method for improving VCP electroplating line material number switching efficiency |
| CN112760701B (en) * | 2020-12-16 | 2022-04-12 | 景旺电子科技(珠海)有限公司 | Vertical continuous electroplating equipment |
| CN112760701A (en) * | 2020-12-16 | 2021-05-07 | 景旺电子科技(珠海)有限公司 | Vertical continuous electroplating equipment |
| CN112899759A (en) * | 2021-01-20 | 2021-06-04 | 珠海松柏科技有限公司 | Electroplating production line and switching process of multiple plate types |
| CN112921383A (en) * | 2021-01-20 | 2021-06-08 | 珠海松柏科技有限公司 | Electroplating production equipment and instant starting method of rectifier |
| CN114775023A (en) * | 2022-05-26 | 2022-07-22 | 枣庄睿诺光电信息有限公司 | Electroplating device |
| CN115505996A (en) * | 2022-11-04 | 2022-12-23 | 昆山东威科技股份有限公司 | Electroplating device |
| CN115505996B (en) * | 2022-11-04 | 2023-03-10 | 昆山东威科技股份有限公司 | Electroplating device |
| CN116657203A (en) * | 2023-06-09 | 2023-08-29 | 江苏博敏电子有限公司 | HDI board blind hole electroplating process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121121 Termination date: 20200424 |