CN112760701B - Vertical continuous electroplating equipment - Google Patents
Vertical continuous electroplating equipment Download PDFInfo
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- CN112760701B CN112760701B CN202011487781.3A CN202011487781A CN112760701B CN 112760701 B CN112760701 B CN 112760701B CN 202011487781 A CN202011487781 A CN 202011487781A CN 112760701 B CN112760701 B CN 112760701B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
The invention relates to the field of circuit board manufacturing, and provides vertical continuous electroplating equipment which comprises a cathode conveyor belt, a clamp, an electroplating tank and an anode on-off assembly, wherein an anode rod comprises a plurality of anode conductive segments arranged at intervals along the plate conveying direction and a plurality of anode insulating segments connected between two adjacent anode conductive segments, and each anode conductive segment is connected to the anode of a rectifier in parallel; the anode on-off component comprises a first inductor, a first control unit electrically connected with the first inductor and a plurality of anode switches electrically connected with the first control unit, wherein the first control unit is used for calculating the time of the plate passing through each anode conductive segment according to the speed of the plate when the plate passes through the first inductor, and controlling the anode switches to be closed when the plate passes through the anode conductive segments and to be opened when no plate passes through the anode conductive segments. The vertical continuous electroplating equipment can realize precise electroplating on the plate, basically avoids the use of the plated plate, improves the productivity, reduces the cost, improves the electroplating quality and reduces the difference of the electroplating copper thickness of each plate.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to vertical continuous electroplating equipment.
Background
As shown in fig. 1 and 2, the vertical continuous plating apparatus generally moves the plate member 200 'held by the jigs 400' and 400 'on its lower side by the cathode conveyor 300' in the conveying direction of the plate member 200 'to pass through at least one plating tank 500'. Each of the plating bath cylinders 500 'is provided at both sides of the cathode conveyor 300' with anode bars 510 'extending in the conveying direction of the plate member 200', and a plurality of titanium baskets 520 'loaded with copper balls are connected to the lower sides of the anode bars 510'. In the case where the current is supplied to the cathode conveyor belt 300 'and the anode rod 510' by the rectifier 100 ', the copper balls in the titanium blue may be dissolved, and the electrons may be transferred to the cathode and deposit elemental copper on the surface of the plate member 200', thereby performing electroplating.
However, when the rectifier 100 'is operated and the plate 200' in the plating tank 500 'is insufficient, the excessive current generated by the anode is easily collected to the front plate 200' to cause the plate burning phenomenon. For this reason, in the related art, the rectifier 100 ' is usually operated when the plating bath 500 ' is filled with the plate 200 ' to avoid the plate burning phenomenon, and the plating assistant plates 210 ' are disposed at both the front end and the rear end of the transfer to ensure that the middle production plate 220 ' is in a current state during the plating.
However, the use of the plating partner plate 210' is liable to cause the following problems:
firstly, the productivity and the copper balls are wasted, so that the cost is high;
secondly, after the plate is repeatedly used for a period of time, copper particles, copper wires and the like are generated on the surface of the plating accompanying plate 210 ', so that potential quality hazards are easily caused on electroplating of the production plate 220';
thirdly, the plating area of the plating assistant plate 210 'is not estimated accurately, and when the plating areas of the plating assistant plate 210' and the production plate 220 'in the same plating tank 500' are different and the plating area of the plating assistant plate 210 'is not estimated accurately, the plated copper thickness of each production plate 220' is likely to be different.
Disclosure of Invention
The embodiment of the invention aims to provide vertical continuous electroplating equipment to solve the technical problems of capacity waste, high cost, potential risks to electroplating quality of production plates and easy variation of electroplated copper thickness of each production plate of the conventional vertical continuous electroplating equipment due to the use of plating accompanying plates.
In order to achieve the purpose, the invention adopts the technical scheme that: a vertical continuous plating apparatus for use with a rectifier and for plating a plate member, comprising:
the cathode conveyor belt is electrically connected with the cathode of the rectifier;
the plurality of clamps are connected to the cathode conveyor belt at intervals and can move along the conveying direction of the plate under the driving of the cathode conveyor belt;
the electroplating tank cylinder is provided with at least one anode rod along the plate conveying direction, the two opposite sides of the cathode conveying belt of the electroplating tank cylinder are respectively provided with an anode rod, each anode rod comprises a plurality of anode conducting segments arranged at intervals along the plate conveying direction and a plurality of anode insulating segments connected between every two adjacent anode conducting segments, each anode conducting segment of each anode rod is connected to the anode of the rectifier in parallel, and the anode conducting segments are also connected with a titanium basket for loading copper balls;
the anode on-off assembly comprises a first inductor, a first control unit and a plurality of anode switches, wherein the first control unit is electrically connected with the first inductor, the plurality of anode switches are electrically connected with the first control unit, the anode switches are used for controlling the on-off of the anode conducting segments and the anode of the rectifier, the first inductor is used for sensing whether plates pass through or not, the first control unit is used for calculating the time of the plates passing through each anode conducting segment according to the speed of the plates when the plates pass through the first inductor, and controlling the anode switches to be closed when the plates pass through the anode conducting segments and to be opened when no plates pass through the anode conducting segments.
In one embodiment, the cathode conveyor belt comprises a plurality of cathode conductive segments arranged at intervals along the conveying direction of the plate and a plurality of cathode insulating segments connected between two adjacent cathode conductive segments, each cathode conductive segment is connected to the negative pole of the rectifier in parallel, and each cathode conductive segment is connected with each clamp in a one-to-one correspondence manner;
the vertical continuous electroplating equipment further comprises a cathode on-off assembly, wherein the cathode on-off assembly comprises a plurality of second inductors, a second control unit electrically connected with the second inductors, and a plurality of cathode switches electrically connected with the second control unit, the cathode switches are used for controlling the cathode conductive segments and the negative pole of the rectifier to be on or off, the second inductors are used for sensing whether the clamp clamps the plate, the second control unit is used for controlling the cathode switches to be on when the second inductors sense that the clamp clamps the plate, and controlling the cathode switches to be off when the clamp does not clamp the plate.
In one embodiment, the clamp comprises a first clamping piece and a second clamping piece which is used together with the first clamping piece for clamping a plate, a first clamping structure is arranged on the first clamping piece, a second clamping structure opposite to the first clamping structure is arranged on the second clamping piece, and the first clamping structure and the second clamping structure are both electrically connected with the second inductor; the second sensor is a resistance value sensor.
In one embodiment, the cathode insulating segment is made of polytetrafluoroethylene.
In one embodiment, the vertical continuous electroplating equipment further comprises a reflux tank cylinder, wherein the reflux tank cylinder and each electroplating tank cylinder are sequentially arranged along the plate conveying direction; the first inductor is arranged in the backflow groove cylinder.
In one embodiment, the reflux tank cylinder is filled with reflux liquid; the first sensor is arranged on the upper side of a liquid level line of the reflux liquid.
In one embodiment, the first inductor is spaced from the notch of the reflow oven cylinder by a distance of 30 cm.
In one embodiment, the first inductor is spaced apart from the plating tank cylinder adjacent to the reflow tank cylinder by a distance of 10 cm.
In one embodiment, the first sensor is an infrared sensor.
In one embodiment, the anode insulating segment is made of polytetrafluoroethylene.
The invention has the following beneficial effects:
the vertical continuous electroplating equipment provided by the embodiment of the invention comprises a clamp, a cathode conveyor belt, a first control unit and a rectifier, wherein the clamp is used for clamping a plate, the cathode conveyor belt is used for driving the clamp and the plate to sequentially pass through a first inductor and each electroplating tank, when the first inductor induces the plate, the first control unit can calculate the time for the plate to reach each anode conductive segment, and controls the corresponding anode switch to be closed at the corresponding moment, so that the anode conductive segment can be conducted with the anode of the rectifier when the plate passes through the anode conductive segment, and can be disconnected with the anode of the rectifier when no plate passes through the anode conductive segment. Based on the above, even if the plating bath is not filled with plates, the plating bath can accurately and directionally apply current to each anode conductive segment according to the number of the plates, the current of the anode conductive segments is not redundant, and the current is not gathered to individual plates to cause plate burning, so that the current is not communicated when the plating bath is filled with plates as in the prior art; the plate conveying device can also ensure that the plate is in a current state during electroplating, and the curve of the electroplating current can be relatively stable, so that the plate conveying front end and the plate conveying rear end do not need to be replaced by plating accompanying plates in the prior art. Therefore, the vertical continuous electroplating equipment provided by the embodiment of the invention can realize precise electroplating on the plate, and can basically avoid the use of the plating accompanying plate, thereby improving the productivity, at least reducing the cost on the copper ball, improving the electroplating quality of the production plate, realizing precise electroplating, and reducing the difference degree of the electroplated copper thickness of each production plate.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic diagram of electroplating of a vertical continuous electroplating apparatus provided in the prior art when the plating bath is not filled with plates;
FIG. 2 is a schematic view of a vertical continuous plating apparatus provided in the prior art;
FIG. 3 is a schematic diagram of the connection between an anode rod and a rectifier according to an embodiment of the present invention;
FIG. 4 is a first schematic view of a vertical continuous electroplating apparatus according to an embodiment of the present invention;
FIG. 5 is a second schematic view of the vertical continuous electroplating apparatus provided in FIG. 4;
FIG. 6 is a schematic diagram illustrating a board passing through a first sensor according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of the connection between the cathode conveyor and the rectifier according to the embodiment of the present invention;
FIG. 8 is a schematic view of a clamp according to an embodiment of the present invention when the clamp is not clamping a plate;
FIG. 9 is a schematic view of the clamp provided in FIG. 8 when clamping a panel;
FIG. 10 is a schematic electroplating diagram of a vertical continuous electroplating apparatus according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
100' -a rectifier; 200 '-plate, 210' -plating plate, 220 '-production plate, 300' -cathode conveyor belt, 400 '-clamp, 500' -plating bath cylinder, 510 '-anode rod, 520' -titanium basket;
100-cathode conveyor belt, 110-cathode conducting segment, 120-cathode insulating segment; 200-clamp, 210-first clamp, 211-first clamping structure, 220-second clamp, 221-second clamping structure; 300-electroplating bath cylinder, 310-anode rod, 311-anode conducting segment, 312-anode insulating segment and 320-titanium basket; 400-anode on-off component, 410-first inductor, 411-transmitting tube, 412-receiving tube, 420-anode switch; 500-cathode on-off assembly, 510-second inductor, 520-cathode switch; 600-a reflux tank; 700-prepreg tank.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The following describes a specific implementation of the present invention in more detail with reference to specific embodiments:
referring to fig. 4 and 5, an embodiment of the invention provides a vertical continuous electroplating apparatus, which is used in cooperation with a rectifier 100 ' and is used for electroplating a plate 200 ' during a specific use process, wherein the rectifier 100 ' has a positive electrode and a negative electrode.
Referring to fig. 3 and 10, the vertical continuous electroplating apparatus includes a cathode conveyor 100, a clamp 200, an electroplating tank 300 and an anode on-off assembly 400, wherein the cathode conveyor 100 is electrically connected to the negative electrode of a rectifier 100'; a plurality of clamps 200 are arranged and used for clamping the plate 200', and the plurality of clamps 200 are connected to the cathode conveyor belt 100 at intervals and can move along the plate conveying direction a under the driving of the cathode conveyor belt 100; at least one electroplating tank cylinder 300 is arranged along the plate conveying direction a, the electroplating tank cylinder 300 is respectively provided with anode rods 310 at two opposite sides of the cathode conveying belt 100, each anode rod 310 comprises a plurality of anode conductive segments 311 which are arranged at intervals along the plate conveying direction a, and a plurality of anode insulating segments 312 which are connected between two adjacent anode conductive segments 311, each anode conductive segment 311 of each anode rod 310 is connected to the anode of the rectifier 100' in parallel, and each anode conductive segment 311 is further connected with a titanium basket 320 for loading copper balls; the anode on-off assembly 400 includes a first inductor 410, a first control unit (not shown in the figure) electrically connected to the first inductor 410, and a plurality of anode switches 420 electrically connected to the first control unit (not shown in the figure), wherein the anode switches 420 are used for controlling the anode conductive segments 311 and the anode of the rectifier 100 ', the first inductor 410 is used for sensing whether the plate 200 ' passes through the first inductor 410, the first control unit (not shown in the figure) is used for calculating the time when the plate 200 ' passes through each anode conductive segment 311 according to the speed of the plate 200 ' when the plate 200 ' passes through the first inductor 410, and controlling the anode switches 420 to be turned on when the plate 200 ' passes through the anode conductive segments 311 and turned off when no plate 200 ' passes through the anode conductive segments 311.
It should be noted that a plurality of clamps 200 are connected to the lower side of the cathode conveyor belt 100 at intervals, and generally, a plurality of adjacent clamps 200 can be commonly used for clamping a plate 200'. The cathode conveyor 100 is electrically connected to the negative electrode of the rectifier 100 'to apply current to the plate 200' held by the jig 200.
It should be further noted that, in the electroplating tank 300, each anode conductive segment 311 of the anode rod 310 is made of a conductive material and is connected in parallel to the positive pole of the rectifier 100 ', an anode switch 420 is further disposed on a circuit between the anode conductive segment 311 and the positive pole of the rectifier 100', the circuit between the anode conductive segment 311 and the positive pole of the rectifier 100 'can be controlled to be on by closing the anode switch 420, and the circuit between the anode conductive segment 311 and the positive pole of the rectifier 100' can be controlled to be off by opening the anode switch 420. And, the two adjacent anode conductive segments 311 are also insulated and separated by the anode insulating segment 312 made of insulating material, so that mutual current crosstalk between the anode conductive segments 311 can be prevented.
It should be further noted that, under the driving of the cathode conveyor 100, the fixture 200 can drive the plate 200 'clamped by the fixture to sequentially pass through the first sensor 410 and each electroplating tank 300 along the plate conveying direction a, when the plate 200' passes through the first sensor 410, the first sensor 410 senses the plate 200 'and feeds back the sensing result to the first control unit (not shown in the figure), and the first control unit (not shown in the figure) can calculate the time when the plate 200' reaches each anode conductive segment 311 of each electroplating tank 300 in real time after acquiring the sensing data of the first sensor 410.
For example, the position of the first inductor 410 may be set as the origin, and the specific position of the anode conductive segment 311, the width of the anode conductive segment 311, and the length of the electroplating tank 300 are generally fixed, so that the distance S between each anode conductive segment 311 and the first inductor 410 may be recorded in advance in a first control unit (not shown in the figure), the cathode conveyor belt 100 runs at a constant speed, the transmission speed is V on average, and thus, according to the time formula: t is S/V, the time t for the plate 200' to reach any one of the anode conductive segments 311 can be calculated.
It should be further noted that when no plate 200 'passes through the anode conductive segment 311, the anode switch 420 corresponding to the anode conductive segment 311 is in an open state, and at this time, the anode conductive segment 311 is disconnected from the circuit of the anode of the rectifier 100'. After the first control unit (not shown) calculates the time when the plate 200 'reaches each anode conductive segment 311 of each electroplating tank 300, the first control unit (not shown) may control the anode switch 420 of the corresponding anode conductive segment 311 to close at the corresponding time, so that when the plate 200' passes through the anode conductive segment 311, the anode conductive segment 311 is conducted with the circuit of the anode of the rectifier 100 ', and thus the anode of the rectifier 100' can accurately and directionally apply current to the anode conductive segment 311. And the anode switch 420 is again opened when the plate 200 'leaves the anode conductive segment 311 and no other plate 200' passes the anode conductive segment 311. Of course, if there are successive plates 200 'passing the anode conductive segment 311 in sequence, the anode switch 420 may remain closed until no plate 200' passes and opens again.
In the situation, the copper balls in the titanium basket 320 connected to the lower side of the anode conductive segment 311 are dissolved to form copper ions, and the copper ions can be transferred to the cathode and precipitate elemental copper on the surface of the plate 200', so that precise electroplating can be realized.
To sum up, in the vertical continuous electroplating apparatus according to the embodiment of the present invention, the plate 200 'is clamped by the clamp 200, and the cathode conveyor 100 drives the clamp 200 and the plate 200' to sequentially pass through the first sensor 410 and each electroplating tank 300, when the plate 200 'is sensed by the first sensor 410, the first control unit (not shown) can calculate the time when the plate 200' reaches each anode conducting segment 311, and control the corresponding anode switch 420 to be closed at the corresponding time, so that the anode conducting segment 311 is conducted with the anode of the rectifier 100 'when the plate 200' passes by the time, and is disconnected with the anode of the rectifier 100 'when no plate 200' passes by the time. Based on this, even if the plating tank 300 is not filled with the plate members 200 ', the plating tank 300 can accurately and directionally apply current to each anode conductive segment 311 according to the number of the plate members 200 ', the current of the anode conductive segment 311 is not excessive, and the current is not gathered to the individual plate members 200 ' to cause the plate members 200 ' to burn, so that the current is not communicated when the plating tank 300 is filled with the plate members 200 ' as in the prior art; it can also ensure that the plate 200 'is in a current state during electroplating, and can make the curve of the electroplating current relatively smooth, thereby avoiding the need of replacing the plate 200' at the front end and the rear end of the transmission with plating accompanying plates as in the prior art. Therefore, the vertical continuous electroplating equipment provided by the embodiment of the invention can realize precise electroplating on the plate 200' and basically avoid the use of plating accompanying plates, thereby improving the productivity, at least reducing the cost on copper balls, improving the electroplating quality of production plates, realizing precise electroplating and reducing the difference degree of the electroplated copper thickness of each production plate.
Referring to fig. 7, 8 and 9, in the present embodiment, the cathode conveyor 100 includes a plurality of cathode conductive segments 110 disposed at intervals along the conveying direction a of the board, and a plurality of cathode insulating segments 120 connected between two adjacent cathode conductive segments 110, each cathode conductive segment 110 is connected to the negative electrode of the rectifier 100', and each cathode conductive segment 110 is connected to each clamp 200 in a one-to-one correspondence; the vertical continuous plating apparatus further comprises a cathode on-off assembly 500, wherein the cathode on-off assembly 500 comprises a plurality of second inductors 510, a second control unit (not shown) electrically connected to each of the second inductors 510, and a plurality of cathode switches 520 electrically connected to the second control unit (not shown), the cathode switches 520 are used for controlling the cathode conductive segments 110 to be on and off with the negative electrode of the rectifier 100 ', the second inductors 510 are used for sensing whether the plate 200 is clamped by the clamp 200, and the second control unit (not shown) is used for controlling the cathode switches 520 to be closed when the second inductors 510 sense that the plate 200 ' is clamped by the clamp 200, and controlling the cathode switches 520 to be open when the plate 200 ' is not clamped by the clamp 200.
It should be noted here that only the cathode conductive segment 110 has the clamp 200 connected thereunder. Each cathode conductive segment 110 is made of a conductive material and is connected in parallel to the negative electrode of the rectifier 100 ', and a cathode switch 520 is further disposed on a circuit between the cathode conductive segment 110 and the negative electrode of the rectifier 100'. The electrical continuity of the cathode conductive segment 110 and the negative pole of the rectifier 100 'is controlled by closing the cathode switch 520, and the electrical continuity of the cathode conductive segment 110 and the negative pole of the rectifier 100' is controlled by opening the cathode switch 520. And, two adjacent cathode conductive segments 110 are insulated and separated by the cathode insulating segment 120 made of insulating material, so that mutual current crosstalk between the cathode conductive segments 110 can be prevented.
It should be noted that a second sensor 510 is connected to the clamp 200, and the second sensor 510 can sense whether the clamp 200 is currently clamping the plate 200'. When the second sensor 510 senses that the plate 200 'is clamped by the clamp 200, the second control unit (not shown) may control the corresponding cathode switch 520 to be closed, i.e., control the cathode conductive segment 110 corresponding to the clamp 200 to be conducted with the negative electrode of the rectifier 100'. When the second sensor 510 senses that the clamp 200 does not clamp the plate 200 ', the second control unit (not shown) may control the corresponding cathode switch 520 to remain open, i.e., control the cathode conductive segment 110 corresponding to the clamp 200 to be disconnected from the negative electrode of the rectifier 100'.
Based on this, the rectifier 100 ' can also apply current to the clamp 200 holding the plate 200 ' accurately and directionally, and similarly, only when the clamp 200 holds the plate 200 ' and the cathode conductive segment 110 is conducted with the negative electrode of the rectifier 100 ', and the plate 200 ' passes through the anode conductive segment 311 and the anode conductive segment 311 is conducted with the positive electrode of the rectifier 100 ', that is, the cathode and the anode are communicated, an electrochemical plating process can occur, in this situation, the copper balls in the titanium basket 320 connected to the lower side of the anode conductive segment 311 can be dissolved and form copper ions, and the copper ions can be transferred to the cathode, and elemental copper can be precipitated on the surface of the plate 200 ', so that precise plating can be realized.
In summary, the operation flow of the vertical continuous electroplating apparatus provided by this embodiment is:
firstly, the plate 200 ' is transferred to the clamp 200 by a feeding manipulator or manually, the clamp 200 clamps the plate 200 ', the second sensor 510 senses that the plate 200 is clamped by the clamp 200 ', a signal is sent to a second control unit (not shown), the second control unit (not shown) judges and sends an instruction, the cathode switch 520 between the clamp 200 clamping the plate 200 ' and the negative electrode of the rectifier 100 ' is closed, and at the moment, the cathode and the anode are not communicated, so that the electroplating process is not started.
Subsequently, under the action of the cathode conveyor belt 100, the fixture 200 and the plate 200 ' sequentially pass through the first inductor 410 and each electroplating tank 300, when the plate 200 ' passes through the first inductor 410, the first inductor 410 sends a signal to a first control unit (not shown in the figure), at this moment, the first control unit (not shown in the figure) starts to calculate the time when the plate 200 ' reaches different anode conductive segments 311, when the foremost end of the plate 200 ' in the plate conveying direction a reaches the foremost end of a certain anode conductive segment 311, the first control unit (not shown in the figure) closes an anode switch 420 between the corresponding anode conductive segment 311 and the positive electrode of the rectifier 100 ', at this moment, the cathode and the anode are communicated, and the electroplating process is started. When the extreme end of the plate member 200' in the plate member conveying direction a is separated from the extreme end of the corresponding anode conductive segment 311, the anode switch 420 is turned off, and the plating is finished. When a plurality of plate members 200' continuously and sequentially enter the plating area of the anode conductive segment 311, the anode switch 420 of the anode conductive segment 311 is kept closed to continuously plate. When the interval between the previous plate 200 'and the next plate 200' exceeds the width of the anode conductive segment 311, the anode switch 420 is still controlled by the first control unit (not shown) to be turned on or off at different times. When the last board 200' moves along the board conveying direction a, the anode conductive segments 311 of the path are sequentially closed by a first control unit (not shown) until the plating is finished.
Finally, after the plate 200 'is taken out of the electroplating tank 300, the electroplating is finished because the non-anode conductive segment 311 is connected with the anode of the rectifier 100'. After the plate 200 'passes through the post-treatment section (water washing section, drying section), the blanking manipulator or the manual handling collects the plate 200', at this time, the clamp 200 returns to unclamping the plate 200 ', the second sensor 510 sends a signal to the second control unit (not shown in the figure), the second control unit (not shown in the figure) sends a command to open the cathode switch 520 between the cathode conductive section 110 and the negative electrode of the rectifier 100', and the electroplating is finished.
Therefore, the vertical continuous electroplating device provided by the embodiment can relatively independently form directional, smooth, balanced and accurate electroplating currents according to the number of the plates 200 ' on the basis of avoiding using plating accompanying plates, thereby realizing more precise electroplating on the plates 200 ', being beneficial to promoting the thickness of the electroplated copper of the plates 200 ' to be more uniform, and further reducing the difference degree of the thickness of the electroplated copper of each production plate.
Referring to fig. 8 and 9, in the present embodiment, the clamp 200 includes a first clamping member 210 and a second clamping member 220 used together with the first clamping member 210 for clamping the plate 200', the first clamping member 210 is provided with a first clamping structure 211, the second clamping member 220 is provided with a second clamping structure 221 opposite to the first clamping structure 211, and both the first clamping structure 211 and the second clamping structure 221 are electrically connected to the second inductor 510; second sensor 510 is a resistance sensor.
It should be noted that, when the first clamping member 210 and the second clamping member 220 clamp the plate 200 ' together, the first clamping structure 211 can clamp to one plate surface of the plate 200 ' and form a clamping point, and the second clamping structure 221 can clamp to the other plate surface of the plate 200 ' and form another clamping point, so as to form a uniform clamping force on the plate 200 ', thereby being beneficial to maintaining the stable state of the plate 200 '.
It should be further noted that the second sensor 510 is a resistance sensor electrically connected to the first clamping structure 211 and the second clamping structure 221. When the first clamping structure 211 and the second clamping structure 221 contact each other without clamping the plate 200 ', the resistance measured by the second sensor 510 is relatively small, and when the first clamping structure 211 and the second clamping structure 221 are clamped at two opposite sides of the plate 200', the resistance measured by the second sensor 510 is relatively large. Therefore, the second control unit (not shown) can accurately determine whether the plate 200' is clamped on the clamp 200 by monitoring the variation of the resistance measured by the second sensor 510.
Referring to fig. 7 and 10, in the present embodiment, the cathode insulating section 120 is made of teflon.
It should be noted that, by using the cathode insulating segment 120 made of ptfe, the cathode insulating segment 120 can not only reliably and effectively prevent the mutual current crosstalk between the cathode conducting segments 110 to ensure the relative independence between the cathode conducting segments 110, but also has the advantages of stable structure, high strength, high temperature resistance, deformation resistance, and low possibility of being corroded by chemical substances, so as to improve the service performance and the service life of the cathode insulating segment 120.
Referring to fig. 4, 5 and 6, in the present embodiment, the vertical continuous plating apparatus further includes a reflow tank 600, and the reflow tank 600 and each plating tank 300 are sequentially disposed along the plate conveying direction a; the first inductor 410 is disposed in the reflow oven chamber 600.
It should be noted that the cathode conveyor 100 generally drives the fixture 200 and the plate 200' to pass through the degreasing bath cylinder, the washing bath cylinder, the pre-dipping bath cylinder 700 and the reflow bath cylinder 600 in sequence, and then pass through the electroplating bath cylinders 300 in sequence. Based on this, in the embodiment, by disposing the first sensor 410 within the range of the reflow tank 600, before the plate 200 ' enters the first electroplating tank 300, the plate 200 ' is sensed by the first sensor 410, and then the time when the plate 200 ' reaches each anode conductive segment 311 of each electroplating tank 300 is calculated in real time by the first control unit (not shown). Therefore, the induction timeliness of the first inductor 410 is favorably ensured, so that each anode conductive segment 311 can be smoothly and accurately conducted with the anode of the rectifier 100 'at the correct time, the precision electroplating of the plate 200' can be favorably ensured to be smoothly carried out, and the service performance of the vertical continuous electroplating equipment is favorably ensured and improved.
Referring to fig. 6, in the present embodiment, a reflux tank 600 is filled with reflux liquid; the first sensor 410 is provided above a liquid level line of the reflux liquid.
By adopting the above scheme, the first inductor 410 can be prevented from being soaked by the reflux liquid, so that the use performance of the first inductor 410 can be ensured, and the service life of the first inductor 410 can be prolonged.
Referring to fig. 6, in the present embodiment, the distance between the first sensor 410 and the notch of the reflow oven cylinder 600 is 30 cm.
By adopting the above scheme, can avoid first inductor 410 to be soaked by the flowing back liquid, on the basis of guaranteeing the performance of first inductor 410 and prolonging the life of first inductor 410, improve the response precision of first inductor 410 to plate 200 ', avoid first inductor 410 missense to take place to the condition of anchor clamps 200, thereby can further ensure that each positive pole conducting segment 311 can be smooth, accurately switch on with the positive pole of rectifier 100 ' at the exact opportunity, do benefit to the precision plating that ensures plate 200 ' and go on smoothly, do benefit to the performance that improves perpendicular continuous electroplating equipment.
Referring to fig. 4 and 5, in the present embodiment, the distance between the first sensor 410 and the plating tank 300 adjacent to the reflow tank 600 is 10 cm.
By adopting the above scheme, the distance between the first inductor 410 and the first electroplating tank 300 is about 10cm, so that after the first inductor 410 induces the plate 200 ', a certain time difference is still reserved for the first control unit (not shown in the figure) to calculate the time when the plate 200 ' reaches each anode conductive segment 311 of each electroplating tank 300, so that the first control unit (not shown in the figure) can send out an instruction for controlling the anode switch 420 to be timely turned on or off before the plate 200 ' passes through the first anode conductive segment 311, and based on the instruction, each anode conductive segment 311 can be further ensured to be smoothly and accurately conducted with the anode of the rectifier 100 ' at the correct time, thereby further ensuring that the precise electroplating of the plate 200 ' can be smoothly carried out, and being beneficial to improving the service performance of the vertical continuous electroplating equipment.
Referring to fig. 6, in the present embodiment, the first sensor 410 is an infrared sensor. The first inductor 410 includes a transmitting tube 411 and a receiving tube 412 disposed at both sides of the plate member 200'.
By adopting the above scheme, the transmitting tube 411 of the first sensor 410 can transmit a signal to the receiving tube 412 in real time, and when the plate 200 ' is shielded between the transmitting tube 411 and the receiving tube 412, the first sensor 410 can accurately judge that the plate 200 ' passes through, so that a first control unit (not shown in the figure) can calculate the time when the plate 200 ' reaches each anode conductive segment 311 of each electroplating tank 300 according to the sensing result of the first sensor 410, thereby being beneficial to ensuring the sensing accuracy of the first sensor 410, further ensuring that each anode conductive segment 311 can be smoothly and accurately conducted with the anode of the rectifier 100 ' at the correct time, further ensuring that the precise electroplating of the plate 200 ' can be smoothly carried out, and being beneficial to improving the service performance of the vertical continuous electroplating equipment.
Referring to fig. 3 and 10, in the present embodiment, the anode insulating section 312 is made of teflon.
It should be noted that, by using the anode insulating segment 312 made of ptfe, the anode insulating segment 312 can not only reliably and effectively prevent mutual current crosstalk between the anode conductive segments 311 to ensure relative independence between the anode conductive segments 311, but also has the advantages of stable structure, high strength, high temperature resistance, deformation resistance, and low possibility of corrosion by chemical substances, so as to improve the usability and the service life of the anode insulating segment 312.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (9)
1. A vertical continuous plating apparatus for use with a rectifier and for plating a plate member, comprising:
the cathode conveyor belt is electrically connected with the cathode of the rectifier; a plurality of clamps are connected to the lower side of the cathode conveyor belt at intervals;
the plurality of clamps are connected to the cathode conveyor belt at intervals and can move along the conveying direction of the plate under the driving of the cathode conveyor belt;
the electroplating tank cylinder is provided with at least one anode rod along the plate conveying direction, the two opposite sides of the cathode conveying belt of the electroplating tank cylinder are respectively provided with an anode rod, each anode rod comprises a plurality of anode conducting segments arranged at intervals along the plate conveying direction and a plurality of anode insulating segments connected between every two adjacent anode conducting segments, each anode conducting segment of each anode rod is connected to the anode of the rectifier in parallel, and the anode conducting segments are also connected with a titanium basket for loading copper balls;
the anode on-off assembly comprises a first inductor, a first control unit and a plurality of anode switches, wherein the first control unit is electrically connected with the first inductor, the plurality of anode switches are electrically connected with the first control unit, the anode switches are used for controlling the on-off of the anode conducting segments and the anode of the rectifier, the first inductor is used for sensing whether plates pass through or not, the first control unit is used for calculating the time when the plates pass through each anode conducting segment according to the speed of the plates when the plates pass through the first inductor, and controlling the anode switches to be closed when the plates pass through the anode conducting segments and to be opened when no plates pass through the anode conducting segments;
the cathode conveyor belt comprises a plurality of cathode conductive segments arranged at intervals along the conveying direction of the plate and a plurality of cathode insulating segments connected between two adjacent cathode conductive segments, each cathode conductive segment is connected to the negative pole of the rectifier in parallel, and each cathode conductive segment is connected with each clamp in a one-to-one correspondence manner;
the vertical continuous electroplating equipment further comprises a cathode on-off assembly, wherein the cathode on-off assembly comprises a plurality of second inductors, a second control unit electrically connected with the second inductors, and a plurality of cathode switches electrically connected with the second control unit, the cathode switches are used for controlling the cathode conductive segments and the negative pole of the rectifier to be on and off, the second inductors are used for sensing whether the clamp clamps the plate, the second control unit is used for controlling the cathode switches to be on when the second inductors sense that the clamp clamps the plate, and controlling the cathode switches to be off when the clamp does not clamp the plate.
2. The vertical continuous electroplating apparatus according to claim 1, wherein the clamp comprises a first clamping member and a second clamping member used together with the first clamping member for clamping the plate member, the first clamping member is provided with a first clamping structure, the second clamping member is provided with a second clamping structure opposite to the first clamping structure, and the first clamping structure and the second clamping structure are electrically connected with the second inductor; the second sensor is a resistance value sensor.
3. The vertical continuous plating apparatus of claim 1, wherein said cathode insulating section is made of polytetrafluoroethylene.
4. The vertical continuous plating apparatus as recited in claim 1, further comprising a return tank cylinder, the return tank cylinder and each of the plating tank cylinders being disposed in order in a plate conveying direction; the first inductor is arranged in the backflow groove cylinder.
5. The vertical continuous plating apparatus according to claim 4, wherein said reflow vessel cylinder is loaded with a reflow liquid; the first sensor is arranged on the upper side of a liquid level line of the reflux liquid.
6. The vertical continuous plating apparatus according to claim 5, wherein the first inductor is spaced from the notch of the reflow vessel by a distance of 30 cm.
7. The vertical continuous plating apparatus according to claim 4, wherein the first inductor is spaced apart from the plating tank adjacent to the reflow tank by a distance of 10 cm.
8. The vertical continuous plating apparatus of claim 4, wherein said first sensor is an infrared sensor.
9. The vertical continuous plating apparatus of claim 1, wherein said anode insulating section is made of polytetrafluoroethylene.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011487781.3A CN112760701B (en) | 2020-12-16 | 2020-12-16 | Vertical continuous electroplating equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011487781.3A CN112760701B (en) | 2020-12-16 | 2020-12-16 | Vertical continuous electroplating equipment |
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| CN112760701A CN112760701A (en) | 2021-05-07 |
| CN112760701B true CN112760701B (en) | 2022-04-12 |
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| CN202011487781.3A Active CN112760701B (en) | 2020-12-16 | 2020-12-16 | Vertical continuous electroplating equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114775023A (en) * | 2022-05-26 | 2022-07-22 | 枣庄睿诺光电信息有限公司 | Electroplating device |
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| CN210506565U (en) * | 2019-08-16 | 2020-05-12 | 联策科技股份有限公司 | Device with clamp with sensor |
| CN111172580A (en) * | 2018-07-17 | 2020-05-19 | 法西利迪股份有限公司 | Workpiece holding member, power supply monitoring system for electrolytic processing device provided with same, and electrolytic processing device |
| CN211848180U (en) * | 2019-11-12 | 2020-11-03 | 东莞宇宙电路板设备有限公司 | Electroplating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5795514B2 (en) * | 2011-09-29 | 2015-10-14 | アルメックスＰｅ株式会社 | Continuous plating equipment |
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| US5292424A (en) * | 1989-12-01 | 1994-03-08 | Atotech Deutschland Gmbh | Method for controlling the work cycle of electroplating plants |
| CN202543364U (en) * | 2012-04-24 | 2012-11-21 | 博敏电子股份有限公司 | Sectional striking current electroplating bath |
| CN104593853A (en) * | 2015-02-06 | 2015-05-06 | 苏州创峰光电科技有限公司 | On-line identification method for plating clamps |
| CN204982125U (en) * | 2015-08-24 | 2016-01-20 | 黄海 | Cathode current segmentation adjusting mechanism for perpendicular continuous electroplating production line of PCB |
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| CN112760701A (en) | 2021-05-07 |
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