CN113862760A - Electroplating device for controlling current of individual clamp - Google Patents
Electroplating device for controlling current of individual clamp Download PDFInfo
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- CN113862760A CN113862760A CN202011613110.7A CN202011613110A CN113862760A CN 113862760 A CN113862760 A CN 113862760A CN 202011613110 A CN202011613110 A CN 202011613110A CN 113862760 A CN113862760 A CN 113862760A
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- anode
- plating line
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- 238000009713 electroplating Methods 0.000 title claims abstract description 24
- 238000007747 plating Methods 0.000 claims abstract description 197
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000010408 film Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 210000000080 chela (arthropods) Anatomy 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
Abstract
The invention provides an electroplating device for controlling the current of an individual clamp, which comprises: a continuous plating line having a 1 st anode; a step-by-step plating line which is disposed at the rear of the continuous plating line and which is provided with a 2 nd anode; a control part for adjusting current values applied to the 1 st anode and the 2 nd anode to make a final plating thickness formed on the substrate uniform, wherein the continuous plating line performs plating in a state that the substrate is moved, the step plating line performs plating in a state that the substrate is stopped, the control part keeps the current value applied to the 1 st anode constant in the whole section of the continuous plating line, and the control part adjusts the current value applied to the 2 nd anode corresponding to the clamp by the clamp in a state that the clamp transferred by the continuous plating line is stopped in the step plating line to make the final plating thickness formed on the substrate uniform.
Description
Technical Field
The present invention relates to a plating apparatus for controlling a current of an individual jig, and more particularly, to a plating apparatus for controlling a current of an individual jig, which can form a plated layer having a uniform thickness on a substrate held by a jig.
Background
In order to realize patterning of a metal film on a substrate, an electroplating method which is superior in electromigration resistance and lower in manufacturing cost than an evaporation method has been preferred.
Korean laid-open patent publication No. 2010-0034318 (published on 4/1/2010) has described the principle of conventional electroplating, and describes that a copper plate for forming an anode (anode) and a substrate for forming a cathode (cathode) are immersed in a plating bath containing an electrolytic solution so that copper ions (Cu2+) separated from the copper plate move to the substrate to form a metal film.
In one example of the plating method, the plating method using the weak hanger employs the following principle: the object to be electroplated is mounted on the weak hanging bracket, is assembled on the vertical rail or the horizontal rail, is precipitated in the electroplating solution contained in the electroplating tank while being started, and then is used as a cathode, and the metal to be electroplated or insoluble metal is used as an anode.
Then, when current is supplied to the electrode through the rectifier, the plating solution is electrolyzed, and metal ions contained in the plating solution are separated and adhered to the surface of the plating object as a cathode, and a metal thin film is formed and the plating is completed after a while.
In the future, as printed wiring boards become thinner, it is necessary to control current density, plating thickness distribution, and the like in order to form a metal film with uniform thickness.
Specifically, the conventional popular plating through (tapping Power) method is an example thereof.
In this method, one rectifier is connected to a plurality of cathode hangers (cathode hangers) on which a plurality of jigs are divided, and a substrate is held in a pincer form to pass a current.
However, this blanket plating method has a disadvantage in that it is difficult to uniformly form a copper metal film on a substrate.
That is, the plating area of the substrate is large, the current start on the hanger is different, and the plating current on the substrate is dispersed due to contamination of the jig, poor chuck strength of the jig, and the like.
Due to such a plating current difference, the circuit density on the substrate becomes different, resulting in uneven plating thickness distribution.
Therefore, the copper metal film of the printed circuit board has an uneven plating layer thickness distribution as a whole, which leads to a decrease in surface quality and a decrease in reliability of the printed circuit board.
Disclosure of Invention
In order to solve the above-mentioned drawbacks of the conventional techniques, the present invention provides a plating apparatus for controlling individual chuck currents, which allows a final plating layer formed on a substrate held by a chuck to have a uniform thickness, in a plating line in which the substrate continuously moves.
The invention is realized by the following technical scheme:
the invention provides an electroplating device for controlling the current of an individual clamp, which comprises:
a continuous plating line for continuously moving a jig holding a substrate at a constant speed in one direction, supplying power to the 1 st anode, and forming a plating layer on the substrate;
a step plating line which is disposed at the rear of the continuous plating line, has a 2 nd anode, supplies power to the 2 nd anode, and forms an additional plating layer on the transferred substrate after the plating is performed in the continuous plating line;
a control part for adjusting the current value applied to the 1 st anode and the 2 nd anode to make the final plating thickness formed on the substrate uniform,
the continuous plating line performs plating in a state where the substrate is moved, the step plating line performs plating in a state where the substrate is stopped,
the control part keeps a current value applied to the 1 st anode constant in the whole section of the continuous plating line, and adjusts a current value applied to the 2 nd anode corresponding to the clamp by the clamp in a state that the clamp transferred by the continuous plating line is stopped in the step plating line, so that the final plating thickness formed on the substrate is kept uniform.
The control unit controls the current in the entire continuous plating line and the entire step plating line so that the final total current value applied to the individual jigs by the 1 st anode and the 2 nd anode is within a preset constant value, calculates an intermediate total value by summing the current values applied to the individual jigs by the 1 st anode in the continuous plating line, and adjusts and controls the current value applied to the 2 nd anode in the step plating line so that a remaining current value obtained by subtracting the intermediate total value from the final total current value is applied to the individual jigs.
Further comprising: and a jig transfer means for forcibly transferring the jig reaching the end point of the continuous plating line to a place where the 2 nd anode of the step plating line is disposed, wherein the jig transfer means transfers the jig at a speed higher than that of the continuous plating line.
The step plating line performs plating in a state where the substrate disposed in the step plating line is stopped until a new substrate reaches the end point of the continuous plating line.
The step plating line forms a 1 st individual region and a 2 nd individual region in which individual substrates are arranged along a direction, the 1 st individual region and the 2 nd individual region are respectively provided with a 2 nd anode, and when the jig transfer tool transfers a new substrate from the continuous plating line to the 1 st individual region, the substrate positioned in the 1 st individual region is transferred to the adjacent 2 nd individual region along with the movement of the jig transfer tool.
Has the advantages that:
as described above, the electroplating apparatus for controlling the current of the individual jigs according to the present invention has the following technical effects.
The invention provides a step electroplating production line arranged at the lower part of a continuous electroplating production line, and a current value applied to a No. 2 anode from the step electroplating production line is adjusted, even if the resistance value of each clamp has partial difference, the final current value applied to the clamp can be always kept constant, and the final electroplating thickness of a substrate held by the clamp can be kept uniform.
In addition, in the step plating line, the blocking plates may be provided at upper, lower, left and right sides of the 2 nd anode, so that the current may be prevented from being concentrated at the entire edge portion of the substrate, the thickness of the plating layer at the edge portion of the substrate may be prevented from being abnormally increased, and the current value applied to the 2 nd anode may be adjusted by the control part so that the plating layer formed on the entire substrate may be maintained at a uniform thickness.
Drawings
FIG. 1 is a plan view of a plating apparatus according to an embodiment of the present invention.
Fig. 2 is a plan view of the state in fig. 1 in which the jig is transferred to the 1 st individual region by the jig transfer tool.
Fig. 3 is a plan view of the state in fig. 2 in which the jigs are transferred to the 1 st individual area and the 2 nd individual area by the jig transfer tool.
Fig. 4 shows a graph of the adjusted current value of an embodiment of the present invention.
Fig. 5 is a front view of the 1 st anode and the 2 nd anode in the example of the invention.
Description of the symbols
10: a continuous electroplating production line; 11: an electroplating bath; 12: 1 st anode; 17: 1, a first guide rail;
20: a step-by-step electroplating production line; 21: an electroplating bath; 22: a 2 nd anode; 23: 1 st individual region;
24: 2 nd individual region; 25: individual partitions; 26: a through hole; 27: a 2 nd guide rail;
28: an insulated rail fitting; 29: a conductive rail fitting; 30: a control unit; 40: a jig transfer tool;
50: a clamp; 51: a substrate; 52: and (7) blocking the plate.
Detailed Description
As shown in fig. 1 to 3, the plating apparatus for controlling the current of individual jigs according to the present invention includes a continuous plating line 10, a step plating line 20, a control section 30, a jig transfer device 40, and the like.
The continuous plating line 10 is provided with a plating tank 11 and a 1 st anode 12.
The continuous plating line 10 continuously moves a jig 50 holding a substrate 51 at a constant speed in one direction, and supplies power to the 1 st anode 12 disposed inside the plating tank 11 to form a plated layer on the substrate 51.
The continuous plating line 10 is a line in which the substrate 51 is completely plated while the jig 50 holding the substrate 51 is continuously moved in one direction without stopping.
The step plating line 20 is disposed at the rear of the continuous plating line 10, and is provided with the plating tank 21 and the 2 nd anode 22.
The plating bath 21 formed in the step plating line 20 extends from the plating bath 11 formed in the continuous plating line 10.
The step plating line 20 supplies power to the 2 nd anode 22 disposed inside the plating tank 21, and after the continuous plating line 10 completes plating, an additional plating layer is formed on the substrate 51 transferred by the jig transfer device 40.
The step plating line 20 is a line for further completing plating on the substrate 51 in a state where the jig 50 for holding the substrate 51 is stopped without moving.
That is, the continuous plating line 10 performs plating while the substrate 51 is moving, and the step plating line 20 performs plating while the substrate 51 transferred by the jig transfer tool 40 is stopped, and the continuous plating line 10 and the step plating line 20 are not separately provided, but the step plating line 20 is connected to the rear of the continuous plating line 10.
As shown in fig. 4, the control part 30 adjusts the current values applied to the 1 st anode 12 and the 2 nd anode 22 so that the final plating thickness formed on the substrate 51 is maintained uniform.
The control unit 30 keeps the current value applied to the 1 st anode 12 constant in the continuous plating line 10 regardless of the individual jig 50 holding each substrate 51, and adjusts the current value applied to the 2 nd anode 22 in the step plating line 20 so that the individual jigs 50 individually match the current value.
As can be seen more specifically from the continuous plating line 10, the control portion 30 keeps the current value applied to the 1 st anode 12 constant throughout the entire section of the continuous plating line 10, i.e., throughout the entire plating section, regardless of the plurality of individual jigs 50.
That is, even if there is a partial difference in the self-resistance values of the plurality of jigs 50, the control unit 30 applies a constant current value to the 1 st anode 12 over the entire section of the continuous plating line 10 regardless of the difference.
Thus, even if the same current value is applied to the 1 st anode 12 when the resistance values of the plurality of jigs 50 are partially different, the substrate 51 held by the jigs 50 can be plated to have different thicknesses depending on the resistance values of the jigs 50.
Further, as can be seen more specifically from the step plating line 20, the control unit 30 adjusts, for each individual jig 50, that is, for each jig 50 holding each substrate 51, in a state where the jig 50 transferred from the continuous plating line 10 is stopped: the current value applied to the 2 nd anode 22 corresponding to the jig 50.
That is, the controller 30 may change and adjust the current value applied to the 2 nd anode 22 in the step plating line 20 so that the 2 nd anode 22 faces the substrate 51 held by the individual jig 50 one by one.
Thus, in the step plating line 20, the current value applied to the 2 nd anode 22 can be changed by the control unit 30 for each of the individual jigs 50 placed therein, so that the additional plating layer formed on the substrate 51 in the step plating line 20 has a different thickness.
The control part 30 keeps the current value applied to the 1 st anode 12 constant in the continuous plating line 10, and adjusts the current value applied to the 2 nd anode 22 in the step plating line 20, so that the thickness of the plating layer formed on the substrate 51 can be adjusted in the step plating line 20 even if there is a resistance value difference between the individual jigs 50, and the final plating thickness formed on the substrate 51 can be kept uniform.
In this case, in the present invention, the control unit 30 adjusts the current value in the step plating line 20 section to adjust the thickness of the plating layer formed on the substrate 51, and the step plating line 20 performs plating in a state where the substrate 51 is stopped without moving, so that the plating layer can be formed on the substrate 51 more stably, and the thickness of the plating layer can be controlled accurately.
A plurality of the 2 nd anodes 22 may be provided at intervals in the step plating line 20, and the control section 30 controls the 2 nd anodes 22.
As described above, the current values applied to the plurality of 2 nd anodes 22 are individually controlled, so that the final plating thickness formed on the substrate 51 is maintained uniform by changing the current values applied to the respective 2 nd anodes 22 by the control unit 30 and changing the thickness of the plating layer formed on the respective substrates 51 in a state where the substrates 51 are temporarily stopped after being sequentially moved in the step plating line 20.
With respect to the current values applied to the 1 st anode 12 of the continuous plating line 10 and the 2 nd anode 22 of the step plating line 20, the control portion 30 controls the currents throughout the entire sections of the continuous plating line 10 and the step plating line 20 such that the final total current value applied to the individual jigs 50 through the 1 st anode 12 and the 2 nd anode 22 is the same as a preset constant value or within a certain range.
More specifically, the control unit 30 sums up the current values applied to the individual jigs 50 by the 1 st anode 12 in the continuous plating line 10, and calculates an intermediate total value.
Then, after the control unit 30 calculates a residual current value obtained by subtracting the intermediate total value from the final total current value, the step plating line 20 adjusts and controls the current value applied to the 2 nd anode 22 so that the calculated residual current value is applied to the individual jig 50.
As described above, when the control unit 30 adjusts the current value, the final total current value applied to the jig 50 is always constant.
At this time, the final total current value does not mean a current value applied to the 1 st and 2 nd anodes 12 and 22, but means a current value detected from the jig 50 by a sensor or the like.
Therefore, even if there is a partial difference in the resistance value of each jig 50, the final current value applied to the jig 50 is always constant, thereby maintaining the final plating thickness of the substrate 51 held by the jig 50 uniform.
The jig transfer tool 40 forcibly transfers the jig 50 that has reached the end of the continuous plating line 10 to the place where the 2 nd anode 22 of the step plating line 20 is disposed.
The specific structure of the jig transfer device 40 may be any of various conventionally known devices, and thus, a description thereof will be omitted.
The jig transfer tool 40 transfers the jig 50 at a speed faster than the speed at which the jig 50 is transferred by the continuous plating line 10.
That is, the jig transfer tool 40 transfers the jig 50 to the step plating line 20 at a speed higher than the speed at which the jig 50 is transferred in the continuous plating line 10.
As shown in fig. 2, the step plating line 20 completes plating in a state where the substrate 51 disposed in the step plating line 20 is stopped until a new substrate 51 reaches the end point of the continuous plating line 10.
As described above, since the jig transfer tool 40 transfers the jig 50 at a speed higher than the speed at which the jig 50 is transferred by the continuous plating line 10, the jig 50 positioned at the end of the continuous plating line 10 is transferred to the step plating line 20, and then the step plating line 20 forms a plating layer on the substrate 51 in a stopped state until a new substrate 51 reaches the end of the continuous plating line 10.
The step plating line 20 forms the 1 st individual region 23 and the 2 nd individual region 24 in which the individual substrates 51 are arranged along one direction.
The 1 st individual region 23 and the 2 nd individual region 24 are merely examples, and many more individual regions may be present.
The 1 st individual region 23 and the 2 nd individual region 24 are provided with the 2 nd anode 22.
When a new substrate 51 is transferred from the continuous plating line 10 to the 1 st individual area 23 by the jig transfer device 40, the substrate 51 located in the 1 st individual area 23 is automatically transferred to the 2 nd individual area 24 as shown in fig. 3 along with the movement of the jig transfer device 40.
That is, the jig transfer tool 40 transfers the jig 50 disposed at the end of the continuous plating line 10 to the 1 st individual area 23 of the step plating line 20, and simultaneously transfers the jig 50 disposed in the 1 st individual area 23 to the adjacent 2 nd individual area 24.
Further, since the 1 st individual region 23 and the 2 nd individual region 24 are provided with the respective 2 nd anodes 22, the control section 30 adjusts the current values applied to the respective 2 nd anodes 22 so that the final plating thicknesses of the substrates 51 passing through the completed step plating line 20 are equalized to each other.
In the step plating line 20, individual sections 25 are provided for the individual areas 23 and 24 where the individual substrates 51 are arranged.
In the individual zones of the step plating line 20, when the substrates 51 are plated, the influence of the adjacent substrates 51 on the plating, that is, the influence of ions, electric fields, and the like can be minimized by the individual zones 25.
The individual zones 25 are provided on the step plating line 20 along a direction orthogonal to the transfer direction of the substrate 51.
The individual regions are formed between two individual partitions 25 spaced apart along the moving direction of the jig 50, and are provided with one substrate 51 and the 2 nd anode 22.
The individual partition 25 is formed with a through hole 26 for transferring the substrate 51 in one direction.
Therefore, when the jig 50 is transferred, the substrate 51 held by the jig 50 passes through the through-hole 26 formed in the individual partition 25 and is easily moved to an adjacent individual area.
The continuous plating line 10 is provided with a 1 st rail 17 made of a conductive material for transferring the jig 50, and the step plating line 20 is provided with a 2 nd rail 27 for transferring the jig 50.
The 2 nd guide rail 27 is composed of: a plurality of conductive rail members 29 made of a conductive material and arranged at intervals; insulating rail fittings 28 arranged between the conductive rail fittings 29.
The conductive rail members 29 are disposed in the respective regions and electrically connected to the jig 50 stopped in the respective regions.
The control part 30 controls the current values applied to the respective 2 nd anodes 22 arranged in the respective areas, respectively, and controls the currents throughout the continuous plating line 10 and the step plating line 20 so that the final total current values applied to the respective jigs 50 through the 1 st anodes 12 and the 2 nd anodes 22 are within a preset constant value.
Further, the 1 st anode 12 disposed in the continuous plating line 10 is provided with baffle plates 52 at the upper and lower portions thereof as shown in fig. 5(a and b), and the 2 nd anode 22 disposed in the step plating line 20 is provided with baffle plates 52 at the upper, lower, left and right sides thereof as shown in fig. 5(a and b).
In the continuous plating line 10, since the substrate 51 continues to move in the lateral direction, the resistance plates 52 cannot be provided to the left and right sides of the 1 st anode 12, but in the step plating line 20, since the plating is completed in a state where the substrate 51 is stopped, the resistance plates 52 may be provided to the left and right sides of the 2 nd anode 22.
As described above, since the blocking plates 52 are provided not only on the upper and lower portions but also on the left and right sides of the 2 nd anode 22, it is possible to prevent the current from being collected at the edge portion of the substrate 51 and the thickness of the plating layer from becoming uneven when the plating is performed.
That is, the step plating line 20 according to the present invention may be provided with the resistive plates 52 on each of the upper, lower, left, and right sides of the 2 nd anode 22, may prevent the current from being concentrated on the entire edge portion of the substrate 51, resulting in the abnormal thickening of the thickness of the plating layer on the edge portion of the substrate 51, and may adjust the value of the current applied from the control part 30 to the 2 nd anode 22, resulting in the uniformity of the thickness of the plating layer formed on the entire substrate 51.
The plating apparatus for controlling the current of the individual jigs according to the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope allowed by the technical idea of the present invention.
Claims (5)
1. An electroplating apparatus for controlling current of an individual jig, comprising:
the method comprises the following steps:
a continuous plating line for continuously moving a jig holding a substrate at a constant speed in one direction, supplying power to the 1 st anode, and forming a plating layer on the substrate;
a step plating line which is disposed at the rear of the continuous plating line, has a 2 nd anode, supplies power to the 2 nd anode, and forms an additional plating layer on the transferred substrate after the plating is performed in the continuous plating line;
a control part for adjusting the current value applied to the 1 st anode and the 2 nd anode to make the final plating thickness formed on the substrate uniform,
the continuous plating line performs plating in a state where the substrate is moved,
the step plating line performs plating in a state where the substrate is stopped,
the control part keeps a current value applied to the 1 st anode constant in the whole section of the continuous plating line, and adjusts a current value applied to the 2 nd anode corresponding to the clamp by the clamp in a state that the clamp transferred by the continuous plating line is stopped in the step plating line, so that the final plating thickness formed on the substrate is kept uniform.
2. An electroplating apparatus for controlling current of an individual chuck according to claim 1, wherein:
the control part controls the current in the whole section of the continuous electroplating production line and the step electroplating production line, so that the final total current value applied to the individual jigs through the 1 st anode and the 2 nd anode is within a preset constant value,
the control unit calculates an intermediate total value by summing up the current values applied to the individual jigs by the 1 st anode in the continuous plating line, and controls the current value applied to the 2 nd anode so that a residual current value obtained by subtracting the intermediate total value from the final total current value is applied to the individual jigs in the step plating line.
3. An electroplating apparatus for controlling current of an individual chuck according to claim 1, wherein:
further comprising: a jig transfer tool for forcibly transferring the jig reaching the end point of the continuous plating line to a place where the 2 nd anode of the step plating line is disposed,
the jig transfer tool transfers the jig at a speed faster than that of the continuous plating line.
4. An electroplating apparatus for controlling current of an individual chuck according to claim 1, wherein: the step plating line performs plating in a state where the substrate disposed in the step plating line is stopped until a new substrate reaches the end point of the continuous plating line.
5. An electroplating apparatus for controlling current of an individual chuck according to claim 3, wherein:
the step plating line forms a 1 st individual region and a 2 nd individual region in which individual substrates are arranged along a direction,
the 1 st and 2 nd individual regions are provided with 2 nd anodes respectively,
when the jig transfer tool transfers a new substrate from the continuous plating line to the 1 st individual area, the substrate located in the 1 st individual area is transferred to the adjacent 2 nd individual area in accordance with the movement of the jig transfer tool.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2020-0080185 | 2020-06-30 | ||
| KR1020200080185A KR102164884B1 (en) | 2020-06-30 | 2020-06-30 | Plating apparatus for controlling current applied jig |
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| Publication Number | Publication Date |
|---|---|
| CN113862760A true CN113862760A (en) | 2021-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011613110.7A Pending CN113862760A (en) | 2020-06-30 | 2020-12-30 | Electroplating device for controlling current of individual clamp |
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| Country | Link |
|---|---|
| KR (1) | KR102164884B1 (en) |
| CN (1) | CN113862760A (en) |
| TW (1) | TWI746330B (en) |
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| KR102271818B1 (en) | 2021-01-22 | 2021-07-02 | (주)네오피엠씨 | Auto control method and control system of copper ion concentration in plating solution |
| KR102306782B1 (en) * | 2021-03-04 | 2021-09-30 | (주)네오피엠씨 | Current control system of electric planting substrate |
| KR102435753B1 (en) * | 2021-10-25 | 2022-08-25 | 임지훈 | System for improving deviation of electroplating apparatus |
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| CN204982125U (en) * | 2015-08-24 | 2016-01-20 | 黄海 | Cathode current segmentation adjusting mechanism for perpendicular continuous electroplating production line of PCB |
| KR101859395B1 (en) * | 2017-10-18 | 2018-05-18 | (주)네오피엠씨 | Substrate plating apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3523555B2 (en) * | 2000-02-28 | 2004-04-26 | 古河電気工業株式会社 | Plating equipment |
| JP2006037134A (en) * | 2004-07-23 | 2006-02-09 | Chuo Seisakusho Ltd | Current control method for continuous plating device of carrier system |
| CN201485521U (en) * | 2009-08-14 | 2010-05-26 | 宁波华龙电子股份有限公司 | Continuous electroplating device for lead frame of integrated circuit |
| CN202246942U (en) * | 2011-08-29 | 2012-05-30 | 江阴康强电子有限公司 | Continuous plating device for lead frame |
| JP5795514B2 (en) * | 2011-09-29 | 2015-10-14 | アルメックスＰｅ株式会社 | Continuous plating equipment |
| KR101300325B1 (en) | 2011-12-21 | 2013-08-28 | 삼성전기주식회사 | Apparatus for plating substrate and control method thereof |
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2020
- 2020-06-30 KR KR1020200080185A patent/KR102164884B1/en active IP Right Grant
- 2020-12-29 TW TW109146731A patent/TWI746330B/en active
- 2020-12-30 CN CN202011613110.7A patent/CN113862760A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009120938A (en) * | 2007-11-14 | 2009-06-04 | Samsung Electro Mech Co Ltd | Plating apparatus |
| CN204982125U (en) * | 2015-08-24 | 2016-01-20 | 黄海 | Cathode current segmentation adjusting mechanism for perpendicular continuous electroplating production line of PCB |
| KR101859395B1 (en) * | 2017-10-18 | 2018-05-18 | (주)네오피엠씨 | Substrate plating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102164884B1 (en) | 2020-10-14 |
| TWI746330B (en) | 2021-11-11 |
| TW202202663A (en) | 2022-01-16 |
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