KR20030025523A - apparatus for electroplating PCB - Google Patents

apparatus for electroplating PCB Download PDF

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Publication number
KR20030025523A
KR20030025523A KR1020010058604A KR20010058604A KR20030025523A KR 20030025523 A KR20030025523 A KR 20030025523A KR 1020010058604 A KR1020010058604 A KR 1020010058604A KR 20010058604 A KR20010058604 A KR 20010058604A KR 20030025523 A KR20030025523 A KR 20030025523A
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South Korea
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plating
basket
rectifier
pcb
terminal
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KR1020010058604A
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Korean (ko)
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홍승유
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지에스티 반도체장비(주)
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Priority to KR1020010058604A priority Critical patent/KR20030025523A/en
Publication of KR20030025523A publication Critical patent/KR20030025523A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: A PCB electrolytic plating apparatus is provided to be capable of making a plating layer thickness of an object uniform by reducing deflection of a current density according to a part of the object. CONSTITUTION: A basket(22) consists of a plurality of baskets disposed on a hanger(24) so as to be spaced apart from one another. Each of the baskets has a terminal(23). A rectifier(30) has a plurality of rectification control parts(31) to control respective outputs individually. Each of the rectification control parts(31) has an anode output terminal(32), which is connected to a corresponding terminal(23) of each basket(22). A cathode output terminal(33) is connected to a cathode bar(25) so as to control a current value applied to each basket(22) individually.

Description

ＰＣＢ 전해도금장치{ apparatus for electroplating PCB}PCC electroplating apparatus {apparatus for electroplating PCB}

본 발명은 전해 도금장치에 관한 것으로, 특히 전자회로기판(Printed Circuit Board, 이하 간단히 'PCB'라 한다)의 패턴을 형성하기 위한 전해도금장치에 관한 것이다.The present invention relates to an electroplating apparatus, and more particularly, to an electroplating apparatus for forming a pattern of a printed circuit board (hereinafter, simply referred to as 'PCB').

PCB는 제조될 때 여러종류의 도금공정을 거치게 되는 데, 이들 도금공정은 패턴도금(pattern plating)과 패널도금(panel plating)으로 분류할 수 있으며, 이들 도금공정은 모두 관통구멍( through hole) 도금을 위한 1차 무전해 동도금 이후의 공정으로 전자의 경우 노광, 현상후 패턴만을 선택적으로 2차로 동도금 및 납 도금을 한 후 필름을 박리하고 회로부 이외의 불필요한 부분은 에칭공정에서 에칭액(etchant)으로 부식하여 제거하게 되어 있고, 후장의 경우는 전체를 2차로 동도금한 이우에 노광, 현상을 거쳐 회로부를 필름으로 피복한 후 이외의 불필요한 부분을 에칭액으로 부식하여 제거하는 방법이다.When a PCB is manufactured, it is subjected to various plating processes, which can be classified into pattern plating and panel plating, all of which are through hole plating. For the former, after the first electroless copper plating process, in case of the former, copper plating and lead plating are selectively performed after the exposure and development only for the second time, and the film is peeled off, and the unnecessary parts other than the circuit part are corroded by the etchant in the etching process. In the case of a thick sheet, after coating and exposing the circuit part with the film to the Yiwu which copper-plated the whole secondary, the unnecessary part is corroded and removed by etching liquid.

그런데 현재 반도체가 고기능화와 고집적화되어 감에 따라 회로부의 선폭 및 선사이 간격이 점점 좁아지고 있으며 선폭과 선사이 간격을 균일하게 줄이는 것이 제품의 품질과 성능을 결정하는 요인이 된다. 특히 도금 두께의 편차를 줄이는 것이 정밀 패턴(fine pattern)을 달성할 수 있는 중요한 요소가 되는 데, 이러한 도금두께는 피도물 위치에 따라 편차가 발생하고 그로인하여 제품의 품질에 영향을 미치게 된다. 예컨대 도금두께의 편차가 큰 상태에서 부식공정을 진행할 경우 도금층이 두꺼운 부분은 완전히 부식이 되지 못하므로 선사이에 단락이 발생하고, 요구되는 선 사이 간격을 유지할 수 없게 되는 반면, 도금층이 얇은 부분은 과도한 부식이 진행되어 선폭이 가늘어지거나 단락현상이 발생하여 불량원인이 된다.However, as semiconductors become more highly functional and highly integrated, line widths and line spacing between circuit sections become narrower and narrower between line widths and line spacing become factors that determine product quality and performance. In particular, reducing the variation in plating thickness is an important factor in achieving a fine pattern, which causes variation in the position of the workpiece and thereby affects the quality of the product. For example, when the corrosion process is performed in a state where the plating thickness is large, the thick portion of the plated layer is not completely corroded, and thus short circuit occurs in the liner, and the gap between the required lines cannot be maintained, while the thin portion of the plated layer is excessively Corrosion progresses and the line width becomes thinner or short-circuit occurs, which causes defect.

이러한 도금공정을 수행하는 종래의 전해도금장치는 도 1에 도시된 바와 같이, 도금조(1)의 중앙에 피도물인 PCB(10)를 음극봉(9)에 걸어 정류기(11)의 음극단자(11a)에 연결하고, 좌우측에는 양극봉(3)을 설치하며 양극봉(3)에는 바스켓(7)에 구형상의 동(8)을 적재하거나 동괴를 적재한 상태에서 정류기(11)의 양쪽 단자(11a,11b)에 전원을 인가하면 도금용액은 양극에서 동이온으로 분리하여 음극의 피도물로 이송시켜 부착시킴으로써 도금을 수행하게 되어 있다. 설명하지 않은 도면부호 5는 걸이봉이다.In the conventional electroplating apparatus for performing such a plating process, as shown in FIG. 1, the cathode 10 of the rectifier 11 is attached to the cathode 10 by hanging the PCB 10, which is a workpiece in the center of the plating vessel 1, on the cathode rod 9. 11a), and the positive and negative poles 3 are installed on the left and right sides, and both terminals of the rectifier 11 are mounted on the positive pole rods 3 with the spherical copper 8 in the basket 7 or the ingot loaded. When power is applied to 11a, 11b), the plating solution is separated by copper ions from the positive electrode and transferred to the object of the negative electrode to attach. Reference numeral 5 that is not described is a hanger rod.

상기 종래의 도금장치는 단일의 전극으로 구성되어 있고, 이 전극에서는 일정한 전류를 송출하게 되어 있으므로 피도물의 위치마다 전류밀도가 달라서 도금층의 두께가 피도물의 위치마다 불균일해지는 문제가 있었다. 이와 같이 도금두께가 불균일한 문제를 해결하기 위하여 종래에는 전류의 세기를 조절하거나 도금용액의 조성성분을 조정하거나 용액흐름, 도금조의 용액온도를 조절하였으나 이러한 조절로써는 피도물의 부위마다 전류밀도편차에 따른 도금층의 두께를 균일하게 하는 데에는 불완전하였다.The conventional plating apparatus is composed of a single electrode, and since this electrode transmits a constant current, there is a problem that the thickness of the plating layer is uneven for each position of the workpiece because the current density is different for each position of the workpiece. Thus, in order to solve the problem of uneven plating thickness, conventionally, the strength of the current was adjusted, the composition of the plating solution was adjusted, the solution flow, and the solution temperature of the plating bath were adjusted. It was incomplete in making thickness of a plating layer uniform.

이에 본 발명은 상기한 바와 같은 종래 전해 도금장치의 문제점을 해결하기 위하여 고안된 것으로, 피도물의 부위에 따른 전류밀도의 편차를 줄여서 피도물의 도금층 두께를 균일하게 하는 도금장치를 제공함에 목적이 있다. 그리고 본 발명은 종래 기존의 도금장치의 설비변경을 최소화하여 기존 도금장치를 활용하고자 함에 또 다른 목적이 있다.Accordingly, the present invention is designed to solve the problems of the conventional electrolytic plating apparatus as described above, and an object of the present invention is to provide a plating apparatus that makes the thickness of the coating layer uniform by reducing the variation in current density according to the portion of the workpiece. And another object of the present invention is to utilize the existing plating apparatus by minimizing the equipment change of the conventional plating apparatus.

도 1은 종래 PCB 전해도금장치의 개략적인 구성을 도시한 도면,1 is a view showing a schematic configuration of a conventional PCB electroplating apparatus,

도 2는 본 발명에 따른 전해도금장치의 개략적인 구성을 도시한 평면도,2 is a plan view showing a schematic configuration of an electroplating apparatus according to the present invention;

도 3은 본 발명에 따른 전해도금장치를 절단하여 정면에서 도시한 단면도,Figure 3 is a cross-sectional view from the front cut the electroplating apparatus according to the present invention,

도 4는 본 발명에 따른 전해도금장치를 절단하여 측면에서 도시한 단면도이다.4 is a cross-sectional view of the electroplating apparatus according to the present invention.

※ 도면의 주요부분에 대한 부호의 설명※※ Explanation of code about main part of drawing ※

20: 도금조 21: 도금금속체20: plating bath 21: plating metal body

22: 바스켓 23: 단자22: basket 23: terminal

24: 행거 25: 음극봉24: hanger 25: cathode rod

26: PCB26: PCB

30: 정류기 31: 정류제어부30: rectifier 31: rectifier control unit

32: 양극출력단자 33: 음극출력단자32: positive output terminal 33: negative output terminal

상기 목적을 달성하기 위한 본 발명은 도금용액을 수용하고 있는 도금조의 좌우측 측벽에 각각 도금금속체를 수용하는 바스켓이 행거를 통하여 복수개 설치되고, 도금조의 중앙에는 음극이 연결되는 피도물인 PCB가 설치되며 도금금속체를 수용하는 각 바스켓과 피도물인 PCB사이에 직류전원을 공급하는 정류기는 복수개의 양극의 출력단자를 가지고 각 양극의 출력단자마다 각각 다른 전류값이 출력되게 복수의 정류제어부를 구비하여 상기 정류제어부의 양극출력단자는 상기 바스켓마다 1개씩 연결되고 음극출력단자는 상기 음극봉에 연결되어 상기 바스켓마다 인가되는 전류값을 각각 개별적으로 제어하는 구성으로 된 것이다.The present invention for achieving the above object is provided with a plurality of baskets each containing a plated metal body through a hanger on the left and right side walls of the plating bath containing the plating solution, the PCB is installed in the center of the plating bath is connected to the cathode The rectifier for supplying DC power between each basket accommodating the plated metal body and the PCB to be coated is provided with a plurality of rectifier control units to have a plurality of output terminals of a plurality of anodes and to output different current values for each output terminal of each anode. One positive output terminal of the control unit is connected to each one of the baskets and one negative output terminal is connected to the negative electrode bar is configured to control each of the current value applied to each basket individually.

본 발명의 전해도금장치는 상기한 바와 같이 구성됨으로써 정류기의 각 정류부마다 개별적으로 전류의 세기를 제어하여 각 도금금속체에 인가되는 전류의 세기를 조절함으로써 피도물의 위치마다 서로 다른 전류밀도를 형성하고, 그로써 피도물의 부위마다 도금층의 두께를 조절할 수 있다. 그러므로 제품의 특성에 따라 도금층 두께 편차를 극소화하여 제품의 도금품질을 향상시키고 불량을 방지할 있다.The electroplating apparatus of the present invention is configured as described above to form a different current density for each position of the workpiece by controlling the strength of the current applied to each plated metal body by controlling the strength of the current individually for each rectifying portion of the rectifier. Thus, the thickness of the plating layer can be adjusted for each part of the workpiece. Therefore, the plating layer thickness variation can be minimized according to the characteristics of the product to improve the plating quality of the product and prevent defects.

이하, 본 발명에 따른 전해 도금장치의 실시예를 첨부도면에 따라 상세히 설명한다.Hereinafter, an embodiment of the electroplating apparatus according to the present invention will be described in detail according to the accompanying drawings.

도 2는 본 발명에 따른 전해 도금장치의 구성을 개략적으로 도시한 평면도이고, 도 3은 도금조를 길이방향으로 절단하여 도시한 정면도이며, 도 4는 도금조를 폭방향으로 절단하여 도시한 측면도이다.Figure 2 is a plan view schematically showing the configuration of an electrolytic plating apparatus according to the present invention, Figure 3 is a front view showing the plating bath in the longitudinal direction, Figure 4 is a side view showing the plating bath in the width direction cut to be.

본 발명에 따른 전해 도금장치는, 도 2 내지 도 4에 도시된 바와 같이 도금용액을 수용하고 있는 도금조(20)를 포함하고, 상기 도금조(20)의 좌우측 측벽에는 도금금속체(21)를 담아서 수용하는 복수개의 바스켓(22)이 행거(24)에 상하좌우로 일정한 간격으로 설치된다. 상기 각 바스켓(22)마다 단자(23)가 구비되어 양극이 연결되게 되어 있고, 각 바스켓(22)은 측벽 및 바닥에 복수개의 구멍이 뚫려져 있으며 티타늄재로 만들어 진다.The electroplating apparatus according to the present invention includes a plating bath 20 containing a plating solution as shown in FIGS. 2 to 4, and the plating metal body 21 is disposed on the left and right side walls of the plating bath 20. A plurality of baskets 22 to receive and accommodate the hangers 24 are installed at regular intervals in the vertical, horizontal, vertical direction. Each basket 22 is provided with a terminal 23 so that a positive electrode is connected thereto, and each basket 22 has a plurality of holes formed in the sidewall and the bottom thereof and is made of titanium.

그리고 도 2 및 도 3에 도시된 바와 같이, 상기 도금조(20)의 중앙에는 음극봉(25)이 폭방향으로 설치되고, 상기 음극봉(25)은 피도물인 PCB(26)인 PCB를 걸어서 지지하며, 한쪽 선단에 음극이 연결된다.2 and 3, the cathode rod 25 is installed at the center of the plating bath 20 in the width direction, and the cathode rod 25 is a PCB 26 which is a workpiece 26 by walking. It supports, and the cathode is connected to one end.

본 발명의 전해도금장치는, 도 2에 도시된 바와 같이 상기 각 바스켓(22)과 피도물인 PCB(26)사이에 직류전원을 공급하는 정류기(30)를 구비하고, 상기 정류기(30)는 각각 개별적으로 출력을 제어하도록 된 복수의 정류제어부(31)를 구비한다. 상기 각 정류제어부(31)는 각각의 양극출력단자(32)를 가지고, 각 양극출력단자(32)는 상기 바스켓(22)의 단자(23)마다 개별적으로 연결되고 음극출력단자(33)는 상기 음극봉(25)에 연결되어 상기 바스켓(22)마다 인가되는 전류값을 각각 개별적으로 제어하게 된 것이다.The electroplating apparatus of the present invention, as shown in Figure 2 is provided with a rectifier 30 for supplying a DC power between the basket 22 and the PCB (26), the rectifier 30, respectively A plurality of rectifier controllers 31 are provided to control the output individually. Each rectifier control unit 31 has a respective positive output terminal 32, each positive output terminal 32 is individually connected to each terminal 23 of the basket 22 and the negative output terminal 33 is It is connected to the cathode rod 25 to control the current value applied to each of the baskets 22 individually.

상기한 바와 같이 구성된 본 발명의 전해도금장치는 상기 각 바스켓(22)에 복수개의 동재 구(球)를 담아두고, 피도물인 PCB(26)의 각 부위마다 개별적인 전류치가 인가되게 상기 바스켓(22)마다 연결된 정류제어부(31)의 설정치를 조정한다. 그 상태에서 전원을 인가하면 상기 정류기(30)의 각 정류제어부(31)는 바스켓(22)마다 서로 다른 전류치를 인가하게 되고 그에 따라 피도물인 PCB(26)의 부위마다각각 다른 전류밀도가 형성되어 피도물인 PCB(26)의 위치에 따라 다른 도금두께가 형성되게 되어 도금층이 전체적으로 균일하게 된다.The electroplating apparatus of the present invention configured as described above contains a plurality of copper spheres in each basket 22, and the basket 22 so that a separate current value is applied to each portion of the PCB 26 as a workpiece. The set value of the rectification control part 31 connected every time is adjusted. When power is applied in this state, each rectifier control unit 31 of the rectifier 30 applies different current values for each basket 22, and accordingly, different current densities are formed for each portion of the PCB 26 as a workpiece. Different plating thicknesses are formed depending on the position of the PCB 26 as the workpiece, so that the plating layer is uniform throughout.

상기한 본 발명의 전해도금장치는 일정한 전류치가 PCB에 전체적으로 일정한 전류치가 인가되어 PCB의 위치에 따라 전류밀도가 불균일한 단점을 해소하여 양극의 출력단자마다 출력되는 전류치를 개별적으로 제어하여 PCB의 위치에 따라 다른 전류치를 인가함으로써 PCB에 전체적으로 전류밀도가 균일하게 되어 도금층이 전체적으로 균일하게 된다.In the electroplating apparatus of the present invention described above, a constant current value is applied to the PCB as a whole so that the current density is uneven according to the position of the PCB. Therefore, by applying different current values, the current density is uniform to the PCB as a whole, and the plating layer is uniform as a whole.

Claims (1)

도금용액을 수용하고 있는 도금조(20), 각각 도금금속체(21)를 수용하여 도금금속체 행거(24)로써 상기 도금조(20)의 좌우양쪽에 설치되는 바스켓(22)과, 상기 도금조(20)의 중앙에서 피도물인 PCB(26)를 상기 도금금속체(21)와 서로 마주보게 설치하는 음극봉(25)과, 교류를 정류하여 음극은 상기 음극봉(25)에 연결하고 양극은 상기 바스켓(22)에 연결하여 상기 도금금속체(21)와 PCB(26)사이에 소정의 전압을 인가하는 정류기(30)를 포함한 도금장치에 있어서,A plating tank 20 containing a plating solution, a basket 22 which receives plating metal bodies 21, respectively, and which is installed on left and right sides of the plating bath 20 as plating metal hangers 24, and the plating. In the center of the tank 20, the negative electrode rod 25 for installing the PCB 26, which is the workpiece to face each other with the plated metal body 21, and rectifies the alternating current, the negative electrode is connected to the negative electrode rod 25 and the positive electrode In the plating apparatus including a rectifier 30 is connected to the basket 22 to apply a predetermined voltage between the plated metal body 21 and the PCB 26, 상기 바스켓(22)은 상기 행거(24)상에 상하좌우로 일정한 간격을 두고 배치된 복수개의 바스켓(22)으로 이루어지고, 각 바스켓(22)마다 단자(23)를 구비하며,상기 정류기(30)는 각각 개별적으로 출력을 제어하도록 된 복수의 정류제어부(31)를 구비하며, 상기 각 정류제어부(31)는 각각의 양극출력단자(32)를 가지고, 각 양극출력단자(32)는 상기 바스켓(22)의 단자(23)마다 개별적으로 연결되고 음극출력단자(33)는 상기 음극봉(25)에 연결되어 상기 각 바스켓(22)마다 인가되는 전류값을 각각 개별적으로 제어하게 된 것을 특징으로 하는 PCB 전해도금장치.The basket 22 is composed of a plurality of baskets 22 arranged at regular intervals on the hanger 24 at regular intervals up, down, left and right, and each terminal 22 has a terminal 23, and the rectifier 30 ) Each has a plurality of rectifier controllers 31 to control the output individually, each rectifier control unit 31 has a respective positive output terminal 32, each positive output terminal 32 is the basket Each terminal 23 of the 22 is connected individually and the negative output terminal 33 is connected to the negative electrode 25, characterized in that to control the current value applied to each of the basket 22 individually PCB electroplating device.
KR1020010058604A 2001-09-21 2001-09-21 apparatus for electroplating PCB KR20030025523A (en)

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CN103789818A (en) * 2012-10-31 2014-05-14 三星电机株式会社 System and method for controlling electroplating
CN111378997A (en) * 2018-12-31 2020-07-07 乐金显示有限公司 Plating apparatus and plating method using the same

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JPH06116799A (en) * 1992-10-01 1994-04-26 Hitachi Chem Co Ltd Electroplating method
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CN103789818A (en) * 2012-10-31 2014-05-14 三星电机株式会社 System and method for controlling electroplating
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CN111378997B (en) * 2018-12-31 2023-04-28 乐金显示有限公司 Electroplating apparatus and electroplating method using the same
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