CN214115758U - Electroplating device - Google Patents
Electroplating device Download PDFInfo
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- CN214115758U CN214115758U CN202022048430.4U CN202022048430U CN214115758U CN 214115758 U CN214115758 U CN 214115758U CN 202022048430 U CN202022048430 U CN 202022048430U CN 214115758 U CN214115758 U CN 214115758U
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Abstract
The application discloses electroplating device, electroplating device includes: the device comprises an electroplating container, two metal electrode plates which are arranged at intervals and in parallel, a transportation assembly and a power supply assembly; the electroplating container is used for accommodating electroplating solution; the two metal electrode plates are arranged in the electroplating container, an electroplating space is formed between the two metal electrode plates, and the electroplating space is used for accommodating a workpiece to be processed so as to realize electroplating operation of the workpiece to be processed; the conveying assembly is arranged at one end of the metal electrode plate and is used for fixing the workpiece to be processed and driving the workpiece to be processed to move towards the direction close to or far away from the electroplating space; the positive electrode of the power supply assembly is electrically connected with one end, far away from the transportation assembly, of the metal electrode plate, the negative electrode of the power supply assembly is electrically connected with the workpiece to be processed, and the potential difference between the metal electrode plate and the workpiece to be processed enables metal ions in electroplating solution to gather towards the workpiece to be processed so as to plate and form a conductive metal layer on the surface of the workpiece to be processed. The thickness uniformity of the conductive metal layer plated on the workpiece to be processed is ensured through the scheme.
Description
Technical Field
The application belongs to the technical field of printed circuit board processing equipment, and particularly relates to an electroplating device.
Background
At present, on a Printed Circuit Board (PCB), a conductive metal layer may be formed on a surface of the PCB and an inner wall of a through hole by electroplating, and then a predetermined functional Circuit may be formed on the PCB by patterning and/or back drilling.
In the prior art, a copper ball is generally used as an electroplating anode, and a circuit board to be processed is used as an electroplating cathode, so as to realize electroplating processing of the circuit board to be processed. However, when the conventional electroplating device is used to perform electroplating on the circuit board to be processed, the thickness uniformity of the formed conductive metal layer is not high.
SUMMERY OF THE UTILITY MODEL
The present application provides an electroplating apparatus to solve the above technical problems.
In order to solve the technical problem, the application adopts a technical scheme that: there is provided an electroplating apparatus including:
an electroplating container for accommodating an electroplating solution;
the electroplating container comprises two metal electrode plates which are arranged in parallel at intervals, an electroplating space is formed between the two metal electrode plates, and the electroplating space is used for accommodating a workpiece to be processed so as to realize electroplating operation on the workpiece to be processed;
the conveying assembly is arranged at one end of the metal electrode plate and is used for fixing the workpiece to be processed and driving the workpiece to be processed to move towards the direction close to or far away from the electroplating space;
the positive electrode of the power supply assembly is electrically connected with one end, far away from the conveying assembly, of the metal electrode plate, the negative electrode of the power supply assembly is electrically connected with the workpiece to be machined, and through the potential difference between the metal electrode plate and the workpiece to be machined, metal ions in the electroplating solution are gathered towards the workpiece to be machined so as to plate a metal layer on the surface of the workpiece to be machined.
Optionally, the metal electrode plate is a phosphor copper plate or a titanium plate.
Optionally, the power supply assembly comprises a power supply and a conductive member;
the power supply is electrically connected with the conductive piece, and the conductive piece is connected to one end, far away from the transportation assembly, of the metal electrode plate.
Optionally, the conductive member includes a plurality of contact portions arranged at intervals, the plurality of contact portions are connected to the metal electrode plate, and the conductive member is electrically connected to the metal electrode plate through the contact portions.
Optionally, a slot is formed in one end of the metal electrode plate, which is far away from the transportation assembly, and at least part of the contact portion is inserted into the slot to realize connection with the metal electrode plate
Optionally, the surface of the workpiece to be machined, which faces the metal electrode plate, is parallel to the metal electrode plate.
Optionally, the electroplating device further comprises a first driving device, and the first driving device is connected to the metal electrode plate and is used for driving the metal electrode plate to move towards a direction close to or away from the transportation assembly.
Optionally, the electroplating device further comprises a second driving device, and the second driving device is connected to the metal electrode plates and is used for driving the two metal electrode plates to move towards or away from each other.
Optionally, the electroplating apparatus further comprises a controller, the controller is coupled to the first driving device, and the controller is configured to control the first driving device to enable the first driving device to drive the metal electrode plate to move toward or away from the transportation assembly.
Optionally, the controller is further configured to control the first driving device to operate according to a size of the workpiece to be processed immersed in the electroplating solution, so that the electroplating space formed by the metal electrode plate can accommodate the workpiece to be processed.
The beneficial effect of this application is: the embodiment of the application can ensure the uniformity of charge distribution on the metal electrode plate by connecting the positive electrode of the power supply to one side of the metal electrode plate, which is far away from the transportation assembly, and further ensure the thickness uniformity of the metal layer plated on the workpiece to be processed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic structural diagram of an embodiment of an electroplating apparatus provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are referred to in the embodiments of the present application, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an electroplating apparatus according to an embodiment of the present disclosure.
The electroplating apparatus 10 includes an electroplating vessel (not shown), two spaced parallel metal electrode plates 100, a transport assembly 200, and a power module 300.
The electroplating container is used for accommodating electroplating solution; the plating solution may be a conductive solution having metal ions, and among them, may be a salt solution of copper, a salt solution of zinc, or the like.
The metal electrode plate 100 may be disposed within a plating vessel, and the metal electrode plate 100 may be at least partially immersed in a plating solution when performing a plating operation.
In this embodiment, the number of the metal electrode plates 100 is two, and the two metal electrode plates 100 are parallel and spaced apart from each other. The region between the two metal electrode plates 100 may then form a plating space 101. The work piece to be processed can be immersed in the plating solution in the plating space 101, thereby realizing the plating process.
In this embodiment, the metal electrode plate 100 may be connected to the positive electrode of the power module 300 to form a plating anode, and the workpiece to be processed is connected to the negative electrode of the power module 300 to form a plating cathode.
When electroplating operation is carried out, a parallel electric field can be formed between the metal electrode plate 100 and a workpiece to be processed, because the electric potential of an electroplating anode formed by the metal electrode plate 100 is greater than the electric potential of an electroplating cathode formed by the workpiece to be processed, positively charged metal cations in an electroplating solution can be gathered to the surface of the workpiece to be processed, wherein, because a negative electrode of the power supply component 300 can release electrons into the electroplating solution through the workpiece to be processed, the released electrons can be combined with the metal cations to form metal atoms, a large number of metal atoms are gathered on the surface of the workpiece to be processed, so that a conductive metal layer can be formed, and parameters such as electroplating time and the concentration of the electroplating solution are adjusted, so that the formed conductive metal layer has a preset thickness.
In this embodiment, when the metal electrode plate 100 is placed in the electroplating container, the opening of the electroplating container is generally upward, and at this time, the positive electrode of the power module 300 may be connected to the end of the metal electrode plate 100 away from the opening of the electroplating container, and the transportation module 200 may be disposed at the opening of the electroplating container or above the opening of the electroplating container. The transporting assembly 200 can fix the workpiece to be processed and move the workpiece to be processed toward or away from the electroplating space 101.
Therefore, the transportation assembly 200 can drive the workpiece to be processed into the electroplating space 101 from the side of the metal electrode plate 100 away from the connection end with the positive electrode of the power supply assembly 300, so as to realize electroplating of the workpiece to be processed.
Therefore, in this embodiment, the positive electrode of the power supply module 300 is connected to one end of the metal electrode plate 100 far from the transport module 200, so that in the process that the transport module 200 drives the workpiece to be processed to move into the electroplating space 101, the electric charges accumulated on the metal electrode plate 100 at the connection end region between the positive electrode of the power supply module 300 and the metal electrode plate 100 are uniformly dispersed on the whole metal electrode plate 100, and therefore, the uniformity of the electric field formed between the metal electrode plate 100 and the workpiece to be processed can be ensured, and the thickness uniformity of the conductive metal layer plated on the workpiece to be processed can be ensured.
In this embodiment, the metal electrode plate 100 is a phosphor-copper plate, wherein the metal electrode plate 100 may be formed by adding phosphor to copper, and the phosphor-copper plate may have good conductivity and corrosion resistance, which may ensure the conductivity of the circuit during the electroplating operation and may prevent the metal electrode plate 100 from being corroded in the electroplating solution. The metal electrode plate 100 has a uniform thickness throughout. In other embodiments, the metal electrode plate 100 may also be a titanium plate, wherein the titanium plate may be made of titanium metal or titanium alloy.
Referring further to fig. 1, power module 300 includes a power source (not shown) and a conductive member 320. The positive electrode of the power source may be electrically connected to the conductive member 320, and electrically connected to the metal electrode plate 100 through the conductive member 320.
In this embodiment, the conductive member 320 is connected to an end of the metal electrode plate 100 away from the transportation assembly 200.
The conductive member 320 may be configured to include a plurality of contact portions 321 arranged at intervals, the plurality of contact portions 321 are connected to the metal electrode plate 100, and the conductive member 320 may be electrically connected to the metal electrode plate 100 through the contact portions 321.
Alternatively, the end of the metal electrode plate 100 away from the transportation assembly 200 may be provided with a slot, and the contact portion 321 may be at least partially inserted into the slot to achieve connection with the metal electrode plate 100.
In this embodiment, the conductive member 320 may include an elongated main body plate 322, and the contact portion 321 may be a boss portion disposed on one side of the main body plate 322, wherein the main body plate 322 and the contact portion 321 may be integrally formed, or may be separately formed and then fixedly connected by welding, adhering, or using a bolt structure to fix. Wherein the main body board 322 and each contact portion 321 are also electrically connected. The main body plate 322 can be used to electrically connect with the positive electrode of the power source, wherein the positive electrode of the power source and the main body plate 322 can be connected by a conductive connector such as a conductive wire.
Further, in this embodiment, the workpiece to be processed may be a circuit board to be processed, and the electroplating device 10 may form a conductive metal layer with a predetermined thickness on the surface of the circuit board to be processed and the inner wall of the through hole of the circuit board to be processed.
In this embodiment, the surface of the workpiece facing the metal electrode plate 100 may be parallel to the metal electrode plate 100.
In this embodiment, the transportation assembly 200 may include a fixing mechanism 210 and a power mechanism (not shown), wherein the power mechanism may be connected to the fixing mechanism 210 to drive the fixing mechanism 210 to move toward or away from the electroplating space 101, and the fixing mechanism 210 may fix the workpiece to be processed, so that the workpiece to be processed moves synchronously.
It should be noted that, in this embodiment, the fixing mechanism 210 may also be made of a conductive material, and the fixing mechanism 210 may be connected to the negative electrode of the power supply, so that the workpiece to be processed fixed by the fixing mechanism 210 may be connected to the negative electrode of the power supply, thereby forming the electroplating cathode.
Referring to fig. 1, similarly, the fixing mechanism 210 may be provided with a plurality of fixing portions, and the fixing portions are disposed at intervals for clamping the workpiece to be processed, and the fixing portions of the fixing mechanism 210 may clamp different positions of the workpiece to be processed to clamp and fix the workpiece to be processed.
Further, in the present embodiment, the electroplating apparatus 10 may further include a driving device (not shown), wherein the driving device may be used to adjust the position of the metal electrode plate 100.
Specifically, the electroplating apparatus 10 further includes a first driving device, wherein the first driving device is connected to the metal electrode plate 100 for driving the metal electrode plate 100 to move toward or away from the transportation assembly 200.
In this embodiment, the number of the first driving devices may be one, wherein two metal electrode plates 100 may be both mounted on a substrate, and the first driving devices may drive the substrate to move, so as to drive the metal electrode plates 100 mounted on the substrate to move toward or away from the transportation assembly 200. Alternatively, in other embodiments, each of the metal electrode plates 100 may be connected to a first driving device, and two first driving devices are used to respectively drive two metal electrode plates 100 to move toward or away from the transportation assembly 200.
Further, the electroplating apparatus 10 further includes a second driving device, and the second driving device may be connected to the metal electrode plates 100 for driving the two metal electrode plates 100 to move toward or away from each other. So as to adjust the distance between the two metal electrode plates 100, and further adjust the electric field intensity formed between the metal electrode plates 100 and the workpiece to be processed.
Further, the electroplating apparatus 10 may further include a controller (not shown), wherein the controller may be coupled to the first driving device and/or the second driving device.
When the controller is coupled to the first driving device, the controller may be configured to control the first driving device to drive the metal electrode plate 100 to move toward or away from the transport assembly 200. When the controller is coupled to the second driving device, the controller may be configured to control the second driving device to enable the second driving device to drive the metal electrode plates 100 to move toward or away from each other.
In one embodiment, the controller may be further configured to control the first driving device to operate according to a size of the workpiece to be processed immersed in the electroplating solution, so that the electroplating space 101 formed by the metal electrode plate 100 can accommodate the workpiece to be processed.
In summary, those skilled in the art can easily understand that the beneficial effects of the present application are: the embodiment of the application can ensure the uniformity of charge distribution on the metal electrode plate by connecting the positive electrode of the power supply to one side of the metal electrode plate away from the transportation assembly, and further ensure the thickness uniformity of the metal layer plated on the workpiece to be processed.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.
Claims (10)
1. An electroplating apparatus, comprising:
an electroplating container for accommodating an electroplating solution;
the electroplating container comprises two metal electrode plates which are arranged in parallel at intervals, and an electroplating space is formed between the two metal electrode plates and is used for accommodating a workpiece to be machined so as to realize electroplating operation on the workpiece to be machined;
the conveying assembly is arranged at one end of the metal electrode plate and is used for fixing the workpiece to be processed and driving the workpiece to be processed to move towards the direction close to or far away from the electroplating space;
the positive electrode of the power supply assembly is electrically connected with one end, far away from the conveying assembly, of the metal electrode plate, the negative electrode of the power supply assembly is electrically connected with the workpiece to be machined, and through the potential difference between the metal electrode plate and the workpiece to be machined, metal ions in the electroplating solution are gathered towards the workpiece to be machined so as to form a conductive metal layer on the surface of the workpiece to be machined in a plating mode.
2. The plating apparatus as recited in claim 1,
the metal electrode plate is a phosphor copper plate or a titanium plate.
3. The plating apparatus as recited in claim 1,
the power supply assembly comprises a power supply and a conductive piece;
the power supply is electrically connected with the conductive piece, and the conductive piece is connected to one end, far away from the transportation assembly, of the metal electrode plate.
4. Plating apparatus according to claim 3,
the conductive piece comprises a plurality of contact parts arranged at intervals, the contact parts are connected with the metal electrode plate, and the conductive piece is electrically connected with the metal electrode plate through the contact parts.
5. Plating apparatus according to claim 4,
the end of the metal electrode plate, which is far away from the transportation assembly, is provided with a slot, and at least part of the contact part is inserted into the slot so as to realize connection with the metal electrode plate.
6. The plating apparatus as recited in claim 1,
and the surface of one side of the workpiece to be processed, which faces the metal electrode plate, is parallel to the metal electrode plate.
7. Electroplating apparatus according to any of claims 1 to 6,
the electroplating device further comprises a first driving device, and the first driving device is connected with the metal electrode plate and is used for driving the metal electrode plate to move towards the direction close to or far away from the transportation assembly.
8. Electroplating apparatus according to any of claims 1 to 6,
the electroplating device further comprises a second driving device, and the second driving device is connected with the metal electrode plates and is used for driving the two metal electrode plates to move towards a direction close to or away from each other.
9. The plating apparatus as recited in claim 7,
the electroplating device further comprises a controller, wherein the controller is coupled with the first driving device and is used for controlling the first driving device to drive the metal electrode plate to move towards or away from the transportation assembly.
10. Plating apparatus according to claim 9,
the controller is also used for controlling the first driving device to operate according to the size of the workpiece to be processed immersed in the electroplating solution, so that the electroplating space formed by the metal electrode plate can contain the workpiece to be processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022048430.4U CN214115758U (en) | 2020-09-16 | 2020-09-16 | Electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022048430.4U CN214115758U (en) | 2020-09-16 | 2020-09-16 | Electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214115758U true CN214115758U (en) | 2021-09-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022048430.4U Active CN214115758U (en) | 2020-09-16 | 2020-09-16 | Electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214115758U (en) |
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2020
- 2020-09-16 CN CN202022048430.4U patent/CN214115758U/en active Active
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