CN216688384U

CN216688384U - Uniform nickel plating device for semiconductor

Info

Publication number: CN216688384U
Application number: CN202123208971.XU
Authority: CN
Inventors: 张少阳; 高翔鹰
Original assignee: Suzhou Core Silicon Electronics Technology Co ltd
Current assignee: Suzhou Core Silicon Electronics Technology Co ltd
Priority date: 2021-12-20
Filing date: 2021-12-20
Publication date: 2022-06-07
Anticipated expiration: 2031-12-20

Abstract

The utility model discloses a semiconductor uniform nickel plating device which comprises a rack, wherein throwing mechanisms are arranged at the bottoms of supporting rods at two ends of the rack, a water bath is arranged on the rack, the water temperature in the water bath is controlled by a constant temperature mechanism/a heating mechanism and a temperature sensing mechanism, a nickel plating tank is arranged inside the water bath, the water bath is connected with the supporting rods and does throwing motion along with the supporting rods, a positioning mechanism for fixing a semiconductor is arranged in the nickel plating tank, and a nickel precipitation preventing mechanism is also arranged in the nickel plating tank. The product is fully and uniformly contacted with the nickel plating solution in the nickel plating process through the throwing mechanism, and meanwhile, the water bath heating is stably carried out on the nickel plating solution through the water bath, so that the stability of the nickel plating solution is ensured, and the uniformity and the stability of the nickel plating layer of the product are ensured.

Description

Uniform nickel plating device for semiconductor

Technical Field

The utility model relates to the field of nickel plating processing equipment, in particular to a uniform nickel plating device for a semiconductor.

Background

In the preparation process of semiconductor products, in order to improve corrosion resistance, prevent products from rusting and improve the flatness of the products, one or more layers of plating films are often required to be plated, and because the corrosion resistance of nickel is better, a nickel plating layer is usually plated on the surfaces of the products.

The traditional nickel plating mode is simple, the uneven nickel plating layer is easy to appear, the surface smoothness of a product is influenced, nickel ions are separated out in the electroplating process, the problems of waste and the like are caused, the processing quality of the product is influenced, the processing cost is increased, and the traditional nickel plating mode is not suitable for processing more precise semiconductor products.

SUMMERY OF THE UTILITY MODEL

The novel purpose is to solve the problems in the prior art and provide a uniform nickel plating device for a semiconductor.

The purpose of the utility model is realized by the following technical scheme:

even nickel plating device of semiconductor, which comprises a frame, frame both ends branch bottom is provided with throws actuating mechanism, be provided with the water bath in the frame, through heating mechanism control water bath internal water temperature in the water bath, the inside of water bath is provided with the nickel plating groove, branch is connected with the nickel plating groove to the water bath, and follows the throwing motion is done to branch, be provided with the positioning mechanism who is used for fixed semiconductor in the nickel plating inslot, still be provided with anti-separation mechanism in the nickel plating groove.

Preferably, the throwing stroke and the throwing direction of the throwing mechanism can be adjusted.

Preferably, the throwing mechanism comprises a cam arranged at the bottom of the support rod in parallel, and the cam drives the water bath and the nickel plating bath to throw up and down through the driving of a motor.

Preferably, the throwing stroke of the throwing mechanism is less than or equal to 30 mm.

Preferably, the heating mechanism comprises a heating plate arranged at the bottom of the water bath tank and a heat preservation mechanism arranged on the periphery of the water bath tank.

Preferably, the positioning mechanism comprises a positioning frame arranged in the nickel plating bath, and a limiting seat for placing a semiconductor is arranged on the positioning frame.

Preferably, the height of the limiting seat is adjustable.

Preferably, the precipitation prevention mechanism comprises a conductive rod electrically connected with the positive electrode through a lead and a negative electrode conductive mechanism arranged outside the nickel plating bath.

Preferably, a protective cover is further arranged at the top of the nickel plating bath.

Even nickel plating device of semiconductor, including the water bath, through heating mechanism control water temperature in the water bath through the water bath, the inside of water bath is provided with the nickel plating groove, be provided with the positioning mechanism who is used for fixed semiconductor in the nickel plating groove, positioning mechanism's both sides are connected with throws the frame, the bottom of throwing the frame is provided with the cam, the cam drives positioning mechanism through motor drive and is thrown the motion from top to bottom, still be provided with in the nickel plating groove and prevent that nickel from appearing the mechanism.

The technical scheme of the utility model has the following beneficial effects:

1. according to the scheme, the product is fully and uniformly contacted with the nickel plating solution in the nickel plating process through the throwing mechanism, and meanwhile, the water bath heating is stably carried out on the nickel plating solution through the water bath, so that the stability of the nickel plating solution is ensured, and the uniformity and the stability of a nickel plating layer of the product are ensured;

2. the scheme utilizes a material electroplating mode to reduce nickel ions in the electroplating solution from being separated out and attached to the wall of the nickel plating tank, thereby preventing waste, and simultaneously, after nickel plating is finished, manual cleaning is not needed, thereby simplifying the process steps;

3. the throwing stroke of the throwing mechanism in the scheme is adjustable, and the height of the limiting seat for placing the product in the positioning mechanism is adjustable, so that the requirements of electroplating the product in different states can be met, and meanwhile, the stability of processing the product is ensured.

Drawings

FIG. 1: is a perspective view of the semiconductor uniform nickel plating device of the embodiment 1 of the utility model;

FIG. 2: is a side view of the semiconductor uniform nickel plating device in the embodiment 1 of the utility model;

FIG. 3: is a cross-sectional view a-a in fig. 2 of the present invention.

Detailed Description

Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.

In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the embodiment, the operator is used as a reference, and the direction close to the operator is a proximal end, and the direction away from the operator is a distal end.

The utility model discloses a semiconductor uniform nickel plating device which is explained by combining the accompanying drawings as follows:

example 1:

as shown in fig. 1-3, the semiconductor uniform nickel plating apparatus includes a frame 1, the bottoms of the support rods at two ends of the frame 1 are provided with throwing mechanisms 2, and the throwing mechanism 2 can be any throwing mechanism 2 with adjustable throwing stroke and throwing direction, such as: the throwing mechanism 2 comprises a cam 21 which is arranged at the bottom of the supporting rod in parallel, the cam 21 drives the water bath 3 and the nickel plating tank 4 to throw up and down through the motor drive, and the throwing stroke of the throwing mechanism 2 is less than or equal to 30 mm.

Specifically, be provided with water bath 3 on the frame 1, the liquid in the water bath 3 is heated through heating mechanism in the water bath 3, heating mechanism 5 is the PFA hot plate of setting in water bath 3 bottom, and the cell wall of water bath sets up ceramic thermal-insulated cotton and keeps warm, the inside of water bath 3 is provided with nickel-plated groove 4, water bath 3 and nickel-plated groove 4 are connected branch, and follow branch is throwing the motion.

Specifically, a positioning mechanism 6 for fixing a semiconductor is arranged in the nickel plating tank 4, the positioning mechanism 6 comprises a positioning frame arranged in the nickel plating tank 4, a limiting seat 61 for placing the semiconductor is arranged on the positioning frame, specifically, a plurality of limiting seats 61 can be arranged on the positioning frame in parallel, so that the uniform nickel plating device for the semiconductor can perform nickel plating on a plurality of products at the same time, the processing efficiency is improved, the length and the width of the limiting seats 61 can be adjusted according to the types of the products, the products can be stably placed on the limiting seats 61, the products cannot fall off due to the fact that the limiting seats 61 are not matched with the shapes of the products in the throwing process, additionally, in the scheme, the height of the limiting seats 61 can be correspondingly adjusted according to the depth of the nickel plating solution in the nickel plating tank 4 and the types of the semiconductors, and incomplete product processing caused by the fact that the positions of the limiting seats 61 are too high, and the product processing is avoided, Or the nickel plating solution is splashed out in the throwing process due to the excessive nickel plating solution.

Specifically, still be provided with in the nickel plating bath 4 and prevent appearing mechanism 7, prevent appearing mechanism 7 and include with anodal electric connection's conducting rod of power and set up and be in the outer electrically conductive mechanism of power negative pole of nickel plating bath 4, specifically, the outer electrically conductive mechanism of power negative pole of nickel plating bath 4 passes through wire and power negative pole electric connection, the conducting rod passes through wire and the anodal electric connection of power, just the conducting rod has a plurality ofly, in this scheme, the conducting rod is provided with four, respectively with four corners of 4 inner walls of nickel plating bath are connected, under the circular telegram state, the electrically conductive mechanism of power negative pole and power negative pole electric connection can prevent that the nickel in the plating solution from appearing, prevent simultaneously that nickel from attaching to on nickel plating bath 4.

Specifically, the top of the nickel plating bath 4 is also provided with a protective cover to prevent nickel plating solution from splashing out of the nickel plating bath 4 in the throwing process.

Example 2:

the uniform nickel plating device for the semiconductor comprises a water bath 3, wherein the water temperature in the water bath 3 is controlled by a heating mechanism 5 in the water bath 3, a nickel plating bath 4 is arranged in the water bath 3, a positioning mechanism 6 for fixing a semiconductor is arranged in the nickel plating bath 4, the positioning mechanism 6 is provided with a limiting seat 61 for placing a product, two sides of the positioning mechanism 6 are connected with a throwing frame, the bottom of the throwing frame is provided with a cam 21, the cam 21 drives the positioning mechanism 6 to do up-and-down throwing motion through the driving of a motor, the nickel plating bath 4 is also internally provided with an anti-separation mechanism 7, in the scheme, the water bath 3 and the nickel plating bath 4 are separated from the throwing frame, in the working process, the positioning mechanism 6 moves up and down in a throwing manner along with the throwing frame seat, the water bath 3 and the nickel plating bath 4 are fixed, and the rest scheme is consistent with that in the embodiment 1.

In the present invention, example 1 is a preferred example.

The utility model has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the utility model.

Claims

1. The uniform nickel plating device for the semiconductor is characterized in that: including frame (1), frame (1) both ends branch bottom is provided with throwing actuating mechanism (2), be provided with water bath (3) on frame (1), through heating mechanism (5) control water temperature in water bath (3), the inside of water bath (3) is provided with nickel plating groove (4), branch is connected with nickel plating groove (4) in water bath (3), and follow throwing actuating motion is done to branch, be provided with positioning mechanism (6) that are used for fixed semiconductor in nickel plating groove (4), still be provided with anti-precipitation mechanism (7) in nickel plating groove (4).

2. The apparatus of claim 1, wherein: the throwing stroke of the throwing mechanism (2) can be adjusted.

3. The apparatus of claim 2, wherein: the throwing mechanism (2) comprises a cam (21) which is arranged at the bottom of the supporting rod in parallel, and the cam (21) drives the water bath (3) and the nickel plating tank (4) to throw up and down through the driving of a motor.

4. The apparatus of claim 3, wherein: the throwing stroke of the throwing mechanism (2) is less than or equal to 30 mm.

5. The apparatus of claim 1, wherein: the heating mechanism (5) comprises a heating plate arranged at the bottom of the water bath (3) and a heat preservation mechanism arranged on the periphery of the water bath (3).

6. The apparatus of claim 1, wherein: the positioning mechanism (6) comprises a positioning frame arranged in the nickel plating bath (4), and a limiting seat (61) used for placing a semiconductor is arranged on the positioning frame.

7. The apparatus of claim 6, wherein: the height of the limiting seat (61) is adjustable.

8. The apparatus of claim 1, wherein: the anti-precipitation mechanism (7) comprises a conductive rod electrically connected with the positive electrode of the power supply through a lead and a power supply negative electrode conductive mechanism arranged outside the nickel plating bath (4).

9. The apparatus of claim 1, wherein: the top of the nickel plating bath (4) is also provided with a protective cover.

10. The uniform nickel plating device for the semiconductor is characterized in that: including water bath (3), through heating mechanism (5) control water temperature in water bath (3), the inside of water bath (3) is provided with nickel plating groove (4), be provided with positioning mechanism (6) that are used for fixed semiconductor in nickel plating groove (4), the both sides of positioning mechanism (6) are connected with throws and move the frame, the bottom of throwing the frame is provided with cam (21), throwing about cam (21) drive positioning mechanism (6) are moved through motor drive, still be provided with in nickel plating groove (4) and prevent appearing mechanism (7).