CN104342742B - A kind of electrode configuration of zinc-plated electroplating bath - Google Patents
A kind of electrode configuration of zinc-plated electroplating bath Download PDFInfo
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- CN104342742B CN104342742B CN201310335991.4A CN201310335991A CN104342742B CN 104342742 B CN104342742 B CN 104342742B CN 201310335991 A CN201310335991 A CN 201310335991A CN 104342742 B CN104342742 B CN 104342742B
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- cell body
- negative electrode
- anode
- tape
- master tape
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Abstract
The present invention relates to a kind of electrode configuration, particularly to the electrode configuration of a kind of zinc-plated electroplating bath.Its structure includes electroplating cell body, described electroplating cell body central authorities are provided with insulated column, upper anode master tape is set in described insulated column, negative electrode master tape is set outside described electroplating cell body, upper anode master tape both sides connect two. g., lead tape, two described. g., lead tape are prolonged to downwardly extend outside insulated column and are then horizontally diverted, on the anode block base being finally secured to arrange in described electroplating cell body, . g., lead tape on described anode block base is provided above immersion anode spelter, connect on described negative electrode master tape and have negative electrode copper bar, described negative electrode copper bar extends in the middle of electroplating cell body two is lateral, DC source complete machine outside described upper anode master tape and the connection of negative electrode master tape.The electrode configuration of a kind of zinc-plated electroplating bath of the present invention, it can balance the pressure drop of anode. g., lead tape, improve zinc-plated production efficiency, and can be applicable to the steel wire electroplating zinc technology of more than 60 lines.
Description
Technical field
The present invention relates to a kind of electrode configuration, particularly to the electrode configuration of a kind of zinc-plated electroplating bath.
Background technology
Existing design tradition is electroplating bath both sides while being negative electrode master tape, and opposite side is anode master tape. g., lead tape jointed anode
From left to right, negative electrode copper bar connects negative electrode master tape from right to left to master tape, and this design galvanizing bath should not be the widest, and line radical is typically at 24
Left and right, major defect is that the voltage drop of anode. g., lead tape is too big, and causes plating upper zinc amount side height opposite side low, upper zinc amount error
At ± 3 grams/m.
Therefore usual steel wire electroplating zinc wire number 24-30 root, if to electroplate more than 60 lines, traditional anode and cathode layout can not
Adapting to, as built two production lines, occupation of land is many, with double set DC sources and retractable line equipment, yields poorly, labor productivity
Low.
Summary of the invention
In order to solve problem of the prior art, the invention provides the electrode configuration of a kind of zinc-plated electroplating bath, its energy
Enough balance the pressure drop of anode. g., lead tape, improve zinc-plated production efficiency, and the steel wire electroplating zinc technology of more than 60 lines can be applicable to.
The technical solution adopted in the present invention is as follows:
The electrode configuration of a kind of zinc-plated electroplating bath, including electroplating cell body, described electroplating cell body central authorities are provided with insulation
Post, arranges upper anode master tape in described insulated column, arrange negative electrode master tape, upper anode master tape two outside described electroplating cell body
Side connects has two. g., lead tape, two described. g., lead tape to prolong to downwardly extend outside insulated column and be then horizontally diverted, and is finally secured to set
Putting on the anode block base in described electroplating cell body, the. g., lead tape on described anode block base is provided above immersion anode spelter,
Connecting on described negative electrode master tape and have negative electrode copper bar, described negative electrode copper bar extends in the middle of electroplating cell body two is lateral, described
DC source complete machine outside upper anode master tape and the connection of negative electrode master tape.
Electroplating cell body internal frame is provided with connecting copper pipe.
In electroplating cell body, both sides form two shunt circuits.
The technical scheme that the present invention provides has the benefit that
By anode master tape is arranged on the insulated column in the middle part of electroplating cell body, as upper anode, about anode. g., lead tape
Two, the outside extension the most to left and right again to electroplating cell body bottom vertically downward；Negative electrode master tape electroplating cell body left and right outside
Side, negative electrode copper bar be connected with negative electrode master tape after in the left and right lateral groove of electroplating cell body position extend so that an electroplating cell body
Form two shunt circuits.
If the present invention needs to carry out 60 bethanizings, 1.4 meters of wide cell bodies, the length of cathode and anode is less than 0.7
Rice, therefore decreases the pressure drop 50% of. g., lead tape, makes zinc amount on each section of line uniform and stable, simultaneously because form two shunt circuits, and one
Individual coating bath 60 lines of plating, make yield promote 100%, and the DC source configured, retractable cable, only with a set of, thoroughly avoids simultaneously
The. g., lead tape long voltage range of decrease is big, the defect that upper zinc amount is uneven.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, in embodiment being described below required for make
Accompanying drawing be briefly described, it should be apparent that, below describe in accompanying drawing be only some embodiments of the present invention, for
From the point of view of those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the structural representation of the electrode configuration of a kind of zinc-plated electroplating bath of the present invention.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to embodiment party of the present invention
Formula is described in further detail.
Embodiment one
Including suitably widening, can hold the electroplating cell body 1 of 64 steel wires, electroplating cell body central authorities erect insulated column 3, are used for setting up
Upper anode master tape 7, two. g., lead tape (8A, 8B) drawn under upper anode master tape 7 both sides connect vertically, in electroplating cell body 1
Arranging anode block base 2. g., lead tape extends the most to the left and right sides, and. g., lead tape arranges immersion anode spelter (4A, 4B).
Negative electrode master tape (5A, 5B) outside electroplating cell body 1, connect have negative electrode copper bar (6A, 6B), from arranged on left and right sides in
Centre extends, and electroplating cell body forms two shunt circuits, completely eliminates the voltage drop brought owing to. g., lead tape is long, simultaneously by
Configure in two-way cathode and anode, the electric voltage equalization of each section, reach to improve the uniform purpose of zinc amount on electrogalvanizing, make an electroplating bath
Can plate 64 steel wires, and still with a set of direct current unit, a set of retractable line equipment, the personnel of a line realize two production lines
Production capacity, reach energy-conservation, consumption reduction, operating rate improve 100% effect.
Electroplating cell body 1 internal frame is provided with connecting copper pipe 9.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (2)
1. an electrode configuration for zinc-plated electroplating bath, including electroplating cell body, described electroplating cell body central authorities are provided with insulated column,
Upper anode master tape is set in described insulated column, negative electrode master tape is set outside described electroplating cell body, it is characterised in that described
Upper anode master tape both sides connect to be had two. g., lead tape, two described. g., lead tape to prolong to downwardly extend then level outside insulated column and turn
To, on the anode block base being finally secured to arrange in described electroplating cell body, the. g., lead tape on described anode block base is provided above
Immersion anode spelter, described negative electrode master tape connects and has negative electrode copper bar, and described negative electrode copper bar is lateral from electroplating cell body two
DC source complete machine outside middle extension, described upper anode master tape and the connection of negative electrode master tape.
The electrode configuration of a kind of zinc-plated electroplating bath the most according to claim 1, it is characterised in that described electroplating bath
Internal erection has connecting copper pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310335991.4A CN104342742B (en) | 2013-08-02 | 2013-08-02 | A kind of electrode configuration of zinc-plated electroplating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310335991.4A CN104342742B (en) | 2013-08-02 | 2013-08-02 | A kind of electrode configuration of zinc-plated electroplating bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104342742A CN104342742A (en) | 2015-02-11 |
| CN104342742B true CN104342742B (en) | 2016-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310335991.4A Active CN104342742B (en) | 2013-08-02 | 2013-08-02 | A kind of electrode configuration of zinc-plated electroplating bath |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105199864A (en) * | 2015-09-30 | 2015-12-30 | 江苏耀兴安全玻璃有限公司 | Preparation method of glassware cleaning agent for experimental use |
| CN108441910B (en) * | 2018-05-11 | 2021-02-26 | 无锡市新科冶金设备有限公司 | Steel wire galvanizing bath |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4347115A (en) * | 1980-05-03 | 1982-08-31 | Thyssen Aktiengesellschaft Vorm. August Thyssen-Hutte | Electroplating apparatus |
| CN1418259A (en) * | 2000-03-17 | 2003-05-14 | 新日本制铁株式会社 | Plated metal wire and production method and production device therefor |
| CN201296799Y (en) * | 2008-09-19 | 2009-08-26 | 贵州钢绳股份有限公司 | Horizontal electrogalvanizing zinc anode device for steel wire |
| CN103215625A (en) * | 2012-04-25 | 2013-07-24 | 安徽恒晶电缆集团有限公司 | Armoured cable steel band electrogalvanizing production technology |
-
2013
- 2013-08-02 CN CN201310335991.4A patent/CN104342742B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4347115A (en) * | 1980-05-03 | 1982-08-31 | Thyssen Aktiengesellschaft Vorm. August Thyssen-Hutte | Electroplating apparatus |
| CN1418259A (en) * | 2000-03-17 | 2003-05-14 | 新日本制铁株式会社 | Plated metal wire and production method and production device therefor |
| CN201296799Y (en) * | 2008-09-19 | 2009-08-26 | 贵州钢绳股份有限公司 | Horizontal electrogalvanizing zinc anode device for steel wire |
| CN103215625A (en) * | 2012-04-25 | 2013-07-24 | 安徽恒晶电缆集团有限公司 | Armoured cable steel band electrogalvanizing production technology |
Non-Patent Citations (3)
| Title |
|---|
| 宝钢2030mm电镀锌机组的技术改造;徐冲等;《轧钢》;20080831;第25卷(第4期);第46-48页 * |
| 电镀锌钢丝锌层均匀性研究;金劲松等;《金属制品》;19991031;第25卷(第5期);第20-22页 * |
| 钢丝电镀锌过程的节能降耗措施;李晓明等;《新疆钢铁》;20111231(第3期);第42－44页 * |
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| CN104342742A (en) | 2015-02-11 |
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