TWI546421B - Plating connector and plating apparatus - Google Patents

Description

Plating connector and plating equipment

The invention relates to an electroplating connector and an electroplating apparatus having the same.

Conventional electroplating equipment such as flash copper (FCP) often uses a rectifier to control current and voltage, and the cable is used to deliver electricity to the insoluble anode plate. And since the anodized plate must be immersed in copper sulphate for electrical conduction to produce electroplating, the anodized plate is usually made of titanium. However, the core of the cable cannot be immersed in copper sulphate for a long time. Therefore, in order to solve this problem, the anodized plate is usually specially designed to extend the position where the current needs to be introduced into the column or the strip body to none. The area where the copper sulfate solution is immersed (for example, extending to the liquid surface of the copper sulfate liquid), and then the copper terminal is electrically connected to the cable to overcome the problem that the core of the cable cannot be immersed in the copper sulfate liquid for a long time.

However, the above design still increases the amount of titanium material used, and it is easy to cause the extended portion to be burnt due to the difficulty of withstanding the current, which also causes an increase in equipment cost.

In view of the above, the present inventors have made great efforts to improve and solve the above-mentioned shortcomings, and have finally made a proposal to rationally and effectively improve the above-mentioned defects.

The main object of the present invention is to provide a plating connector for connecting between a cable and a plated anode plate, the cable has a cable core, and the conductivity of the material of the cable core is the first conductivity; The connector includes a conductive frame, a conductive joint disposed on the conductive frame, and a plurality of electrically conductive adapter posts. The conductive connector has a terminal electrically connected to the cable, and the conductivity of the material of the conductive joint is the second conductivity. And each of the conductance transfer columns is electrically connected to the plated anode plate; wherein the minimum cross-sectional area of the cable multiplied by the value of the first conductivity is the divided value, and the second conductivity is multiplied by the value of the number of the conductive transfer columns After dividing by the divisor value, the quotient value obtained is less than or equal to the minimum cross-sectional area of the conductive joint.

In order to achieve the above object, the present invention provides an electroplating apparatus for electroplating a workpiece; the electroplating apparatus includes a power supply, a plating tank, an electroplated anode plate, and a plurality of electroplating connectors, and the power source has a positive electrode and a negative electrode. The cable and the negative cable are electrically connected to the workpiece, and the plating tank is formed into a receiving portion for accommodating the plating solution and immersing the workpiece in the plating solution. The plating anode plate is placed in the plating tank and is electrically connected to either side of the workpiece. The positive cable, and the positive cable of the power supply has a cable core, and the conductivity of the material of the cable core is the first conductivity, and each plating connector is connected between the positive cable and the plated anode plate, and the plating connector includes a conductive frame, a conductive joint and a plurality of conductive transfer posts, conductive joints and respective electric The conductive transfer column is respectively disposed on the conductive frame, and the conductivity of the material of the conductive joint is the second conductivity; wherein the minimum cross-sectional area of the positive cable is multiplied by the value of the first conductivity, the value is divided, and the second The value of the conductivity multiplied by the number of conductance transfer columns is divided by the value, and the quotient obtained is less than or equal to the minimum cross-sectional area of the conductive joint.

<present invention>

1‧‧‧Electroplating connector

10‧‧‧ Conductive frame

100‧‧‧Adapter

101‧‧‧ first joint

102‧‧‧Connected parts

11‧‧‧Electrical connector

110‧‧‧ Terminal

111‧‧‧Transfer

112‧‧‧second joint

12‧‧‧ Conductance adapter

2‧‧‧ cable

20‧‧‧ positive cable

200‧‧‧ cable core

21‧‧‧Negative cable

3‧‧‧Electroplating anode plate

4‧‧‧Workpiece

40‧‧‧Power supply

41‧‧‧ plating bath

410‧‧‧ 容 部

411‧‧‧ plating solution

1 is a schematic perspective view of a plated connector of the present invention.

2 is a schematic plan view of the plating connector of the present invention.

Figure 3 is a cross-sectional view taken along line 2A-2A of Figure 2;

Figure 4 is a cross-sectional view taken along line 2B-2B of Figure 2;

Figure 5 is a cross-sectional view taken along line 2C-2C of Figure 2;

Figure 6 is a cross-sectional view taken along line 2D-2D of Figure 2;

Figure 7 is a schematic plan view showing the plating of the electroplated anode plate of the electroplated connector of the present invention.

Figure 8 is a schematic plan view showing another embodiment of the plated connector of the present invention.

9 is a schematic plan view showing a further embodiment of the plated connector of the present invention.

Figure 10 is a schematic plan view showing the plating apparatus of the present invention in a lateral direction.

Figure 11 is a plan view showing the plating apparatus of the present invention in an upright position.

The detailed description of the present invention and the accompanying drawings are to be understood by the accompanying claims .

Please refer to FIG. 1 , FIG. 2 and FIG. 7 , which are respectively a schematic view of a three-dimensional appearance of the electroplated connector of the present invention, a schematic view of the plane, and a schematic view of the planar appearance of the electroplated anode plate of the electroplated connector. The present invention provides a plating connector and an electroplating apparatus for connecting between a cable 2 and an electroplated anode plate 3 to provide electroplating equipment for electroplating a workpiece 4; the electroplating connector 1 includes a The conductive frame 10, the conductive joint 11 and the plurality of conductive transfer posts 12, wherein the conductive frame 10 is used to connect the conductive joint 11 and the conductive transfer posts 12, and the conductive frame 10 can be a long rod or a long length. The strip-shaped body is arranged so that the conductive joint 11 and the respective conductive transfer posts 12 can be respectively disposed along the extending direction of the rod or the plate of the conductive frame 10.

The conductive joint 11 is disposed on the conductive frame 10 and has a terminal 110 for electrically connecting the cable 2; wherein the cable 2 has a cable core 200 (shown in FIG. 2), and the cable 2 After being inserted into the terminal 110, the electrical contact 11 is electrically contacted through the bare cable core 200. In the embodiment of the present invention, the conductive frame 10 is provided with an adapter 100. The adapter 100 can be integrally formed on the conductive frame 10. The first side of the adapter 100 has a first bonding surface 101. The conductive connector 11 further has a switching end 111, and the switching end 111 is located at an end away from the terminal 110, and the switching end 111 has a second bonding surface 112 on one side, and the switching end 111 is on the side. The first bonding surface 101 and the second bonding surface 112 are bonded to each other, and the first bonding surface 102 is coupled to the second bonding surface 101 and 112. The socket 100 and the adapter end 111 are used to thereby connect the conductive tab 11 to the conductive frame 10. The coupling member 102 can be a bolt.

The conductive transfer posts 12 are respectively disposed on the conductive frame 10 to be electrically connected to the plated anode plate 3. In the embodiment of the present invention, the number n of the respective conductive transfer posts 12 can be increased according to the requirements of the actual plating operation, as shown in FIG. 8 or FIG.

Accordingly, referring to FIG. 2, FIG. 3 and FIG. 4, the present invention mainly provides that the conductivity of the material of the cable core 200 is the first conductivity ρ ₁ , and the conductive material of the conductive joint 11 is electrically conductive. The second conductivity ρ ₂ , the minimum cross-sectional area A _{1 of} the cable 2 (shown in FIG. 3 ) multiplied by the value of the first conductivity ρ ₁ is divided by the value X, multiplied by the second conductivity ρ ₂ After the value of the number n of the conductance transfer columns 12 is divided by the value Y, the obtained quotient value Z is less than or equal to the minimum cross-sectional area A _{2 of} the conductive joint 11 (as shown in FIG. 4). The formula is: (A ₁ ‧ ρ ₁ ) / (n ‧ ρ ₂ ) ≦ A ₂ ; meaning: X / Y = Z, Z ≦ A ₂

In the embodiment of the present invention, the conductive frame 10 and the conductive joint 11 are connected through the adapter 100, so that the obtained quotient value Z is also less than or equal to the minimum cross-sectional area A of the adapter 100. ₃ (as shown in Figure 5). Similarly, the obtained quotient value Z is also less than or equal to the minimum cross-sectional area A _{4 of} the conductive frame 10 (as shown in FIG. 6 ), and the obtained quotient value Z is also less than or equal to the minimum cutoff of the conductance transfer column 12 . area.

Further, as shown in FIG. 10, a preferred embodiment of the electroplating apparatus provided by the present invention is shown. The electroplating apparatus is used for electroplating a workpiece 4, and includes a power supply 40, a plating tank 41, and a plurality of electroplating connectors 1 described above; wherein: the power supply 40 has a positive cable 20 and a negative cable 21, and a negative cable 21 The positive electrode cable 20 is electrically connected to the workpiece 4, and the positive cable 20 has a cable core 200 (as shown in FIG. 2), and the conductivity of the material of the cable core 200 is the same. A conductivity ρ ₁ .

A receiving portion 410 is formed in the plating tank 41 for accommodating the plating solution 411 such as copper sulfate, and the workpiece 4 is immersed in the plating solution 411 for performing the plating operation.

The plated anode plate 3 is placed in the plating tank 41 to be electrically connected to the positive electrode cable 20 with respect to either side of the workpiece 4 (i.e., the surface to be plated).

The plating connector 1 is similar to the above-described structure and the like (as shown in FIGS. 1 to 9 and the like), and is disposed between the positive electrode cable 20 and the plated anode plate 3, and has a conductivity of the material of the conductive joint 11 Two conductivity ρ ₂ . Thereby, through the above formula: (A ₁ ‧ ρ ₁ ) / (n ‧ ρ ₂ ) ≦ A ₂ ; the minimum cross-sectional area A _{1 of} the positive cable 20 multiplied by the value of the first conductivity ρ ₁ is divided by the value X, multiplied by the second conductivity ρ ₂ by the number n of the conductance transfer columns 12, divided by the value Y, the obtained quotient value Z is less than or equal to the minimum cross-sectional area A _{2 of} the conductive joint 11 .

In the embodiment shown in FIG. 10, the electroplated anode plate 3 of the electroplating apparatus is horizontally disposed; in addition, as shown in the embodiment shown in FIG. 11, the electroplating anode degree 3 of the electroplating apparatus may also be erected.

Therefore, the plating connector and the plating apparatus of the present invention can be obtained by the above-described structural composition.

Therefore, with the plating connector of the present invention and the plating apparatus having the plating connector, the above-described relationship (A ₁ ‧ ρ ₁ ) / (n ‧ ρ ₂ ) ≦ A ₂ can reduce the burning of the plating connector. In turn, unnecessary titanium material usage can be reduced to reduce equipment costs.

However, the above description is only a preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, and the equivalent techniques and means, etc., which are used in the description of the present invention and the contents of the drawings, are the same. It is included in the scope of the present invention and is combined with Chen Ming.

1‧‧‧Electroplating connector

10‧‧‧ Conductive frame

100‧‧‧Adapter

101‧‧‧ first joint

102‧‧‧Connected parts

11‧‧‧Electrical connector

110‧‧‧ Terminal

111‧‧‧Transfer

112‧‧‧second joint

12‧‧‧ Conductance adapter

2‧‧‧ cable

200‧‧‧ cable core

Claims (10)

An electroplating connector for connecting between a cable and a plated anode plate, the cable having a cable core, and the conductivity of the material of the cable core is a first conductivity; comprising: a conductive frame a conductive joint disposed on the conductive frame and having a terminal for electrically connecting the cable, and the conductivity of the material of the conductive joint is a second conductivity; and the plurality of conductance transfer columns, Separatingly disposed on the conductive frame and electrically connecting the plated anode plate; wherein a minimum cross-sectional area of the cable is multiplied by a value of the first conductivity value divided by a value, and multiplied by the second conductivity The value obtained by dividing the value of the number of the conductive transfer columns by the divisor is less than or equal to the minimum cross-sectional area of the conductive joint. The electroplating connector of claim 1, wherein the conductive frame is provided with an adapter, and the conductive connector has an adapter end, and the adapter is laterally coupled to the adapter. And the obtained quotient value is also less than or equal to the minimum cross-sectional area of the adapter. The plated connector of claim 2, wherein the adapter is integrally formed on the conductive frame. The plated connector of claim 2, wherein one side of the adapter has a first joint surface, and one side of the adapter has a second joint surface, and the joint portion passes through the joint. The first and second bonding surfaces are combined with the adapter and the adapter. The plated connector of claim 2, wherein the adapter is located at an end remote from the terminal. The electroplated connector of claim 1, wherein the quotient obtained is also less than or equal to the minimum cross-sectional area of the conductive frame. The electroplated connector of claim 1, wherein the quotient value obtained is also less than or equal to the minimum cross-sectional area of the conductance transfer column. An electroplating apparatus for electroplating a workpiece; comprising: a power supply having a positive cable and a negative cable, the negative cable electrically connecting the workpiece, and the positive cable has a cable core, and the cable core The conductivity of the material is the first conductivity; a plating bath, the receiving portion forms a receiving portion for accommodating the plating solution and immersing the workpiece in the plating solution; The electroplating tank is electrically connected to the positive electric cable on either side of the workpiece; and the plurality of electroplating connectors are coupled between the positive electric cable and the electroplating anode plate, and the electroplating connectors comprise a conductive frame, a conductive joint and a plurality of electrically conductive transfer posts, wherein the conductive joints and the conductive transfer posts are respectively disposed on the conductive frame, and the conductivity of the material of the conductive joint is a second conductivity; wherein the positive electrical cable The minimum cross-sectional area multiplied by the value of the first conductivity is the divided value, and the value obtained by multiplying the second conductivity by the number of the conductance transfer columns is divided by the value, and the obtained quotient value Less than Equal to the minimum cross-sectional area of the conductive contact. The electroplating apparatus of claim 8, wherein the electroplated anode plate is horizontally disposed. An electroplating apparatus according to claim 8, wherein the electroplated anode plate It is erect.