CN206624935U - A kind of board substrate electroplanting device - Google Patents
A kind of board substrate electroplanting device Download PDFInfo
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- CN206624935U CN206624935U CN201720297720.8U CN201720297720U CN206624935U CN 206624935 U CN206624935 U CN 206624935U CN 201720297720 U CN201720297720 U CN 201720297720U CN 206624935 U CN206624935 U CN 206624935U
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- 239000000758 substrate Substances 0.000 title claims abstract description 22
- 238000009713 electroplating Methods 0.000 claims abstract description 127
- 230000005540 biological transmission Effects 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Abstract
本实用新型公开了一种线路板基材电镀装置，包括具有若干个电镀槽的电镀池、与电镀池电连接的电源，所述的装置还包括：用于并排夹持线路板基材的电镀架、跨设在电镀池上方用于吊装电镀架的传输机构、对应设置在传输机构两侧并用于传输机构滑动的滑轨和分别与电源、传输机构电连接的控制器，电镀池位于传输机构滑动方向上的一端设置有用于放置电镀架的中转支架，电镀槽和中转支架位于传输机构跨设的两侧均设有用于放置电镀架的支撑块，所述的电镀槽侧壁上设有与电源阳极电连接的电镀极板，位于电镀槽两侧的支撑块与电源阴极电连接，通过本实用新型装置使得待电镀线路板基材的装入和取出过程更为方便，效率更高，还节约了人力，提高了电镀产能。
The utility model discloses an electroplating device for circuit board base material, which comprises an electroplating pool with several electroplating tanks and a power supply electrically connected to the electroplating pool. The frame, the transmission mechanism for hoisting the electroplating frame across the electroplating tank, the slide rails arranged on both sides of the transmission mechanism and used for the sliding of the transmission mechanism, and the controllers electrically connected to the power supply and the transmission mechanism respectively, the electroplating pool is located in the transmission mechanism One end in the sliding direction is provided with a transfer bracket for placing the electroplating frame, and the electroplating tank and the transfer bracket are located on both sides of the transmission mechanism, and both sides are provided with supporting blocks for placing the electroplating frame. The electroplating pole plate electrically connected to the anode of the power supply, and the supporting blocks located on both sides of the electroplating tank are electrically connected to the cathode of the power supply. The device of the utility model makes the process of loading and unloading the substrate of the circuit board to be electroplated more convenient and efficient, and also It saves manpower and improves the electroplating production capacity.
Description
技术领域technical field
本实用新型涉及线路板电镀装置领域，尤其是一种线路板基材电镀装置。The utility model relates to the field of circuit board electroplating devices, in particular to a circuit board substrate electroplating device.
背景技术Background technique
电镀是线路板生产制作过程中的重要工序，是通过电解方法在基材上沉积形成镀层的过程，通常电镀时，镀层金属做阳极，被氧化成阳离子进入电镀液，待镀的线路板则做阴极，镀层金属的阳离子在线路板表面被还原形成镀层，线路板电镀时，需要保证镀层厚度的均匀性，而目前线路电镀生产时，通常需要一批次一批次的进行电镀处理，导致电镀生产工序的效率非常低，另一方面操作工人在装夹线路板基材时，需要多人进行配合装夹以及放入电镀池，导致用人成本较高，也存在一定的生产危险性。Electroplating is an important process in the production process of circuit boards. It is the process of depositing and forming coatings on the substrate by electrolysis. Usually, during electroplating, the coating metal is used as the anode, which is oxidized into cations and enters the electroplating solution. The circuit board to be plated is then The cathode, the cation of the plating metal is reduced on the surface of the circuit board to form a coating. When the circuit board is electroplated, it is necessary to ensure the uniformity of the thickness of the coating. However, in the current line electroplating production, it is usually necessary to carry out electroplating treatment batch by batch, resulting in electroplating The efficiency of the production process is very low. On the other hand, when the operator clamps the substrate of the circuit board, multiple people are required to cooperate with the clamping and put it into the electroplating pool, resulting in high labor costs and certain production risks.
发明内容Contents of the invention
为了解决现有技术的不足，本实用新型的目的在于提供一种一次性可以电镀多块线路板、操作方便、节约人力的线路板基材电镀装置。In order to solve the deficiencies of the prior art, the purpose of this utility model is to provide a circuit board substrate electroplating device which can electroplate multiple circuit boards at one time, is easy to operate, and saves manpower.
为了实现上述的技术目的，本实用新型的技术方案为：In order to realize above-mentioned technical purpose, the technical scheme of the utility model is:
一种线路板基材电镀装置，包括具有若干个电镀槽的电镀池、与电镀池电连接的电源，所述的装置还包括：用于并排夹持线路板基材的电镀架、跨设在电镀池上方用于吊装电镀架的传输机构、对应设置在传输机构两侧并用于传输机构滑动的滑轨和分别与电源、传输机构电连接的控制器，所述的电镀池位于传输机构滑动方向上的一端设置有用于放置电镀架的中转支架，所述的电镀槽和中转支架位于传输机构跨设的两侧均设有用于放置电镀架的支撑块，所述的电镀槽侧壁上设有与电源阳极电连接的电镀极板，所述位于电镀槽两侧的支撑块与电源阴极电连接。A circuit board substrate electroplating device, comprising an electroplating tank with several electroplating tanks, and a power supply electrically connected to the electroplating tank, the device also includes: an electroplating rack for clamping circuit board substrates side by side, straddling the The transmission mechanism above the electroplating pool for hoisting the electroplating frame, the slide rails arranged on both sides of the transmission mechanism and used for the sliding of the transmission mechanism, and the controller electrically connected to the power supply and the transmission mechanism respectively. The electroplating pool is located in the sliding direction of the transmission mechanism One end on the top is provided with a transfer bracket for placing the electroplating frame. The electroplating tank and the transfer bracket are located on both sides of the transmission mechanism and are provided with supporting blocks for placing the electroplating rack. The side wall of the electroplating tank is provided with The electroplating plate is electrically connected to the anode of the power supply, and the support blocks located on both sides of the electroplating tank are electrically connected to the cathode of the power supply.
进一步，所述的传输机构为龙门式航车，其包括跨设在电镀池上方的龙门架，所述的龙门架两侧固定设置有带动龙门架沿滑轨平移滑动的驱动器，所述的驱动器与控制器电连接，并由驱动器控制进行同步转动。Further, the transmission mechanism is a gantry-type air vehicle, which includes a gantry frame straddling the electroplating pool, and drivers are fixed on both sides of the gantry frame to drive the gantry frame to translate and slide along the slide rails. The driver It is electrically connected with the controller and controlled by the driver for synchronous rotation.
优选的，所述龙门架的横梁下方设有用于起吊电镀架的连接架，所述的连接架与龙门架两侧相近端通过一对相对设置在龙门架上部两侧的升降电机进行驱动升降，所述的连接架下端至少设有一对位置相对用于起吊电镀架的L形吊钩，所述电镀架的两端对应吊钩设有与其相配合的7字形挂钩。Preferably, a connecting frame for lifting the electroplating frame is provided under the beam of the gantry frame, and the adjacent ends of the connecting frame and the two sides of the gantry frame are driven and lifted by a pair of lifting motors relatively arranged on both sides of the upper part of the gantry frame. The lower end of the connecting frame is provided with at least one pair of L-shaped hooks opposite to each other for lifting the electroplating rack, and the corresponding hooks at both ends of the electroplating rack are provided with 7-shaped hooks matched with it.
优选的，所述的龙门架两侧对应连接架两端位置设有用于连接架升降导向的导向滑杆，所述的导向滑杆由龙门架上方竖直向下穿设过连接架并延伸至龙门架下端。Preferably, the two sides of the gantry corresponding to the two ends of the connecting frame are provided with guide sliders for the lifting and lowering of the connecting frame, and the guide sliders pass through the connecting frame vertically downward from the top of the gantry and extend to The lower end of the gantry.
优选的，所述的驱动器侧面还设有与滑轨侧面相贴合的导向滚轮。Preferably, the side of the driver is also provided with guide rollers that fit on the side of the slide rail.
进一步，所述的电镀架包括由导电材质制成的支撑杆和间隔设置在支撑杆上用于夹持线路板基材的夹子，所述的夹子主体为导电材质制成，所述夹子的夹嘴与支撑杆可形成电通路。Further, the electroplating frame includes a support rod made of conductive material and clips arranged on the support rod at intervals for clamping the circuit board substrate, the main body of the clip is made of conductive material, and the clips of the clip The mouth and the support rod may form an electrical pathway.
进一步，所述的支撑块设有用于固定放置电镀架的V形槽，所述位于电镀槽两侧的支撑块V形槽底部固定有与电源阴极连接的导电条。Further, the support block is provided with a V-shaped groove for fixing the electroplating rack, and the bottom of the V-shaped groove of the support block located on both sides of the electroplating tank is fixed with a conductive strip connected to the cathode of the power supply.
采用上述的技术方案，本实用新型的有益效果为：通过将电镀池分隔成多个电镀槽使得电镀池可以同一时间进行多块线路板基材电镀，提高电镀产能和效率，另外，利用龙门式航车来进行起吊并排夹持线路板基材的电镀架，一方面能够提高操作安全性和效率，另一方面还能够节约人力，电镀架利用导电材质支撑的支撑杆，使得无需再对支撑杆上固定的夹子进行布线电连接，令电镀架的结构更为简单，使用更为可靠，同时电镀池位于传输机构滑动方向上的一端设置有用于放置电镀架的中转支架，电镀槽和中转支架位于传输机构跨设的两侧均设有用于放置电镀架的支撑块，将电镀架架设在中转支架上，操作工人只需将线路板基材夹持在支撑杆上的夹子上即可，装夹完毕后，只需操作龙门式航车将电镀架起吊移送至电镀槽中即可进行电镀操作，同时，电镀槽侧边设置的支撑块为V形槽结构，可以保证支撑杆更为稳固的放置，另外电镀槽侧边设置的支撑块V形槽底部固定有与电源阴极连接的导电条，使龙门式航车将电镀架放置在支撑块上后，即可同步完成电镀架与电源阴极的电连接，使得整个过程简单方便，还高效率。By adopting the above-mentioned technical scheme, the beneficial effect of the utility model is: by dividing the electroplating tank into multiple electroplating tanks, the electroplating tank can perform electroplating on multiple circuit board substrates at the same time, thereby improving the electroplating production capacity and efficiency. In addition, using the gantry type The electroplating frame used to lift and clamp the circuit board base material side by side by the aircraft can improve the safety and efficiency of the operation on the one hand, and save manpower on the other hand. The clamps fixed on the top are used for wiring and electrical connection, which makes the structure of the electroplating rack simpler and more reliable in use. At the same time, the end of the electroplating pool located in the sliding direction of the transmission mechanism is provided with a transfer bracket for placing the electroplating rack. The electroplating tank and transfer bracket are located on the Both sides of the transmission mechanism span are provided with support blocks for placing the electroplating rack. The electroplating rack is erected on the transfer bracket, and the operator only needs to clamp the circuit board substrate on the clip on the support rod. After the completion, you only need to operate the gantry-type aircraft to lift the electroplating frame and transfer it to the electroplating tank for electroplating operation. At the same time, the support block set on the side of the electroplating tank is a V-shaped groove structure, which can ensure a more stable placement of the support rod In addition, the bottom of the V-shaped groove of the support block set on the side of the electroplating tank is fixed with a conductive strip connected to the cathode of the power supply, so that after the gantry vehicle places the electroplating rack on the support block, the electroplating rack and the cathode of the power supply can be synchronously completed. The connection makes the whole process simple, convenient and efficient.
附图说明Description of drawings
下面结合附图和具体实施方式对本实用新型做进一步的阐述：Below in conjunction with accompanying drawing and specific embodiment, the utility model is further elaborated:
图1为本实用新型装置的实施状态之一的结构示意图；Fig. 1 is a structural representation of one of the implementation states of the utility model device;
图2为本实用新型装置的实施状态之二的结构示意图，其中有一组电镀架已放置入电镀槽；Fig. 2 is the structural representation of the second implementation state of the utility model device, wherein one group of electroplating racks has been placed into the electroplating tank;
图3为图1中A处的局部放大示意图；Fig. 3 is the partially enlarged schematic diagram of place A in Fig. 1;
图4为图1中B处的局部放大示意图；Fig. 4 is the partially enlarged schematic diagram of place B in Fig. 1;
图5为图1中C处的局部放大示意图；Fig. 5 is the partially enlarged schematic diagram of place C in Fig. 1;
图6为图2中D处的局部放大示意图。FIG. 6 is a partially enlarged schematic diagram at point D in FIG. 2 .
具体实施方式detailed description
如图1至6之一所示，本实用新型包括具有若干个电镀槽14的电镀池1、与电镀池1电连接的电源（未示出），所述的装置还包括：用于并排夹持线路板基材的电镀架3、跨设在电镀池1上方用于吊装电镀架3的传输机构2、对应设置在传输机构2两侧并用于传输机构2滑动的滑轨4和分别与电源、传输机构2电连接的控制器（未示出），所述的电镀池1位于传输机构2滑动方向上的一端设置有用于放置电镀架3的中转支架11，所述的电镀槽14和中转支架11位于传输机构2跨设的两侧均设有用于放置电镀架3的支撑块12，所述的电镀槽14侧壁上设有与电源阳极电连接的电镀极板15，所述位于电镀槽14两侧的支撑块12与电源阴极电连接。As shown in one of Figures 1 to 6, the utility model includes an electroplating pool 1 having several electroplating tanks 14, a power supply (not shown) electrically connected to the electroplating pool 1, and the device also includes: The electroplating frame 3 holding the circuit board base material, the transmission mechanism 2 for hoisting the electroplating frame 3 straddling the electroplating pool 1, the slide rails 4 correspondingly arranged on both sides of the transmission mechanism 2 and used for the transmission mechanism 2 to slide, and respectively connected to the power supply , the controller (not shown) electrically connected to the transmission mechanism 2, the electroplating tank 1 is located at one end of the transmission mechanism 2 sliding direction is provided with a transfer bracket 11 for placing the electroplating frame 3, the electroplating tank 14 and the transfer The support 11 is located on both sides of the transmission mechanism 2 and is provided with a support block 12 for placing the electroplating rack 3. The electroplating tank 14 side wall is provided with an electroplating plate 15 electrically connected to the anode of the power supply. The support blocks 12 on both sides of the slot 14 are electrically connected to the cathode of the power supply.
进一步，所述的传输机构2为龙门式航车，其包括跨设在电镀池1上方的龙门架21，所述的龙门架21两侧固定设置有带动龙门架21沿滑轨4平移滑动的驱动器24，所述的驱动器24与控制器电连接，并由驱动器24控制进行同步转动。Further, the transmission mechanism 2 is a gantry-type air vehicle, which includes a gantry 21 straddling the electroplating pool 1, and the two sides of the gantry 21 are fixedly arranged to drive the gantry 21 to translate and slide along the slide rail 4. A driver 24, the driver 24 is electrically connected to the controller, and is controlled by the driver 24 to rotate synchronously.
优选的，所述龙门架21的横梁下方设有用于起吊电镀架3的连接架22，所述的连接架22与龙门架21两侧相近端通过一对相对设置在龙门架21上部两侧的升降电机23进行驱动升降，所述的连接架22下端至少设有一对位置相对用于起吊电镀架3的L形吊钩221，所述电镀架3的两端对应吊钩221设有与其相配合的7字形挂钩33，所述的连接架22两端分别通过连接带222与升降电机23连接。Preferably, the crossbeam of the gantry 21 is provided with a connecting frame 22 for lifting the electroplating frame 3, and the adjacent ends of the connecting frame 22 and the two sides of the gantry 21 are arranged on both sides of the upper part of the gantry 21 through a pair of The lifting motor 23 is driven to lift, and the lower end of the connecting frame 22 is at least provided with a pair of L-shaped hooks 221 that are relatively used for lifting the electroplating rack 3, and the corresponding hooks 221 at two ends of the electroplating rack 3 are provided with matching The 7-shaped hook 33, the two ends of the connecting frame 22 are respectively connected with the lifting motor 23 through the connecting belt 222.
优选的，所述的龙门架21两侧对应连接架22两端位置设有用于连接架升降导向的导向滑杆211，所述的导向滑杆211由龙门架21上方竖直向下穿设过连接架22并延伸至龙门架21下端。Preferably, the two sides of the gantry 21 corresponding to the two ends of the connecting frame 22 are provided with guide sliders 211 for the lifting and lowering of the connecting frame, and the guide sliders 211 pass vertically downward from the top of the gantry 21 The connecting frame 22 extends to the lower end of the gantry frame 21 .
优选的，所述的驱动器23侧面还设有与滑轨4侧面相贴合的导向滚轮241。Preferably, the side of the driver 23 is also provided with guide rollers 241 that are attached to the side of the slide rail 4 .
进一步，所述的电镀架3包括由导电材质制成的支撑杆31和间隔设置在支撑杆31上用于夹持线路板基材的夹子32，还可以选择性通过在支撑杆31上方设置加强杆34与支撑杆固定连接，然后再将其两端分别与电镀架3上的7字形挂钩33固定连接，所述的夹子32主体为导电材质制成，所述夹子3的2夹嘴与支撑杆31可形成电通路。Further, the electroplating rack 3 includes support rods 31 made of conductive material and clips 32 arranged at intervals on the support rods 31 for clamping the substrate of the circuit board. The rod 34 is fixedly connected with the support rod, and then its two ends are fixedly connected with the 7-shaped hooks 33 on the electroplating frame 3 respectively. The main body of the clip 32 is made of conductive material, and the 2 jaws of the clip 3 are connected with the support The rod 31 may form an electrical pathway.
进一步，所述的支撑块12设有用于固定放置电镀架3的V形槽，所述位于电镀槽14两侧的支撑块12V形槽底部固定有与电源阴极连接的导电条13。Further, the support block 12 is provided with a V-shaped groove for fixing the electroplating rack 3 , and the bottom of the V-shaped groove of the support block 12 located on both sides of the electroplating tank 14 is fixed with a conductive strip 13 connected to the cathode of the power supply.
本实用新型采用上述的技术方案，通过将电镀池1分隔成多个电镀槽14使得电镀池1可以同一时间进行多块线路板基材电镀，提高电镀产能和效率，另外，利用龙门式航车来进行起吊并排夹持线路板基材的电镀架3，一方面能够提高操作安全性和效率，另一方面还能够节约人力，电镀架3利用导电材质支撑的支撑杆31，使得无需再对支撑杆31上固定的夹子32进行布线电连接，令电镀架3的结构更为简单，使用更为可靠，同时电镀池1位于传输机构2滑动方向上的一端设置有用于放置电镀架的中转支架11，电镀槽14和中转支架11位于传输机构2跨设的两侧均设有用于放置电镀架3的支撑块12，将电镀架3架设在中转支架11上，操作工人只需将线路板基材夹持在支撑杆上的夹子32上即可，装夹完毕后，只需操作龙门式航车将电镀架3起吊移送至电镀槽14中即可进行电镀操作，同时，电镀槽14侧边设置的支撑块12为V形槽结构，可以保证支撑杆31更为稳固的放置，另外电镀槽14侧边设置的支撑块12V形槽底部固定有与电源阴极连接的导电条13，使龙门式航车将电镀架3放置在支撑块上后，即可同步完成电镀架3与电源阴极的电连接，使得整个过程简单方便，还高效率。The utility model adopts the above-mentioned technical scheme, and by dividing the electroplating pool 1 into a plurality of electroplating tanks 14, the electroplating pool 1 can perform electroplating on multiple circuit board substrates at the same time, thereby improving the electroplating production capacity and efficiency. The electroplating frame 3 that is used to lift and clamp the circuit board substrate side by side can improve the safety and efficiency of the operation on the one hand, and can save manpower on the other hand. The clip 32 fixed on the rod 31 is used for wiring and electrical connection, so that the structure of the electroplating frame 3 is simpler and the use is more reliable. At the same time, one end of the electroplating pool 1 located in the sliding direction of the transmission mechanism 2 is provided with a transfer bracket 11 for placing the electroplating frame , the electroplating tank 14 and the transfer bracket 11 are located on both sides of the transmission mechanism 2 and are provided with support blocks 12 for placing the electroplating rack 3, and the electroplating rack 3 is erected on the transfer bracket 11, and the operator only needs to place the circuit board substrate Just clamp it on the clip 32 on the support rod. After the clamping is completed, you only need to operate the gantry type aircraft to lift the electroplating frame 3 and transfer it to the electroplating tank 14 to perform the electroplating operation. At the same time, the side of the electroplating tank 14 is set The support block 12 is a V-shaped groove structure, which can ensure that the support rod 31 is placed more stably. In addition, the bottom of the support block 12 V-shaped groove provided on the side of the electroplating tank 14 is fixed with a conductive strip 13 connected to the cathode of the power supply, so that the gantry type aviation After the car places the electroplating frame 3 on the support block, the electrical connection between the electroplating frame 3 and the cathode of the power supply can be completed synchronously, making the whole process simple, convenient and efficient.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108950661A (en) * | 2018-08-31 | 2018-12-07 | 湖北龙腾电子科技有限公司 | A kind of electroplating device |
| CN109402713A (en) * | 2018-12-19 | 2019-03-01 | 汕头凯星印制板有限公司 | Gantry upright plating line plates cylinder |
| CN110699739A (en) * | 2019-11-22 | 2020-01-17 | 惠州建富科技电子有限公司 | Circuit board electroplating production equipment |
| CN110760919A (en) * | 2019-11-26 | 2020-02-07 | 湖州努特表面处理科技有限公司 | High-bearing lifting hanger for electroplating |
| CN111411388A (en) * | 2020-04-16 | 2020-07-14 | 生态环境部华南环境科学研究所 | Special high-pressure atomization spraying device for electroplating production |
| CN111996573A (en) * | 2020-08-11 | 2020-11-27 | 孙即胡 | Integral electroplating equipment for manufacturing flexible circuit board and operation method thereof |
| CN112795970A (en) * | 2020-12-30 | 2021-05-14 | 安徽持恒电子科技有限公司 | Copper plating device for circuit board printing |
| CN113089061A (en) * | 2021-04-01 | 2021-07-09 | 南通德上汽车零配件制造有限公司 | Chromium-nickel electroplating processing system and method for automobile workpiece |
| CN117062331A (en) * | 2023-10-11 | 2023-11-14 | 深圳市金业达电子有限公司 | Suspension PCB circuit board heavy golden device with many postures |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108950661A (en) * | 2018-08-31 | 2018-12-07 | 湖北龙腾电子科技有限公司 | A kind of electroplating device |
| CN109402713A (en) * | 2018-12-19 | 2019-03-01 | 汕头凯星印制板有限公司 | Gantry upright plating line plates cylinder |
| CN110699739A (en) * | 2019-11-22 | 2020-01-17 | 惠州建富科技电子有限公司 | Circuit board electroplating production equipment |
| CN110760919A (en) * | 2019-11-26 | 2020-02-07 | 湖州努特表面处理科技有限公司 | High-bearing lifting hanger for electroplating |
| CN111411388A (en) * | 2020-04-16 | 2020-07-14 | 生态环境部华南环境科学研究所 | Special high-pressure atomization spraying device for electroplating production |
| CN111411388B (en) * | 2020-04-16 | 2023-10-03 | 生态环境部华南环境科学研究所 | Special high-pressure atomization spraying device for electroplating production |
| CN111996573A (en) * | 2020-08-11 | 2020-11-27 | 孙即胡 | Integral electroplating equipment for manufacturing flexible circuit board and operation method thereof |
| CN112795970A (en) * | 2020-12-30 | 2021-05-14 | 安徽持恒电子科技有限公司 | Copper plating device for circuit board printing |
| CN112795970B (en) * | 2020-12-30 | 2021-12-21 | 安徽持恒电子科技有限公司 | Copper plating device for circuit board printing |
| CN113089061A (en) * | 2021-04-01 | 2021-07-09 | 南通德上汽车零配件制造有限公司 | Chromium-nickel electroplating processing system and method for automobile workpiece |
| CN117062331A (en) * | 2023-10-11 | 2023-11-14 | 深圳市金业达电子有限公司 | Suspension PCB circuit board heavy golden device with many postures |
| CN117062331B (en) * | 2023-10-11 | 2023-12-08 | 深圳市金业达电子有限公司 | Suspension PCB circuit board heavy golden device with many postures |
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Denomination of utility model: A PCB substrate electroplating device Granted publication date: 20171110 Pledgee: Industrial Bank Putian branch, Limited by Share Ltd. Pledgor: PUTIAN HANJIANG YD PCB Co.,Ltd. Registration number: Y2024980056559 |
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