CN211079390U - Independent electroplating device for hardware workpiece - Google Patents
Independent electroplating device for hardware workpiece Download PDFInfo
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- CN211079390U CN211079390U CN201921918705.6U CN201921918705U CN211079390U CN 211079390 U CN211079390 U CN 211079390U CN 201921918705 U CN201921918705 U CN 201921918705U CN 211079390 U CN211079390 U CN 211079390U
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Abstract
The utility model discloses a hardware work piece independently electroplates device, it is including electroplating the cavity, electroplate the top of cavity and seted up and supply the export that hardware work piece passed, the bottom of electroplating the cavity is offered and is used for pouring into the entry of predetermineeing the flow plating solution, be equipped with cyclic annular positive pole in the electroplating cavity, the top of electroplating the cavity is equipped with and is used for the clamping hardware work piece's cathode mechanism, during electroplating, will hardware work piece by the export is inserted in electroplate in the cavity, and will hardware work piece arranges in within the cyclic annular positive pole, through right cyclic annular positive pole with cathode mechanism circular telegram and make hardware work piece electroplates. The utility model discloses can arrange hardware work piece in an independent electroplating environment, and then improve hardware work piece's electroplating effect, help the control electroplating process.
Description
Technical Field
The utility model relates to an electroplate the device, especially relate to a hardware work piece independently electroplates device.
Background
Among the prior art, common five metals electroplating device, generally adopt and hang basket or stores pylon etc. place many hardware work piece products in an electroplating bath simultaneously, utilize negative pole and the positive pole circular telegram in an electroplating bath of an electroplating power, the electroplating in-process, a plurality of hardware work piece are arranged in same electric field, there is the interact between the hardware work piece product, the electroplating effect that leads to hardware work piece hardly reaches the ideal effect, and the electroplating process of every hardware work piece product can't independently be monitored, especially not be applicable to some selective electroplating occasions that require.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, to prior art not enough, provide one kind can arrange hardware work piece in an independent electroplating environment, and then improve hardware work piece's electroplating effect, help the independent electroplating device of control electroplating process.
In order to solve the technical problem, the utility model adopts the following technical scheme.
The utility model provides a hardware work piece independently electroplates device, its is including electroplating the cavity, electroplate the top of cavity and seted up and supply the export that hardware work piece passed, the bottom of electroplating the cavity is offered and is used for pouring into the entry of predetermineeing the flow plating solution, be equipped with cyclic annular positive pole in the electroplating cavity, the top of electroplating the cavity is equipped with and is used for the clamping hardware work piece's cathode mechanism, during the electroplating, will hardware work piece by the export is inserted in the electroplating cavity, and will hardware work piece arranges in within the cyclic annular positive pole, through right cyclic annular positive pole with cathode mechanism circular telegram and make hardware work piece electroplates.
Preferably, the electroplating cavity is fixed on a supporting plate, and the supporting plate is arranged in a preset electroplating box.
Preferably, the electroplating cavity is in a shape of a circular tube.
Preferably, the device further comprises a moving mechanism for driving the cathode mechanism to ascend or descend.
Preferably, the edge of the outlet is formed with an inwardly projecting inner edge.
Preferably, be equipped with the plane positive pole in the electroplating cavity, the plane positive pole is located the below of cyclic annular positive pole, just the plane positive pole orientation hardware work piece's lower extreme.
Preferably, the electroplating cavity is made of an insulating material.
Preferably, the number of the electroplating cavities is multiple, and the electroplating cavities are all fixed on the supporting plate.
The utility model discloses an among the independent electroplating device of hardware work piece, earlier before electroplating hardware work piece clamping in cathode mechanism utilize devices such as the predetermined pump body to the entry lasts to pour into the plating solution of predetermineeing the flow into, and the plating solution via the export flows the back, makes be full of the plating solution that flows in the electroplating cavity, then will hardware work piece by the export is inserted in the electroplating cavity, until hardware work piece is located cyclic annular positive pole is inboard, and it is right to utilize predetermined electroplating power cyclic annular positive pole with the cathode mechanism circular telegram makes hardware work piece electroplates under independent electroplating environment. Compared with the prior art, the utility model discloses utilize the electroplating cavity does the hardware component provides an independent electroplating environment, can avoid electroplating in batches the influence of factors such as hardware component's electroplating effect, and then improves hardware component's electroplating process quality, in addition, the utility model discloses it is right to utilize independent electroplating environment the hardware component carries out electroplating process, helps the control hardware component's electroplating process is particularly useful for the occasion of selective electroplating requirement, has satisfied the application demand betterly.
Drawings
FIG. 1 is a cross-sectional view of the independent electroplating device for hardware workpieces of the present invention;
FIG. 2 is a flow chart of the independent electroplating process for hardware workpiece of the present invention.
Detailed Description
The present invention will be described in more detail with reference to the accompanying drawings and examples.
The utility model discloses a hardware work piece independently electroplates device please see figure 1, it is including electroplating cavity 1, electroplating cavity 1's top is seted up and is supplied hardware work piece 100 passes export 10, electroplating cavity 1's bottom is offered and is used for pouring into the entry 11 of predetermineeing the flow plating solution into, be equipped with cyclic annular positive pole 12 in electroplating cavity 1, electroplating cavity 1's top is equipped with and is used for the clamping hardware work piece 100's cathode mechanism 2, during electroplating, will hardware work piece 100 by export 10 inserts in electroplating cavity 1, and will hardware work piece 100 arranges in cyclic annular positive pole 12 is inside, through right cyclic annular positive pole 12 with cathode mechanism 2 circular telegram and make hardware work piece 100 electroplates.
Among the above-mentioned device, earlier before electroplating hardware workpiece 100 clamping in cathode mechanism 2, utilize devices such as the predetermined pump body to entry 11 lasts to pour into the plating solution of predetermineeing the flow into, and the plating solution via export 10 flows the back, makes it is full of mobile plating solution to electroplate in the cavity 1, then will hardware workpiece 100 by export 10 inserts in electroplating cavity 1, until hardware workpiece 100 is located annular anode 12 is inboard, utilizes predetermined electroplating power supply to annular anode 12 with cathode mechanism 2 circular telegram makes hardware workpiece 100 electroplates under independent electroplating environment. Compared with the prior art, the utility model discloses utilize electroplating cavity 1 does hardware component 100 provides an independent electroplating environment, can avoid electroplating in batches the influence of factors such as hardware component 100's electroplating effect, and then improve hardware component 100's electroplating processing quality, in addition, the utility model discloses it is right to utilize independent electroplating environment hardware component 100 carries out electroplating processing, helps the control hardware component 100's electroplating process, is particularly useful for the selective occasion that requires of electroplating, has satisfied the application demand betterly.
In order to support the electroplating chamber 1, in this embodiment, the electroplating chamber 1 is fixed on a supporting plate 3, and the supporting plate 3 is disposed in a predetermined electroplating box.
As a preferred structure, the electroplating cavity 1 is in a circular tube shape. However, this is only a preferred way, in other embodiments of the present invention, the electroplating chamber 1 can also be configured as a square cylinder or a chamber structure with other shapes, the present invention does not limit the specific shape of the electroplating chamber 1, that is, any chamber in the prior art that can provide an independent electroplating environment all belongs to the protection scope of the present invention.
The present embodiment further comprises a moving mechanism for driving the cathode mechanism 2 to ascend or descend. Specifically, the moving mechanism may be a transfer device such as a crane or a robot.
Preferably, the edge of the outlet 10 is formed with an inwardly projecting inner edge 13. The inner edge 13 can form an inner necking at the outlet 10, thereby meeting different electroplating requirements.
In this embodiment, be equipped with plane anode 14 in the electroplating cavity 1, plane anode 14 is located the below of cyclic annular anode 12, just plane anode 14 orientation hardware work piece 100's lower extreme. Furthermore, an auxiliary anode capable of extending into the hardware workpiece 100 may be further disposed on the planar anode 14, and the planar anode 14 is used to perform electroplating processing on the end surface, the inner side, and other positions of the hardware workpiece 100.
As a preferable mode, the electroplating chamber 1 is a chamber made of an insulating material. Specifically, the electroplating cavity 1 is preferably a plastic cavity.
In order to meet the requirement of batch electroplating, in this embodiment, the number of the electroplating cavities 1 is multiple, and the electroplating cavities 1 are all fixed on the supporting plate 3. In the structure, a plurality of hardware workpieces 100 can be simultaneously electroplated by using the same electroplating box, but each hardware workpiece 100 is independently electroplated in one electroplating cavity 1, so that an independent electroplating environment is provided for each hardware workpiece 100.
The utility model discloses still relate to an independent electroplating process of hardware work piece, it is shown with fig. 2 to combine, and this technology is realized based on a device, the device is including electroplating cavity 1, the export 10 has been seted up at electroplating cavity 1's top, electroplating cavity 1's bottom has been seted up entry 11, be equipped with cyclic annular positive pole 12 in the electroplating cavity 1, electroplating cavity 1's top is equipped with cathode mechanism 2, the technology includes following step:
step S1, clamping the hardware workpiece 100 to the cathode mechanism 2;
step S2, continuously injecting a preset flow rate of the plating solution into the inlet 11, and discharging the plating solution through the outlet 10;
step S3, inserting the hardware workpiece 100 into the electroplating cavity 1 from the outlet 10 until the hardware workpiece 100 is positioned inside the annular anode 12;
step S4, energizing the annular anode 12 and the cathode mechanism 2, and further electroplating the hardware workpiece 100.
In step S2 of the above process, the plating solution injected into the inlet 11 is a plating solution with a preset temperature;
in step S3, the cathode mechanism 2 and the workpiece 100 are driven to move up or down by a predetermined moving mechanism.
The utility model discloses an among the independent electroplating device of hardware work piece, every electroplating cavity corresponds a hardware work piece product, compare prior art, the utility model discloses can avoid influencing each other between each hardware work piece product, and then promote and electroplate the quality, in electroplating process, can independently give every hardware work piece product circular telegram, can also set up different electroplating parameters to different hardware products, if necessary, all hardware work piece product's electroplating parameter all can utilize the P L C controller of predetermineeing to take notes, arrange into the report form through setting for the procedure, the cooperation is traceed back the system, can easily seek the complete electroplating process of every hardware work piece product, and then satisfy intelligent technology requirement.
The above is only the embodiment of the present invention, and is not intended to limit the present invention, and all modifications, equivalent replacements or improvements made within the technical scope of the present invention should be included within the protection scope of the present invention.
Claims (8)
1. An independent electroplating device for hardware workpieces is characterized by comprising an electroplating cavity (1), an outlet (10) through which the hardware workpiece (100) can pass is formed in the top of the electroplating cavity (1), the bottom of the electroplating cavity (1) is provided with an inlet (11) for injecting electroplating solution with preset flow, an annular anode (12) is arranged in the electroplating cavity (1), a cathode mechanism (2) for clamping the hardware workpiece (100) is arranged above the electroplating cavity (1), and when in electroplating, inserting the hardware workpiece (100) into the electroplating cavity (1) from the outlet (10), and the hardware workpiece (100) is arranged in the annular anode (12), electroplating the hardware workpiece (100) by electrifying the annular anode (12) and the cathode mechanism (2).
2. A hardware workpiece independent electroplating device according to claim 1, wherein the electroplating chamber (1) is fixed on a supporting plate (3), and the supporting plate (3) is arranged in a preset electroplating box.
3. The independent electroplating device for hardware workpieces as claimed in claim 1, characterized in that the electroplating cavity (1) is in a shape of a circular pipe.
4. The independent electroplating device for hardware workpieces as claimed in claim 1, characterized by further comprising a moving mechanism for driving the cathode mechanism (2) to ascend or descend.
5. A hardware workpiece self-contained plating apparatus according to claim 1, wherein an inwardly projecting inner edge (13) is formed at the edge of the outlet (10).
6. The independent electroplating device for hardware workpieces according to claim 1, wherein a planar anode (14) is arranged in the electroplating cavity (1), the planar anode (14) is positioned below the annular anode (12), and the planar anode (14) faces the lower end of the hardware workpiece (100).
7. The independent electroplating device for hardware workpieces as claimed in claim 1, wherein the electroplating cavity (1) is made of insulating materials.
8. The independent electroplating device for hardware workpieces as claimed in claim 2, wherein the number of the electroplating cavities (1) is multiple, and the electroplating cavities (1) are all fixed on the supporting plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921918705.6U CN211079390U (en) | 2019-11-07 | 2019-11-07 | Independent electroplating device for hardware workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921918705.6U CN211079390U (en) | 2019-11-07 | 2019-11-07 | Independent electroplating device for hardware workpiece |
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| Publication Number | Publication Date |
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| CN211079390U true CN211079390U (en) | 2020-07-24 |
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| CN201921918705.6U Active CN211079390U (en) | 2019-11-07 | 2019-11-07 | Independent electroplating device for hardware workpiece |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110699738A (en) * | 2019-11-07 | 2020-01-17 | 俊杰机械(深圳)有限公司 | Independent electroplating device and process for hardware workpiece |
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2019
- 2019-11-07 CN CN201921918705.6U patent/CN211079390U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110699738A (en) * | 2019-11-07 | 2020-01-17 | 俊杰机械(深圳)有限公司 | Independent electroplating device and process for hardware workpiece |
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