CN2441817Y - Supersonic plating device - Google Patents
Supersonic plating device Download PDFInfo
- Publication number
- CN2441817Y CN2441817Y CN 00225529 CN00225529U CN2441817Y CN 2441817 Y CN2441817 Y CN 2441817Y CN 00225529 CN00225529 CN 00225529 CN 00225529 U CN00225529 U CN 00225529U CN 2441817 Y CN2441817 Y CN 2441817Y
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- CN
- China
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- electroplating
- plating tank
- sidewall
- electroplanting device
- utility
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Abstract
The utility model relates to a supersonic electroplating device, comprising an electroplating bath, electroplating liquid filled in the electroplating bath, an insulating support frame arranged in the electroplating bath and a red copper electrode arranged on the insulating support frame and connected with a power supply, and the red copper electrode is connected with a positive electrode and a negative electrode which are arranged in the electroplating liquid. The utility model is characterized in that electroacoustic transducers are arranged on at least one wall face of each side wall and bottom wall of the electroplating bath, and the electroacoustic transducers are connected with an ultrasonic generator in parallel. The utility model can effectively avoid the edge effect when electroplating, and make an electroplating body with large surface area obtain a uniform and compact electroplating layer.
Description
The utility model relates to a kind of ultrasonic wave electroplanting device.
At present at the widely used electroplanting device of electroplating industry, to form by cell body that electroplate liquid is housed and the positive and negative two arrays of electrodes that is fixed on the cell body, workpiece to be plated uses as negative pole.When two groups of pole plates feed galvanic current, the metal ion in the electroplate liquid just is deposited on and finishes electroplating process on the workpiece surface.When such electroplanting device amasss greatly at workpiece surface, can produce " fringing effect ", promptly edge coating is thicker than approaching for centre coating, and particularly bigger in current density, electroplating time is longer, and when the coating requirement was thicker, fringing effect was also just obvious more.A kind of chemical cell as domestic certain war production is used " two property pole piece ", and it is of a size of 200 * 180 * 0.2mm, adopts its edge thickness of coating of general electroplanting device and center thickness of coating to differ 60%.In order to solve " fringing effect " phenomenon of big area pole plate, manufacturer and R﹠D institution have taked some improvement on the existing plating device, as adding shielded partitions at negative pole, stir electroplate liquid and mobile pole plate etc. with jet or jet flow, but poor effect all.
The purpose of this utility model provides a kind of ultrasonic wave electroplanting device, and it can make the electroplating parts of large surface area obtain even and fine and close coating, avoids " fringing effect " effectively.
In order to achieve the above object, ultrasonic wave electroplanting device of the present utility model includes plating tank, contain the electroplate liquid in plating tank, place the insulating frame above the plating tank, be furnished with two red copper electrodes that link to each other with power supply on the insulating support, two red copper electrodes link to each other with negative potential with the positive electrode of the electroplate liquid that places plating tank respectively, negative electricity workpiece very to be plated, each sidewall and diapire at plating tank, have at least on the wall to be furnished with electroacoustics transducer, electroacoustics transducer is connected in parallel on the ultrasonic generator.
After adopting such structure, because at each sidewall of plating tank, be furnished with the electroacoustics transducer that is connected in parallel on the producer on the diapire, the high-intensity ultrasonic wave that produces can produce " cavitation effect " in electroplate liquid, be that the continuous generation in electroplate liquid of countless micro-bubbles is burst apart again, follow the utmost point short period of time simultaneously, very low range luminous, high pressure, high temperature and highfield, its comprehensive action, be subjected to the intensive stirring and be tending towards even and fine and close with regard to power line and the metal ion that makes the workpiece to be plated surface, thereby make the workpiece to be plated of large surface area obtain even and fine and close coating, avoid " fringing effect " phenomenon effectively.
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is the sectional view of first embodiment of the utility model ultrasonic wave electroplanting device.
Fig. 2 is the sectional view of second embodiment of the utility model ultrasonic wave electroplanting device.
Be first embodiment of ultrasonic wave electroplanting device as shown in Figure 1, at plating tank 7 electroplate liquid 8 is housed, insulating support 3 is arranged on plating tank, on insulating support 3, be provided with two red copper electrodes 2 that link to each other with power supply respectively, two red copper electrodes 2 link to each other with negative potential 5 with the positive electrode 4 that places electroplate liquid respectively, negative potential 5 is a workpiece to be plated, be furnished with the electroacoustics transducer 6 that is connected in parallel on ultrasonic generator 9 on each sidewall on the plating tank 7 and bottom surface, electroacoustics transducer 6 directly sticks on each sidewall of plating tank and the outer side of bottom surface with epoxy resin glue.
Fig. 2 shows second embodiment of the utility model ultrasonic wave electroplanting device, removing the electroacoustics transducer setting is different from outside first embodiment, other structures of ultrasonic wave electroplanting device are identical, be connected in parallel on the electroacoustics transducer 6 on the ultrasonic generator 9, be arranged in the golden body 11 of sealing by fairlead 10, the box body 11 that is provided with electroacoustics transducer 6 places in the plating tank 7, and is fixed on the medial surface of each sidewall of plating tank and diapire.
Certainly,, both can be arranged in individually on the wall or diapire of each sidewall of plating tank 7, also can on each sidewall, make up layout, can also on sidewall and diapire, make up layout as the electroacoustics transducer 6 among embodiment 1 and the embodiment 2.
Claims (3)
1, a kind of ultrasonic wave electroplanting device, include the electroplate liquid (8) in plating tank (7) and the Sheng Yuqi, insulating support (3) is set above the plating tank, insulating support is provided with two red copper electrodes (2) that link to each other with power supply (1), red copper electrode (2) is analysed (5) with the positive electrode that places electroplate liquid (4) respectively and is linked to each other with negative electricity, negative potential (5) is a workpiece to be plated, it is characterized in that: on each sidewall and diapire of plating tank (7), have at least a wall to be furnished with electroacoustics transducer (6), electroacoustics transducer (6) is connected in parallel on the ultrasonic generator (9).
2, according to the described ultrasonic wave electroplanting device of claim 1, it is characterized in that: the electroacoustics transducer (6) that is connected in parallel on the ultrasonic generator (9) directly sticks on the outer side of each sidewall, bottom surface of plating tank (7) with Resins, epoxy.
3, according to the described ultrasonic wave electroplanting device of claim 1, it is characterized in that: the electroacoustics transducer (6) that is connected in parallel on the ultrasonic generator (9) is arranged in the box body (11) of sealing by fairlead (10), box body (11) places in the plating tank (7), and is fixed on the medial surface of each sidewall, diapire of plating tank (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00225529 CN2441817Y (en) | 2000-08-31 | 2000-08-31 | Supersonic plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00225529 CN2441817Y (en) | 2000-08-31 | 2000-08-31 | Supersonic plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2441817Y true CN2441817Y (en) | 2001-08-08 |
Family
ID=33589609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00225529 Expired - Fee Related CN2441817Y (en) | 2000-08-31 | 2000-08-31 | Supersonic plating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2441817Y (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100396823C (en) * | 2005-09-29 | 2008-06-25 | 陕西科技大学 | Method and device for preparing coating or film using supersonic, water-heating and electrodeposition technology |
| CN100432300C (en) * | 2001-09-05 | 2008-11-12 | 3M创新有限公司 | Ultrasonically-enhanced electroplating apparatus and methods |
| CN101643923B (en) * | 2009-09-09 | 2011-03-23 | 河南科技大学 | Electroforming method and electroforming apparatus commonly acted by ultrasonic wave and laser |
| CN102560578A (en) * | 2010-12-21 | 2012-07-11 | 中国科学院金属研究所 | Discontinuous ultrasonic electroplating device and application thereof |
| CN103526270A (en) * | 2013-09-17 | 2014-01-22 | 兰继红 | Simple electroplating solution pool |
| CN103572344A (en) * | 2013-09-29 | 2014-02-12 | 杭州电子科技大学 | Ultrasonic wave precise electroplating device |
| CN103576708A (en) * | 2013-09-29 | 2014-02-12 | 杭州电子科技大学 | Circuit of control system based on ultrasonic precise electroplating device |
| CN106906501A (en) * | 2017-03-30 | 2017-06-30 | 江苏理工学院 | A kind of overcritical electric deposition device of ultrasonic wave added |
| CN109207945A (en) * | 2018-09-12 | 2019-01-15 | 杭州联芳科技有限公司 | A kind of combined type magnetic control sputtering sedimentation platform |
| CN111101162A (en) * | 2019-12-26 | 2020-05-05 | 江苏科技大学 | Method for regulating and controlling nanocrystalline texture growth by using alternating ultrasonic frequency |
| CN111910237A (en) * | 2020-06-17 | 2020-11-10 | 吴征威 | Plasma bionic material micro-arc oxidation method and device |
| TWI772983B (en) * | 2019-11-27 | 2022-08-01 | 日商松田產業股份有限公司 | Method for inhibiting biofilm in wet plating step |
-
2000
- 2000-08-31 CN CN 00225529 patent/CN2441817Y/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100432300C (en) * | 2001-09-05 | 2008-11-12 | 3M创新有限公司 | Ultrasonically-enhanced electroplating apparatus and methods |
| CN100396823C (en) * | 2005-09-29 | 2008-06-25 | 陕西科技大学 | Method and device for preparing coating or film using supersonic, water-heating and electrodeposition technology |
| CN101643923B (en) * | 2009-09-09 | 2011-03-23 | 河南科技大学 | Electroforming method and electroforming apparatus commonly acted by ultrasonic wave and laser |
| CN102560578B (en) * | 2010-12-21 | 2014-09-10 | 中国科学院金属研究所 | Discontinuous ultrasonic electroplating device and application thereof |
| CN102560578A (en) * | 2010-12-21 | 2012-07-11 | 中国科学院金属研究所 | Discontinuous ultrasonic electroplating device and application thereof |
| CN103526270A (en) * | 2013-09-17 | 2014-01-22 | 兰继红 | Simple electroplating solution pool |
| CN103576708B (en) * | 2013-09-29 | 2016-02-03 | 杭州电子科技大学 | Based on the control system circuit of ultrasonic precision electroplanting device |
| CN103576708A (en) * | 2013-09-29 | 2014-02-12 | 杭州电子科技大学 | Circuit of control system based on ultrasonic precise electroplating device |
| CN103572344A (en) * | 2013-09-29 | 2014-02-12 | 杭州电子科技大学 | Ultrasonic wave precise electroplating device |
| CN103572344B (en) * | 2013-09-29 | 2016-03-09 | 杭州电子科技大学 | Ultrasonic precision electroplanting device |
| CN106906501A (en) * | 2017-03-30 | 2017-06-30 | 江苏理工学院 | A kind of overcritical electric deposition device of ultrasonic wave added |
| CN109207945A (en) * | 2018-09-12 | 2019-01-15 | 杭州联芳科技有限公司 | A kind of combined type magnetic control sputtering sedimentation platform |
| TWI772983B (en) * | 2019-11-27 | 2022-08-01 | 日商松田產業股份有限公司 | Method for inhibiting biofilm in wet plating step |
| CN111101162A (en) * | 2019-12-26 | 2020-05-05 | 江苏科技大学 | Method for regulating and controlling nanocrystalline texture growth by using alternating ultrasonic frequency |
| CN111101162B (en) * | 2019-12-26 | 2021-07-27 | 江苏科技大学 | Method for regulating and controlling nanocrystalline texture growth by using alternating ultrasonic frequency |
| CN111910237A (en) * | 2020-06-17 | 2020-11-10 | 吴征威 | Plasma bionic material micro-arc oxidation method and device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |