CN216891287U - Jet electrodeposition processing device - Google Patents
Jet electrodeposition processing device Download PDFInfo
- Publication number
- CN216891287U CN216891287U CN202220067348.2U CN202220067348U CN216891287U CN 216891287 U CN216891287 U CN 216891287U CN 202220067348 U CN202220067348 U CN 202220067348U CN 216891287 U CN216891287 U CN 216891287U
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- Prior art keywords
- end cover
- cathode
- anode
- electroplating
- nozzle
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- 238000004070 electrodeposition Methods 0.000 title claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 55
- 238000009713 electroplating Methods 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 abstract description 7
- 238000000151 deposition Methods 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract description 4
- 239000007791 liquid phase Substances 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract 1
- 238000007670 refining Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a jet flow electrodeposition processing device which mainly comprises a mobile platform, a connecting plate, an electrical interface end cover, an anode cavity, a nozzle end cover, an anode bar, a liquid supply pipe, an electroplating liquid pump, a cathode workpiece, a cathode power connection device, a cathode support platform and an electroplating liquid tank containing electroplating liquid, wherein the connecting plate is positioned below the mobile platform; the anode cavity is positioned below the electric interface end cover, and the nozzle is fixed below the anode cavity by the nozzle end cover; the liquid supply pipe is positioned at one side of the anode cavity and is connected with the electroplating liquid pump below; the cathode power-on device is positioned below the cathode workpiece and above the cathode supporting platform. The utility model can improve the liquid phase mass transfer process of the electrodeposition, refine crystal grains, improve the quality of the deposition surface, and has low processing cost and simple operation.
Description
Technical Field
The utility model relates to the technical field of electrodeposition, in particular to a jet electrodeposition processing device.
Background
The electro-deposition processing belongs to one kind of electrochemical processing, and is an electrochemical processing method which utilizes the principle of cathode deposition to reduce metal ions at a cathode. Jet electrodeposition is of interest because of its better heat transfer properties and higher deposition rates. Due to the impact of the electroplating solution on the cathode workpiece, the plating layer can be mechanically activated, the thickness of the diffusion layer can be effectively reduced, and the liquid phase mass transfer process in the electrodeposition process is improved, so that the effect of refining grains is achieved, and a compact deposition layer is obtained. Therefore, a jet electrodeposition processing device with simple structure and convenient operation is urgently needed in the field.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the utility model aims to provide a jet flow electrodeposition processing device which can improve the liquid phase mass transfer process in the electrodeposition process so as to play a role in refining grains and has simple operation.
2. Technical scheme
In order to solve the problems, the utility model adopts the following technical scheme: a jet electrodeposition processing device characterized in that: the device mainly comprises a mobile platform, a connecting plate, an electric interface end cover, an anode cavity, a nozzle end cover, an anode rod, a liquid supply pipe, an electroplating liquid pump, a cathode workpiece, a cathode electric connection device, a cathode supporting platform and an electroplating liquid tank containing electroplating liquid; the connecting plate is positioned below the mobile platform, the electric interface end cover is positioned above the mobile platform, the mobile platform is in threaded connection with the electric interface end cover, and the electric interface end cover is in bolted connection with the connecting plate; the anode cavity is positioned below the electric interface end cover, and the nozzle is fixed below the anode cavity by the nozzle end cover; the liquid supply pipe is positioned at one side of the anode cavity and is connected with an electroplating liquid pump below the liquid supply pipe, and the electroplating liquid pump is positioned in the electroplating liquid; the cathode power-on device is positioned below the cathode workpiece and above the cathode supporting platform; the cathode support platform is positioned above the electroplating solution tank and above the surface of the electroplating solution.
As a preferred embodiment of the jet electrodeposition processing apparatus of the present invention, the movable platform is an X, Y, Z three-coordinate movable platform, the connecting device is connected below the movable platform by 4 bolts, the electrical interface end cap is connected with the connecting plate by a thread, and the electrical interface end cap and the connecting device are respectively provided with four through holes and connected by bolts.
As a preferred embodiment of the jet electrodeposition processing apparatus of the present invention, the electrical interface end cap is in threaded connection with the anode cavity, the anode rod is coaxially matched with the electrical interface end cap, the nozzle is attached to the lower end face of the anode cavity and fixed below the anode cavity by the nozzle end cap, the nozzle end cap is in threaded connection with the anode cavity, and the lower end face of the anode rod is overlapped with the lower end face of the nozzle.
As a preferred embodiment of the jet electrodeposition processing apparatus of the present invention, the cathode supporting platform is disposed above the electroplating bath, the cathode power connection apparatus is disposed above the cathode supporting platform, the cathode power connection apparatus is connected to a negative electrode of the power supply, and the anode rod is connected to the negative electrode of the power supply.
In a preferred embodiment of the jet electrodeposition processing apparatus of the present invention, the anode chamber is connected to a liquid supply pipe, and the liquid supply pipe is connected to an electroplating liquid pump, and the electroplating liquid pump is placed in the electroplating liquid.
Drawings
FIG. 1 is a schematic view of the overall structure of a jet electrodeposition processing apparatus according to the present invention;
FIG. 2 is a cross-sectional view of an anode chamber of a jet electrodeposition processing device according to the present invention.
FIG. 3 is a cross-sectional view of a nozzle of a jet electrodeposition processing device of the present invention.
The reference numbers in the figures illustrate: 1 anode cavity, 2 anode rods, 3 moving platforms, 4 connecting plates, 5 electrical interface end covers, 6 liquid supply pipes, 7 nozzle end covers, 8 nozzles, 9 electroplating liquid pumps, 10 electroplating liquid, 11 cathode supporting platforms, 12 cathode power connection devices, 13 cathode workpieces and 14 electroplating liquid tanks.
Detailed Description
The technical solutions in the embodiments of the present invention will be further described with reference to the drawings, but the present invention is not limited thereto.
As shown in fig. 1 and 2, a jet electrodeposition processing apparatus is characterized in that: the device mainly comprises a mobile platform, a connecting plate, an electric interface end cover, an anode cavity, a nozzle end cover, an anode rod, a liquid supply pipe, an electroplating liquid pump, a cathode workpiece, a cathode electric connection device, a cathode supporting platform and an electroplating liquid tank containing electroplating liquid; the connecting plate is positioned below the mobile platform, the electric interface end cover is positioned above the mobile platform, the mobile platform is in threaded connection with the electric interface end cover, and the electric interface end cover is in bolted connection with the connecting plate; the anode cavity is positioned below the electric interface end cover, and the nozzle is fixed below the anode cavity by the nozzle end cover; the liquid supply pipe is positioned on one side of the anode cavity and is connected with an electroplating liquid pump below the liquid supply pipe, and the electroplating liquid pump is positioned in the electroplating liquid; the cathode power-on device is positioned below the cathode workpiece and above the cathode supporting platform; the cathode support platform is positioned above the electroplating solution tank and above the surface of the electroplating solution.
Specifically, moving platform be X, Y, Z three-coordinate moving platform, connecting device adopts 4 bolted connection in moving platform below, the electrical interface end cover passes through threaded connection with the connecting plate, and electrical interface end cover and connecting device have four through-holes respectively and pass through bolted connection.
Specifically, the electrical interface end cover adopts threaded connection with the positive pole cavity, and the coaxial center cooperation of positive pole stick and electrical interface end cover, the terminal surface laminating is and fixed in positive pole cavity below by the nozzle end cover under nozzle and the positive pole cavity, and the nozzle end cover adopts threaded connection with the positive pole cavity, terminal surface coincidence under terminal surface and the nozzle under the positive pole stick.
Specifically, the cathode supporting platform is arranged above the electroplating liquid tank, the cathode power connection device is arranged above the cathode supporting platform, the cathode power connection device is connected with the negative pole of the power supply, and the anode bar is connected with the negative pole of the power supply.
Specifically, the anode cavity is connected with a liquid supply pipe, the liquid supply pipe is connected with an electroplating liquid pump, and the electroplating liquid pump is arranged in electroplating liquid.
The working process is as follows: before use, the prepared electroplating solution 10 is placed in an electroplating solution tank 14, a cathode workpiece 13 is placed on a cathode power connection device 12 and is placed on a cathode support platform 11, the cathode power connection device 12 is connected with a power supply cathode, an anode rod 2 is inserted into an anode cavity 1 through an electrical interface end cover 5, the upper end of the anode rod 2 is connected with a power supply anode, a liquid supply pipe 6 is respectively connected with the anode cavity 1 and an electroplating solution pump 9, the distance between a nozzle 8 and the cathode workpiece 13 is adjusted to a required position through a mobile platform 3, the power supply of the electroplating solution pump 9 is turned on to enable the electroplating solution 10 to be sprayed and flow out through the nozzle 8, the mobile platform 3 drives the nozzle 8 to do plane motion, and under the action of a power supply, an electrodeposition reaction occurs between the anode rod 2 and the electroplating solution 10 and the cathode workpiece 13.
The present invention is not limited to the above-described embodiments, and any person skilled in the art can modify, supplement or substitute the technical solution of the present invention by using similar methods within the technical scope of the present invention, and shall be covered by the protection scope of the present invention.
Claims (5)
1. A jet electrodeposition processing device characterized in that: the device mainly comprises a mobile platform, a connecting plate, an electric interface end cover, an anode cavity, a nozzle end cover, an anode rod, a liquid supply pipe, an electroplating liquid pump, a cathode workpiece, a cathode electric connection device, a cathode supporting platform and an electroplating liquid tank containing electroplating liquid; the connecting plate is positioned below the mobile platform, the electric interface end cover is positioned above the mobile platform, the mobile platform is in threaded connection with the electric interface end cover, and the electric interface end cover is in bolted connection with the connecting plate; the anode cavity is positioned below the electric interface end cover, and the nozzle is fixed below the anode cavity by the nozzle end cover; the liquid supply pipe is positioned at one side of the anode cavity and is connected with an electroplating liquid pump below the liquid supply pipe, and the electroplating liquid pump is positioned in the electroplating liquid; the cathode power-on device is positioned below the cathode workpiece and above the cathode supporting platform; the cathode support platform is positioned above the electroplating solution tank and above the surface of the electroplating solution.
2. A jet electrodeposition processing apparatus according to claim 1, characterized in that: the mobile platform is X, Y, Z three-coordinate mobile platform, the connecting plate adopts 4 bolted connection below the mobile platform, the electrical interface end cover passes through threaded connection with the connecting plate, and electrical interface end cover and connecting device have four through-holes respectively and pass through bolted connection.
3. A jet electrodeposition processing apparatus according to claim 1, characterized in that: the electric interface end cover and the anode cavity are in threaded connection, the anode rod and the electric interface end cover are in coaxial matching, the nozzle is attached to the lower end face of the anode cavity and fixed below the anode cavity through the nozzle end cover, the nozzle end cover and the anode cavity are in threaded connection, and the lower end face of the anode rod is overlapped with the lower end face of the nozzle.
4. A jet electrodeposition processing apparatus according to claim 1, characterized in that: the cathode supporting platform is arranged above the electroplating liquid tank, the cathode power connection device is arranged above the cathode supporting platform and is connected with the negative pole of the power supply, and the anode bar is connected with the negative pole of the power supply.
5. A jet electrodeposition processing apparatus according to claim 1, characterized in that: the anode cavity is connected with a liquid supply pipe, the liquid supply pipe is connected with an electroplating liquid pump, and the electroplating liquid pump is arranged in electroplating liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220067348.2U CN216891287U (en) | 2022-01-12 | 2022-01-12 | Jet electrodeposition processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220067348.2U CN216891287U (en) | 2022-01-12 | 2022-01-12 | Jet electrodeposition processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216891287U true CN216891287U (en) | 2022-07-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220067348.2U Expired - Fee Related CN216891287U (en) | 2022-01-12 | 2022-01-12 | Jet electrodeposition processing device |
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| Country | Link |
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| CN (1) | CN216891287U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116005215A (en) * | 2022-12-27 | 2023-04-25 | 青岛理工大学 | Jet electrodeposition nozzle device and 3D printer |
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2022
- 2022-01-12 CN CN202220067348.2U patent/CN216891287U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116005215A (en) * | 2022-12-27 | 2023-04-25 | 青岛理工大学 | Jet electrodeposition nozzle device and 3D printer |
| CN116005215B (en) * | 2022-12-27 | 2023-11-28 | 青岛理工大学 | Jet electrodeposition nozzle device and 3D printer |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220705 |