CN210506562U - Plating bath with electroplating solution control structure - Google Patents
Plating bath with electroplating solution control structure Download PDFInfo
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- CN210506562U CN210506562U CN201921098433.XU CN201921098433U CN210506562U CN 210506562 U CN210506562 U CN 210506562U CN 201921098433 U CN201921098433 U CN 201921098433U CN 210506562 U CN210506562 U CN 210506562U
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- electroplating
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- plating
- precipitation tank
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Abstract
The utility model discloses a plating bath with plating solution control structure, including electroplating the cell body, at internal anode plate and the shield plate of being fixed with of plating bath, the side of vertical extension board has been seted up and has been gone up and down to erect the groove, erect the inslot at going up and down and be provided with ball screw and be fixed with driving motor at the top of vertical extension board, erect the inslot at going up and down and be provided with the lift slider with ball screw threaded connection, be fixed with rotating electrical machines in horizontal backup pad, evenly be fixed with the couple that is used for placing the work piece on the axostylus axostyle, be fixed with on electroplating the lateral wall of cell body and spout the liquid hole, be provided with the precipitation tank in electroplating the bottom of cell body, be provided with the pump body in the precipitation tank, be fixed with the strengthening rib pole between the roof of. The utility model discloses a structure sets up rationally, through the pump body and hydrojet hole, is favorable to solving the inhomogeneous condition of cladding material that the plating solution is inhomogeneous and lead to, has improved the effect of electroplating, and the suitability is strong and the practicality is good.
Description
Technical Field
The utility model belongs to the technical field of electroplating equipment, concretely relates to plating bath with plating solution control structure.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing the electrolysis principle, and the wear resistance, the conductivity, the light reflection and the corrosion resistance of a workpiece can be enhanced after plating, and the appearance is also enhanced; during electroplating, plating metal or other insoluble materials are used as an anode, a workpiece to be plated is used as a cathode, and cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer; when people electroplate a workpiece, the most common tool is an electroplating bath which is the most basic matching in electroplating equipment and is used for copper plating, nickel plating, zinc plating, gold plating and the like; the existing electroplating bath has low strength and is easy to cause the phenomenon of electroplating solution leakage; and the phenomenon of uneven plating layer caused by uneven electroplating solution is easy to occur in the electroplating process, and the electroplating effect is not good.
Disclosure of Invention
The utility model aims at providing a structure sets up reasonable and the suitability is strong plating bath with plating solution control structure.
The technical scheme for realizing the purpose of the utility model is that the electroplating bath with the electroplating solution control structure comprises an electroplating bath body, an anode plate and a shielding plate are fixed in the electroplating bath body, a through hole is arranged at the center of the top of the electroplating bath body, a vertical support plate is fixed on the top wall of the electroplating bath body, a lifting vertical groove is arranged on the side surface of the vertical support plate, a ball screw is arranged in the lifting vertical groove, a driving motor connected with the ball screw is fixed on the top of the vertical support plate, a lifting slide block in threaded connection with the ball screw is arranged in the lifting vertical groove, a transverse support plate is fixed on the lifting slide block, a rotating motor is fixed on the transverse support plate, a shaft lever is fixed on the main shaft of the rotating motor, and hooks for placing workpieces are uniformly fixed on the shaft lever, the side wall of the electroplating tank body is fixed with a liquid spraying hole, the bottom wall of the electroplating tank body is provided with a liquid discharging hole, the bottom of the electroplating tank body is provided with a settling tank, a pump body is arranged in the settling tank and communicated with the liquid spraying hole through a liquid guide pipe, reinforcing rib rods are uniformly fixed between the top wall of the settling tank and the bottom wall of the electroplating tank body, and inclined rib plates are uniformly fixed on the outer wall of the electroplating tank.
The utility model discloses a dirty push pedal of row is provided with on the diapire of precipitation tank the lateral wall bottom of precipitation tank is provided with row miscellaneous passageway be provided with row miscellaneous push pedal on the diapire of precipitation tank be fixed with telescopic cylinder on the outer wall of precipitation tank, telescopic cylinder with arrange miscellaneous passageway symmetry and set up just telescopic cylinder's piston shaft through the connecting rod with row miscellaneous push pedal is connected.
An isolation net is fixed in the middle of the precipitation tank, the pump body is arranged above the isolation net, and the impurity discharge push plate is located between the isolation net and the bottom wall of the precipitation tank.
The electroplating tank is characterized in that a control gate valve is arranged at the liquid discharge hole, a power supply connector, an external air pump interface and a switch panel are arranged on the electroplating tank body, and a driving motor switch, a rotating motor button and a telescopic cylinder switch are fixed on the switch panel.
The utility model discloses has positive effect: the utility model discloses a structure sets up rationally, the simple operation, it can effectual realization electroplate the operation, and it is favorable to solving the inhomogeneous condition of cladding material that the plating solution is inhomogeneous and lead to through the pump body and spout the liquid hole simultaneously, has improved the effect of electroplating, also can guarantee the bulk strength of plating bath simultaneously, avoids appearing the condition of weeping, uses reliable and stable, and the suitability is strong and the practicality is good.
Drawings
In order that the present invention may be more readily and clearly understood, the following detailed description of the present invention is provided in connection with the following specific embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
(example 1)
Fig. 1 shows a specific embodiment of the present invention, wherein fig. 1 is a schematic structural diagram of the present invention.
Referring to fig. 1, an electroplating bath with an electroplating solution control structure comprises an electroplating bath body 1, an anode plate 2 and a shielding plate 3 are fixed in the electroplating bath body, which is a conventional structure in the prior art, so that a through hole 4 is not described in detail, a vertical support plate 5 is fixed on the top wall of the electroplating bath body, a lifting vertical groove 6 is arranged on the side surface of the vertical support plate, a ball screw 7 is arranged in the lifting vertical groove, a driving motor 8 connected with the ball screw is fixed on the top of the vertical support plate, a lifting slide block 9 in threaded connection with the ball screw is arranged in the lifting vertical groove, a transverse support plate 10 is fixed on the lifting slide block, a rotary motor 11 is fixed on the transverse support plate, a shaft lever 12 is fixed on the main shaft of the rotary motor, and hooks 13 for placing workpieces are uniformly fixed on the shaft lever, the side wall of the electroplating tank body is fixedly provided with a liquid spraying hole 14, the bottom wall of the electroplating tank body is provided with a liquid discharging hole 15, the bottom of the electroplating tank body is provided with a precipitation tank 16, a pump body 17 is arranged in the precipitation tank, the pump body is communicated with the liquid spraying hole through a liquid guide pipe 18, reinforcing rib rods 19 are uniformly fixed between the top wall of the precipitation tank and the bottom wall of the electroplating tank body, and inclined rib plates 20 are uniformly fixed on the outer wall of the electroplating tank.
Be provided with row's miscellaneous passageway 21 bottom the lateral wall of precipitation tank be provided with row miscellaneous push pedal 22 on the diapire of precipitation tank be fixed with telescopic cylinder 23 on the outer wall of precipitation tank, telescopic cylinder with arrange miscellaneous passageway symmetry and set up just telescopic cylinder's piston shaft through connecting rod 24 with row miscellaneous push pedal is connected.
An isolation net 25 is fixed in the middle of the precipitation tank, the pump body is arranged above the isolation net, and the impurity discharge push plate is positioned between the isolation net and the bottom wall of the precipitation tank.
The liquid discharge hole is provided with a control gate valve 26, the electroplating tank body is provided with a power supply connector 27, an external air pump connector 28 and a switch panel 29, and a driving motor switch, a rotating motor button and a telescopic cylinder switch are fixed on the switch panel.
The utility model discloses a structure sets up rationally, the simple operation, it can effectual realization electroplate the operation, and it is favorable to solving the inhomogeneous condition of cladding material that the plating solution is inhomogeneous and lead to through the pump body and spout the liquid hole simultaneously, has improved the effect of electroplating, also can guarantee the bulk strength of plating bath simultaneously, avoids appearing the condition of weeping, uses reliable and stable, and the suitability is strong and the practicality is good.
The standard parts used in the present embodiment may be purchased directly from the market, and the non-standard structural components described in the specification and drawings may be obtained by processing without any doubt according to the common general knowledge in the art, and the connection manner of the respective parts is by the conventional means developed in the art, and the machines, parts and equipment are of the conventional type in the art, so that the detailed description thereof is omitted.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And such obvious changes and modifications which fall within the spirit of the invention are deemed to be covered by the present invention.
Claims (4)
1. The utility model provides an electroplating bath with plating solution control structure, includes the electroplating cell body be fixed with anode plate and shield plate in the electroplating cell body the top center of electroplating cell body is provided with the through-hole be fixed with vertical extension board, its characterized in that on the roof of electroplating cell body: the side surface of the vertical support plate is provided with a lifting vertical groove, a ball screw is arranged in the lifting vertical groove, a driving motor connected with the ball screw is fixed at the top of the vertical support plate, a lifting slide block in threaded connection with the ball screw is arranged in the lifting vertical groove, a transverse support plate is fixed on the lifting slide block, a rotating motor is fixed on the transverse support plate, a shaft rod is fixed on a main shaft of the rotating motor, hooks for placing a workpiece are uniformly fixed on the shaft rod, a liquid spraying hole is fixed on the side wall of the electroplating tank body, a liquid discharging hole is arranged on the bottom wall of the electroplating tank body, a settling tank is arranged at the bottom of the electroplating tank body, a pump body is arranged in the settling tank and communicated with the liquid spraying hole through a liquid guide pipe, and a reinforcing rod is uniformly fixed between the top wall of the settling tank and the bottom wall of the electroplating tank body, inclined rib plates are uniformly fixed on the outer wall of the electroplating bath.
2. The plating tank having a plating solution control structure as recited in claim 1, wherein: the utility model discloses a dirty push pedal of row is provided with on the diapire of precipitation tank the lateral wall bottom of precipitation tank is provided with row miscellaneous passageway be provided with row miscellaneous push pedal on the diapire of precipitation tank be fixed with telescopic cylinder on the outer wall of precipitation tank, telescopic cylinder with arrange miscellaneous passageway symmetry and set up just telescopic cylinder's piston shaft through the connecting rod with row miscellaneous push pedal is connected.
3. The plating tank having a plating solution control structure as recited in claim 2, wherein: an isolation net is fixed in the middle of the precipitation tank, the pump body is arranged above the isolation net, and the impurity discharge push plate is located between the isolation net and the bottom wall of the precipitation tank.
4. The plating tank having a plating solution control structure as recited in claim 3, wherein: the electroplating tank is characterized in that a control gate valve is arranged at the liquid discharge hole, a power supply connector, an external air pump interface and a switch panel are arranged on the electroplating tank body, and a driving motor switch, a rotating motor button and a telescopic cylinder switch are fixed on the switch panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921098433.XU CN210506562U (en) | 2019-07-12 | 2019-07-12 | Plating bath with electroplating solution control structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921098433.XU CN210506562U (en) | 2019-07-12 | 2019-07-12 | Plating bath with electroplating solution control structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210506562U true CN210506562U (en) | 2020-05-12 |
Family
ID=70583022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921098433.XU Expired - Fee Related CN210506562U (en) | 2019-07-12 | 2019-07-12 | Plating bath with electroplating solution control structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210506562U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112160009A (en) * | 2020-09-04 | 2021-01-01 | 合肥工业大学 | Combined electroplating equipment with flocculation function and electroplating method thereof |
| CN113981515A (en) * | 2021-11-30 | 2022-01-28 | 四川海英电子科技有限公司 | Electroplating production device and electroplating method for high-speed high-density board |
-
2019
- 2019-07-12 CN CN201921098433.XU patent/CN210506562U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112160009A (en) * | 2020-09-04 | 2021-01-01 | 合肥工业大学 | Combined electroplating equipment with flocculation function and electroplating method thereof |
| CN113981515A (en) * | 2021-11-30 | 2022-01-28 | 四川海英电子科技有限公司 | Electroplating production device and electroplating method for high-speed high-density board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200512 Termination date: 20210712 |
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| CF01 | Termination of patent right due to non-payment of annual fee |