CN114381790A - Horizontal electroplating equipment for preparing HIT crystalline silicon solar cell - Google Patents
Horizontal electroplating equipment for preparing HIT crystalline silicon solar cell Download PDFInfo
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- CN114381790A CN114381790A CN202011129945.5A CN202011129945A CN114381790A CN 114381790 A CN114381790 A CN 114381790A CN 202011129945 A CN202011129945 A CN 202011129945A CN 114381790 A CN114381790 A CN 114381790A
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- 238000009713 electroplating Methods 0.000 title claims abstract description 44
- 229910021419 crystalline silicon Inorganic materials 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 264
- 239000007788 liquid Substances 0.000 claims abstract description 96
- 238000007747 plating Methods 0.000 claims abstract description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000002360 preparation method Methods 0.000 claims abstract description 24
- 238000007599 discharging Methods 0.000 claims abstract description 19
- 238000001035 drying Methods 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims abstract description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 4
- 229910001432 tin ion Inorganic materials 0.000 claims abstract description 4
- 238000009826 distribution Methods 0.000 claims abstract 4
- 238000005507 spraying Methods 0.000 claims description 79
- 230000000903 blocking effect Effects 0.000 claims description 43
- 239000002699 waste material Substances 0.000 claims description 42
- 239000002912 waste gas Substances 0.000 claims description 19
- 238000001914 filtration Methods 0.000 claims description 14
- 210000001503 joint Anatomy 0.000 claims description 12
- 238000004065 wastewater treatment Methods 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 239000007789 gas Substances 0.000 claims description 7
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 238000005086 pumping Methods 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 210000004027 cell Anatomy 0.000 claims 10
- 239000007921 spray Substances 0.000 claims 8
- 210000005056 cell body Anatomy 0.000 claims 4
- 230000007723 transport mechanism Effects 0.000 claims 2
- 239000010791 domestic waste Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 12
- 239000012634 fragment Substances 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 238000002203 pretreatment Methods 0.000 abstract 1
- 241000196324 Embryophyta Species 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000011068 loading method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010908 plant waste Substances 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 206010011409 Cross infection Diseases 0.000 description 1
- 206010029803 Nosocomial infection Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses horizontal electroplating equipment for preparing HIT (heterojunction with intrinsic thin layer) crystalline silicon solar cells, which comprises a feeding assembly, a pre-treatment assembly, a copper-plating assembly, a copper post-treatment assembly, a tin-plating assembly, a tin post-treatment assembly, a drying assembly and a discharging assembly which are sequentially connected, wherein a copper plating solution preparation mechanism is arranged on the side surface of the copper-plating assembly, a plating solution is prepared by the copper plating solution preparation mechanism in a dissolving mode through a stirring mechanism and is stored in a liquid distribution tank through a pump, copper ions are provided for a plating tank through a copper-plating auxiliary tank, a tin plating solution preparation mechanism is arranged on the side surface of the tin-plating assembly, a plating solution is prepared by the tin plating solution preparation mechanism in a dissolving mode through the stirring mechanism and is stored in the liquid distribution tank through the pump, and tin ions are provided for the plating tank through the copper-plating auxiliary tank. The horizontal coating is adopted, so that the conversion process of the battery piece at the feeding and discharging end of the electroplating equipment between the horizontal direction and the vertical direction is omitted, a hanging tool is not used, the fragment rate is reduced, the electroplating quality is improved, the production yield is improved, and the labor cost and the production cost are reduced.
Description
Technical Field
The invention relates to the technical field of HIT crystalline silicon solar cell manufacturing, in particular to horizontal electroplating equipment for preparing HIT crystalline silicon solar cells.
Background
With the enlargement and rapid development of the scale of the photovoltaic industry and policy adjustment, the cost requirement of the market on the solar cell is more and more strict, and each process is forced to reduce the manufacturing cost of equipment, simplify the production and preparation steps and adopt a more efficient implementation mode. At present, most of solar cells are printed by silver paste, and the silver paste accounts for more than 25% of the total cost of producing the solar crystalline silicon cells. Obviously, the silver paste is replaced by the cheap copper-tin metal, so that the method has great significance for reducing the production cost of the crystalline silicon solar cell. The adoption of the copper-tin grid is a good way to replace silver paste, and the adoption of the copper-tin grid electroplating process can greatly reduce the cost for producing the crystalline silicon solar cell. The HIT solar cell is a hybrid solar cell made of a crystalline silicon substrate and an amorphous silicon thin film, and has higher photoelectric conversion efficiency, better stability and lower cost compared with the traditional single/polycrystalline silicon cell. I have developed perpendicular continuous electroplating equipment at present and applied to the actual production of HIT solar cells, and the commissioning test shows that the approach is correct and feasible, but in the whole copper-tin grid forming process, the slide mount serves as a consumable material, and the challenges are provided for reducing the maintenance cost and improving the effective utilization rate of the equipment. Therefore, the horizontal electroplating equipment for preparing the grid line electrode of the solar cell is developed more effectively to overcome the problems existing in the vertical continuous electroplating equipment, and has great significance and application prospects in reducing the production, manufacturing, maintenance and repair cost of the equipment, improving the effective utilization rate of the equipment and the production yield of the HIT crystalline silicon solar cell, and reducing the energy consumption and the production cost.
Disclosure of Invention
Aiming at the problems, the invention provides the horizontal plating equipment for preparing the HIT crystalline silicon solar cell, which omits the conversion process of a feeding and discharging end cell of the plating equipment between the horizontal direction and the vertical direction, does not use a hanging tool, reduces the breakage rate, improves the plating quality, improves the production yield, and reduces the labor cost and the production cost.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the utility model provides a horizontal electroplating device of preparation HIT crystalline silicon solar wafer, includes the material loading subassembly, preceding processing subassembly, copper facing subassembly, copper after-treatment subassembly, tin-plating subassembly, tin after-treatment subassembly, stoving subassembly, the unloading subassembly that connect gradually, copper facing subassembly side is provided with copper plating solution preparation mechanism, and copper plating solution preparation mechanism will prepare the plating solution through the mode that rabbling mechanism dissolved to save in joining in marriage the cistern through the pump, provide copper ion through the copper facing auxiliary tank to the coating bath, tin-plating subassembly side is provided with tin plating solution preparation mechanism, and tin plating solution preparation mechanism will prepare the plating solution through the mode that rabbling mechanism dissolved to save in joining in marriage the cistern through the pump, provide tin ion through the copper facing auxiliary tank to the coating bath.
Furthermore, the feeding assembly is provided with a rack and a conveying mechanism, the limiting rollers on the conveying mechanism transversely limit the battery pieces in a certain area, and the supporting and conveying rollers on the conveying mechanism are uniformly distributed at the bottoms of the battery pieces.
Further, the pretreatment assembly is provided with a groove body, a conveying mechanism, an inflating mechanism, a liquid blocking mechanism, a spraying mechanism and a waste discharge mechanism, wherein the conveying mechanism is supported on groove walls on two sides of the groove body, the inflating mechanism is arranged at the bottom of the groove body, the liquid blocking mechanism is arranged at an inlet/outlet of a pretreatment section through a liquid blocking roller and a liquid blocking air knife and limits treatment solution in the groove body, the spraying mechanism comprises an upper spraying part and a lower spraying part which are arranged between the upper surface and the lower surface of a plurality of rows of battery pieces, the upper spraying mechanism and the lower spraying mechanism respectively and independently work through a flowmeter and a pressure gauge, and the waste liquid discharge mechanism is arranged at the bottom of the groove and is butted with a plant service end waste water treatment device.
Further, the copper plating component is provided with a tank body, a conveying mechanism, a gas pumping mechanism, a spraying mechanism, a liquid blocking mechanism, an electrode mechanism, an anode titanium net, a filtering circulation mechanism and a waste discharge mechanism, wherein the spraying mechanism comprises an upper spraying part and a lower spraying part which are arranged between the upper surface and the lower surface of a plurality of rows of battery pieces, the upper spraying part and the lower spraying part are separately and independently supplied with liquid through a flowmeter and a pressure gauge, the liquid blocking mechanism is arranged at an inlet/outlet of a copper plating section and limits the plating solution in the tank body, the electrode mechanism provides electricity through a rectifier, a cathode is communicated with grid line electrodes of the plurality of rows of battery pieces through a conducting device, an anode is respectively communicated with the upper anode titanium net and the lower anode titanium net through the conducting device, the filtering circulation mechanism circularly filters the plating solution in the tank body through a loop formed by a filter and a circulating pump, the waste discharge mechanism comprises a waste liquid discharge mechanism and a waste gas discharge mechanism, the waste liquid discharge mechanism is arranged at the bottom of the tank, the waste gas discharge mechanism is arranged at the upper end of the side wall of the tank body and is butted with the plant waste gas treatment equipment.
Furthermore, the copper post-treatment assembly is provided with a tank body, a conveying mechanism, an inflating mechanism, a liquid blocking mechanism, a spraying mechanism and a waste liquid discharging mechanism, wherein the liquid blocking mechanism comprises a liquid blocking roller and a liquid blocking air knife, the liquid blocking air knife is arranged at an inlet/outlet of the section and limits a treatment solution in the tank body, the spraying mechanism comprises an upper spraying mechanism and a lower spraying mechanism, the upper spraying mechanism and the lower spraying mechanism are arranged on/under a plurality of rows of battery pieces at a certain distance, the upper spraying mechanism and the lower spraying mechanism separately and independently work through a flow meter, and the waste liquid discharging mechanism is arranged at the bottom of the tank and is in butt joint with plant service end waste water treatment equipment.
Furthermore, the tin plating component is provided with a tank body, a conveying mechanism, a gas pumping mechanism, a spraying mechanism, a liquid blocking mechanism, an electrode mechanism, an anode zirconium net, a filtering circulation mechanism and a waste discharge mechanism, wherein the spraying mechanism comprises an upper spraying part and a lower spraying part which are arranged between the upper surface and the lower surface of a plurality of rows of battery pieces, the upper spraying part and the lower spraying part separately and independently supply liquid through a flowmeter and a pressure gauge, the liquid blocking mechanism is arranged at an inlet/outlet of a tin plating section and limits the plating solution in the tank body, the electrode mechanism provides electric energy through a rectifier, a cathode is communicated with grid line electrodes of the plurality of rows of battery pieces through a conductive device, an anode is respectively communicated with the anode zirconium net through a conductive device, the filtering circulation mechanism circularly filters the plating solution in the tank body through a loop formed by a filter and a circulating pump, the waste discharge mechanism comprises a waste liquid discharge mechanism and a waste gas discharge mechanism, and the waste liquid discharge mechanism is arranged at the bottom of the tank, the waste gas discharge mechanism is arranged above the side wall of the tank body.
Furthermore, the tin post-treatment assembly is provided with a tank body, a conveying mechanism, an inflating mechanism, a liquid blocking mechanism, a spraying mechanism and a waste liquid discharging mechanism, wherein the liquid blocking mechanism comprises a liquid blocking roller and a liquid blocking air knife which are arranged at the inlet and the outlet of the section and limit the treatment solution in the tank body, the spraying mechanism comprises an upper spraying mechanism and a lower spraying mechanism which are arranged on/under a plurality of rows of battery pieces at a certain distance, the upper/lower spraying mechanisms separately and independently work through a flow meter, and the waste liquid discharging mechanism is arranged at the bottom of the tank and is butted with plant service end wastewater treatment equipment.
Furthermore, the drying assembly is provided with a groove body, a conveying mechanism, an air inlet mechanism and an air exhaust mechanism, the air inlet mechanism continuously conveys fresh drying air to the periphery of the rows of battery pieces through an air blower, and the air exhaust mechanism is in butt joint with plant waste gas equipment to exhaust waste gas out of the groove body.
Furthermore, the blanking assembly is provided with a rack and a conveying mechanism, a limiting roller on the conveying mechanism transversely limits the battery piece in a certain area, and supporting and conveying rollers on the conveying mechanism are uniformly distributed at the bottom of the battery piece.
From the above description of the structure of the present invention, compared with the prior art, the present invention has the following advantages:
1. the invention adopts the horizontal film coating to save the conversion process of the battery piece at the feeding and discharging end of the electroplating equipment between the horizontal direction and the vertical direction, thereby saving the cost for preparing the electroplating equipment; in addition, the electroplating mode has no problem that residual liquid cannot be removed due to the fact that the rack is used for vertical continuous electroplating due to the fact that the slide rack is not arranged, and therefore the performance of the battery piece is improved; meanwhile, compared with vertical continuous electroplating, in the whole horizontal electroplating process, as the risk of mechanism impact does not exist, the battery plate can stably and smoothly pass through the whole electroplating bath, on the other hand, the risk of fragment caused by taking and placing a hanger is reduced, the fragment rate is reduced, and the production yield is improved; the hanger is not used, so that the fragments caused by the deformation of the hanger and the contact displacement caused by mechanical impact when the hanger is lifted and transversely moved in the electroplating process are avoided, and the grid line electrode can more uniformly pass through the current, so that the electroplating quality is improved, and the production yield is also improved; and moreover, no hanging tool is provided, the maintenance workload of equipment is reduced, the labor cost and the production cost are reduced, and the automatic flow line operation of the circular continuous electroplating and the battery production is deeply influenced.
2. The HIT crystalline silicon solar cell grid line electrode prepared by the horizontal electroplating equipment has the advantages of small contact resistance and body resistance, high preparation speed and high production efficiency, can be used for preparing a thicker conducting layer grid line electrode, and is small in internal stress and not easy to break.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is an isometric view of the overall structure of the present invention;
FIG. 2 is an isometric view of the loading assembly and the pretreatment assembly of the present invention;
FIG. 3 is an isometric view of a copper plated assembly of the present invention;
FIG. 4 is an isometric view of a copper aftertreatment component and tin plating component of the invention
FIG. 5 is a perspective view of the tin post-treatment assembly, the drying assembly and the blanking assembly of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Examples
The utility model provides a horizontal electroplating device of preparation HIT crystalline silicon solar wafer, includes the material loading subassembly 10, preceding processing subassembly 20, copper facing subassembly 30, copper aftertreatment subassembly 40, tin-plating subassembly 50, tin aftertreatment subassembly 60, stoving subassembly 70, unloading subassembly 80 that connect gradually, copper facing subassembly 30 side is provided with copper plating solution preparation mechanism 91, and copper plating solution preparation mechanism 91 will be through the mode preparation plating solution that rabbling mechanism 911 dissolved to save in liquid preparation tank 913 through pump 912, provide copper ion through copper facing sub-tank 914 to the coating bath, tin-plating subassembly 50 side is provided with tin plating solution preparation mechanism 92, and tin plating solution preparation mechanism 92 will prepare the plating solution through the mode that rabbling mechanism 921 dissolved, and save in liquid preparation tank 923 through pump 922, provide tin ion through copper facing sub-tank 924 to the coating bath.
The feeding assembly 10 is provided with a rack 11 and a conveying mechanism 12, a limiting roller 121 on the conveying mechanism 12 transversely limits the battery pieces 00 in a certain area and has a supporting and conveying function, and supporting and conveying rollers 122 on the conveying mechanism 12 are uniformly distributed at the bottoms of the battery pieces 00 and rotate together with the limiting roller (121) under the driving of equipment power, so that multiple rows of battery pieces (00) can smoothly enter the interior of the pretreatment assembly (20).
The pretreatment assembly 20 is provided with a groove body 21, a conveying mechanism 22, an inflating mechanism 23, a liquid blocking mechanism 24, a spraying mechanism 25 and a waste discharge mechanism 26, wherein the conveying mechanism 22 is supported on the groove walls on two sides of the groove body 21, the inflating mechanism 23 is arranged at the bottom of the groove body 21 and used for stirring a pretreatment solution, so that adverse impurities on the surfaces of multiple rows of battery pieces (00) are more conveniently removed, the liquid blocking mechanism 24 is arranged at an inlet/outlet of a pretreatment section by a liquid blocking roller 241 and a liquid blocking air knife 242 and limits the treatment solution in the groove body 21, the spraying mechanism 25 comprises an upper spraying 251 and a lower spraying 252 and is arranged between the upper surface and the lower surface of the multiple rows of battery pieces 00, the upper spraying mechanism and the lower spraying mechanism are separated and independently work by a flow meter and a pressure meter, so that the battery pieces to be plated are completely treated, and the waste liquid discharge mechanism 26 is arranged at the bottom of the groove and is in butt joint with a plant service end waste water treatment device.
The copper plating component 30 is provided with a tank body 31, a conveying mechanism 32, a pumping mechanism 33, a spraying mechanism 34, a liquid blocking mechanism 35, an electrode mechanism 36, an anode titanium mesh 37, a filtering circulation mechanism 38 and a waste discharge mechanism 39, wherein the spraying mechanism 34 comprises an upper spraying 341 and a lower spraying 342 and is arranged between the upper surface and the lower surface of a plurality of rows of battery pieces 00, the upper spraying mechanism and the lower spraying mechanism are separately and independently supplied with liquid through a flowmeter and a pressure gauge, the liquid blocking mechanism 35 is arranged at an inlet/outlet of a copper plating section and limits the plating solution in the tank body 31 to avoid cross infection with the tank liquid of the front section and the rear section, the electrode mechanism 36 is supplied with electric quantity through a rectifier, a cathode is communicated with grid electrodes of the plurality of rows of battery pieces 00 through a conductive device, an anode is respectively communicated with the upper anode titanium mesh 37 and the lower anode through the conductive device, the filtering circulation mechanism 38 is used for circularly filtering the plating solution in the tank body through a loop formed by a filter and a circulation pump, the waste discharge mechanism 39 comprises a waste liquid discharge mechanism 391 and a waste gas discharge mechanism 392, the waste liquid discharge mechanism 391 is arranged at the bottom of the tank and is in butt joint with plant-service-end waste water treatment equipment, and the waste gas discharge mechanism 392 is arranged at the upper end of the side wall of the tank body and is in butt joint with plant-service waste gas treatment equipment to discharge waste gas out of the tank body (31) so as to ensure a good electroplating environment.
The copper post-treatment assembly 40 is provided with a groove body 41, a conveying mechanism 42, an inflating mechanism 43, a liquid blocking mechanism 44, a spraying mechanism 45 and a waste liquid discharging mechanism 46, wherein the liquid blocking mechanism 44 comprises a liquid blocking roller 441 and a liquid blocking air knife 442 which are arranged at an inlet/outlet of the section to limit a treatment solution in the groove body 41, the spraying mechanism 45 comprises an upper spraying body 451 and a lower spraying body 452 which are arranged at a certain distance above/below the multi-column battery pieces 00, the upper/lower spraying mechanisms separately and independently work through a flow meter, and the waste liquid discharging mechanism 46 is arranged at the bottom of a groove and is in butt joint with plant-service-end waste water treatment equipment.
The tin plating component 50 is provided with a tank body 51, a conveying mechanism 52, a gas pumping mechanism 53, a spraying mechanism 54, a liquid blocking mechanism 55, an electrode mechanism 56, an anode zirconium mesh 57, a filtering and circulating mechanism 58 and a waste discharging mechanism 59, wherein the spraying mechanism 54 comprises an upper spraying 541 and a lower spraying 542 which are arranged between the upper surface and the lower surface of a plurality of rows of battery pieces 00, the upper spraying mechanism and the lower spraying mechanism are separately and independently supplied with liquid through a flow meter and a pressure meter, the liquid blocking mechanism 55 is arranged at an inlet/outlet of a tin plating section and limits plating solution in the tank body 51, the electrode mechanism 56 is supplied with electric energy through a rectifier, a cathode is communicated with grid electrodes of the plurality of rows of battery pieces 00 through a conducting device, an anode is respectively communicated with the anode zirconium mesh 57 through the conducting device, the filtering and circulating mechanism 58 circularly filters the tin solution through a loop formed by a filter and a circulating pump, the waste discharging mechanism 59 comprises a waste liquid discharging mechanism 591 and a waste gas discharging mechanism 592, the waste liquid discharge mechanism 591 is arranged at the bottom of the tank, and the waste gas discharge mechanism 592 is arranged above the side wall of the tank body.
The tin post-treatment component 60 is provided with a groove body 61, a conveying mechanism 62, an inflating mechanism 63, a liquid blocking mechanism 64, a spraying mechanism 65 and a waste liquid discharging mechanism 66, wherein the liquid blocking mechanism 64 comprises a liquid blocking roller 641 and a liquid blocking air knife 642, the liquid blocking roller 641 and the liquid blocking air knife 642 are arranged at an inlet and an outlet of the section and limit a treatment solution in the groove body 61, the spraying mechanism 65 comprises an upper spraying roller 651 and a lower spraying roller 652 and is arranged at a certain distance above/below a plurality of columns of battery pieces 00, the upper/lower spraying mechanisms separately and independently work through a flow meter, and the waste liquid discharging mechanism 66 is arranged at the bottom of the groove and is in butt joint with a plant-end wastewater treatment device.
The drying assembly 70 is provided with a groove body 71, a conveying mechanism 72, an air inlet mechanism 73 and an air exhaust mechanism 74, the air inlet mechanism 73 continuously conveys fresh drying air to the periphery of the rows of battery pieces 00 through an air blower, and the air exhaust mechanism 74 is in butt joint with plant waste gas equipment to exhaust waste gas out of the groove body 71.
The blanking assembly 80 is provided with a rack 81 and a conveying mechanism 82, a limiting roller on the conveying mechanism 82 transversely limits the battery piece 00 in a certain area, and supporting transmission rollers on the conveying mechanism 82 are uniformly distributed at the bottom of the battery piece 00.
During operation, the multiple columns of HIT crystalline silicon solar cells 00 completing the previous process are directly conveyed to the feeding assembly 10 through the automatic equipment, are sequentially subjected to pretreatment, copper plating, copper post-treatment, tin plating, tin post-treatment and drying, and are then butted with the rear-section automatic equipment through the feeding assembly 80.
The invention adopts the horizontal film coating to save the conversion process of the battery piece at the feeding and discharging end of the electroplating equipment between the horizontal direction and the vertical direction, thereby saving the cost for preparing the electroplating equipment; in addition, the electroplating mode has no problem that residual liquid cannot be removed due to the fact that the rack is used for vertical continuous electroplating due to the fact that the slide rack is not arranged, and therefore the performance of the battery piece is improved; meanwhile, compared with vertical continuous electroplating, in the whole horizontal electroplating process, as the risk of mechanism impact does not exist, the battery plate can stably and smoothly pass through the whole electroplating bath, on the other hand, the risk of fragment caused by taking and placing a hanger is reduced, the fragment rate is reduced, and the production yield is improved; the hanger is not used, so that the fragments caused by the deformation of the hanger and the contact displacement caused by mechanical impact when the hanger is lifted and transversely moved in the electroplating process are avoided, and the grid line electrode can more uniformly pass through the current, so that the electroplating quality is improved, and the production yield is also improved; and moreover, no hanging tool is provided, the maintenance workload of equipment is reduced, the labor cost and the production cost are reduced, and the automatic flow line operation of the circular continuous electroplating and the battery production is deeply influenced. The HIT crystalline silicon solar cell grid line electrode prepared by the horizontal electroplating equipment has the advantages of small contact resistance and body resistance, high preparation speed and high production efficiency, can be used for preparing a thicker conducting layer grid line electrode, and is small in internal stress and not easy to break.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. The horizontal electroplating equipment for preparing the HIT crystalline silicon solar cell is characterized in that: comprises a feeding component (10), a pretreatment component (20), a copper plating component (30), a copper post-treatment component (40), a tin plating component (50), a tin post-treatment component (60), a drying component (70) and a blanking component (80) which are connected in sequence, the side surface of the copper plating component (30) is provided with a copper plating solution preparation mechanism (91), the copper plating solution preparation mechanism (91) prepares the plating solution by dissolving through a stirring mechanism (911), and stored in a liquid distribution tank 913 by a pump 912, and supplies copper ions to the plating tank via a copper plating sub-tank 914, the side surface of the tin plating component (50) is provided with a tin plating solution preparation mechanism (92), the tin plating solution preparation mechanism (92) prepares the plating solution by dissolving through a stirring mechanism (921), and stored in a liquid distribution tank 923 by a pump 922, and tin ions are supplied to the plating tank through a copper plating sub-tank 924.
2. The horizontal electroplating equipment for preparing the HIT crystalline silicon solar cell piece is characterized in that: the feeding assembly (10) is provided with a rack (11) and a conveying mechanism (12), the limiting rollers (121) on the conveying mechanism (12) transversely limit the battery pieces (00) in a certain area, and the supporting and conveying rollers (122) on the conveying mechanism (12) are uniformly distributed at the bottoms of the battery pieces (00).
3. The horizontal electroplating equipment for preparing the HIT crystalline silicon solar cell piece is characterized in that: the pretreatment assembly (20) is provided with a groove body (21), a conveying mechanism (22), an inflating mechanism (23), a liquid blocking mechanism (24), a spraying mechanism (25) and a waste discharging mechanism (26), the conveying mechanism (22) is supported on the groove walls on two sides of the groove body (21), the inflating mechanism (23) is arranged at the bottom of the groove body (21), the liquid blocking mechanism (24) is arranged at an inlet/outlet of a pretreatment section through a liquid blocking roller (241) and a liquid blocking air knife (242), a treatment solution is limited in the groove body (21), the spraying mechanism (25) comprises an upper spraying mechanism (251) and a lower spraying mechanism (252) which are arranged between the upper surface and the lower surface of a plurality of rows of battery pieces (00), the upper spraying mechanism and the lower spraying mechanism work independently through a flow meter and a pressure meter, and the waste discharging mechanism (26) is arranged at the bottom of the groove and is in butt joint with a plant service end waste water treatment device.
4. The horizontal electroplating equipment for preparing the HIT crystalline silicon solar cell piece is characterized in that: the copper plating component (30) is provided with a tank body (31), a conveying mechanism (32), an inflating mechanism (33), a spraying mechanism (34), a liquid blocking mechanism (35), an electrode mechanism (36), an anode titanium net (37), a filtering circulation mechanism (38) and a waste discharge mechanism (39), wherein the spraying mechanism (34) comprises an upper spraying mechanism (341) and a lower spraying mechanism (342) which are arranged between the upper surface and the lower surface of a plurality of rows of battery pieces (00), the upper spraying mechanism and the lower spraying mechanism are separated and independently supply liquid through a flowmeter and a pressure gauge, the liquid blocking mechanism (35) is arranged at an inlet/outlet of a copper plating section and limits plating liquid in the tank body (31), the electrode mechanism (36) provides electric quantity through a rectifier, a cathode is communicated with grid electrodes of the plurality of rows of battery pieces (00) through a conductive device, an anode is respectively communicated with the upper/lower anode titanium net (37) through the conductive device, the filtering circulation mechanism (38) circularly filters the plating liquid in the tank body through a loop formed by a filter and a circulation pump, the waste discharge mechanism (39) comprises a waste liquid discharge mechanism (391) and a waste gas discharge mechanism (392), wherein the waste liquid discharge mechanism (391) is arranged at the bottom of the tank and is in butt joint with waste water treatment equipment at a plant service end, and the waste gas discharge mechanism (392) is arranged at the upper end of the side wall of the tank and is in butt joint with waste gas treatment equipment at a plant service.
5. The horizontal electroplating equipment for preparing the HIT crystalline silicon solar cell piece is characterized in that: copper aftertreatment subassembly (40) are equipped with cell body (41), transport mechanism (42), inflate mechanism (43), hinder liquid mechanism (44), spray mechanism (45), waste liquid discharge mechanism (46), hinder liquid mechanism (44) including hindering liquid gyro wheel (441) and hindering liquid air knife (442), place this section into/exit department, will handle solution restriction in cell body (41), spray mechanism (45) including spraying (451) and spraying (452) down, place in the certain distance below/on multiseriate battery piece (00), and go up/spray mechanism down and pass through flowmeter and separately independent work, waste liquid discharge mechanism (46) are placed in the tank bottom, dock with the plant service end waste water treatment equipment.
6. The horizontal electroplating equipment for preparing the HIT crystalline silicon solar cell piece is characterized in that: the tin plating component (50) is provided with a tank body (51), a conveying mechanism (52), a gas pumping mechanism (53), a spraying mechanism (54), a liquid blocking mechanism (55), an electrode mechanism (56), an anode zirconium net (57), a filtering circulation mechanism (58) and a waste discharge mechanism (59), wherein the spraying mechanism (54) comprises an upper spraying mechanism (541) and a lower spraying mechanism (542) which are arranged between the upper surface and the lower surface of a plurality of rows of battery pieces (00), the upper spraying mechanism and the lower spraying mechanism are separated from each other through a flowmeter and a pressure gauge to independently supply liquid, the liquid blocking mechanism (55) is arranged at a tin plating section inlet/outlet to limit the plating liquid in the tank body (51), the electrode mechanism (56) provides electric energy through a rectifier, a cathode is communicated with grid electrodes of the plurality of rows of battery pieces (00) through a conducting device, an anode is respectively communicated with the anode zirconium net (57) through the conducting device, the filtering circulation mechanism (58) circulates and filters the plating liquid in the tank body through a loop formed by the filtering machine and a circulation pump, the waste discharge mechanism (59) comprises a waste liquid discharge mechanism (591) and a waste gas discharge mechanism (592), wherein the waste liquid discharge mechanism (591) is arranged at the bottom of the tank, and the waste gas discharge mechanism (592) is arranged above the side wall of the tank body.
7. The horizontal electroplating equipment for preparing the HIT crystalline silicon solar cell piece is characterized in that: tin aftertreatment subassembly (60) are equipped with cell body (61), transport mechanism (62), inflate mechanism (63), hinder liquid mechanism (64), spray mechanism (65), waste liquid discharge mechanism (66), hinder liquid mechanism (64) including hindering liquid gyro wheel (641) and hindering liquid air knife (642), place this section entrance exit in, restrict processing solution in cell body (61), spray mechanism (65) including spray (651) and spray (652) down, place in multiseriate battery piece (00) certain distance from the top/bottom, and spray mechanism down/separately independent work through the flowmeter, waste liquid discharge mechanism (66) are placed in the cell bottom, dock with the house-hold waste water treatment equipment.
8. The horizontal electroplating equipment for preparing the HIT crystalline silicon solar cell piece is characterized in that: the drying assembly (70) is provided with a groove body (71), a conveying mechanism (72), an air inlet mechanism (73) and an air exhaust mechanism (74), the air inlet mechanism (73) continuously conveys dry fresh air to the periphery of a plurality of rows of battery pieces (00) through an air blower, and the air exhaust mechanism (74) is in butt joint with factory waste gas equipment to discharge waste gas out of the groove body (71).
9. The horizontal electroplating equipment for preparing the HIT crystalline silicon solar cell piece is characterized in that: the blanking assembly (80) is provided with a rack (81) and a conveying mechanism (82), a limiting roller on the conveying mechanism (82) transversely limits the battery piece (00) in a certain area, and supporting transmission rollers on the conveying mechanism (82) are uniformly distributed at the bottom of the battery piece (00).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011129945.5A CN114381790A (en) | 2020-10-21 | 2020-10-21 | Horizontal electroplating equipment for preparing HIT crystalline silicon solar cell |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011129945.5A CN114381790A (en) | 2020-10-21 | 2020-10-21 | Horizontal electroplating equipment for preparing HIT crystalline silicon solar cell |
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| CN114381790A true CN114381790A (en) | 2022-04-22 |
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| CN202011129945.5A Pending CN114381790A (en) | 2020-10-21 | 2020-10-21 | Horizontal electroplating equipment for preparing HIT crystalline silicon solar cell |
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| CN116254586A (en) * | 2023-05-15 | 2023-06-13 | 苏州晶洲装备科技有限公司 | Electroplating device |
| CN117116825A (en) * | 2023-10-19 | 2023-11-24 | 昆山科比精工设备有限公司 | Feeding and conveying device of silicon wafer jig |
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| CN117116825B (en) * | 2023-10-19 | 2024-02-13 | 昆山科比精工设备有限公司 | Feeding and conveying device of silicon wafer jig |
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