WO2018000779A1

WO2018000779A1 - Electroplating clamp conductive-type reel-to-reel vertical continuous electroplating device

Info

Publication number: WO2018000779A1
Application number: PCT/CN2016/112518
Authority: WO
Inventors: 邓高荣
Original assignee: 广州明毅电子机械有限公司
Priority date: 2016-07-01
Filing date: 2016-12-28
Publication date: 2018-01-04
Also published as: CN106087028B; KR101891023B1; KR20180003977A; CN106087028A; JP2018003150A; TWI627313B; TW201802302A; JP6517252B2

Abstract

An electroplating clamp conductive-type reel-to-reel vertical continuous electroplating device, composed of an unreeling machine (1), a pre-treatment section (2), an electroplating section (3), a post-treatment section (4), and a reeling machine (5); the electroplating section is provided with an electroplating cylinder (31), a plurality of negative electrode clamps (32), a clamp drive control device (33), a positive electrode plate (34), and a power source system (35); the clamp drive control device (33) can drive the negative electrode clamps (32) to open before entering an entry end position (rd), to close while moving from the entry end position (rd) to an exit end position (cd), and to open again after exiting the exit end position (cd); the power source system (35) is provided with a direct current power source (351), a negative electrode conductive mechanism and a positive electrode wire; the negative electrode clamps (32) are electrically connected to a negative electrode of the direct current power source (351) by means of the negative electrode conductive mechanism while moving from the entry end position (rd) to the exit end position (cd). The electroplating device has the advantages of highly uniform electroplating, a wide application range of an electroplated flexible circuit board, the electroplated board being free of electroplating stratification, occupying a small space, being capable of electroplating an electroplated flexible circuit board of a smaller thickness, a high working safety level, and a highly reliable structure.

Description

Electroplated clip conductive roll-to-roll vertical continuous plating equipment

Technical field

The invention relates to a plated clip conductive roll-to-roll vertical continuous plating apparatus.

Background technique

With the changes of the times, the advancement of science and technology, everything is about efficiency and precision, as well as electroplating technology. The thickness of PCBs in the industry is getting thinner and thinner, from hard boards to thin boards to soft boards or FPCs. The electroplating industry puts forward higher requirements, with smaller footprint, higher production capacity, thinner substrate, good electrical conductivity during electroplating, high electroplating uniformity, and electroplating equipment with more electroplating varieties. The PCB electroplating process can be mainly divided into three parts: a pre-processing section for pre-process processing of the substrate, a copper-plated section for electroplating the substrate, and a post-processing section for post-processing of the substrate. Several key processes in the pre-treatment section, such as degreasing, micro-etching and pickling, are mainly to decontaminate the PCB surface before copper plating; while the post-processing section is to clean the residual liquid from the copper-plated section of the PCB. In the past, the electroplating tanks of the vertical plating equipment in the industry were all made by roller type, plate thickness of plating, poor electrical conductivity, and few electroplating varieties, as illustrated below.

1 to 4 show a prior art roller-type vertical plating apparatus. The electroplating process requires that a positive electrode and a negative electrode are turned on to generate metal ions to precipitate on the surface of the object to be plated. Therefore, the negative power supply of the line is in contact with the board by the conductive type of the roller. (The so-called roller conductive type: refers to the electroplated negative electrode conductive wire connected to the roller, as shown in Figure 1, the first copper plated conductive roller A8 and the second copper plated conductive roller A9, the current is energized by the roller contact plate surface) . The copper plating tank is segmented (so-called segmented type: it means that the copper in the copper channel A3 and the copper-plated copper channel A4 in Figure 1 are not connected to each other, and the middle is separated, as shown in Figure 1. The copper plating in the copper channel A3 is plated through the isolation section and then into the copper-plated two-segment copper channel A4 plating in Fig. 1). This will cause delamination of the plate after plating (can be seen through professional slicing, this phenomenon is not allowed in this process). This line is a plating equipment for feeding, plating and automatic receiving in rolls. The direction indicated by the arrow is the moving direction of the PCB. In the figure, the copper plate is taken as the center line. In the figure, the automatic unwinding machine A1 is the loading. In the figure, the pre-processing section A2 is the starting point of the whole process, and multiple slots are used. composition. After the pre-treatment, the PCB enters a copper-plated copper channel A3, and then enters the isolation segment A10. The PCB enters the copper-plated two-segment copper channel A4. After the plating, it enters the post-processing section A5. The post-processing consists of a plurality of small grooves. The residual chemical liquid and the surface of the board which are carried out by the copper plating section on the cleaning board surface are dried, and finally collected into a roll by the automatic closing machine A6.

As shown in Fig. 2 and Fig. 3, the direction indicated by the arrow is the moving direction of the PCB. In the figure, the copper plate is taken as the center line. The automatic unwinding machine A1 in the figure is used for feeding (PCB), and enters pre-processing and pre-processing. Segment A2 is the starting point of the entire process. After entering the pre-treatment tank, the pre-processing section guide wheel A11 (PCB) can normally move in the position specified in the middle of the tank. It consists of a number of small slots. After the pre-treatment, the PCB enters the plating section. The copper-plated copper channel A3 in the figure is fixed by the copper-plated first-stage conductive roller A12 and has a conductive function. After the plating process, enter the isolation section A10 in the figure. Then enter the copper-plated two-section copper trough A4, which is fixed by the copper-plated second-stage conductive roller A13 and conductive function, and electroplated. After the plating, the process enters the post-processing section A5, and after entering the post-treatment tank, the post-processing section guide roller A14 (PCB) can normally move in the position specified in the middle of the trough. The post-treatment consists of a plurality of small grooves for the purpose of cleaning the residual chemical liquid brought out by the plating section on the surface of the plate and drying the surface of the plate, and finally collecting the rolls by the automatic closing machine A6.

As shown in FIG. 3, the pre-processing section guide wheel A11 in the figure is mainly used to guide and fix the running direction and position of the PCB. The post-processing section guide roller A14 has the same function as the pre-processing section guide wheel A11. The first stage of the copper plated conductive roller A12 and the second stage of the copper plated conductive roller A13 are mainly used for electroplating the negative electrode and guiding and fixing the running direction and position of the PCB. The isolation section A10 is an isolation section between the slot and the slot, and the isolation section slot is not filled with the liquid.

As shown in FIG. 4, the conductive roller A12 is used for electroplating the negative electrode to conduct electricity to the PCB and to guide and fix the running direction and position of the PCB. The conductive wire A7 is used for a conductor in which the negative electrode of the battery communicates with the conductive roller A12, and can be energized normally. The copper tank A16 is a container for the charging liquid.

The above existing roller conductive vertical plating equipment has the following disadvantages:

First, the above roller-conducting vertical plating apparatus cannot produce a selective plating plate (ie, pattern plating), and only a full plating plate can be produced. (The so-called selective plating plate has a line distributed on the surface of the board), (the so-called full plating board is the board surface, all lines need to be electroplated.) Because the roller is conductive, used as conductive and can be used as PCB transition and guidance, in electroplating When the entire surface of the PCB is in contact with the roller, the roller is energized as a whole. The selected plate is distributed on the surface of the plate, and the portion to be plated is bare, and the portion that is not required to be plated is coated on the surface with a dry film. This makes the conduction effect worse. Affects plating uniformity and poor uniformity, reaching only <80 to 90%.

Second, the copper plating tank is segmented (so-called segmented: it means that the copper-plated copper channel A3 and the copper-plated two-segment copper channel A4 copper tank are not connected to each other, and the middle is separated by the isolation section A10). This will cause delamination of the plate after plating (can be seen through professional slicing, this phenomenon is not allowed in this process).

Thirdly, the above-mentioned roller-conducting vertical electroplating apparatus has no moving conveying mechanism in the middle, and only the unwinding and winding ends have a conveying rotating mechanism, and the PCB span is too long to be straightened so that the pulling force is increased and easily broken. Only PCBs with a thickness of 36um or more can be plated.

Summary of the invention

The technical problem to be solved by the present invention is to provide a plated clip conductive roll-to-roll vertical continuous plating apparatus.

To solve the above technical problems, the technical solutions adopted by the present invention are as follows:

The utility model relates to a plate-clamping conductive roll-to-roll vertical continuous plating device, which comprises a unwinder, a pre-processing section, a plating section, a post-processing section and a winder, wherein the pre-processing section, the plating section and the post-processing section are all installed The unwinder and the winder are arranged in order according to the direction from the unwinder to the winder, and the rolled electroplated flexible circuit board is discharged by the unwinder and is again collected by the winder. a roll, and the electroplated flexible circuit board moved by the unwinder to the winder is tensioned by the unwinder and the winder in a plane, the pre-processing section, the plating section and the post-processing During the moving process, the electroplated flexible circuit board is subjected to pre-plating treatment, electroplating treatment and post-plating treatment; wherein the electroplating section is provided with a plating cylinder, a plurality of negative electrode fixtures, and a clamp drive control. a device, a positive plate, and a power supply system; the plated flexible circuit board passes through an inner cavity of the plating cylinder, and an upper end of the inner end of the plating cylinder near the end of the unwinder is recorded as an input end Position, close to the end of the winder The square position is recorded as an end position; the clamp drive control device is capable of driving each of the negative electrode clamps to circulate between the inlet end position and the outlet end position and the respective negative electrode holders are evenly distributed during the cyclic motion Interval distribution, and during movement of the negative electrode holder from the inlet end position to the outlet end position, the clamp drive control device can drive the negative electrode clamp to open before entering the inlet end position, Opening the positional position to the outlet position, closing after exiting the outlet position, causing the negative electrode clamp to be separated from the electroplated flexible circuit board before entering the inlet end position, by the inlet The end position is moved to the upper end of the electroplated flexible circuit board during the movement to the end position, and is separated from the electroplated flexible circuit board, and each of the negative electrode holders is separated The clamping position of the plated flexible circuit board is located in a plane of the electroplated flexible circuit board, and the moving speed of each of the negative electrode clamps is opposite to the power receiving The flexible circuit board has the same moving speed; the power system is provided with a DC power source, a negative conducting mechanism and a positive lead, and the negative clamp passes through the negative conducting mechanism and the DC during movement from the in-end position to the out-end position The negative electrode of the power source is electrically connected; the positive plate of each block is installed in the inner cavity of the plating cylinder, and the positive electrode plate is electrically connected to the positive electrode of the direct current power source through the positive electrode wire.

As a structural improvement of the action of the negative electrode clamp of the present invention, the negative electrode clamp is provided with a mounting bracket, a left clamping body, a right clamping body, two clamp springs and two guiding rollers; the middle and right clamping bodies of the left clamping body The middle portion is rotatably coupled to the lower end of the mounting bracket, wherein one of the clamp springs is mounted between the inner side wall of the upper end portion of the left collet and the mounting bracket, and the other of the clamp springs is mounted to the right Between the inner side wall of the upper end of the clip body and the mounting bracket, and under the spring force of the two clamp springs, the lower end portion of the left collet body and the lower end portion of the right collet body are clamped together The negative electrode clamp is closed; one of the guide rollers is mounted at an upper end portion of the left clamp body and located at an outer position, and the other of the guide rollers is mounted at an upper end portion of the right clamp body and located at an outer position;

The clamp driving control device is installed at an upper position of the plating cylinder, and is provided with a clamp driving mechanism, an inlet guiding rail group and an outlet guiding rail group; the clamp driving mechanism can drive each of the negative electrodes The fixture is in a straight line from below, on the a counterclockwise cyclic motion on a closed trajectory composed of a square linear trajectory, an entrance semicircular trajectory, and an outgoing semicircular trajectory, wherein the lower linear trajectory and the upper linear trajectory are both parallel to the moving direction of the electroplated flexible circuit board, and the lower side a linear path passes through the entry end position and the exit end position;

The inlet guide rail group and the outlet guide rail group are both fixed at a lower position of the clamp driving mechanism, and the inlet guide rail group is disposed adjacent to the inlet semicircular track, and the outlet end The guiding slide group is disposed adjacent to the semi-circular trajectory of the outlet end, and the inlet guiding rail group and the leading guiding rail group each comprise two inner side opposite sides and the inner side surface is gradually convex from the two end portions to the middle portion. a slide rail, the rear end portions of the two guide rails of the inlet guide rail group are bent upward, the middle portion and the rear end portion extend along the lower straight track, and the outlet guides the two guide slides of the slide rail group The front end portion and the front end portion of the rail extend along the lower linear trajectory, and the front end portion is upwardly bent. The front end position of the two guiding slide rails of the entrance end guiding slide group is the inlet end position, and the end guiding position The last end position of the two guiding rails of the slide rail group is the outlet end position;

So that when each of the negative electrode holders moves to the boundary position between the entrance semicircular trajectory and the lower linear trajectory, the two guide rollers of the negative clamp are slid into the two guiding slides of the inlet guiding slide group Between the inner side surfaces, the two guiding slide rails of the inlet guiding slide group generate the spring force against the two clamp springs by the two guiding rollers on the upper ends of the left and right clamping bodies Squeezing the force, so that the lower end portions of the left and right clamping bodies gradually open at the rear end portions of the two guiding rails of the inlet guiding rail group, and the sliding rail group is guided at the inlet end The middle of the two guiding rails is opened to the maximum extent, and the front ends of the two guiding rails of the guiding rail group at the inlet end are gradually closed;

And causing: when each of the negative electrode clamps moves to a boundary position between the lower linear trajectory and the outer semicircular trajectory, the two guiding rollers of the negative electrode clamp roll and slide into the two guiding slides of the outgoing guiding slide group Between the inner sides of the rails, the two guiding rails of the outlet guiding rail group are formed by the two guiding rollers against the upper ends of the left and right clamping bodies to overcome the spring force of the two clamp springs. The pressing force is such that the lower end portions of the left and right clamping bodies are gradually opened at the rear end portions of the two guiding rails of the starting end guiding rail group, and the sliding rail group is guided at the outlet end The two guiding rails are opened to the maximum extent, and the leading ends of the two guiding rails at the leading end guiding rail group are gradually closed.

As a preferred embodiment of the present invention, the clamp driving mechanism is composed of a main transmission motor, a transmission mechanism and two sets of identical sprocket chain mechanisms; the two sets of sprocket chain mechanisms are all driven sprocket and driven sprocket And a chain covering the two, the two chains are respectively located in two planes parallel to the plane of the electroplated flexible circuit board, and the plane of the electroplated flexible circuit board is located at the two Between the planes of the strips; the main drive motor can drive the two driving sprockets to rotate synchronously by the transmission mechanism and drive the two chains to synchronously move;

The upper end portion of the mounting bracket of the negative electrode clamp is a T-shaped portion, and the longitudinal rod portion of the T-shaped portion is connected to the lower end portion of the mounting bracket, and the two ends of the transverse rod portion of the T-shaped portion are respectively fixed at the The two chains are perpendicular to the direction in which the two chains extend.

As a mechanism for improving the energization of the negative electrode clamp of the present invention, the negative conductive mechanism of the power supply system is provided with a negative electrode lead and a conductive slide rail, and each of the negative negative clamps is provided with a conductive slider and a slider connecting mechanism thereof; The conductive rail is fixed at a position between the clamp driving mechanism and the plating cylinder, and the conductive rail has a groove track disposed along a moving direction of the plated flexible circuit board, and the conductive rail passes through the The negative electrode wires are electrically connected to the negative electrode of the DC power source; each of the conductive sliders is mounted on a transverse rod portion of the corresponding negative electrode holder through its slider connecting mechanism, and each of the negative electrode holders is moved to the In the in-position position, the corresponding conductive slider of the negative clamp is slid into the groove track of the conductive slide rail and pressed on the conductive slide by its slider connection mechanism, so that the negative clamp passes through its corresponding a slider connecting mechanism, a conductive slider, the conductive slide rail and the negative lead wire are electrically connected to a negative pole of the DC power source; and each of the negative electrode clamps moves to When the said end position, the negative electrode conductive slide clamp from slipping out of the corresponding groove track in the conductive rail.

As a structural improvement of the present invention for ensuring reliable energization of the negative electrode clamp: the slider connecting mechanism is provided with a slider spring, a fixing bolt, a connecting screw and a connecting wire; the transverse rod portion of the negative electrode clamp is provided with a through hole, and the fixing a rod portion of the bolt passes through the through hole corresponding to the negative electrode holder from top to bottom and is fixedly connected to the top of the conductive slider, and the bolt head of the fixing bolt can be seated on the top surface of the transverse rod portion of the corresponding negative electrode holder The slider spring is sleeved on the rod portion of the fixing bolt and abuts between the bottom surface of the transverse rod portion of the corresponding negative electrode holder and the top of the conductive slider, and one end of the connecting wire passes through the The connecting screw is fixed and electrically connected to the bolt head of the fixing bolt, and the other end is fixed on the corresponding negative jig and electrically connected.

In order to further maintain the stability of the electroplated flexible circuit board when the plating solution is shaken, as an improvement of the present invention, the electroplating section is further provided with an auxiliary guiding mechanism; the auxiliary guiding mechanism is composed of a left bracket and a right bracket. The left guide wheel and the right guide wheel are respectively fixed on the bottom surface of the inner cavity of the plating cylinder, and the left guide wheel and the right guide wheel are both semi-circular barrels, and the left guide wheel Fixed on the left bracket, the right guide wheel is fixed on the right bracket, and the semi-circular arc surfaces of the left guide wheel and the right guide wheel are oppositely disposed with a gap; the electroplated flexible circuit The plate passes through a gap between the left guide wheel and the right guide wheel.

In order to further improve the plating uniformity of the electroplated flexible circuit board, as an improvement of the present invention, the electroplating section is provided with a plurality of the positive electrode plates; and each of the positive electrode plates is installed in the electroplating cylinder In the cavity and divided into two rows, the two rows of positive plates are respectively Located on both sides of the electroplated flexible circuit board, each positive electrode plate in each row is evenly distributed along the moving direction of the electroplated flexible circuit board.

As a preferred embodiment of the present invention, the pre-plating treatment includes a panel cleaning process; and the pre-treatment section is provided with a cleaning liquid nozzle for spraying the cleaning liquid onto the surface of the plated flexible circuit board. a roller box for blocking the cleaning liquid and positioning the movement path of the plated flexible circuit board, and a pre-processing correction system for adjusting the plated flexible circuit board when the weight is dropped, An air extracting device for extracting the exhaust gas generated when the cleaning chemical liquid is cleaned from the surface of the plated flexible circuit board.

As a preferred embodiment of the present invention, the post-plating treatment includes a plate surface residual chemical liquid cleaning process and a blow drying process; the post-treatment section is provided for spraying a cleaning liquid to the plated flexible circuit. a cleaning chemical liquid nozzle of the board surface, a roller box for blocking the cleaning chemical liquid and positioning a moving path of the electroplated flexible circuit board, and for dropping the weight of the electroplated flexible circuit board a post-processing correction system for adjusting the time, an air extracting device for extracting the exhaust gas generated when the cleaning chemical liquid is cleaned by the surface of the plated flexible circuit board, and a plated flexible circuit board for cleaning the cleaning chemical liquid The water mist generated thereon is blown dry air knife blown by a normal temperature wind and a drying air knife for hot air drying of the blown dried electroplated flexible circuit board.

As a preferred embodiment of the present invention, an electroplating liquid nozzle for spraying the plating solution onto a portion of the electroplated flexible circuit board located in the inner cavity of the plating cylinder is further disposed in the inner cavity of the plating cylinder; The electroplated clip-conducting roll-to-roll vertical continuous plating apparatus is further provided with a cleaning liquid supply device for supplying a cleaning chemical liquid to the cleaning chemical liquid nozzle, and for supplying a cleaning medicine to the cleaning chemical liquid nozzle a liquid cleaning solution supply device and an electroplating solution supply device for supplying an electroplating solution to the electroplating solution nozzle; the cleaning solution supply device, the cleaning solution supply device, and the plating solution supply device are both An auxiliary tank, a pump and a filter barrel, wherein the pump is capable of extracting the chemical liquid contained in the auxiliary tank, and filtering the extracted liquid medicine through the filter barrel for impurity filtering; the cleaning medicine The auxiliary tank of the liquid supply device is for holding the cleaning chemical liquid, and the cleaning chemical liquid filtered by the filter barrel of the cleaning chemical liquid supply device is supplied to the cleaning chemical liquid nozzle; the cleaning chemical liquid supply device use Holding the cleaning liquid, and supplying the cleaning liquid filtered through the filter barrel of the cleaning liquid supply device to the cleaning liquid medicine nozzle; the plating liquid supply device is for holding the plating drug The liquid, the plating solution filtered through the filter barrel of the plating solution supply device is supplied to the plating solution nozzle.

Compared with the prior art, the present invention has the following beneficial effects:

First, referring to FIG. 5 to FIG. 23, the present invention is used for electroplating by a plurality of negative electrode holders 32 on the basis of using the unwinder 1 and the winder 5 to pull the plated flexible circuit board FPC in a plane for transmission. The inner cavity of the cylinder 31 will be plated with a flexible circuit board FPC The plated flexible circuit board FPC is pulled in the aforementioned plane and synchronized with the unwinder 1 and the winder 5, and the movement of the negative electrode holder 32 can be driven by the clamp drive control device 33 and automatically clamped at the corresponding position. And releasing the plated flexible circuit board FPC, through the power supply system 35, the negative electrode holder 32 can automatically turn on the negative electrode of the DC power source 351 only when the plated flexible circuit board FPC is clamped;

The above working mode of the electroplating apparatus of the present invention can bring about the following effects:

Since the negative electrode holder 32, which is the negative electrode of the DC power source, is held by the plated flexible circuit board FPC and moves synchronously with it, the positive electrode plate 34, which is the positive electrode of the DC power source, is fixed in the plating tank 31, thereby ensuring the plated flexible circuit board. The conductive contact of the FPC is good and the stability of the conduction current is improved, thereby improving the plating uniformity of the plated flexible circuit board FPC; and, since the negative electrode holder 32 is only clamped at the upper edge of the plated flexible circuit board FPC, the present invention can Suitable for the production of fully plated FPC and selective plating FPC and hole-filling plates, with a wide range of applications;

2. Since the plurality of negative electrode clamps 32 clamped on the electroplated flexible circuit board FPC are evenly spaced along the moving direction V of the electroplated flexible circuit board FPC, the portion of the electroplated flexible circuit board FPC being electroplated can be electrically connected to the power supply. Contact, to avoid the existing roller conductive vertical plating equipment in order to reduce the power supply design requirements (the positive and negative distances are too large, the power supply design requirements are very high) and the problem of the power supply is arranged in sections. Therefore, the present invention can complete the plating at one time. The plated plate does not cause plating delamination; and, in this way, the space occupied by the present invention can be reduced;

3. Since the negative electrode holder 32 can pull the plated flexible circuit board FPC in synchronization with the unwinder 1 and the winder 5 in the same plane, the plated flexible circuit board FPC can remain pulled even when the plating solution is shaken. Straightening without plating with the plating solution, thereby further improving the plating uniformity of the plated flexible circuit board FPC; and, the pulling manner of the plated flexible circuit board FPC is free of conduction compared to the existing roller conductive vertical plating device The wheel has the advantage that the plated flexible circuit board FPC is less resistant; in addition, the negative electrode holder 32 is pulled in the middle of the plated flexible circuit board FPC, so that the unwinder 1 and the winder 5 can be reduced in the conveying process. The pulling force of the plated flexible circuit board FPC is required, so that the thinned plated flexible circuit board FPC is easily broken during production without being strongly tensioned, so that the present invention can process the thinned plated flexible circuit board. FPC (experimental, the invention can handle FPC with a minimum thickness of 12um, while the existing roller conductive vertical plating equipment can only handle FP with a thickness of 36um or more. C), and wrinkles and cracks do not occur when producing thin and soft boards;

4. Since the clamp driving control device 33 can control the negative clamp 32 to automatically clamp and release the plated flexible circuit board FPC at the corresponding position, the power supply system 35 can control the negative clamp 32 to be automatically turned on only when the plating flexible circuit board FPC is clamped. The negative electrode of the DC power source 351 can improve the operational safety of the present invention;

5. Since the unwinder 1 can automatically discharge the roll of the plated flexible circuit board FPC and the discharged electroplated flexible circuit board FPC is again retracted by the winder 5, the plated flexible circuit board FPC can be continuously wound. In operation, only one person can realize the loading and unloading of the plated flexible circuit board FPC, which greatly saves costs;

In summary, the invention has high plating uniformity (up to 97%), wide application range of the electroplated flexible circuit board, electroplating plate does not cause electroplating delamination, small occupied space, and can be smaller in thickness. Electroplated flexible circuit board for electroplating, high safety of work.

Secondly, referring to FIG. 8 to FIG. 15, in order to realize "the movement of the negative electrode holder 32 from the entry end position rd to the end position cd, the clamp drive control device 33 can drive the negative clamp 32 before entering the entry end position rd. The specific structure of the negative electrode jig 32 and the jig drive control device 33 according to claim 2 is designed to be opened when the opening position rd is moved to the end position cd and is closed after leaving the end position cd. The advantage of high sex.

Thirdly, referring to FIG. 16 to FIG. 19-2, the present invention is designed to realize "the negative electrode clamp 32 is electrically connected to the negative electrode of the direct current power source 351 through the negative electrode conducting mechanism during the movement from the in-end position rd to the out-end position cd". The specific structure of the power supply system 35 according to

claims

4 and 5 has the advantage of high reliability.

Fourth, referring to FIG. 14 and FIG. 15, the present invention can further improve the stability of the electroplated flexible circuit board when the plating solution is shaken by adding the auxiliary guiding mechanism 36 to the plating section 3, thereby improving the uniformity of plating.

Fifth, referring to Figs. 16 to 18, the present invention can further improve the plating uniformity of the electroplated flexible circuit board by providing a plurality of positive electrode plates 34 and arranging their arrangement in the inner cavity of the plating cylinder 31.

DRAWINGS

The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

1 is a schematic top plan view of a conventional roller conductive vertical plating apparatus;

2 is a schematic perspective view of a conventional roller conductive vertical plating apparatus;

3 is a schematic perspective view showing a conventional roller conductive vertical plating apparatus with a cross-sectional effect;

4 is a structural exploded view of a copper plated section of a conventional roller conductive vertical plating apparatus;

Figure 5 is a front view showing the structure of the electroplating apparatus of the present invention;

Figure 6 is a top plan view showing the electroplating apparatus of the present invention;

7-1 is a schematic diagram showing the main operation of the unwinding machine 1, the electroplated flexible circuit board FPC, the winder 5, and the negative electrode clamp 32 in the present invention;

7-2 is a schematic plan view showing the unwinding machine 1, the electroplated flexible circuit board FPC, and the winder 5 of the present invention;

Figure 8 is a front view showing the structure of the plating section 3 of the present invention;

Figure 9 is an enlarged schematic view of a portion A of Figure 8;

FIG. 10 is a schematic top plan view of the clamp driving control device 33 of the present invention; FIG.

Figure 11 is a perspective view showing the structure of the portion B of Figure 10 when the negative electrode holder 32 is mounted;

Figure 12 is a perspective view showing the three-dimensional structure of the portion C of Figure 10 when the negative electrode holder 32 is mounted;

Figure 13 is a second perspective view of the portion C of Figure 10 when the negative electrode holder 32 is mounted;

14 is a schematic perspective view showing the plating cylinder 31, the negative electrode holder 32, and the auxiliary guiding mechanism 36 of the present invention;

Figure 15 is a schematic cross-sectional view showing the plating cylinder 31, the negative electrode holder 32, and the auxiliary guiding mechanism 36 of the present invention;

16 is a schematic perspective view showing the plating cylinder 31, the negative electrode holder 32, the positive electrode plate 34, and the power supply system 35 of the present invention;

Figure 17 is an enlarged schematic view of a portion D of Figure 16;

18 is a schematic cross-sectional structural view of a plating cylinder 31, a negative electrode holder 32, a positive electrode plate 34, and a power supply system 35 in the present invention;

19-1 is a perspective structural view of a slider connecting mechanism of the power supply system 35 of the present invention;

19-2 is a schematic plan view showing the slider connecting mechanism of the power supply system 35 of the present invention;

Figure 20 is a schematic structural view of the pretreatment section 2 in the present invention;

Figure 21 is a schematic view showing the operation of the correcting system in the present invention;

Figure 22 is a schematic structural view of the post-processing section 4 of the present invention;

Figure 23 is a schematic view showing the structure of a medical liquid supply device of the present invention.

detailed description

As shown in FIGS. 5 to 23, the electroplated clip-conducting roll-to-roll vertical continuous plating apparatus of the present invention is composed of a unwinder 1, a pre-processing section 2, a plating section 3, a post-processing section 4, and a winder 5. Wherein, the pre-treatment section 2, the electroplating section 3 and the post-treatment section 4 are both installed between the unwinder 1 and the winder 5 and are arranged in order according to the direction of the unwinder 1 to the winder 5, and the roll is received. The plated flexible circuit board FPC is discharged by the unwinder 1 and is again taken up by the winder 5, and the plated flexible circuit board FPC moved by the unwinder 1 to the winder 5 is unwinder 1 and winded up. The machine 5 is tensioned in a plane, and the pre-treatment section 2, the plating section 3 and the post-processing section 4 sequentially perform pre-plating treatment, electroplating treatment and electroplating treatment on the electroplated flexible circuit board FPC during the movement, and post-plating treatment After the plated flexible circuit board FPC is collected into a roll by the winder 5, it can flow to the next process.

The plating section 3 is provided with a plating cylinder 31, a plurality of negative electrode clamps 32, a clamp driving control device 33, a positive electrode plate 34 and a power supply system 35; the electroplated flexible circuit board FPC passes through the inner cavity of the plating cylinder 31, and the inner cavity of the plating cylinder 31 The position immediately above the end of the unwinder 1 at both ends is referred to as the entry position rd, and the position immediately above the end of the winder 5 is recorded as the end position cd; the jig drive control device 33 Each of the negative electrode holders 32 can be driven to circulate between the entry end position rd and the end position cd and the respective negative electrode holders 32 are evenly spaced apart during the cyclic motion, and at the position of the negative electrode holder 32 from the entry end position rd to the end position During the movement of the cd, the clamp driving control device 33 can drive the negative clamp 32 to open before entering the entry end position rd, to be closed during the movement from the inlet position rd to the outlet position cd, and to open after exiting the outlet position cd, so that The negative electrode holder 32 is separated from the plated flexible circuit board FPC before entering the entry end position rd, and is clamped at the upper edge of the plated flexible circuit board FPC and away from the exit end position during the movement from the entry end position rd to the end position cd. After cd, it is separated from the plated flexible circuit board FPC, and the clamping position of each negative electrode holder 32 to the plated flexible circuit board FPC is located in the plane of the plated flexible circuit board FPC, and the moving speed of each negative electrode holder 32 is The moving speed is the same as that of the electroplated flexible circuit board FPC; the power system 35 is provided with a DC power supply 351, a negative conductive mechanism and a positive lead, and the negative clamp 32 is at the input end. The rd is electrically connected to the negative electrode of the DC power source 351 through the negative electrode conducting mechanism during the rd motion to the outlet position cd; each positive plate 34 is mounted in the inner cavity of the plating cylinder 31, and the positive electrode plate 34 is electrically connected to the positive electrode of the DC power source 351 through the positive electrode lead. Therefore, the metal ions generated by the plating solution contained in the inner cavity of the plating cylinder 31 after the respective negative electrode holders 32 and the positive electrode plates 34 are energized are deposited on the surface of the plated flexible circuit board FPC to form a layer of metal. The outer casing completes the plating of the plated flexible circuit board FPC.

Wherein, the present invention realizes that during the movement of the negative electrode holder 32 from the inlet end position rd to the outlet end position cd, the clamp drive control device 33 can drive the negative electrode clamp 32 to open before entering the inlet end position rd, and is moved by the inlet end position rd. The specific structure is as follows: when the outlet position is closed, and after the exit position cd is opened, the specific structure is as follows:

Referring to Fig. 15, the negative electrode holder 32 is provided with a mounting bracket 321, a left body 322, a right body 323, two clamp springs 324, and two guide rollers 325; the middle portion of the left body 322 and the middle portion of the right body 323 are respectively Rotatingly coupled to the lower end of the mounting bracket 321 , one clamp spring 324 is mounted between the inner side wall of the upper end portion of the left collet 322 and the mounting bracket 321 , and the other clamp spring 324 is mounted on the inner side wall of the upper end of the right collet 323 and mounted Between the brackets 321 and, under the spring force of the two clamp springs 324, the lower end portions of the left clamp body 322 and the lower end portions of the right clamp body 323 are clamped together, that is, the negative electrode clamp 32 is closed; one of the guide rollers 325 is mounted. At the upper end portion of the left collet 322 and at the outer position, the other guide roller 325 is mounted at the upper end portion of the right collet 323 and at the outer position.

Referring to Fig. 8, the above-described jig drive control device 33 is mounted at an upper position of the plating cylinder 31, and is provided with a jig drive mechanism, an in-end guide slide group 335 and an end guide slide group 336; the jig drive mechanism can drive each negative electrode The clamp 32 rotates counterclockwise on a closed trajectory composed of a lower linear trajectory, an upper linear trajectory, an entrance semicircular trajectory and an outgoing semicircular trajectory, and the lower linear trajectory and the upper linear trajectory are parallel to the movement of the plated flexible circuit board FPC. The direction V, and the lower straight track passes through the entry end position rd and the exit end position cd.

Referring to Figures 9 to 13, the above-mentioned inlet guide rail group 335 and the outlet guide rail group 336 are both fixed under the clamp driving mechanism. The square position, and the in-end guiding slide group 335 is disposed close to the entrance semi-circular track, the out-end guiding track group 336 is disposed close to the outgoing semi-circular track, and the in-end guiding track group 335 and the out-end guiding track group 336 are both The guide rail includes two guide rails which are opposite to each other and the inner side surface is gradually convex toward the middle portion from the both end portions, and the rear end portions of the two guide rails of the entrance end guide rail group 335 are bent upward, and the middle and rear ends are below. The straight track extends, and the front end portion and the front end portion of the two guiding rails of the leading end guiding rail group 336 extend along a downward linear trajectory, the front end portion is bent upward, and the leading end of the two guiding guide rails of the sliding end group 335 is guided. That is, the end position rd, the last end position of the two guiding slide rails of the outbound guiding slide group 336 is the outbound position cd;

Therefore, when each negative clamp 32 moves to the boundary position between the entrance semicircular trajectory and the lower linear trajectory, the two guide rollers 325 of the negative clamp 32 roll and slide into the inner side of the two guide rails of the entrance guide rail group 335. Between the two guide rails of the inlet guide rail group 335, the upper end portions of the left and

right clamp bodies

322, 323 are biased against the spring force of the two clamp springs 324 by the two guide rollers 325, The lower end portions of the left and

right collet bodies

322 and 323 are gradually opened at the rear end portions of the two guide rails of the in-end guide rail group 335, and the two guide rails of the guide rail group 335 are guided at the entrance end. Open to the maximum extent, the front ends of the two guiding rails of the in-way guiding rail group 335 are gradually closed; thus, each of the negative electrode clamps 32 is gradually opened and then gradually closed when moving to the in-end guiding rail group 335. When the negative electrode holder 32 is moved to the upper side of the plated flexible circuit board FPC, it is gradually opened and moved to gradually close when moving in the same direction as the movement direction V of the plated flexible circuit board FPC until after the entrance end guide rail group 335 is separated. That is, when arriving at the entry position rd Held by the plating at the upper edge of the flexible circuit board FPC.

And: when each negative clamp 32 moves to the boundary position between the lower linear trajectory and the outer semicircular trajectory, the two guiding rollers 325 of the negative clamp 32 roll and slide into the inner side of the two guiding rails of the leading end guiding rail group 336. Between the two guide rails of the outlet guide rail group 336, the upper end portions of the left and

right clamp bodies

322 and 323 are biased against the spring force of the two clamp springs 324 by the two guide rollers 325. The lower ends of the left and right clamping

bodies

322 and 323 are gradually opened at the rear end portions of the two guiding rails of the starting end guiding rail group 336, and the two guiding rails of the sliding rail group 336 are guided at the out end. To the maximum extent, the front ends of the two guiding rails of the starting guide rail group 336 are gradually closed; thus, each of the negative clamps 32 is gradually opened and then gradually closed when moving to the leading end guiding rail group 336. When the negative electrode holder 32 is moved to the end position cd, the opening is gradually opened, thereby releasing the clamping of the plated flexible circuit board FPC, and re-closing after guiding the slide group 336 from the outlet end to be again put into the motion cycle.

Wherein, the specific structure of the present invention that realizes that the clamp driving control device 33 can drive each negative clamp 32 to circulate between the inlet end position rd and the outlet end position cd is as follows:

Referring to FIG. 10 to FIG. 13, the above-mentioned clamp driving mechanism is composed of a main transmission motor 331, a transmission mechanism and two sets of the same sprocket chain mechanism; the two sets of sprocket chain mechanisms are respectively composed of a driving sprocket 332, a driven sprocket 333 and a sleeve. A chain 334 is formed on the two, and the two chains 334 are respectively located in two planes parallel to the plane of the plated flexible circuit board FPC, and the plane of the plated flexible circuit board FPC is located on the plane of the two chains 334. The main drive motor 331 can drive the two drive sprocket 332 through the transmission mechanism Synchronously rotating and driving the two chains 334 to move synchronously.

Further, the upper end portion of the mounting bracket 321 of the negative electrode holder 32 is a T-shaped portion, the longitudinal rod portion of the T-shaped portion is connected to the lower end portion of the mounting bracket 321, and the two ends of the transverse rod portion of the T-shaped portion are respectively fixed to the two chains. 334 is perpendicular to the direction in which the two chains 334 extend.

The specific structure of the present invention is as follows: "The negative electrode clamp 32 is electrically connected to the negative electrode of the DC power supply 351 through the negative electrode conducting mechanism during the movement from the in-end position rd to the out-end position cd" is as follows:

Referring to FIG. 16 to FIG. 19-2, the negative conductive mechanism of the power supply system 35 is provided with a negative lead wire and a conductive slide 352, and a conductive slider 353 and a slider connecting mechanism thereof are disposed corresponding to each negative clamp 32; the conductive slide rail The 352 is fixed at a position between the clamp driving mechanism and the plating cylinder 31, and the conductive rail 352 has a groove track disposed along the moving direction V of the plated flexible circuit board FPC, and the conductive rail 352 passes through the negative wire and the DC power supply 351. The negative electrode is electrically connected; each of the conductive sliders 353 is mounted on the lateral rod portion of the corresponding negative electrode holder 32 by its slider connecting mechanism, and the negative electrode holder 32 corresponds to each of the negative electrode holders 32 when moving to the input end position rd The conductive slider 353 slides into the groove track of the conductive rail 352 and is pressed by the slider connecting mechanism on the conductive rail 352, so that the negative clamp 32 sequentially passes through its corresponding slider connecting mechanism and the conductive slider 353. The conductive rail 352 and the negative lead are electrically connected to the negative pole of the DC power supply 351. When each negative clamp 32 is moved to the output position cd, the corresponding conductive slider 353 of the negative clamp 32 is electrically conductive. 352 slide out of the groove track.

Referring to FIG. 19-1 and FIG. 19-2, the slider connecting mechanism is provided with a slider spring 354, a fixing bolt 355, a connecting screw 356 and a connecting wire; the transverse rod portion of the negative electrode clamp 32 is provided with a through hole, and the fixing bolt 355 is The rod portion passes through the through hole corresponding to the negative electrode holder 32 from above and is fixedly connected to the top of the conductive slider 353, and the bolt head of the fixing bolt 355 can be seated on the top surface of the transverse rod portion of the corresponding negative electrode holder 32, the slider spring 354 is sleeved on the rod portion of the fixing bolt 355 and abuts between the bottom surface of the transverse rod portion of the corresponding negative electrode holder 32 and the top of the conductive slider 353, and one end of the connecting wire is fixed to the bolt head of the fixing bolt 355 by the connecting screw 356. And electrically connected, the other end is fixed on the corresponding negative clamp 32 and electrically connected.

In addition, in order to further maintain the stability of the plated flexible circuit board FPC when the plating solution is shaken, referring to FIG. 14 and FIG. 15, the plating section 3 is further provided with an auxiliary guiding mechanism 36; the auxiliary guiding mechanism 36 is provided by the left bracket 361, right. The bracket 362, the left guide wheel 363 and the right guide wheel 364 are respectively fixed, and the left bracket 361 and the right bracket 362 are respectively fixed on the bottom surface of the inner cavity of the plating cylinder 31, and the left guide wheel 363 and the right guide wheel 364 are both semicircular barrels, left The guide wheel 363 is fixed on the left bracket 361, and the right guide wheel 364 is fixed on the right bracket 362, and the semicircular arc faces of the left guide wheel 363 and the right guide wheel 364 are oppositely disposed with a gap; the electroplated flexible circuit board FPC A gap is passed from the left guide wheel 363 to the right guide wheel 364. Wherein, for the electroplated flexible circuit board FPC having a thickness of 0.12 to 1.0 mm, the gap width between the left guide wheel 363 and the right guide wheel 364 is preferably 0.5 to 1.5 mm; the left guide wheel 363 and the right guide wheel 364 are preferably made of iron. Made of fluorocarbon material, the material is more tough due to wear resistance, so it is coated with flexible circuit board FPC and When the left guide wheel 363 and the right guide wheel 364 are in contact, the surface thereof is not scratched or scratched.

In addition, in order to further improve the plating uniformity of the electroplated flexible circuit board, referring to FIG. 16 to FIG. 18, the plating section 3 is provided with a plurality of positive electrode plates 34; each of the positive electrode plates 34 is installed in the inner cavity of the plating cylinder 31 and Divided into two rows, two rows of positive plates 34 are respectively located on both sides of the plated flexible circuit board FPC, and each of the positive plates 34 in each row is evenly distributed along the moving direction V of the plated flexible circuit board FPC.

Referring to FIG. 20, the above pre-plating treatment includes a surface cleaning process; the pre-treatment section 2 is provided with a cleaning chemical liquid nozzle 21 for spraying the cleaning liquid to the surface of the plated flexible circuit board FPC, for blocking the cleaning liquid and A roller box 22 for positioning a moving path of the plated flexible circuit board FPC, a pre-processing correction system 23 for adjusting the weight of the plated flexible circuit board FPC when the weight is dropped, for extracting the cleaning liquid cleaning and plating flexibility The exhaust device 24 of the exhaust gas generated when the board is FPC board. The roller box 22 can block the cleaning liquid in the pre-treatment section 2 to prevent excessive cleaning and overflow of the cleaning liquid to ensure the liquid level cleaning of the board surface. The pre-processing correction system 23, that is, the EPC, belongs to the existing device, and its action is as shown in FIG. 21, that is, the left side of the pre-processing correction system 23 is fixed by the bearing, and the right side is controlled by the servo motor 231, when the EPC sensor 233 senses When the plated flexible circuit board FPC is dropped, the servo motor 231 operates to tilt the EPC section 234 upward, and the plated flexible circuit board FPC is slowly moved upward by the principle of the slope. On the contrary, if the plated flexible circuit board FPC is higher than the EPC In the case of the sensor 233, the servo motor 231 operates to tilt the EPC section 234 downward, and the plated flexible circuit board FPC is slowly moved downward by the principle of the inclination to realize the function of adjusting the height of the plated flexible circuit board FPC.

Referring to FIG. 22, the above-mentioned post-plating treatment includes a plate surface residual chemical liquid cleaning process and a blow drying process; the post-treatment section 4 is provided with a cleaning liquid medicine nozzle for spraying the cleaning liquid to the surface of the plated flexible circuit board FPC board. 41. A roller box 42 for blocking the cleaning solution and positioning the movement path of the plated flexible circuit board FPC, a post-processing correction system 43 for adjusting the plated flexible circuit board FPC when the weight is dropped, and The air extracting device 44 for extracting the exhaust gas generated when the cleaning solution is cleaned by the FPC board surface of the electroplated flexible circuit board, and the water mist generated by the plating flexible circuit board FPC after being cleaned by the cleaning liquid is dried by the normal temperature air The air knife 45 and the drying air knife 46 for hot air drying of the blown-out electroplated flexible circuit board FPC. Therefore, the post-processing section 4 cleans the liquid remaining on the surface of the plated flexible circuit board FPC after plating and blows and dries the board surface to ensure that the surface of the plated flexible circuit board FPC is not oxidized. Wherein, the roller box 42 can block the cleaning liquid in the post-processing section 4 to prevent excessive cleaning liquid splashing. As shown in FIG. 21, the post-processing correction system 43 has the same functional principle as the rectification system 42, and details are not described herein again. The hot air generated by the drying air knife 46 is preferably between 70 and 90 ° C, and the oxidation of the surface of the plated flexible circuit board FPC can be avoided.

Referring to FIG. 9 and FIG. 23, an electroplating liquid nozzle 311 for spraying a plating solution onto a portion of the electroplated flexible circuit board FPC located in the inner cavity of the plating cylinder 31 is further disposed in the inner cavity of the plating cylinder 31; The conductive roll-to-roll vertical continuous plating apparatus is further provided with a cleaning chemical supply device for supplying the cleaning chemical liquid to the cleaning chemical liquid nozzle 21, and for supplying the cleaning liquid to the cleaning chemical liquid nozzle 41. a liquid cleaning solution supply device and an electroplating solution supply device for supplying an electroplating solution to the plating solution nozzle 311; the cleaning solution supply device, the cleaning solution supply device, and the plating solution supply device are both provided by the auxiliary tank 61. The pump 62 is composed of a pump 62 and a filter barrel 63. The pump 62 can extract the liquid medicine contained in the auxiliary tank 61, and the extracted medicine liquid is filtered through the filter barrel 63 for impurity filtering; and the auxiliary of the cleaning liquid supply device The tank 61 is for holding the cleaning liquid, and the cleaning liquid filtered by the filter barrel 63 of the cleaning liquid supply device is supplied to the cleaning liquid medicine nozzle 21; the cleaning liquid supply device is for holding the cleaning liquid and is cleaned. The cleaning liquid medicine filtered and outputted by the filter tank 63 of the chemical liquid supply device is supplied to the cleaning chemical liquid nozzle 41; the plating chemical liquid supply device is for holding the plating chemical liquid, and is filtered by the filter barrel 63 of the plating chemical supply device. The chemical liquid is supplied to the plating chemical nozzle 311.

The present invention is not limited to the above specific embodiments, and according to the above-mentioned contents, according to the common technical knowledge and conventional means in the art, the present invention can also make other various forms of equivalents without departing from the above basic technical idea of the present invention. Modifications, substitutions or alterations are intended to fall within the scope of the invention.

Claims

A plate-clamping conductive roll-to-roll vertical continuous plating device consisting of a unwinder (1), a pre-processing section (2), a plating section (3), a post-processing section (4) and a winder (5), The pretreatment section (2), the plating section (3) and the post-processing section (4) are both installed between the unwinder (1) and the winder (5) and according to the unwinder (1) Arranged in the order of the winder (5), the coiled electroplated flexible circuit board (FPC) is discharged by the unwinder (1) and re-collected by the winder (5), and The electroplated flexible circuit board (FPC) moved by the unwinder (1) to the winder (5) is tensioned by the unwinder (1) and the winder (5) in a plane. The pre-processing section (2), the electroplating section (3) and the post-processing section (4) sequentially perform pre-plating treatment, electroplating treatment and post-plating treatment on the electroplated flexible circuit board (FPC) during the movement; The electroplating section (3) is provided with a plating cylinder (31), a plurality of negative electrode clamps (32), a clamp drive control device (33), a positive electrode plate (34) and a power supply system (35); A plated flexible circuit board (FPC) passes through the inner cavity of the plating tank (31), and the plating tank (31) The position immediately above the one end of the unwinder (1) is recorded as the end position (rd), and the position immediately above the end of the winder (5) is recorded as the end position (cd); The clamp drive control device (33) is capable of driving each of the negative electrode clamps (32) to circulate between the inlet end position (rd) and the outlet end position (cd) and the respective negative electrode holders (32) are The cyclic motion is evenly spaced, and during the movement of the negative clamp (32) from the inlet end position (rd) to the outlet end position (cd), the clamp drive control device (33) Capable of driving the negative electrode clamp (32) to open before entering the inlet end position (rd), to be closed during the movement from the inlet end position (rd) to the outlet end position (cd), and to leave the outlet end position ( Cd) is then opened such that the negative electrode holder (32) is separated from the electroplated flexible circuit board (FPC) before entering the in-end position (rd), and moved from the in-position position (rd) to Clamped at the upper edge of the plated flexible circuit board (FPC) during the exit position (cd), away from the exit position (cd) and the plated flexible circuit (FPC) phase separation, and the clamping position of each of the negative electrode holders (32) on the electroplated flexible circuit board (FPC) is located in a plane of the electroplated flexible circuit board (FPC), each of which The moving speed of the negative electrode holder (32) is the same as the moving speed of the electroplated flexible circuit board (FPC); the power supply system (35) is provided with a direct current power source (351), a negative electrode conducting mechanism and a positive electrode lead, The negative electrode clamp (32) is electrically connected to the negative electrode of the direct current power source (351) through the negative conductive mechanism during the movement from the inlet end position (rd) to the outlet end position (cd); the positive plate of each block (34) Installed in the inner cavity of the plating tank (31), the positive electrode plate (34) is electrically connected to the positive electrode of the direct current power source (351) through the positive electrode wire.
The electroplated clip-conducting roll-to-roll vertical continuous plating apparatus according to claim 1, wherein said negative electrode holder (32) is provided with a mounting bracket (321), a left collet (322), and a right collet ( 323), two clamp springs (324) and two guiding rollers (325); a middle portion of the left collet (322) and a middle portion of the right collet (323) are respectively rotatably connected to the mounting bracket (321) a lower end, one of the clamp springs (324) is mounted between the inner side wall of the upper end of the left collet (322) and the mounting bracket (321), and the other of the clamp springs (324) is mounted at the Between the inner side wall of the upper end portion of the right collet (323) and the mounting bracket (321), and under the spring force of the two clamp springs (324), the left collet (322) The lower end portions of the lower end portion and the right collet body (323) are clamped together, that is, the negative electrode holder (32) is closed; one of the guide rollers (325) is mounted on the upper end portion of the left collet (322) and is located In the outer position, another guide roller (325) is mounted on the upper end of the right collet (323) and located at an outer position;

The clamp drive control device (33) is mounted above the plating cylinder (31), and is provided with a clamp drive mechanism, an inlet guide slide group (335) and an outlet guide slide group (336); The clamp driving mechanism can drive each of the negative clamps (32) to rotate counterclockwise on a closed trajectory composed of a lower linear trajectory, an upper linear trajectory, an indented semicircular trajectory and an outgoing semicircular trajectory, the lower straight line The trajectory and the upper linear trajectory are both parallel to the moving direction (V) of the plated flexible circuit board (FPC), and the lower linear trajectory passes through the entry end position (rd) and the out end position (cd);

The inlet guiding slide group (335) and the outlet guiding rail group (336) are both fixed at a lower position of the clamp driving mechanism, and the inlet guiding rail group (335) is close to the inlet. The end semicircular trajectory is disposed, the ejecting guide rail group (336) is disposed adjacent to the exit semicircular trajectory, and the inlet end guiding rail group (335) and the outbound guiding rail group (336) each include two a guide rail that is opposite to the inner side of the root and whose inner side is gradually convex toward the middle by both end portions, and the rear end portions of the two guide rails of the inlet guide rail group (335) are bent upward, the middle portion and the rear end portion. Extending along the lower linear trajectory, the front end portion and the front end portion of the two guiding slide rails of the outlet end guiding rail group (336) extend along the lower linear trajectory, and the front end portion is upwardly curved, and the inlet end guides sliding The foremost end position of the two guiding slide rails of the rail group (335) is the inlet end position (rd), and the last end positions of the two guiding rails of the outlet guiding rail group (336) are the out End position (cd);

So that when each of the negative electrode holders (32) moves to the boundary position between the entrance semicircular trajectory and the lower linear trajectory, the two guiding rollers (325) of the negative electrode holder (32) are slid into the inlet end to guide Between the inner sides of the two guiding rails of the rail group (335), the two guiding rails of the inlet guiding rail group (335) pass the two guiding rollers (325) to the left collet The upper end portions of the (322) and the right collet (323) generate a pressing force against the spring force of the two clamp springs (324), and the lower ends of the left and right collet (322) The two guide rail rear end portions of the inlet guide rail group (335) are gradually opened, and the middle of the two guide rails of the inlet guide rail group (335) are opened to the maximum extent. The front ends of the two guiding rails of the guiding guide rail group (335) are gradually closed;

And causing: when each of the negative electrode clamps (32) moves to the boundary position between the lower linear trajectory and the outer semicircular trajectory, the two guiding rollers (325) of the negative electrode clamp (32) roll and slide into the outlet end. Between the inner sides of the two guiding rails of the guiding rail group (336), the two guiding rails of the outlet guiding rail group (336) pass the two guiding rollers (325) to the left clamping The upper end portions of the body (322) and the right body (323) generate a pressing force against the spring force of the two clamp springs (324), so that the left and right collets (322) and (323) The lower end portion is gradually opened at the rear end portions of the two guide rails of the outlet guide rail group (336), and is opened to the maximum at the middle of the two guide rails of the outlet guide rail group (336). To the extent, the front ends of the two guide rails of the guide rail group (336) at the outlet end are gradually closed.
The electroplated clip-conducting roll-to-roll vertical continuous plating apparatus according to claim 2, wherein: said jig drive mechanism is composed of a main drive motor (331), a transmission mechanism and two sets of identical sprocket chain mechanisms; The two sets of sprocket chain mechanisms are composed of a driving sprocket (332), a driven sprocket (333) and a chain (334) disposed on the two, the two chains (334) are respectively located at two Parallel to a plane in which the plated flexible circuit board (FPC) is located, and the plane of the plated flexible circuit board (FPC) is located between the planes of the two chains (334); the main drive The motor (331) can drive the two driving sprockets (332) to synchronously rotate and drive the two chains (334) to synchronously move through the transmission mechanism;

The upper end portion of the mounting bracket (321) of the negative electrode clamp (32) is a T-shaped portion, and the longitudinal rod portion of the T-shaped portion is connected to the lower end portion of the mounting bracket (321), and the transverse rod of the T-shaped portion Both ends of the portion are respectively fixed to the two chains (334) and perpendicular to the extending direction of the two chains (334).
The electroplated clip-conducting roll-to-roll vertical continuous plating apparatus according to claim 3, wherein the negative electrode conducting mechanism of the power supply system (35) is provided with a negative electrode lead and a conductive slide rail (352) and corresponds to each The negative electrode holder (32) is provided with a conductive slider (353) and a slider connecting mechanism thereof; the conductive sliding rail (352) is fixed at a position between the clamp driving mechanism and the plating cylinder (31), and The conductive rail (352) has a groove track disposed along a moving direction (V) of the plated flexible circuit board (FPC), and the conductive track (352) passes through the negative wire and the DC power source The negative electrode of (351) is electrically connected; each of the conductive sliders (353) is mounted on a transverse rod portion of the corresponding negative electrode holder (32) by its slider connecting mechanism, and at each of the negative electrode holders (32) When moving to the entry position (rd), the corresponding conductive slider (353) of the negative clamp (32) slides into the groove track of the conductive slide (352) and is pressed by its slider connection mechanism. The conductive slide rail (352) is arranged such that the negative electrode clamp (32) sequentially passes through its corresponding slider connecting mechanism and guide An electric slider (353), the conductive slide rail (352) and the negative electrode lead are electrically connected to a negative pole of the direct current power source (351); and each of the negative electrode clamps (32) is moved to the outlet end position (cd), the corresponding conductive slider (353) of the negative electrode holder (32) slides out of the groove track of the conductive slide (352).
The electroplated clip-conducting roll-to-roll vertical continuous plating apparatus according to claim 4, wherein said slider connecting mechanism is provided with a slider spring (354), a fixing bolt (355), and a connecting screw (356). And a connecting wire; the transverse rod portion of the negative electrode holder (32) is provided with a through hole, and the rod portion of the fixing bolt (355) passes through the through hole corresponding to the negative electrode holder (32) from the top to the bottom and is fixedly connected thereto. The top of the conductive slider (353), the bolt head of the fixing bolt (355) can be seated on the top surface of the transverse rod portion of the corresponding negative clamp (32), and the slider spring (354) is placed in the On the stem of the fixing bolt (355) and abutting on the rod Corresponding to the bottom surface of the transverse rod portion of the negative electrode holder (32) and the top of the conductive slider (353), one end of the connecting wire passes through the connecting screw (356) and the bolt head of the fixing bolt (355) The phase is fixed and electrically connected, and the other end is fixed on the corresponding negative electrode clamp (32) and electrically connected.
The electroplated clip-conducting roll-to-roll vertical continuous plating apparatus according to claim 1, wherein said electroplating section (3) is further provided with an auxiliary guiding mechanism (36); said auxiliary guiding mechanism (36) is a left bracket (361), a right bracket (362), a left guide wheel (363) and a right guide wheel (364), and the left bracket (361) and the right bracket (362) are respectively fixed to the plating cylinder (31) On the bottom surface of the inner cavity, the left guide wheel (363) and the right guide wheel (364) are both semi-circular barrels, and the left guide wheel (363) is fixed on the left bracket (361), the right a guide wheel (364) is fixed on the right bracket (362), and a semicircular arc surface of the left guide wheel (363) and the right guide wheel (364) are oppositely disposed with a gap; the plated flexibility A circuit board (FPC) passes through a gap between the left guide wheel (363) and the right guide wheel (364).
The electroplated clip-conducting roll-to-roll vertical continuous plating apparatus according to claim 1, wherein said electroplating section (3) is provided with a plurality of said positive electrode plates (34); said positive electrode plates ( 34) are both installed in the inner cavity of the plating cylinder (31) and divided into two rows, the two rows of positive plates (34) are respectively located on both sides of the electroplated flexible circuit board (FPC), in each row Each of the positive plates (34) is evenly distributed along the direction of movement (V) of the plated flexible circuit board (FPC).
The electroplated clip-conducting roll-to-roll vertical continuous plating apparatus according to claim 1, wherein said pre-plating treatment comprises a panel cleaning process; and said pre-treatment section (2) is provided with a cleaning agent Spraying a cleaning liquid nozzle (21) onto the surface of the plated flexible circuit board (FPC) for blocking the cleaning liquid and positioning the moving path of the plated flexible circuit board (FPC) a roller box (22), a pre-processing correction system (23) for adjusting the electroplated flexible circuit board (FPC) when the weight is dropped, for extracting the cleaning liquid to clean the plating flexibility Exhaust device (24) for exhaust gas generated on the surface of the board (FPC).
The electroplated clip-conducting roll-to-roll vertical continuous electroplating apparatus according to claim 8, wherein said post-plating treatment comprises a plate surface residual chemical liquid cleaning process and a blow drying process; said post-processing section (4) providing a cleaning liquid nozzle (41) for spraying a cleaning liquid to the surface of the plated flexible circuit board (FPC) for blocking the cleaning liquid and for the plated flexible circuit a roller box (42) for positioning a movement path of a plate (FPC), a post-processing correction system (43) for adjusting the plated flexible circuit board (FPC) when the weight is dropped, for extracting the a cleaning device (44) for cleaning the exhaust gas generated when the plated surface of the plated flexible circuit board (FPC) is cleaned, and a water mist generated on the plated flexible circuit board (FPC) after cleaning the cleaning solution A blow dry air knife (45) blown with a normal temperature air and a dry air knife (46) for hot air drying of the blown dried electroplated flexible circuit board (FPC).
The electroplated clip-conducting roll-to-roll vertical continuous plating apparatus according to claim 9, wherein said electroplating cylinder The inner cavity of (31) is further provided with an electroplating liquid nozzle (311) for spraying the electroplating liquid to a portion of the electroplated flexible circuit board (FPC) located in the inner cavity of the electroplating cylinder (31); The electroplating clip conductive roll-to-roll vertical continuous plating apparatus is further provided with a cleaning chemical supply device for supplying a cleaning chemical liquid to the cleaning chemical liquid nozzle (21) for supplying the cleaning chemical liquid nozzle (41) a cleaning chemical supply device for supplying a cleaning chemical, and an electroplating solution supply device for supplying a plating solution to the plating solution nozzle (311); the cleaning solution supply device and the cleaning solution supply The device and the electroplating solution supply device are each composed of an auxiliary tank (61), a pump (62) and a filter tank (63) capable of extracting a medicine contained in the auxiliary tank (61) Liquid, and extracting the extracted medical liquid through the filter barrel (63) for impurity filtration and outputting; the auxiliary tank (61) of the cleaning chemical supply device is for holding the cleaning liquid, and the cleaning is performed. a cleaning solution filtered and outputted from a filter tank (63) of the chemical supply device is supplied to the cleaning chemical liquid nozzle (21); the cleaning liquid is supplied a cleaning device for holding the cleaning solution, and a cleaning solution filtered by the filter barrel (63) of the cleaning solution supply device is supplied to the cleaning liquid nozzle (41); the plating solution The supply device is for holding the plating solution, and the plating solution filtered and outputted through the filter barrel (63) of the plating solution supply device is supplied to the plating solution nozzle (311).