JP2002020898A - Method and apparatus for plating long substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for plating a long substrate in which the consistent quality can be obtained at a low cost and the yield can be improved. SOLUTION: The long substrate 10 is held between carrying rolls 101 with the width direction thereof facing in the vertical direction, and carried in the longitudinal direction. A plurality of power supply terminals 50 are provided at predetermined intervals in the vicinity of one side of the long substrate 10. The power supply terminals 50 are electrically connected to a plating area of a conductor layer of a predetermined pattern formed on the longitudinal substrate 10. A plating tank 100 is provided so as to surround the periphery of the carrying rolls 101. A power supply chuck supporting cable 104 stretched between pulleys 102 and 103 and a plurality of power supply chucks 120 are provided above the plating tank 100. A plurality of power supply chucks 120 are successively brought into contact with the power supply terminals 50 of the long substrate 10 to be carried, and hold them, and the power is supplied to the power supply terminals 50 from a rotary distribution board 110 via the power supply chucks 120.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for plating a long board for forming a wiring board.

[0002]

2. Description of the Related Art A flexible circuit board is used in various electronic devices. This flexible circuit board has a plurality of wiring patterns formed on a flexible board. Also,
2. Description of the Related Art In a magnetic disk drive, a plate-shaped support called a magnetic head suspension is used to position a magnetic head on a desired track of a rotating magnetic disk. The magnetic head suspension has a plurality of wiring patterns and a magnetic head mounting portion (tongue portion) for mounting a magnetic head near the tip.

[0003] Hereinafter, a substrate on which a wiring pattern is formed, such as a flexible circuit board or a magnetic head suspension, will be generally referred to as a wiring board. When manufacturing wiring boards,
An insulating layer, a wiring pattern, and a coating layer are sequentially formed on a substrate made of a metal or an insulator.

[0004] In recent years, the densification and miniaturization of electronic equipment have advanced, and in particular, high reliability and low cost of wiring boards used therein have been required, and epoch-making rationalization of the manufacturing process has been required. Was. For this reason, a manufacturing method has been proposed in which, while continuously or intermittently transporting a long substrate, an insulating layer forming step, a wiring pattern forming step, and a covering layer forming step are sequentially performed on the long substrate. I have. As a result, it is becoming possible to perform most steps in the state of a long substrate.

[0005]

SUMMARY OF THE INVENTION The above-mentioned wiring board includes:
A connection terminal for connecting an electronic component or a connector is provided, and the connection terminal is plated. When plating the connection terminal portion by the electrolytic plating method, it is general that the long substrate is cut into a predetermined length and processed one by one.

A method of saving labor by automating such a single-wafer treatment of electrolytic plating is also being studied.
This automation method is a method of simply causing a robot to mainly perform a task performed by a human, and is often used when processing a semiconductor wafer or the like having a very high added value.

[0007] When the above-mentioned single-wafer treatment of electrolytic plating is performed manually by a person, the quality is not stable and the cost is high. Further, in the method in which the robot performs the single-wafer treatment of the electrolytic plating, the cost is further increased. Therefore, it is substantially difficult to apply the method to a product requiring a low cost.

Further, in any of the above-mentioned methods, when the form of the product is a metal thin film structure that is extremely deformable, the product may be broken or wrinkled, resulting in a decrease in the yield of the product.

An object of the present invention is to provide a plating method and a plating apparatus for a long substrate, which can obtain stable quality at low cost and can improve the yield.

[0010]

Means for Solving the Problems and Effects of the Invention A plating method for a long substrate according to the first invention is a method for plating a long substrate for forming a wiring substrate, and the long substrate should be plated. Having a plating area and having a power supply terminal electrically connected to the plating area on at least one side, while transporting the long substrate in the length direction with the width direction of the long substrate facing up and down. The long substrate is immersed in a plating solution so that the power supply terminal is exposed, and power is supplied from the power supply terminal to the plating area.

In the method for plating a long substrate according to the present invention, while feeding the long substrate in the longitudinal direction with the width direction of the long substrate for forming a wiring substrate being directed vertically, the long substrate is supplied with power. By immersing in the plating solution so that the terminals are exposed, power can be supplied from the power supply terminals to the plating area.
Thereby, plating can be continuously and automatically performed on the plating area of the long substrate. In this case, since there is no need for manual processing by a person, the quality is stabilized and the cost is reduced. In addition, since the plating area can be plated in the state of the long substrate, the product does not break or wrinkle. Therefore, the yield is improved.

The long substrate is formed by laminating a conductor pattern of a predetermined pattern on a metal substrate via an insulation layer of a predetermined pattern.
The conductor layer may have a plating area, and the power supply terminal may be electrically connected to the conductor layer.

In this case, by supplying power to the plating region of the conductor layer on the insulating layer via the power supply terminal of the long substrate, the plating region on the long substrate can be continuously and automatically plated.

[0014] The power supply terminal may comprise an exposed region of the metal substrate, and the conductor layer may be electrically connected to the metal substrate.

In this case, since the conductor layer is electrically connected to the metal substrate, the power supply terminal is electrically connected to the conductor layer via the metal substrate. Thus, power can be supplied to the plating region of the conductor layer on the insulating layer via the power supply terminal without forming a wiring pattern for electrically connecting the power supply terminal and the conductor layer.

The power supply terminal may be electrically connected to the conductor layer via a predetermined conductive pattern, and the power supply terminal, the conductor layer and the conductive pattern may be insulated from the metal substrate by an insulating layer.

In this case, since the power supply terminal, the conductor layer, and the conductive pattern are insulated from the metal substrate by the insulating layer, no power is supplied to the metal substrate. Therefore, plating of the surface of the metal substrate can be prevented without coating the surface of the metal substrate with an insulating material.

A plating apparatus for a long substrate according to a second invention is a plating apparatus for plating a long substrate for forming a wiring substrate, wherein the long substrate has a plating area to be plated and has at least one side. It has a power supply terminal electrically connected to the plating area on the side, and a plating solution storage part that stores the plating solution, and transports the long substrate in the length direction with the width direction of the long substrate facing up and down. A feeding unit that immerses the long substrate in the plating solution in the plating solution storage section so that the feeding terminal is exposed, and a feeding unit that feeds the plating area from the feeding terminal of the long substrate that is transferred by the feeding unit. It is provided.

In the plating apparatus according to the present invention, the power supply terminals are exposed while the long substrate is conveyed in the longitudinal direction by the conveying means in such a manner that the width direction of the long substrate for forming the wiring substrate is directed vertically. The long substrate is immersed in the plating solution in the plating solution container. At this time, power is supplied from the power supply terminal of the transported long substrate to the plating area by the power supply means.
Thereby, plating can be continuously and automatically performed on the plating area of the long substrate.

In this case, since there is no need for manual processing by a person, the quality is stabilized and the cost is reduced. Also,
Since the plating area can be plated in the state of the long substrate, the product does not break or wrinkle. Therefore,
The yield is improved.

The power supply means includes a contact portion provided so as to be capable of electrically contacting the power supply terminal of the long substrate, a detection means for detecting information on the position of the power supply terminal, and a contact portion based on a detection result of the detection means. After electrically contacting the portion with the power supply terminal of the long substrate, and moving the contact portion in the transport direction of the long substrate in synchronization with the transport speed of the long substrate by the transport unit,
The power supply unit may include a contact unit driving unit that releases the contact unit from the power supply terminal and a power supply unit that supplies power to the power supply terminal through the contact unit.

In this case, the information regarding the position of the power supply terminal is detected by the detecting means, and based on the detection result, the contact portion is electrically contacted with the power supply terminal of the long substrate by the contact portion driving means. After the contact portion is moved in the transport direction of the long substrate in synchronization with the transport speed of the long substrate, the contact portion is released from the power supply terminal. While the contact portion moves in the transport direction of the long substrate, power is supplied to the power supply terminal through the contact portion by the power supply portion. Thereby, it is possible to continuously and automatically perform plating on the plating area of the transported long substrate.

A plurality of wiring circuit groups each including a predetermined number of wiring circuit patterns are formed on the long substrate, and the predetermined number of wiring circuit patterns of each wiring circuit group have a plating region, respectively. One or more power supply terminals may be provided for each circuit group to be electrically connected to a predetermined number of plating regions of the wiring circuit pattern.

In this case, plating areas of a predetermined number of wiring circuit patterns of the wiring circuit group formed on the transported long substrate are plated simultaneously, and plating processing of a plurality of wiring circuit groups is performed sequentially. Therefore, processing efficiency is increased.

The power supply means has a plurality of contact portions, and the contact portion drive means electrically contacts the plurality of contact portions sequentially to the power supply terminals provided for each wiring circuit group of the long substrate. At the same time, after the long substrate is sequentially moved in the transport direction, it may be sequentially released from the power supply terminal.

In this case, the plurality of contact portions sequentially make electrical contact with the power supply terminals provided for each of the wiring circuit groups of the long substrate, sequentially move in the transport direction of the long substrate, and then move from the power supply terminal to the power supply terminal. By sequentially releasing, the plating regions of the plurality of wiring circuit groups are sequentially plated. Thereby, a continuous and automatic plating process becomes possible.

The power supply means further includes a moving cable which moves in synchronization with the transfer speed of the long substrate by the transfer means,
The contact portion driving means electrically connects the contact portion to the power supply terminal of the long substrate and fixes the contact portion to the moving cable based on the detection result of the detection means, and the contact portion moves with the long substrate for a predetermined time or a predetermined distance. After that, the contact portion may be released from the power supply terminal of the long board and the moving cable.

In this case, when the contact portion electrically contacts the power supply terminal of the long substrate, the contact portion is fixed to the moving cable, and the contact portion moves with the long substrate as the moving cable moves. After the contact portion moves with the long substrate for a predetermined time or a predetermined distance, the contact portion is released from the power supply terminal of the long substrate and the moving cable. Thus, the contact, movement and release of the contact portion with the power supply terminal of the long substrate are smoothly performed.

The long substrate is provided with a portion to be detected as information relating to the position, and the detecting means may detect information relating to the position of the power supply terminal by detecting the portion to be detected.

In this case, information on the position of the power supply terminal is detected by detecting the detection target portion provided on the long substrate by the detection means. Thus, the contact portion can be brought into contact with a predetermined power supply terminal of the long board at a predetermined timing.

[0031]

FIG. 1 is a schematic perspective view of a plating apparatus according to an embodiment of the present invention.

As shown in FIG. 1, the long substrate 10 is sandwiched between the transport rolls 101 in a state where the width direction thereof is directed vertically, and is transported in a direction indicated by an arrow MD (hereinafter, referred to as a transport direction MD). Is done. A plurality of power supply terminals 50 are provided at predetermined intervals near one side of one surface of the long substrate 10. These power supply terminals 50 are electrically connected to a plating region of a conductor layer having a predetermined pattern formed on the long substrate 10 as described later.

A mark 300 is provided between the power supply terminals 50 near one side of the long substrate 10. The mark 300 is made of, for example, black polyimide resin or a hole, is used as information indicating the position of the power supply terminal 50, and is detected by the optical sensor 105.

A plating tank 100 is provided so as to surround the four transport rolls 101. Plating tank 10
A plating solution is stored in the space 0. The plating tank 100
When the plating solution leaks from the gap between the transfer roll 101 and the gap between the plating tank 100 and the long substrate 10,
A storage tank (not shown) for receiving the plating solution leaking from the plating tank 100 is disposed below the plating tank 100. In this case, the plating solution stored in the storage tank is returned into the plating tank 100 using a pump.

A pair of pulleys 102, 103 are disposed above the plating tank 100, and the pulleys 102, 1
A power supply chuck support cable 104 is bridged between the wires 03. A rotary distribution board 110 is provided above the power supply chuck support cable 104. The rotary distribution board 110 includes a power supply circuit and a solenoid valve. A plurality of power supply chucks 120 are attached to the rotary distribution board 110 via a plurality of cables 111.

The power supply chuck 120 is driven by a driving mechanism between the upper standby position and a power supply start position near the transport roll 101 on the upstream side in the transport direction of the long substrate 10 and on the upstream side in the transport direction of the long substrate 10. It is provided movably between a power supply start position close to the transport roll 101 and a standby position above. The power supply chuck 120 is formed of an alkali-resistant material, for example, stainless steel, copper, or the like.

The operation of the rotary distribution board 110, the transport roll 101 and the pulleys 102 and 103 is controlled by a control unit (not shown).
Is controlled by

FIG. 2 is a schematic perspective view showing the detailed structure of the power supply chuck 120 of FIG. Power supply chuck 120
Includes a pair of holding portions 121. A pair of holding portions 121
Are openably and closably connected by a hinge portion 124. A micro air cylinder 122 is mounted between the holding portions 121, and a winding spring 123 is mounted. A conductive contact portion 121a is provided inside one of the holding portions 121.
Is provided.

The pair of holding portions 121 are urged outward by a winding spring 123. The cable 111 includes an operation air supply hose 125 and a power supply cord 126. The micro air cylinder 122 is connected to the operation air supply hose 12.
5 is connected to the rotary distribution board 110. The contact portion 121a of the holding portion 121 is
6 is connected to the rotary distribution board 110.

Normally, as shown in FIG. 2A, the holding portion 121 is opened by the winding spring 123. As shown in FIG. 2B, the holding portion 121 is closed by the operation air supplied from the rotary distribution board 110 to the micro air cylinder 122 via the operation air supply hose 125.

Next, the operation of the plating apparatus of FIG. 1 will be described. When the transport roll 101 rotates, the long substrate 10 is transported at a constant speed in the transport direction MD. The plurality of power supply chucks 120 are arranged at the standby position.
One of the plurality of power supply chucks 120 moves to a power supply start position near the upper end of the long substrate 10.

The optical sensor 105 is a mark 3 on the long substrate 10.
When 00 is detected, a detection signal is given to the control unit. Accordingly, the control unit supplies operation air to the micro air cylinder 122 of the power supply chuck 120 via the rotary distribution board 110. As a result, the holding portion 121 of the power supply chuck 120
Is closed, and the long substrate 10 is held at the position of the power supply terminal 50 of the long substrate 10. Thereby, the contact portion 121a of the power supply chuck 120 is in electrical contact with the power supply terminal 50.

At this time, the power supply chuck 120 holds the power supply chuck support cable 104. Note that the power supply chuck 120 may hold the power supply chuck supporting cable 104 at the same time as the power supply chuck 120 holds the power supply terminal 50, or may be performed at a different timing.

The pulleys 102 and 103 rotate in the direction of arrow S in synchronization with the transport speed of the long substrate 10. Power supply chuck 120 holding power supply terminal 50 of long substrate 10
Move at the same speed as the long substrate 10 due to the movement of the power supply chuck support cable 104. Thus, power is supplied to the power supply terminal 50 of the long substrate 10 to be conveyed via the power supply cord 126. In this case, the rotary distribution board 110
Rotates as shown by an arrow R in accordance with the movement of the power supply chuck 120. This prevents the cable 111 connected to the power supply chuck 120 from being twisted.
At this time, the power supply chuck 120 at the standby position sequentially moves in the direction opposite to the transport direction of the long substrate 10.

While the power supply chuck 120 is in contact with the power supply terminal 50 of the long substrate 10, power is supplied from the rotary distribution board 110 to the power supply terminal 50 of the long substrate 10 through the power supply cord 126 and the power supply chuck 120. The plating area of the scale substrate 10 is plated.

After a lapse of a predetermined time or a predetermined distance from the holding of the power supply chuck 120, the control unit releases the holding by the power supply chuck 120 by the operation air supplied through the operation air supply hose 125. Thereafter, the power supply chuck 120 returns to the standby position.

At the standby position, a contact with which the power supply chuck 120 comes into contact is provided. The control unit monitors the current flowing through the contact, thereby controlling each power supply chuck 120.
Is located at the standby position or whether the long substrate 10 is sandwiched.

Power supply chuck Power supply chuck support cable 1
04 is formed of a conductive material, and a current is supplied to the power supply chuck support cable 104 so that the power supply chuck 12 is formed.
0 may be supplied with current. Thereby, the cable 11
The power supply cord 126 in one is unnecessary.

In the plating apparatus shown in FIG. 1, while the long substrate 10 is transported in the transport direction MD with the width direction of the long substrate 10 being turned up and down by the transport roll 101, the long feeder 50 is exposed so that the power supply terminals 50 are exposed. Scale substrate 10 is plating tank 100
The plating area is immersed in the plating solution, power is supplied to the plating area from the power supply terminal 50 of the long substrate 10 via the power supply chuck 120, and the plating process is performed continuously and automatically. According to this plating apparatus, since there is no need for manual processing by a person, the quality is stabilized and the cost is reduced. Moreover, since the plating area can be plated in the state of the long substrate 10, the product does not break or wrinkle. Therefore,
The yield is improved.

In the present embodiment, the plating tank 100 corresponds to a plating solution container, the transport roll 101 corresponds to a transport unit, and the power supply chuck 120 corresponds to a power supply unit. The optical sensor 105 corresponds to a detecting unit, the operation air supply hose 125 and the power supply chuck 120 correspond to a contact unit driving unit, and the rotary distribution board 110 corresponds to a power supply unit.
Further, the power supply chuck support cable 104 corresponds to a moving cable, and the mark 300 corresponds to a detected portion.

The plating apparatus shown in FIG. 1 is used, for example, when plating a laminated film of nickel and gold on the surface of a conductor layer made of copper.

Next, a description will be given of a long substrate to be plated by the plating apparatus shown in FIG. In the following example, a long substrate for forming a plurality of magnetic head suspensions will be described.

FIG. 3 is a schematic plan view showing an example of the long substrate 10. FIG. 4 is a schematic cross-sectional view of the long substrate 10 taken along line XX in FIG. FIG. 3 shows a long substrate 1.
Only a partial area of 0 is shown.

In the long substrate 10 shown in FIG. 3, a predetermined pattern of an insulating layer 56 (see FIG. 4) made of polyimide or the like and a predetermined pattern made of copper or the like are formed on a metal substrate 51 (see FIG. 4) of stainless steel or the like. A plurality of magnetic head suspensions 1 are formed by laminating a conductor layer and a coating layer 57 of a predetermined pattern made of polyimide or the like.

At one end of the magnetic head suspension 1, four electrode pads 52 are formed, and at the other end, four electrode pads 53 are formed. The electrode pad 52 at one end and the electrode pad 53 at the other end are electrically connected by four wiring patterns 54. The electrode pad 52 is connected to a pad 55 directly formed on the metal substrate 51. In this case, the electrode pads 52 and 53, the wiring pattern 54, and the pad portion 55 correspond to a conductor layer.

The magnetic head suspension 1 is covered with a coating layer 57 except for the regions of the electrode pads 52 and 53, and the electrode pads 52 and 53 are exposed. Further, the pad portion 55 on the metal substrate 51 is also exposed.

A plurality of power supply terminals 50 are provided near one side of the long substrate 10. This power supply terminal 50
Consists of a partial region of the metal substrate 51. In FIG. 3, a region to be plated (hereinafter, referred to as a plating region) is indicated by hatching.

In this embodiment, since the pad portion 55 is formed directly on the metal substrate 51, the power supply terminal 50 is
1, the pad portion 55 is electrically connected to the electrode pad 52, and the pad portion 55 is electrically connected to the electrode pad 53 via the wiring pattern 54.

In this case, the power supply terminal 50 is connected to the metal substrate 51.
The power is supplied to the electrode pads 52 and 53 through the electrodes, and the exposed electrode pads 52 and 53 can be plated.

When plating is performed by supplying power to the power supply terminal 50, not only the exposed surfaces of the electrode pads 52 and 53, but also
The surfaces of the pad portion 55 and the metal substrate 51 are also plated. In this case, to prevent unnecessary consumption of plating material,
A resist film is formed on the entire surface of the metal substrate 51 except for the plating region and the power supply terminal 50. Thereby, the metal substrate 5
1 is prevented from being plated on the surface.

FIG. 5 is a schematic plan view showing another example of the long substrate 10. FIG. 6 is a schematic sectional view taken along line YY of the long substrate 10 in FIG. FIG. 5 shows only a partial area of the long substrate 10.

In the long substrate 10 shown in FIG. 5, an insulating layer 56 (see FIG. 6) of a predetermined pattern made of polyimide or the like and a predetermined substrate made of copper or the like are formed on a metal substrate 51 (see FIG. 6) made of stainless steel or the like. A plurality of magnetic head suspensions 1 are formed by laminating a conductor layer of a pattern and a coating layer 57 of a predetermined pattern made of polyimide or the like.

Also in this embodiment, four electrode pads 52 are formed at one end of the magnetic head suspension 1.
Four electrode pads 53 are formed at the other end.
The electrode pad 52 at one end and the electrode pad 53 at the other end are electrically connected by four wiring patterns 54. The electrode pad 52 is connected to a pad section 55 formed on the insulating layer 56. In this case, the electrode pads 52 and 53, the wiring pattern 54 and the pad portion 5
5 corresponds to the conductor layer.

A plurality of power supply terminals 50 are provided near one side of the long substrate 10. This power supply terminal 50
Are electrically connected to the pad portion 55 by a wiring pattern 58. The plurality of pad portions 55 are electrically connected to each other by a wiring pattern 59. Power supply terminal 50, electrode pads 52, 53, wiring patterns 58, 5
9 and the pad portion 55 are formed on the insulating layer 56 and are electrically insulated from the metal substrate 51. The wiring patterns 54, 58, 59 and the pad portion 55 are covered with a cover layer 57, and the power supply terminal 50 and the electrode pads 52, 5
3 is exposed.

In this example, the power supply terminal 50 is connected to the wiring pattern 5
8, the pad portion 55 is electrically connected to the electrode pad 52, and the pad portion 55 is electrically connected to the electrode pad 53 via the wiring pattern 54.

In this case, power is supplied to the electrode pads 52 and 53 through the power supply terminal 50, and the exposed electrode pads 52 and 53 are supplied.
Can be plated.

In this embodiment, since the metal substrate 51 is electrically insulated from the power supply terminal 50, the surface of the metal substrate 51 is not plated. Accordingly, it is not necessary to form a resist film for preventing the surface of the metal substrate 51 from being plated.

FIG. 7 is a schematic perspective view showing another example of the power supply means in the plating apparatus of FIG.

In the example of FIG. 7, two power supply rolls 310 are arranged at a predetermined interval along the upper end of one surface of the long substrate 10 conveyed by the transport rolls 101,
0, a power supply belt 311 is stretched. The power supply roll 310 and the power supply belt 311 are made of a conductive material such as a metal. Power is supplied to the power supply roll 310 by a power supply brush or the like.

The power supply roll 310 rotates in synchronization with the transport speed of the long substrate 10. Thereby, the power supply belt 311 moves at the same speed as the transport speed of the long substrate 10. The plurality of power supply chucks 310 sequentially hold the power supply terminal 50 and the power supply belt 311 of the long substrate 10 in synchronization with the movement of the long substrate 10. Thus, power is supplied from the power supply roll 310 to the power supply terminal 50 via the power supply belt 311 and the power supply chuck 312. In this case, each power supply chuck 3
Since there is no need to connect the power supply cord 126 to the power supply 12, the structure is simplified.

FIG. 8 is a schematic perspective view showing still another example of the power supply means in the plating apparatus of FIG.

In the example of FIG. 8, two pressing rolls 320 are arranged at a predetermined interval along the upper end of one surface of the long substrate 10 conveyed by the conveying rolls 101, and the pressing rolls 32
The presser belt 321 is stretched around 0. Long board 1
0 along the upper end of one other surface of the two feeding rolls 322
Are arranged at predetermined intervals, and a power supply belt 323 is stretched over the power supply roll 322. The power supply roll 322 and the power supply belt 323 are made of a conductive material such as a metal. Power is supplied to the power supply roll 322 by a power supply brush or the like. Embossing or the like is applied to the outer peripheral surface of the power supply belt 323 to make good electrical contact with the power supply terminals 50 of the long substrate 10.

The power supply roll 322 rotates in synchronization with the transport speed of the long substrate 10. As a result, the power supply belt 323 is moved at the same speed as the transport speed of the long substrate
Move in contact with. Therefore, the feeding roll 3
Power is supplied from the power supply 22 to the power supply terminal 50 via the power supply belt 323. In this case, since the power supply chuck is not required, the structure is simpler.

Next, a method of forming a plurality of magnetic head suspensions on the long substrate 10 will be described with reference to FIGS. FIG. 9 is a schematic plan view showing an example of the long substrate, and FIG. 10 is an enlarged plan view of a part of the long substrate in FIG.

In FIG. 9, a long substrate 10 made of stainless steel is carried in the carrying direction MD. Long substrate 10
Is, for example, 250 mm. The transport speed is, for example, 0.5 to 1 m / min. A plurality of rectangular regions 2 are provided on the long substrate 10 along the length direction. In each region 2, as shown in FIG. 10, a plurality of magnetic head suspensions 1 are formed in 8 rows in the width direction and 88 columns in the length direction. The plurality of magnetic head suspensions 1 in each area 2 constitute a wiring circuit group. The plurality of regions 2 are arranged at a period D. The cycle D is, for example, 230 mm.

As shown in FIG. 9, two power supply terminals 50 are provided for each region 2. The size of each power supply terminal 50 is about 1 cm in diameter in the case of a circle, and about 1 cm square in the case of a square.

The plating regions of the plurality of magnetic head suspensions 1 in each region 2 are electrically connected to corresponding power supply terminals 50. In the case of the embodiment shown in FIG. 5, the power supply terminals 50 of different groups are electrically independent from each other.

As in this example, it is preferable to provide a plurality of power supply terminals 50 for each region 2. In that case, even if the contact position of the power supply chuck 120 with any one of the power supply terminals 50 is shifted, the other power supply chucks 120 can contact the other power supply terminals 50.

Next, a method of manufacturing the magnetic head suspension will be described. FIG. 11 is a plan view of the magnetic head suspension. FIG. 12A is a sectional view taken along line AA of the magnetic head suspension of FIG. 11, and FIG.
FIG. 12 is a sectional view taken along line BB of the magnetic head suspension of FIG. 11.

As shown in FIG. 11, the magnetic head suspension 1 has a suspension body 20 formed by a substrate 10a made of stainless steel. A wiring pattern 25 is formed on the suspension body 20. A magnetic head mounting portion (hereinafter, referred to as a tongue portion) 24 is provided at a distal end portion of the suspension body portion 20 by forming a U-shaped opening portion 26. The tongue portion 24 is bent at a location indicated by a broken line M so as to form a predetermined angle with respect to the suspension main body portion 20.

At the end of the tongue 24, four electrode pads 22 are formed. Four electrode pads 27 are formed on the other end of the suspension body 20. Electrode pad 22 on tongue 24 and suspension body 2
0 is electrically connected to the electrode pad 27 at the other end by a wiring pattern 25. Further, a plurality of holes 28 are formed in the suspension body 20. FIG. 11 does not show a coating layer.

As shown in FIG. 12A, an insulating layer 11 made of polyimide is formed on a substrate 10a.
A chromium film 12, a conductor layer pattern 16 made of copper, and a nickel film 17 are sequentially laminated at four places on the insulating layer 11, and an electrode pad 27 made of gold is formed on the nickel film 17. The upper surface of the insulating layer 11 is covered with a coating layer 18 made of polyimide except for the upper surface of the electrode pad 27.

As shown in FIG. 12B, a chromium film 12, a conductor layer pattern 16 made of copper, and a nickel film 17 are formed at two places on one side and the other side of the insulating layer 11, respectively. Are sequentially stacked. 2 on each side
The set of the chromium film 12, the conductor layer pattern 16, and the nickel film 17 are covered with a covering layer 18 made of polyimide. Thereby, the wiring pattern 25 is formed.

Here, the manufacturing process of the magnetic head suspension shown in FIG. 11 will be described. FIGS. 13, 14 and 15 are schematic sectional views showing the steps of manufacturing the magnetic head suspension of FIG.

First, as shown in FIG.
On a substrate 10a made of stainless steel of 5 to 50 μm,
Photosensitive polyimide resin precursor 11a having a thickness of 5 to 25 μm
Is applied. Next, as shown in FIG. 13B, the photosensitive polyimide resin precursor 11a on the substrate 10a is applied to the photosensitive polyimide resin precursor 11a on the substrate 10a through a predetermined mask in an exposure machine at 200 to 700 mJ / cm.
^The insulating layer 11 made of polyimide is formed by irradiating the substrate with ultraviolet light.

Then, as shown in FIG. 13 (c), a chromium film 12 having a thickness of 100 to 600 ° and a thickness of 500 to 2000 ° are formed on the substrate 10a and the insulating layer 11 by continuous sputtering of chromium and copper. 0.6Ω /
□ A copper plating base 13 having the following sheet resistance is formed in order.

Next, as shown in FIG. 13D, a plating resist 14 having a predetermined pattern is formed on the copper plating base 13. Then, as shown in FIG. 13E, a copper plating layer 15 having a thickness of 2 to 15 μm is formed in the opening of the resist 14 by electrolytic plating of copper. In this embodiment, the thickness of the copper plating layer 15 is about 10 μm.

Next, as shown in FIG. 14 (f), after the resist 14 is removed, the copper plating base 13 is removed by etching with an alkaline treatment solution to form a conductor layer pattern 16 made of copper. Further, as shown in FIG. 14 (g), the chromium film 12 exposed on the substrate 10a and on the insulating layer 11 is removed by etching with an alkaline processing solution (potassium ferricyanide solution).

Next, as shown in FIG. 14H, a nickel film 17 having a thickness of 0.05 to 0.1 μm is formed on the substrate 10a and the conductor layer pattern 16 by electroless plating of nickel. The nickel film 17 is provided for improving the adhesion between the conductor layer pattern 16 and the coating layer 18 and for preventing migration of copper.

Next, as shown in FIG. 14 (i), a photosensitive polyimide resin precursor is applied on the nickel film 17 and the insulating layer 11, and an exposure process, a heating process, a developing process and a heat curing process are sequentially performed. Accordingly, the thickness 3 having a predetermined pattern is formed on the insulating layer 11 and the nickel film 17.
A coating layer 18 made of polyimide having a thickness of about 5 μm is formed.
In this case, an opening 19 for forming an electrode pad is provided at a predetermined position of the coating layer 18. Further, a part of the nickel film 17 is exposed as the lead portion 29 for electrolytic plating of the electrode pad. In this case, the lead portion 29 for electrolytic plating is
Corresponding to the pad portion 55. The lead portion 29 for electrolytic plating is in contact with the substrate 10a.

Next, as shown in FIG. 15 (j), after the exposed nickel film 17 is peeled off, the thickness of the coating layer 18 is formed in the opening 19 by electrolytic plating using the plating apparatus of FIG. 1-5 μm nickel film 21 and thickness 1-5 μm
The electrode pad 22 made of gold is formed. In this case, in order to prevent unnecessary consumption of gold, the surface of the conductive layer pattern 16 made of copper in the opening 19 is covered with a resist film. Thereafter, as shown in FIG. 15K, the lead portion 29 for electrolytic plating of the electrode pad is removed by etching.

Next, as shown in FIG.
A photoresist 23 having a predetermined pattern is formed on Oa and the coating layer 18. Then, as shown in FIG. 15 (m), the substrate 10a is etched using a ferric chloride solution and a cupric chloride solution to form an opening 26, and then the photoresist 23 is removed. Finally, water washing is performed. Thus, the magnetic head suspension 1 shown in FIG. 11 is manufactured.

As described above, when the plating apparatus shown in FIG. 1 is used, the plating regions of the plurality of magnetic head suspensions 1 can be continuously and automatically plated. It can be performed in the state of a scale substrate.

The plating apparatus and the plating method of the present invention are not limited to the case of plating a laminated film made of nickel and gold on the surface of a conductor layer made of copper. It can be used when doing. Further, the plating apparatus and the plating method of the present invention can be used not only when a magnetic head suspension is formed but also when various wiring boards such as a flexible circuit board are formed on a long board.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a plating apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a detailed structure of a power supply chuck in the plating apparatus of FIG.

FIG. 3 is a schematic plan view showing an example of a long substrate.

4 is a schematic cross-sectional view of the long substrate of FIG. 3 taken along line XX.

FIG. 5 is a schematic plan view showing another example of a long substrate.

6 is a schematic cross-sectional view taken along line YY of the long substrate of FIG.

FIG. 7 is a perspective view showing another example of the power supply means in the plating apparatus of FIG.

FIG. 8 is a perspective view showing still another example of the power supply means in the plating apparatus of FIG.

FIG. 9 is a schematic plan view showing an example of a long substrate.

FIG. 10 is an enlarged plan view of a part of the long substrate of FIG. 9;

FIG. 11 is a plan view of a magnetic head suspension.

12 is a sectional view of the magnetic head suspension of FIG.
It is a line sectional view and a BB line sectional view.

FIG. 13 is a schematic process sectional view showing the process of manufacturing the magnetic head suspension of FIG. 11;

FIG. 14 is a schematic process sectional view showing a process of manufacturing the magnetic head suspension of FIG. 11;

FIG. 15 is a schematic process sectional view showing a process of manufacturing the magnetic head suspension of FIG. 11;

[Explanation of symbols]

 Reference Signs List 1 magnetic head suspension 10 long substrate 10a substrate 50 power supply terminal 51 metal substrate 52, 53 electrode pad 54 wiring pattern 55 pad portion 56 insulating layer 57 covering layer 58, 59 wiring pattern 101 transport roll 102, 103 pulley 104 power feeding chuck support cable Reference Signs List 105 Optical sensor 110 Rotary distribution board 111 Cable 120, 312 Power supply chuck 121 Nipping part 121a Contact part 122 Micro air cylinder 123 Winding spring 124 Hinge part 125 Operation air supply hose 126 Power supply code 300 Mark 310, 322 Power supply roll 311, 323 Power supply Belt 320 Presser roll 321 Presser belt

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) G11B 5/60 G11B 5/60 P 21/21 21/21 C H05K 3/18 H05K 3/18 NF term (reference) 4K024 AA03 AA09 AA11 AB04 AB08 AB15 AB17 BA04 BB11 BC01 CB01 CB03 CB04 CB10 CB26 EA04 FA05 5D042 NA01 PA10 TA07 5D059 AA01 BA01 DA31 DA36 EA08 5E343 AA03 AA18 AA22 AA33 BB23 BB24 BB24 BB23 BB24 BB38

Claims (10)

[Claims] 1. A method of plating a long substrate for forming a wiring board, wherein the long substrate has a plating region to be plated and is electrically connected to the plating region on at least one side. The long substrate is immersed in a plating solution such that the power supply terminals are exposed while the long substrate is transported in the length direction with the width direction of the long substrate facing up and down. And supplying power to the plating area from the power supply terminal. 2. The long substrate has a conductor pattern of a predetermined pattern laminated on a metal substrate via an insulation layer of a predetermined pattern, the conductor layer has the plating region, and the power supply terminal is formed of the conductor. The plating method for a long substrate according to claim 1, wherein the plating method is electrically connected to the layer. 3. The method according to claim 2, wherein the power supply terminal comprises an exposed area of the metal substrate, and the conductor layer is electrically connected to the metal substrate. 4. The power supply terminal is electrically connected to the conductor layer via a predetermined conductive pattern.
The plating method for a long substrate according to claim 2, wherein the conductive layer and the conductive pattern are insulated from the metal substrate by the insulating layer. 5. A plating apparatus for plating a long substrate for forming a wiring board, wherein the long substrate has a plating region to be plated and is electrically connected to the plating region on at least one side. And a plating solution storage section for storing a plating solution, and the long substrate is transported in the longitudinal direction with the width direction of the long substrate facing up and down. Transport means for immersing the plating terminal in the plating solution so as to expose the power supply terminal; and power supply means for supplying power to the plating area from the power supply terminal of the long substrate transported by the transport means. A plating apparatus for a long substrate. 6. The power supply means includes: a contact portion provided so as to be capable of electrically contacting the power supply terminal of the long substrate; a detection means for detecting information on a position of the power supply terminal; Based on the detection result, the contact portion is brought into electrical contact with the power supply terminal of the long substrate, and the contact portion of the long substrate is synchronized with a transport speed of the long substrate by the transport unit. 6. The power supply device according to claim 5, further comprising: a contact part driving unit that releases the contact part from the power supply terminal after being moved in the transport direction; and a power supply part that supplies power to the power supply terminal through the contact part. Plating device for shaku substrate. 7. A plurality of wiring circuit groups each including a predetermined number of wiring circuit patterns are formed on the long substrate, and the predetermined number of wiring circuit patterns of each wiring circuit group correspond to the plating region. 7. The power supply terminal according to claim 6, wherein one or a plurality of the power supply terminals are provided for each of the wiring circuit groups, the power supply terminals being electrically connected to the plating area of the predetermined number of wiring circuit patterns. Plating device for shaku substrate. 8. The power supply means includes a plurality of the contact portions, and the contact portion drive means includes a plurality of the contact portions provided on the power supply terminals provided for each wiring circuit group of the long substrate. To
The plating apparatus for a long substrate according to claim 7, wherein the long substrate is sequentially contacted and sequentially moved in a transport direction of the long substrate, and then sequentially released from the power supply terminal. 9. The power supply unit further includes a moving cable that moves in synchronization with a transfer speed of the long substrate by the transfer unit, wherein the contact unit driving unit is configured to output a signal based on a detection result of the detection unit. The contact portion is electrically connected to the power supply terminal of the long substrate and is fixed to the moving cable. After the contact portion moves with the long substrate for a predetermined time or a predetermined distance, the contact portion is moved to the length. The plating apparatus for a long board according to any one of claims 6 to 8, wherein the plating apparatus is released from the power supply terminal of the long board and the moving cable. 10. A detection unit is provided on the long substrate as information on the position, and the detection unit detects information on the position of the power supply terminal by detecting the detection unit. The plating apparatus for a long substrate according to any one of claims 5 to 9, wherein: