JPH0617290A - Plating treatment device for hoop material - Google Patents

Abstract

PURPOSE:To shorten the distances at which a hoop material comes into contact with air and to enable the continuous execution of a plating treatment with good quality by passing the hoop material through the inside of tanks from which respective liquid chemicals are allowed to overflow at the time of transporting the hoop material straight in the approximately horizontal direction within plural liquid chemical treatment sections. CONSTITUTION:The hoop-shaped frame F is successively transported in perpendicularly upright state rectilinearly in the approximately horizontal direction in an electrolytic degreasing treatment region A, frame etching treatment region B, a solder plating region C, a neutralizing and final cleaning region D and a drying treatment region E, by this, the frame is subjected to a plating treatment. The liquid chemicals in the respective reservoir tanks 15 are sucked up respectively into the overflow tanks 16 and the hoop material F is passed in these liquid chemicals in the regions A, B, C at the time. The liquid chemical in the reservoir tank 24 is blown to the hoop material F via nozzles 25 in the region D. As a result, the distances between the respective liquid chemical treatment regions A, B, C, D, E are shortened to lessen the contact of the hoop material F stuck with the liquid chemicals with air and the reception of the adverse influence thereof, such as discoloration or oxidation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for plating a hoop material, in which all the chemical solutions necessary for the plating processing are carried out while the hoop material is passed through each chemical solution processing section in series. Regarding what you did.

[0002]

2. Description of the Related Art Semiconductor devices such as transistors, ICs, and diodes are manufactured using a manufacturing frame. That is, this manufacturing frame is formed by punching a thin metal plate such as copper or iron so that the island portion on which the semiconductor chip is to be mounted and a single partition portion including a predetermined number of lead portions are continuous in the longitudinal direction. Has been done.

The process steps to be performed on the manufacturing frame to manufacture the semiconductor device are a chip bonding process for mounting a semiconductor chip on the island portion, and pads and leads on the chip thus bonded. Wire bonding process for connecting parts, packaging process for packaging such chip bonding part and wire bonding part by resin molding method, marking process for printing lot number, manufacturer name or product symbol on resin package part, characteristic inspection There are an inspection process for removing defective products by performing a lead cutting process for separating the leads from the manufacturing frame and performing a predetermined forming on the leads. The electrical connection between the chip and the leads bonded on the island is performed by wire bonding as described above,
For example, in the case of manufacturing a capacitor, the lead may be directly welded on the capacitor chip or may be connected by a fuse member. However, in the state in which the resin packaging process is completed, as long as the manufacturing frame is a manufacturing frame for resin package type electronic parts, the resin package parts are formed at regular intervals on predetermined portions on the frame. It has a similar form.

The manufacturing frame that has undergone the resin packaging process is usually subjected to solder plating. Such solder plating treatment includes electrolytic degreasing treatment tank, subsequent cleaning treatment tank, frame etching treatment tank, subsequent cleaning treatment tank, acid activation treatment tank, solder plating treatment tank,
This is performed by successively immersing the manufacturing frame that has undergone the resin packaging process in a plurality of chemical liquid processing tanks including a subsequent cleaning processing tank, a neutralization processing tank, and a subsequent cleaning processing tank.

In order to perform each chemical solution treatment without any inconvenience, it is required to minimize the time for moving in the air after being immersed in one chemical solution treatment tank. This is because if the substrate is left in the air after being dipped in the treatment liquid, discoloration due to oxidation occurs in a few seconds to a few tens of seconds, which deteriorates the quality of the plating treatment.

On the other hand, the frame for manufacturing an electronic component such as the semiconductor device has a strip shape, or a so-called hoop shape having a shape in which the strip-shaped production frames are connected in series in the longitudinal direction. There is a manufacturing frame.
In the process of manufacturing an electronic component using the strip-shaped manufacturing frame, in order to perform the solder plating treatment described above, a large number of strip-shaped frames are held in a basket, and the basket is filled with the chemical liquid in each of the processing tanks. The method of sequentially dipping is adopted. In this case, in order to shorten the time for moving in the air between the processing liquid tanks, it can be easily dealt with by increasing the moving speed of the basket.

By the way, in the case where a hoop-shaped manufacturing frame is used to pass each process in series while sequentially performing each process, even in the plating process, the pre-process (resin packaging process) is performed. When it is considered that the hoop-shaped frame sent from the apparatus is continuously passed through each chemical bath constituting the plating apparatus, the following problems to be solved are found.

That is, when carrying out all the process equipment for manufacturing electronic parts while carrying the hoop-shaped manufacturing frame in series as described above, the carrying speed of the hoop-shaped frame is , It must be set according to the process equipment with the slowest operating speed. In particular, regarding the resin packaging process, even if the number of unit electronic components that can be molded by one pressing operation is increased by forming a large number of cavities in the mold, the mold is closed from the mold open state, A certain time is inevitably required for the operation of one cycle including the resin injection and the curing process. Therefore, the average transfer speed of this hoop-shaped frame is currently 1 to 2 m per minute. .

When performing a solder plating treatment while further transporting such a hoop-shaped frame in series, the speed at which each of the chemical liquid tanks constituting the solder plating treatment apparatus passes is also
The above-mentioned relatively slow speed is unavoidable.
Then, if the hoop-shaped frame is sequentially submerged in each chemical solution tank and transported, it takes a relatively long time until the hoop-shaped frame exposed in the air from one chemical solution tank enters the next chemical solution tank. Therefore, the hoop-shaped frame is exposed to the air and is oxidized or discolored, which has a detrimental effect on the plating quality.

Therefore, in the case of manufacturing an electronic component using the hoop-shaped frame, the plating apparatus for performing the plating processing on the hoop-shaped frame is simply arranged with a plurality of chemical solution tanks in series. At the same time, with the configuration in which the hoop-shaped frame is sequentially submerged in each chemical solution tank, satisfactory plating cannot be performed at all.

Therefore, an object of the present invention is to continuously transfer a hoop material such as a hoop-shaped frame and perform a predetermined plating treatment on the hoop material so that the hoop material is turned into air between adjacent chemical solution tanks. By shortening the contact distance, it is possible to perform plating processing on the hoop material without inconvenience.

Further, according to the present invention, in the production of electronic parts using the hoop-shaped frame, in practice, the transportation speed of the hoop-shaped frame must be relatively low. It is also an object to prevent deterioration in processing quality due to unevenness and unevenness in temperature so that better plating can be performed.

Further, according to the present invention, the amount of the chemical liquid attached to the hoop material that has passed through one chemical liquid tank and sent to the succeeding chemical liquid tank is reduced as much as possible to prevent the chemical liquid in each chemical liquid tank from being contaminated. It is also an object to reduce the number and to improve the plating quality by this.

[0014]

In order to solve the above problems, the present invention improves the following technical means.
The invention described in claim 1 of the present application is an apparatus that is provided with a plurality of chemical liquid processing units in series, and performs a predetermined plating process on the hoop material by passing the hoop material through each chemical liquid processing unit. While being conveyed between the respective chemical liquid processing units as a whole in a substantially straight line in the horizontal direction, at least one of the plurality of chemical liquid processing units is arranged in the reserve tank and is pumped up from the reserve tank. An overflow tank for overflowing the chemical liquid is provided, and the hoop material is configured to pass through the chemical liquid in the overflow tank.

Further, in the invention described in claim 2 of the present application, in the plating apparatus of claim 1, the hoop material is conveyed in a vertical upright state, and the overflow tank is arranged in a conveying direction of the hoop material. The front and rear walls facing each other are provided with vertical slits through which the hoop material conveyed in the vertical standing state can pass.

Further, in the invention of claim 3 of the present application, in the plating apparatus of claim 2, the vertical slit is provided with a liquid draining curtain member for elastically sandwiching the hoop material passing therethrough from both sides.

The invention according to claim 4 of the present application is
An apparatus for providing a plurality of chemical liquid processing units in series, and performing a predetermined plating process on the hoop material by passing the hoop material through each chemical liquid processing unit, wherein the hoop material is generally horizontal between the chemical liquid processing units. At least one of the plurality of chemical liquid processing units is conveyed linearly in the direction, and at least one of the plurality of chemical liquid processing units is disposed in the reserve tank and the chemical liquid pumped from the reserve tank or introduced from the outside is the hoop. It is characterized in that it is configured by a nozzle that jets toward the material.

Further, in the invention of claim 5, the above-mentioned claim 4 is adopted.
In the plating apparatus, the hoop material is conveyed in a vertical upright shape, and the nozzles are composed of at least a pair of nozzles arranged at both ends of the vertical upright hoop material.

In each of the above inventions, as the hoop material, there is, for example, a hoop-shaped frame for manufacturing electronic parts which has undergone the resin packaging process (claim 6).

Further, the plating treatment in each of the above-mentioned inventions includes, for example, the case where the hoop-shaped frame for manufacturing an electronic component after the resin molding process is subjected to the solder plating treatment (claim 7).

Further, the invention according to claim 8 of the present application is the electrolytic degreasing treatment section, the subsequent cleaning treatment section, the etching treatment section, the subsequent cleaning treatment section, the acid activation treatment section, the solder plating treatment section, Cleaning process part, neutralization process part,
A cleaning treatment unit subsequent to this, which is provided with a plurality of chemical liquid treatment units in series, is a device for performing a solder plating process on the hoop material through a hoop material through each chemical liquid treatment unit, and the hoop material is The electrolytic degreasing treatment part and the solder plating treatment part are arranged in the reserve tank and the chemical liquid pumped from the reserve tank while being conveyed linearly in a substantially horizontal direction between the chemical solution treating parts as a whole. With the overflow tank for overflowing, the hoop material is configured to pass through the chemical liquid in the overflow tank, each of the cleaning processing unit,
It is characterized by comprising a reserve tank and a nozzle which is disposed in the reserve tank and which injects a chemical liquid pumped from the reserve tank or introduced from the outside toward the hoop material.

Further, in the invention according to claim 9 of the present application, in the solder plating apparatus according to claim 8, the hoop material is conveyed in a vertical upright state, and the overflow tank conveys the hoop material. The front and rear walls facing each other have vertical slits through which the hoop material conveyed in the vertical upright shape can pass, and the nozzles are at least a pair of both sides arranged on both sides of the vertical upright hoop material. It is composed of nozzles.

[0023]

For example, when the hoop material is subjected to the solder plating treatment, the hoop material is sequentially subjected to electrolytic degreasing treatment, etching treatment, acid activation treatment, solder plating treatment and neutralization treatment. Thus, a cleaning processing unit for rinsing the processing chemical liquid is arranged so as to follow the processing unit that performs each of the above processes. Therefore, more specifically, such a solder plating apparatus includes an electrolytic degreasing processing section, a cleaning processing section for cleaning the electrolytic degreasing processing solution, an etching processing section, a cleaning processing section for cleaning the etching processing solution, and an acid. The activation processing section, the solder plating processing section, the cleaning processing section for cleaning the solder plating processing solution, the neutralization processing section, and the cleaning processing section for cleaning the neutralization processing solution are arranged in series. Following this series of processing units,
Generally, a drying processing unit is arranged.

As is apparent from the above, in the present invention, the term "chemical solution treatment section" is used in addition to the "electrolytic degreasing treatment section", "etching treatment section", "acid activation treatment section" and "solder plating treatment section". A “cleaning processing unit” for cleaning the processing liquid is also included in the meaning.

In the present invention, the hoop material is passed through the plurality of chemical liquid processing sections in series, but in particular, the hoop material is conveyed in a substantially horizontal linear shape. As a result, the distance of the hoop material passing from one chemical liquid processing section to the following chemical liquid processing section is shortened by that much, and as a result, the length of the hoop material that comes into contact with air after passing through the one chemical liquid processing section. Can be shortened, and inconveniences such as discoloration or oxidation can be reduced.

Further, in the present invention, the following two configurations can be selected as the configuration of the chemical liquid processing section. That is, the first is that the chemical liquid processing section is provided with a reserve tank and an overflow tank which is disposed in the reserve tank and overflows the chemical liquid pumped up from the reserve tank.

By using a two-tank system including an overflow tank, the following effects can be expected.
First, since the chemical solution stored in the reserve tank is circulated in the overflow tank, the external dimensions of the overflow tank can be made small even if the chemical solution storage capacity in the reserve tank is increased. Therefore, the shape and arrangement of the overflow tank can be freely set, for example, by making the distance between the overflow tank and the front and rear chemical solution processing units small. For this reason,
After passing through this overflow tank, it is possible to easily reduce the length of contact of the hoop material with the air up to the subsequent chemical solution treatment section, so that the hoop material with the chemical solution touches the air. Inconveniences such as discoloration or oxidation can be more reliably avoided.

Secondly, since the chemical liquid is in a flow state in the overflow tank, the hoop material passing through the chemical liquid is uniformly processed, and therefore the processing quality can be made constant. As a more specific method for transporting the hoop material to such an overflow tank in a straight line in the horizontal direction, as described in claim 2, the hoop material is in a vertical upright shape instead of horizontal. It is conceivable that the hoop material is conveyed, and vertical slits are provided in the front and rear walls of the overflow tank, and the hoop material is passed through the vertical slits.

By doing so, for example, in the plating process portion, by arranging the solder electrodes on both sides of the hoop material which advances vertically in the overflow tank, uniform solder treatment is performed on both front and back surfaces of the hoop material. In addition, it is possible to expect an effect that the hoop material that has passed through the overflow tank is completely drained from the overflow tank, and contamination of the cleaning liquid in the subsequent cleaning processing unit can be suppressed as much as possible.

As described in claim 3, if the vertical slit is provided with a liquid draining curtain member that elastically sandwiches the hoop material passing through the vertical slit from both sides, the liquid drainage described above occurs. Even better, the above-mentioned action of delaying the contamination of the cleaning liquid is achieved to a higher degree.

The second specific constitution of the chemical liquid treating section is, as described in claim 4, a reserve tank, and is arranged in the reserve tank and is pumped up from the reserve tank or introduced from the outside. And a nozzle for ejecting the chemical liquid to the hoop material.

Such a construction is most suitable as a construction of the cleaning processing section, and in the case of a solder plating apparatus as an example, the construction also relates to an etching processing section, an acid activation processing section and a neutralization processing section which do not require electrodes. Can be adopted. When the chemical solution is jetted to the hoop material by the nozzle in this manner, the chemical solution whose concentration and temperature are controlled can be uniformly sprayed on the hoop material, and the stability of the treatment can be achieved. It is possible to reduce the length of the processing unit in the transport direction.

Further, as described in claim 5, when the hoop material is conveyed vertically upright, by disposing a pair of nozzles on the left and right sides of the hoop material, both sides of the hoop material are arranged. It is possible to achieve a uniform chemical solution treatment with respect to the above, and it is possible to improve the liquid run-out after finishing this treatment.

As described above, the apparatus for plating a hoop material according to the present invention is configured such that the hoop material is passed through a plurality of chemical liquid processing sections in series, and the hoop material is aired between the chemical liquid processing sections. Since the distance to touch the hoop can be shortened, even if the transportation speed of the hoop material is relatively slow, it eliminates the inconvenience that the hoop material with the chemical solution discolors or oxidizes when it comes into contact with the air. The processing can be continuously performed.

Further, this means that when an electronic component such as a semiconductor device is manufactured by sequentially passing through each process of a hoop-shaped manufacturing frame, the plating device is also used as a series of transfer paths for the hoop material. This means that the continuous arrangement is possible only for the first time, and the overall improvement in the electronic component manufacturing efficiency due to this is remarkable.

[0036]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a side sectional view schematically showing an overall configuration of an embodiment of a hoop material plating apparatus 1 of the present invention. In this example,
In this example, the hoop-shaped frame F for manufacturing electronic parts is configured to be subjected to solder plating.

The hoop-shaped frame F is conveyed rightward in FIG. 1 so that the entire plating apparatus 1 runs in a straight line in the horizontal direction. The device 1 is roughly divided into four regions in the transport direction of the frame F. In FIG. 1, a region indicated by reference symbol A is an electrolytic degreasing treatment region for forming a base on the frame, a region indicated by reference symbol B is a frame etching treatment region, and a region indicated by reference symbol C is a solder plating treatment region. , The area indicated by the symbol D indicates the neutralization and final washing area, and the area indicated by the symbol E indicates the drying treatment area.

The electrolytic degreasing area A is the electrolytic degreasing section 2
And the subsequent two-step cleaning processing parts 3a and 3b. The frame etching processing area B is composed of the etching processing part 4 and the subsequent three-step cleaning processing parts 5a and 5b.
b, 5c, and solder plating area C
Is composed of an acid activation processing section 6, a solder plating processing section 7 following this, and two subsequent cleaning processing sections 8a and 8b. The neutralization and final cleaning area D is a neutralization processing section. Section 9 and four subsequent cleaning processing sections 10a, 10
b, 10c and 10d. In addition, in the drying processing area E, the frame F is conveyed so as to penetrate the inside of the drying processing chamber 11, and the hot air is blown thereto.

A resin packaging process apparatus is arranged in the preceding stage of the plating apparatus 1, and the hoop-shaped frame F discharged from the apparatus is intermittently fed, for example, via a buffer section (not shown). While being converted from continuous feed to continuous feed, they are successively introduced into the plating processing apparatus 1. Further, the hoop-shaped frame F which has finished passing through the plating processing apparatus 1 is sent to, for example, a measurement process apparatus, where it is subjected to specific measurement and rejected defective products.
The plating apparatus 1 also includes the above-mentioned areas A, B,
Each of C, D, and E is partitioned by a partition wall 12, and an exhaust pipe 13 is connected to each of the regional spaces thus partitioned to ventilate each of the regional spaces.

In each processing region, the number of cleaning treatment units is two or four stages. For example, the cleaning treatment unit in the first stage performs rough cleaning with city water and the cleaning treatment in two or less stages. In order to use high-purity cleaning water such as ion-exchanged water or pure water, it is possible to achieve a high degree of cleaning while saving the amount of ion-exchanged water or pure water used. Is.

As can be seen from FIG. 1, in the plating processing apparatus 1 of this embodiment, a large number of processing sections are arranged in series in the frame F transport direction, and each processing section is partitioned by a partition wall 14. ing. Of course, it goes without saying that the partition walls 14 are formed with slits or holes through which the frame F can penetrate.

In this embodiment, the electrolytic degreasing processing section 2, the etching processing section 4, and the solder plating processing section 7 among the above processing sections are stored in a reserve tank 15 for storing a chemical solution.
And an overflow chamber 16 arranged in the reserve tank 15 to overflow the chemical liquid pumped up from the reserve tank.

That is, taking the solder-plated portion 7 as an example, as shown in FIG. 1 and FIG.
Before and after partitioning each processing unit in the transport direction of
And the side walls 17, 17 facing the frame F in a direction orthogonal to each other.
And a bottom wall 18 for storing a chemical solution 1
5 and has a height sufficient to allow the frame F to pass vertically through the space above the reserve tank 15, and the solder electrodes 19, 1 on both sides with the frame F sandwiched therebetween.
Overflow tank 16 with a width sufficient to accommodate 9
Are arranged. The size of the overflow tank 16 in the front-rear direction is set to be slightly shorter than the distance between the front and rear partition walls of the reserve tank 15.

The reserve tank 15 and the overflow tank 16 are communicated with each other by a conduit 20, and the chemical solution in the reserve tank 15 is fed to the overflow tank 16 at an intermediate portion of the conduit 20. The pump 21 is installed. Therefore, while the pump 21 is operating, the chemical liquid in the reserve tank 15 is pumped up to the overflow tank 16 through the pipe 20 and overflows from the upper edge of the overflow tank 16 to be again in the reserve tank 16. A cycle of falling into the air is achieved.

The front and rear walls 16 of the overflow tank 16
As shown in detail in FIG. 4, a slits 22 for passing the hoop-shaped frame F vertically upright are formed in a and 16b, and the hoop-shaped frame F is inserted into the slits 22 from the left and right sides. The liquid drain curtain member 23 is attached so as to be elastically sandwiched. The liquid drain curtain member 23 is formed of, for example, a fluororesin or the like that is resistant to corrosion by a chemical liquid.

The structure of the electrolytic degreasing unit 2 is the same as the structure of the solder plating unit 7 described above, but for the frame etching unit 4, it is necessary to dispose electrodes in the overflow tank 16. As shown in FIG. 3, the lateral width can be made extremely small because there is no gap.

According to the two-tank type immersion chemical treatment unit having the overflow tank 16 as described above, the shape and arrangement position of the overflow tank 16 can be freely set even if the chemical storage capacity of the reserve tank 15 is increased. Therefore, it is easy to make the position of the end portion of the overflow tank 16 in the front-rear direction so that the distance between the overflow tank 16 and the adjacent processing portion is as small as possible.
Coupled with the fact that the frame F is transported in a straight line as a whole, the length of the frame part that exits the overflow tank and travels in the air can be shortened, and discoloration due to contact with the air while the chemical solution remains attached Alternatively, it is possible to conveniently eliminate inconveniences in plating such as oxidation.

Further, since the chemical solution is constantly flowing in the overflow tank 16, the processing of the frame by the chemical solution is uniformly performed, which also greatly contributes to the improvement of the quality of the plating process as a whole. Further, as compared with the conventional chemical liquid treatment tank of the chemical liquid storage type, it is possible to reduce the amount of the chemical liquid, which makes it possible to make the entire apparatus compact.

Further, in the embodiment, since the hoop-shaped frame F is conveyed vertically, the liquid from the frame which has finished passing through the overflow tank 16 is well drained, which allows the subsequent cleaning processing section to perform the cleaning. Contamination of the cleaning liquid can be minimized, the cleaning degree can be increased, and the amount of cleaning water with high purification such as ion-exchanged water or pure water can be saved. Note that this is, as mentioned above,
This can be achieved to a higher degree by providing the liquid drain curtain member 23 in the slits 22 provided in the front and rear walls 16a and 16b of the overflow tank 16.

Further, in the plating processing apparatus of this embodiment, the cleaning processing sections 3a, 3b, 5a, 5b, 5c, 8a, 8b, 10 arranged in the latter part of the above processing areas.
a, 10b, 10c, 10d and the acid activation processing unit 6,
The neutralization processing unit 9 is a chemical liquid (or cleaning water) that is pumped up from the reserve tank 24 or introduced from the outside.
Are jetted to the frame F which is vertically erected by the nozzle 25.

That is, as shown in detail in FIG. 5, the partition wall 14 for partitioning the front and rear of each processing unit and the partition wall 1 arranged on the left and right sides.
7 and the bottom wall 18 constitute a reserve tank 24, and at least a pair of left and right nozzles 25a, 25b are arranged above the reserve tank 24 so as to sandwich the frame F running in the front-rear direction.
4 and the nozzle 25 are connected by a pipe 27 with a pump 26 interposed. When cleaning with city water, the city water pipe is directly connected to the nozzle 25.

In the above-mentioned structure, the frame F for manufacturing electronic parts is conveyed in a series from the resin packaging process.
Despite being transported through the plating equipment at a relatively slow speed, the distance traveled in air after each chemical treatment is short. Or, a situation such as discoloration which is inconvenient for the plating process is effectively avoided, and high-quality plating process is continuously performed.

According to the present invention, when the hoop-shaped manufacturing frame is used, it is practically the first time that the plating processing apparatus is also continuously connected to the processing apparatus for each process of chip bonding, wire bonding and resin packaging. It has become possible, and the efficient improvement in electronic component manufacturing due to this is extremely remarkable.

Of course, the scope of the present invention is not limited to the above embodiments. In the embodiment, among the chemical liquid treatment parts required for the plating treatment, a part is a two-tank type immersion treatment type having an overflow bath, and a part is a type for ejecting the chemical liquid by a nozzle. It is also within the scope of the present invention that all of the above are of a two tank type having an overflow tank. Further, regarding the plating processing apparatus, as the configuration of the frame etching processing unit,
It is also possible to replace it with a structure having a reserve tank and an injection nozzle. Further, as the chemical solution used for the frame etching processing section, an appropriate etching solution is used according to the frame forming material.

Further, although the above-mentioned embodiment is for the case where the hoop-shaped frame for manufacturing the electronic component is subjected to the solder plating treatment, the subject to be subjected to the plating treatment is for the electronic component production. The frame is not limited to. Also, the type of plating treatment is not limited to solder plating.

[Brief description of drawings]

FIG. 1 is a side sectional view of an embodiment of a hoop material plating apparatus of the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG.

3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a perspective view showing an example of a reserve tank, slits in front and rear walls, and a liquid draining curtain member.

5 is a sectional view taken along line VV of FIG.

[Explanation of symbols]

 1 Plating processing device A Electrolytic degreasing processing area B Frame etching processing area C Solder plating processing area D Neutralization and final cleaning area E Drying processing area 2 Electrolytic degreasing processing part 3a, 3b Cleaning processing part 4 Frame etching processing part 5a, 5b, 5c Cleaning processing section 6 Acid activation processing section 7 Solder plating processing section 8a, 8b Cleaning processing section 9 Neutralization processing section 10a, 10b, 10c, 10d Cleaning processing section 15 Reserve tank 16 Overflow tank 16a, 16b Front and rear wall 20 Pipe line 21 Pump 22 Slit 23 Curtain member 24 Reserve tank 25 Nozzle 26 Pump 27 Piping F Hoop frame

Claims (9)

[Claims] 1. An apparatus for providing a plurality of chemical liquid processing units in series, and passing a hoop material through each chemical liquid processing unit to perform a predetermined plating treatment on the hoop material, wherein the hoop material is between the chemical liquid processing units. While being transported in a substantially horizontal straight line as a whole, at least one of the plurality of chemical liquid processing units is a reserve tank and an overflow tank which is disposed in the reserve tank and overflows the chemical liquid pumped up from the reserve tank. And a hoop material plating apparatus, wherein the hoop material is configured to pass through the chemical liquid in the overflow tank. 2. The hoop material is conveyed vertically, and the overflow tank passes through the front and rear walls facing in the conveyance direction of the hoop material, the hoop material being conveyed vertically. The plating apparatus according to claim 1, further comprising a vertical slit. 3. The plating apparatus according to claim 2, wherein the vertical slit is provided with a liquid drain curtain member that elastically sandwiches a hoop material passing therethrough from both sides. 4. An apparatus comprising a plurality of chemical liquid processing units in series, and performing a predetermined plating process on the hoop material by passing the hoop material through each chemical liquid processing unit, wherein the hoop material is between the chemical liquid processing units. While being transported in a substantially horizontal straight line as a whole, at least one of the plurality of chemical liquid processing units is arranged in the reserve tank and in the reserve tank, and is pumped from the reserve tank or introduced from the outside. And a nozzle for injecting a chemical solution toward the hoop material. 5. The hoop material is conveyed in a vertical upright shape, and the nozzles are constituted by at least a pair of nozzles arranged at both ends of the vertical hoop material. Plating equipment. 6. The plating apparatus according to claim 1, wherein the hoop material is a hoop-shaped frame for manufacturing an electronic component that has undergone a resin molding process. 7. The plating processing apparatus according to claim 1, wherein the series of chemical liquid processing sections is for performing a solder plating process on the hoop material. 8. An electrolytic degreasing treatment section, a cleaning treatment section subsequent thereto, an etching treatment section, a cleaning treatment section subsequent thereto, an acid activation treatment section, a solder plating processing section, a cleaning treatment section subsequent thereto,
An apparatus for performing a solder plating process on the hoop material by passing a hoop material through each of the chemical solution processing sections, which comprises a plurality of chemical solution processing sections including a neutralization processing section and a subsequent cleaning processing section. While the hoop material is conveyed linearly in a substantially horizontal direction as a whole between the chemical liquid treatment parts, the electrolytic degreasing treatment part and the solder plating treatment part are
Reserve tank and disposed in the reserve tank, and with an overflow tank for overflowing the chemical liquid pumped from the reserve tank, the hoop material is configured to pass through the chemical liquid in the overflow tank, Each of the cleaning processing units is configured by a reserve tank and a nozzle that is disposed in the reserve tank and that injects a chemical liquid pumped from the reserve tank or introduced from the outside toward the hoop material. Characterized by,
Hoop material solder plating device. 9. The hoop material is conveyed in a vertical upright shape, and the overflow tank is passed through the front and rear walls facing in the conveyance direction of the hoop material so that the hoop material is conveyed in the vertical upright shape. 9. The solder plating apparatus according to claim 8, wherein the nozzle comprises at least a pair of nozzles arranged on both sides of the vertical upstanding hoop material while having a vertical slit.