TWI627313B - Vertical type continuous roll-to-roll electroplating apparatus with conductive clips - Google Patents

Abstract

The invention provides a conductive continuous roll-to-roll electroplating equipment for electroplating clips, including: Machine, a pre-processing section, a plating section, a post-processing section and a winder, the plating section is provided with a plating tank, a plurality of negative clamps, a clamp drive control device, a positive plate and a power supply system; the clamp The driving control device can drive the negative clamp to open before entering the inlet end, to close during the movement of the inlet end to the outlet end, and to open after leaving the position of the outlet end. The invention has high electroplating uniformity, a wide range of application of the plated flexible circuit board, no plating layering phenomenon will occur in the plated plate, a small space occupation, and the ability to plate and plate the plated flexible circuit board with a smaller thickness and work safety. High, structural reliability.

Description

Electroplating clip conductive roll-to-roll vertical continuous plating equipment

The invention relates to a conductive continuous roll-to-roll electroplating equipment with electroplating clips, particularly an electroplating equipment with an unwinder, a pre-treatment section, a plating section, a post-treatment section and a winding machine.

With the changes of the times and the advancement of technology, efficiency and precision are required in everything, and so is electroplating technology. The thickness of printed circuit boards (PCBs) in the industry is getting thinner, from hard boards to thin boards to soft boards or FPCs. The electroplating industry puts forward higher requirements, smaller floor area, higher production capacity, thinner substrates, good conductivity during electroplating, high electroplating uniformity, and more electroplating equipment with more varieties of electroplating are more favored by customers. The PCB electroplating process can be divided into three parts: a pre-processing section for pre-processing the substrate, a copper plating section for electro-plating the substrate, and a post-processing section for post-processing the substrate. Several key processes in the pre-treatment section, such as degreasing, micro-etching, and pickling, are mainly used to decontaminate the surface of the PCB before copper plating; and the post-treatment section is to clean the residual chemical solution brought out of the copper plating section by the PCB. In the industry, the previous electroplating tanks of vertical electroplating equipment used rollers for conductive methods. The thickness of the electroplating plate was poor, the electrical conductivity was poor, and there were few types of electroplating, as shown below.

As shown in Figures 1 to 4, the roller-conducting vertical electroplating equipment in the prior art is shown in the prior art. The electroplating process requires that positive and negative charges be conducted to generate metal ions that will be deposited on the surface of the object to be plated. Therefore, the line negative pole power supply is in contact with the board by roller conduction. (The so-called roller conductive type: refers to the electroplated negative conductive wire connected to the roller, such as the copper-plated first conductive roller (A8) and copper-plated second conductive roller (A9) in the first figure, the current is contacted through the roller The board is energized). The copper plating tank is a segmented type [the so-called segmented type: refers to the potion in the first section of copper plating (A3) and the second section of copper plating (A4) in the first picture It is connected with a gap in the middle. For example, after the copper plating section (A3) in the copper plating section in the first picture passes through the isolation section, it enters the copper plating section (A4) copper plating in the first picture]. This will delaminate the surface of the plate after plating (visible through professional slicing, which is not allowed in this process). This line is equipped with coil feeding, plating and automatic plating equipment. The direction shown by the arrow is the moving direction of the PCB, with the copper plate as the center line, the automatic unwinding machine (A1) is the feeding, the pre-processing section (A2) is the starting point of the entire process, and consists of multiple small slots. After the pre-treatment, the PCB enters the copper-plated section of the copper tank (A3), and then enters the isolation section (A10). After the PCB enters the copper-plated section of the copper-plated section (A4), it enters the post-processing section (A5). It is composed of multiple small tanks, the purpose of which is to clean the residual chemical liquid carried out by the copper plating section on the board surface and dry the board surface, and finally collect it into rolls by the automatic winder (A6).

As shown in the second and third figures, the direction shown by the arrow is the moving direction of the PCB. The copper plate is used as the center line in the figure. The automatic unwinding machine (A1) in the figure is used to feed the PCB. The processing section (A2) is the starting point of the entire process. After entering the preprocessing tank, the preprocessing section guide wheel (A11) fixes the PCB to move normally at a predetermined position in the middle of the tank. Consists of multiple small slots. After pretreatment, the PCB enters the plating section. The second section of the copper-plated copper groove (A3) in the second figure is fixed in position and conductive by the first copper-plated conductive roller (A12). After the plating process, it enters the isolation section (A10). Then enter the copper-plated second-stage copper tank (A4), and the copper-plated second-stage conductive roller (A13) is used to fix the position and conductive function, and is electroplated. After plating, it enters the post-processing section (A5). After entering the post-processing tank, the post-processing section guide roller (A14) fixes the PCB to move normally at the specified position in the middle of the tank. The post-processing consists of multiple small tanks, the purpose of which is to clean the residual chemical solution carried out by the plating section on the surface of the board and dry the board, and finally collect it into rolls by the automatic winder (A6).

As shown in the third figure, the pre-processing section guide wheel (A11) in the figure is mainly used to guide and fix the running direction and position of the PCB. The post-processing guide roller (A14) has the same function as the pre-processing guide roller (A11). The first copper-plated conductive roller (A12) and the second copper-plated conductive roller (A13) are mainly used to plate the negative electrode to conduct electricity and guide and fix the running direction and position of the PCB. The isolation section (A10) is an isolation section between the tank and the tank, and the tank is not filled with a medicine liquid.

As shown in the fourth figure, the copper-plated first-stage conductive roller (A12) is used to plate the negative electrode to transmit the conductivity to the PCB and guide and fix the running direction and position of the PCB. The conductive wire (A7) is used for the conductor between the negative electrode of the battery and the copper-plated first conductive roller (A12), which can be normally energized. The copper tank (A16) is the container for the liquid medicine.

The above existing roller conductive vertical plating equipment has the following disadvantages:

First, the above-mentioned roller conductive vertical electroplating equipment cannot produce selective plating plates (that is, pattern plating), and can only produce fully plated plates. (The so-called plated plate has circuits distributed on the surface of the board.) (The so-called fully plated plate is the plate surface and all the circuits need to be plated.) Because the roller is conductive, it can be used as a conductive and can also be used as a transition and guidance of the PCB. When the entire PCB surface is in contact with the roller, the roller is charged as a whole after the power is turned on. In the case of the selected plate, the circuit is distributed on the surface of the board, and the part to be plated is exposed, and the part not to be plated is covered with a dry film on the surface. Thus, the conductive effect is not good. Affects the uniformity of plating, the uniformity is less than <80 ~ 90%, and the uniformity of plating is poor.

Second, the copper plating tank is a segmented type [the so-called segmented type: refers to the copper tanks (A3) and copper plating (A4) copper tanks (A4) copper tanks in the copper tank are not connected with each other, the middle by the isolation section ( A10) separate]. This will delaminate the surface of the plate after plating (visible through professional slicing, which is not allowed in this process).

Third, because the roller conductive vertical electroplating equipment has no moving conveying mechanism in the middle, only the unwinding and rewinding ends have a conveying and rotating mechanism. If the PCB span is too long, the board will be straightened so that the tensile force will increase and it will easily break. Therefore, the current technology can only plate PCBs with a thickness of more than 36 microns (um).

Therefore, in order to solve the above technical problems, the present inventor proposes an electroplating clip conductive roll-to-roll vertical continuous electroplating equipment, which includes: a unwinding machine, a pre-processing section, a plating section, a post-processing section and a collection Winding machine; along the direction from the unwinding machine to the winder and between the unwinding machine and the winder, the pre-processing section, the electroplating section and the post-processing section are arranged in order, Electroplated flexible The circuit board is released by the unwinding machine and a reel is collected by the rewinding machine. Through the rewinding machine, the plated flexible circuit board is rolled up. During the movement, the plated flexible circuit is moved. The board is tensioned on a plane by the unwinder and the winder, and the pre-processing section, the electroplating section and the post-processing section sequentially perform a plating process on the plated flexible circuit board during the movement. Treatment, a plating treatment, and a post-plating treatment; wherein, the plating section is provided with a plating tank, a plurality of negative clamps, a clamp drive control device, a positive plate, and a power supply system; the plated flexible circuit board passes through the plating An inner cavity of the cylinder is provided with two ends, one end of which is directly above the unwinding machine is marked as an inlet end, and the other end is directly above the rewinding machine is marked as an exit end. The clamp The driving control device drives the negative clamp to move between the entrance end and the exit end in a loop motion. During the loop motion, each of the negative clamps is spaced apart from each other. During the loop motion, the The driving control device can drive the anode clamp to open before entering the entrance end, to close during the movement of the entrance end to the exit end, and to open after leaving the exit end position, so that the anode clamp is connected to the entrance end before entering the entrance end. The plated flexible circuit board is separated and moved from the inlet end to the outlet end while being clamped at the upper edge of the plated flexible circuit board and separated from the plated flexible circuit board after leaving the outlet end, and each of the negative electrodes A clamping position of the clamp on the plated flexible circuit board is located in the plane where the plated flexible circuit board is located, and the moving speed of each negative electrode clamp is the same as that of the plated flexible circuit board; the power system design There is a DC power supply, a negative conductive mechanism and a positive lead. The negative clamp is connected to a negative power of the DC power through the negative conductive mechanism. Each positive plate is installed in the inner cavity, and the positive plate is connected through the positive lead. A positive electrode of the DC power source is used.

Further, the negative electrode clamp is provided with a mounting bracket, a left clamp body, a right clamp body, two clamp springs and two guide rollers, and the middle part of the left clamp body and the right clamp body are respectively rotatably connected to the mounting bracket. One of the clamp springs is disposed between an inner wall of an upper end portion of the left clamp body and the mounting bracket, and one of the clamp springs is disposed between an inner wall of an upper end portion of the right clamp body and the mounting bracket, between Under the spring force of the two clamp springs, the lower end of the left clamp body and the The lower end of the right clamp is clamped and the negative clamp is closed; one of the guide rollers is installed at the upper end of the left clamp and is located at an outer position, and the other of the guide rollers is installed at the right clamp. The upper end portion is located at an outer position; the fixture driving control device is installed at an upper position of the electroplating cylinder, and is provided with a fixture driving mechanism, an inlet guide rail group and an outlet guide rail group, and the fixture driving mechanism Capable of driving each of the negative clamps in a counterclockwise loop motion on a closed trajectory consisting of a lower straight trajectory, an upper straight trajectory, an incoming semi-circular trajectory, and an outgoing semi-circular trajectory. The lower straight The trajectory and the upper linear trajectory are parallel to a moving direction of the plated flexible circuit board, and the lower linear trajectory passes through the entrance end and the exit end; both the input guide rail group and the output guide rail group are It is fixed at a lower position of the clamp driving mechanism, and the input guide rail assembly is arranged near the semicircular trajectory of the input end, and the output guide rail assembly is disposed at Near the exit semi-circular trajectory, the entry guide rail group and the exit guide rail group are provided with two guide rails opposite to each other with the inner side gradually protruding from both ends to a middle part. A rear end of two of the guide rails of the incoming guide rail group is bent upward, the middle part and a rear end of the guide rail group extend along the lower straight trajectory, and two of the guide rails of the outgoing guide rail group are A front end portion extends along the lower straight trajectory and the front end portion is bent upwards. The two front ends of the two guide rail groups of the input guide rail group are the inlet end, and the two ends of the guide rail group of the output terminal group are The rear end of the guide rail is the exit end; when each negative electrode clamp moves to a boundary position between the semi-circular trajectory of the input end and the linear trajectory below, the two guide rollers of the negative clamp roll and slide into the input Between the two inner sides of the guide rail group of the end guide rail group, the two guide wheels of the input end guide rail group pass through the two guide rollers to the left clamp body and the right clamp body. The upper end part generates a force that overcomes the spring force of the two springs of the clamp. The squeezing force makes the lower ends of the left clamp body and the right clamp body gradually open when entering the rear end portions of the two guide rails of the input guide rail group, and guides at the input end. The two middle portions of the guide rail group are opened to the maximum extent when the middle part of the guide rail group is gradually closed when the front ends of the two guide rail groups of the input guide rail group are gradually closed, so that each of the negative clamps moves. To the intersection of the straight line below and the semicircle at the end At this time, the two guide rollers of the negative clamp are rolled and slid between the inner sides of the two guide slide rails of the out-end guide rail group, and the two guide slide rails of the out-end guide rail group. Through the two guide rollers, the upper end portions of the left clamp body and the right clamp body generate the pressing force that overcomes the spring force of the two clamp springs, so that the left clamp body and the right clamp body The lower end portion gradually expands when entering the two rear end portions of the guide rail group of the out-end guide rail group, and opens to the middle portion of the two guide rail groups of the out-end guide rail group. As far as possible, the front ends of the two guide rails of the guide rail group are gradually closed.

Wherein, the fixture driving mechanism includes a main transmission motor, a transmission mechanism and the same two sets of sprocket chain mechanism; each of the sprocket chain mechanism includes a driving sprocket, a driven sprocket and a sleeve on the driving A sprocket and a chain on the driven sprocket, the two chains are respectively located on two horizontal planes, the horizontal planes are parallel to the plane on which the plated flexible circuit board is located, and the plated flexible circuit board is located between the two chains ; The main drive motor drives two of the active sprocket wheels to rotate synchronously and drives two of the chains to move synchronously through the transmission mechanism; the upper end portion of the mounting bracket of the negative clamp is a T-shaped portion, and a longitudinal direction of the T-shaped portion A rod portion is connected to the lower end portion of the mounting bracket, and two ends of a transverse rod portion of the T-shaped portion are respectively fixed to two of the chains and perpendicular to the extending directions of the two chains.

Wherein, the negative electrode conductive mechanism of the power system is provided with a negative electrode lead and a conductive slide rail, and a conductive slider and a slider connecting mechanism are provided for each of the negative electrode clamps; the conductive slide rail is fixed to the clamp driving mechanism. And the electroplating cylinder, and the conductive slide rail has a groove track arranged along the moving direction of the plated flexible circuit board, and the conductive slide rail is electrically connected to the negative pole of the DC power source through the negative lead; each The conductive slider is mounted on the horizontal rod portion corresponding to the negative electrode clamp through the slider connection mechanism. When each negative electrode clamp moves to the entrance end, the conductive slider corresponding to the negative electrode clamp slides into the conductive slider. In the groove track of the rail, and pressed by the slider connection mechanism on the conductive slide rail, the negative electrode clamp sequentially passes through the corresponding slider connection mechanism, the conductive slider, the conductive slide rail and uses the The negative lead is connected to the negative power of the DC power supply; When the tool moves to the exit end, the conductive slider corresponding to the negative clamp slides out of the groove track of the conductive slide rail.

Wherein, the slider connecting mechanism is provided with a slider spring, a fixing bolt, a connecting screw and a connecting wire; the transverse rod portion of the negative clamp is provided with a through hole, and a rod portion of the fixing bolt passes from top to bottom Passing through the corresponding through hole of the negative clamp and fixedly connected to a top of the conductive slider, a bolt head of the fixing bolt is disposed on the top surface of the horizontal rod portion of the corresponding negative clamp, and the slider is sleeved. On the rod portion of the fixing bolt and abutting between the bottom surface of the lateral rod portion of the corresponding negative clamp and the top of the conductive slider, one end of the connection wire is fixed to the bolt head through the connection screw, One end of the connecting lead is electrically connected to the bolt head, and the other end of the connecting lead is correspondingly fixed and electrically connected to the negative clamp.

Wherein, the plating section is provided with an auxiliary guide mechanism; the auxiliary guide mechanism is composed of a left bracket, a right bracket, a left guide wheel and a right guide wheel, and the left bracket and the right bracket are respectively fixed in the plating cylinder. On the bottom surface of the cavity, the left guide wheel and the right guide wheel are semi-circular barrels, the left guide wheel is fixed on the left bracket, the right guide wheel is fixed on the right bracket, and the left guide wheel and the right The semi-circular arc surfaces of the guide wheels are oppositely disposed with a gap left there; the plated flexible circuit board passes through the above-mentioned gap between the left guide wheel and the right guide wheel.

Further, the electroplating section is provided with a plurality of the positive electrode plates, wherein each of the positive electrode plates is disposed in the inner cavity of the electroplating cylinder and is divided into two rows, and the two positive electrode plates are respectively located on the plated flexible circuit board On both sides of the plate, each of the positive plates in any row is evenly distributed along the moving direction of the plated flexible circuit board.

Wherein, the pre-plating treatment includes a surface cleaning treatment, and the pre-treatment section is provided with a cleaning chemical spray nozzle for spraying a cleaning chemical onto the plated flexible circuit board surface and blocking the cleaning chemical A roller box for positioning the movement path of the plated flexible circuit board, A pre-treatment rectification system that is adjusted when the electroplated flexible circuit board falls under the influence of weight, and an exhaust device for extracting exhaust gas generated when the cleaning chemical liquid is used to clean the surface of the electroplated flexible circuit board.

Wherein, the post-plating treatment includes a cleaning treatment for residual chemical liquid on the surface of the plate and a blow drying process; the post-processing section is provided with a cleaning chemical liquid for spraying a cleaning chemical liquid onto the surface of the plated flexible circuit board. Nozzle, a roller box for blocking the cleaning solution and positioning the moving path of the plated flexible circuit board, and a post-processing correction system for adjusting the plated flexible circuit board when the weight falls An air exhaust device for extracting exhaust gas generated when the cleaning chemical solution is used to clean the electroplated flexible circuit board), and the water mist generated by the electroplated flexible circuit board after the cleaning chemical solution is cleaned is blown with normal temperature air And a drying air knife for hot-air drying the plated flexible circuit board after drying.

Wherein, an inner wall of the electroplating cylinder is provided with a plating chemical liquid spraying nozzle for spraying a plating chemical liquid onto the plated flexible circuit board, and further, a cleaning chemical liquid is supplied to the cleaning chemical liquid spraying tube. A cleaning chemical liquid supply device, a cleaning chemical liquid supply device for supplying the cleaning chemical liquid to the cleaning chemical liquid nozzle, and a plating chemical liquid supply device for spraying and supplying the plating chemical liquid to the plating chemical liquid The cleaning chemical liquid supply device, the cleaning chemical liquid supply device, and the electroplating chemical liquid supply device include an auxiliary tank, a pump, and a filter barrel. The pump extracts a chemical liquid stored in the auxiliary tank, and The extracted chemical liquid is filtered through the filter barrel for impurity filtration and output; the auxiliary tank of the cleaning chemical liquid supply device is used for storing the cleaning chemical liquid, and the cleaning output filtered by the filter barrel of the cleaning chemical liquid supply device The chemical liquid is supplied to the cleaning chemical liquid nozzle; the cleaning chemical liquid supply device is used for storing the cleaning chemical liquid, and the cleaning chemical liquid filtered and output by the filter barrel of the cleaning chemical liquid supply device is supplied to the cleaning chemical liquid spray ; The plating solution supply means for storing the plating liquid, the plating liquid through the plating solution supply means to filter the output of the filter tub of the plating liquid supplied to the nozzle.

In the present invention, the plated flexible circuit board (FPC) is tensioned in a plane by using a unwinder and a rewinder, and a plurality of negative clamps are used to transfer the plated flexible circuit board (FPC) in the inner cavity of the plating cylinder. The plated flexible circuit board (FPC) is clamped in the aforementioned plane, and the plated flexible circuit board (FPC) is pulled synchronously with the unwinder and winder, and the movement of the negative clamp can be driven through the clamp drive control device. The plated flexible circuit board (FPC) is automatically clamped and released at the corresponding position. Through the power supply system, the negative electrode clamp can be automatically connected to the negative pole of the DC power supply only when clamping the plated flexible circuit board (FPC). The working method can bring the following effects:

1. Since the negative clamp as the negative pole of the DC power source is clamped on the plated flexible circuit board (FPC) to move synchronously with it, and the positive plate as the positive pole of the DC power source is fixed in the plating tank, the plated flexibility can be ensured The good conductive contact of the circuit board (FPC) and the stability of the conductive current improve the plating uniformity of the plated flexible circuit board (FPC); and because the negative clamp is only clamped on the plated flexible circuit board (FPC) ) At the upper edge, therefore, the present invention can be applied to the production of fully-plated FPC and selective-plated FPC and hole-filling plate, and the application range is wide.

2. Since the multiple negative clamps clamped on the plated flexible circuit board (FPC) are arranged at even intervals along the movement direction (V) of the plated flexible circuit board (FPC), the plated flexible circuit board ( (FPC) The parts that are being plated can be in good contact with the power supply, avoiding the problem of the need to arrange the power supply in sections in order to reduce the power supply design requirements of the existing roller conductive vertical plating equipment (the positive and negative electrode distance is too large) The present invention can complete electroplating at one time, and the electroplated plate does not produce the phenomenon of electroplating delamination; moreover, this can also reduce the space occupied by the present invention.

3. Since the negative electrode clamp can pull the plated flexible circuit board (FPC) synchronously with the unwinder and winder on the same plane, the plated flexible circuit board (FPC) can be shaken even when the plating solution is shaken. It can still be kept straight without swinging with the plating solution, thereby further improving the plating uniformity of the plated flexible circuit board (FPC); and, the pulling manner of the plated flexible circuit board (FPC) is relatively Existing roller conductive vertical plating equipment eliminates the need for conductive wheels to have the resistance of the plated flexible circuit board (FPC); in addition, the negative electrode clamp is added to the plated flexible circuit board (FPC) to pull it, so It can reduce the need for unwinding and rewinding The tensile force of the plated flexible circuit board (FPC) makes the thin plated flexible circuit board (FPC) free from strong tension and is easily broken in production, so that the present invention can handle the thinner plate. Electroplated flexible circuit board (FPC) (After testing, the present invention can handle FPC with a minimum thickness of 12 micrometers (um), while the existing roller conductive vertical plating equipment can only handle FPC with a thickness of 36 micrometers (um) or more. ), And there will be no wrinkles or cracks in the production of thin and flexible boards.

4. Because the fixture driving control device can control the negative clamp to automatically clamp and release the plated flexible circuit board (FPC) at the corresponding position, the power supply system can control the negative clamp to clamp the plated flexible circuit board (FPC) only. The negative electrode of the direct-current power supply is automatically turned on at any time, so the working safety of the present invention can be improved.

5. Since the unwinding machine can automatically roll out the plated flexible circuit board (FPC) in a roll, and the unrolled plated flexible circuit board (FPC) is rolled into a roll again, the plated flexible The circuit board (FPC) can be continuously operated in a whole roll, and only one person can realize the loading and unloading of the plated flexible circuit board (FPC), which greatly saves costs.

6. The invention has high electroplating uniformity (up to 97%), a wide range of plated flexible circuit boards, no plating layering phenomenon on the plated plate, a small footprint, and can be plated with a smaller thickness. The circuit board is plated and has the advantages of high work safety.

7. In order to realize the "movement process of the negative electrode clamp from the inlet end to the outlet end, the clamp driving control device can drive the negative electrode clamp to open before entering the inlet end, close during the movement from the inlet end to the outlet end, and expand after leaving the outlet end. On ", the specific structure of the negative fixture and fixture drive control device is designed, which has the advantage of high reliability.

8. In order to realize "the negative electrode clamp is electrically connected to the negative electrode of the DC power supply through the negative electrode conductive mechanism during the movement of the negative electrode clamp from the inlet end to the outlet end", the present invention designs a specific structure of the power supply system, which has the advantage of high reliability.

9. The present invention can further improve the stability of the plated flexible circuit board when the plating solution is shaken by adding an auxiliary guide mechanism to the plating section, thereby improving the uniformity of the plating.

10. The present invention can further improve the plating uniformity of the flexible circuit board to be plated by providing a plurality of positive plates and arranging them in the inner cavity of the plating tank.

(1) ‧‧‧Unwinding machine

(2) ‧‧‧ pre-processing section

(21) ‧‧‧Cleaning liquid nozzle

(22) ‧‧‧Roller Box

(23) ‧‧‧Pre-processing correction system

(231) ‧‧‧Servo motor

(233) ‧‧‧Sensor

(234) ‧‧‧ Correction and Correction Device Section

(24) ‧‧‧Exhaust device

(3) ‧‧‧Plating section

(31) ‧‧‧plating cylinder

(311) ‧‧‧ Electroplating liquid nozzle

(32) ‧‧‧Negative clamp

(321) ‧‧‧Mounting bracket

(322) ‧‧‧Left clamp

(323) ‧‧‧Right clip

(324) ‧‧‧Jig Spring

(325) ‧‧‧Guide Wheel

(33) ‧‧‧Clamp drive control device

(331) ‧‧‧Main drive motor

(332) ‧‧‧Active Sprocket

(333) ‧‧‧Driven Sprocket

(334) ‧‧‧Chain

(335) ‧‧‧Incoming guide rail group

(336) ‧‧‧Outside Guide Rail Set

(34) ‧‧‧Positive plate

(35) ‧‧‧Power System

(351) ‧‧‧DC Power

(352) ‧‧‧Conductive slide

(353) ‧‧‧Conductive slider

(354) ‧‧‧Slider spring

(355) ‧‧‧Fixing bolt

(356) ‧‧‧Connecting screw

(36) ‧‧‧Auxiliary guidance mechanism

(361) ‧‧‧Left bracket

(362) ‧‧‧Right bracket

(363) ‧‧‧Leading wheel

(364) ‧‧‧Right guide wheel

(4) ‧‧‧ post-processing section

(41) ‧‧‧Cleaning liquid nozzle

(42) ‧‧‧Roller Box

(43) ‧‧‧Handling system

(44) ‧‧‧Exhaust device

(45) ‧‧‧Blow Dry Air Knife

(46) ‧‧‧Drying Air Knife

(5) ‧‧‧Winder

(61) ‧‧‧Auxiliary tank

(62) ‧‧‧Pump

(63) ‧‧‧Filter barrel

(FPC) ‧‧‧plated flexible circuit board

(PCB) ‧‧‧Printed Circuit Board

(rd) ‧‧‧Entrance

(cd) ‧‧‧Export

(V) ‧‧‧Direction of movement

(A1) ‧‧‧Automatic Unwinding Machine

(A2) ‧‧‧ pre-processing section

(A3) ‧‧‧ copper plated copper tank

(A4) ‧‧‧Bronze-plated copper trough

(A5) ‧‧‧ post-processing section

(A6) ‧‧‧Automatic Take-up Machine

(A7) ‧‧‧Conductive wire

(A8) ‧‧‧ Copper plated first conductive roller

(A9) ‧‧‧ Copper plated second conductive roller

(A10) ‧‧‧ Quarantine

(A11) ‧‧‧Pre-treatment section guide wheel

(A12) ‧‧‧Bronze plated first conductive roller

(A13) ‧‧‧ Copper plated second conductive roller

(A14) ‧‧‧ Post-treatment section guide roller

(A16) ‧‧‧Copper trough

[First image] is a schematic plan view of a conventional roller conductive vertical plating equipment.

[Second picture] It is a schematic diagram of the three-dimensional structure of the existing roller conductive vertical plating equipment.

[Third figure] It is a schematic view of the three-dimensional structure of the existing roller conductive vertical plating equipment with a sectional effect.

[Fourth figure] is an exploded view of the structure of a copper plating section in the existing roller conductive vertical plating equipment.

[Fifth Figure] Schematic view of the front view of the plating equipment of the present invention.

[Sixth Figure] A schematic plan view of the plating equipment of the present invention.

[Seventh A] is a schematic front view of the unwinder, the plated flexible circuit board (FPC), the winder and the negative clamp of the present invention.

[Seventh B] is a schematic plan view of the unwinding machine 1, the plated flexible circuit board (FPC) and the winder of the present invention.

[Eighth Figure] Schematic view of the front view of the plating section of the present invention.

[The ninth figure] is an enlarged schematic view of part A of the eighth figure.

[Tenth figure] is a schematic plan view of the fixture driving control device of the present invention.

[Eleventh figure] A schematic diagram of the three-dimensional structure of Part B in the tenth figure when the negative electrode clamp is installed.

[Twelfth figure] The schematic diagram of the three-dimensional structure of Part C in the tenth figure when the negative clamp is installed.

[Thirteenth figure] It is the second schematic diagram of the three-dimensional structure of the C part in the tenth figure when the negative electrode clamp is installed.

[Fourteenth figure] It is a schematic diagram of the three-dimensional structure of the electroplating cylinder, the negative electrode clamp and the auxiliary guide mechanism in the present invention.

[Fifteenth figure] It is a schematic cross-sectional structure diagram of the electroplating cylinder, the negative electrode clamp and the auxiliary guide mechanism of the present invention.

[Sixteenth figure] It is a three-dimensional structure diagram of the electroplating cylinder, the negative electrode clamp, the positive electrode plate and the power supply system of the present invention.

[Seventeenth figure] is an enlarged schematic view of part D of the sixteenth figure.

[Eighteenth figure] It is a schematic cross-sectional structure diagram of the plating tank, the negative electrode clamp, the positive electrode plate and the power supply system of the present invention.

[Figure 19A] A schematic diagram of the three-dimensional structure of the slider connection mechanism of the power supply system of the present invention.

[Figure 19B] Schematic plan view of the slider connection mechanism of the power supply system of the present invention.

[Twenty figure] The structure diagram of the pre-processing section of the present invention.

[Figure 21A] It is the first operation schematic diagram of the correction system of the present invention.

[Figure 21B] Schematic diagram 2 of the correction system of the present invention

[Figure 21C] Schematic diagram 3 of the operation of the correction system of the present invention

[Twenty-second figure] is a schematic structural diagram of a post-processing section of the present invention.

[Twenty-third figure] It is a schematic structural diagram of a medicinal solution supply device of the present invention.

Based on the above technical features, the main effects of the electroplating clip conductive roll-to-roll vertical continuous electroplating equipment of the present invention will be clearly shown in the following embodiments.

Please refer to FIG. 5 to FIG. 23. As shown in FIG. 5 to FIG. 23, an electroplating clip conductive roll-to-roll vertical continuous electroplating equipment of the present invention includes: a unwinding machine (1), a pre-processing section (2), A plating section (3), a post-processing section (4) and a winder (5).

The pre-processing section (2), the electroplating section (3), and the post-processing section (4) are all installed between the unwinder (1) to the winder (5) and in accordance with the unwinder (1) Arranged in the direction of the winder (5), a rolled flexible printed circuit board (FPC) is released by the winder (1) and is rolled again by the winder (5) And the plated flexible circuit board (FPC) moving from the unwinding machine (1) to the unwinding machine (5) is tightened on a plane by the unwinding machine (1) and the unwinding machine (5) In the process, the pre-processing section (2), the electroplating section (3) and the post-processing section (4) sequentially perform a pre-plating treatment, a plating treatment and An electroplating post-treatment, and the electroplated flexible printed circuit board (FPC) after the electroplating is processed into a roll by the winder (5), and then it can flow to the next process.

The electroplating section (3) is provided with a plating tank (31), a plurality of negative clamps (32), a clamp drive control device (33), a positive plate (34), and a power supply system (35); A flexible circuit board (FPC) passes through the inner cavity of the electroplating cylinder (31). The inner cavity is provided with two ends, one of which is close to the unwinding machine (1) and is marked as an inlet end (rd) and another An end close to the winder (5) is marked as an exit end (cd); the clamp drive control device (33) drives each of the negative clamps (32) to move in a circular motion at the entrance Between the end (rd) and the exit end (cd), during the loop movement, each of the negative clamps (32) is spaced from each other, and in the negative clamp (32) from the entrance end (rd) to During a movement of the exit end (cd), the clamp drive control device (33) drives the negative clamp (32) to open before entering the entrance end (rd) and move from the entrance end (rd) to the exit It is closed during the terminal (cd) and opened after leaving the outlet terminal (cd), so that the negative electrode clamp (32) is separated from the plated flexible circuit board (FPC) before entering the inlet terminal (rd). It is clamped at the upper edge of the plated flexible circuit board (FPC) during the movement from the entrance end (rd) to the exit end (cd), and is separated from the plated flexible circuit board after leaving the exit end (cd). (FPC), and each of the negative clamps (32) holds the plated flexible circuit board (FPC) The positions are located in the plane where the plated flexible circuit board (FPC) is located, and the speed of movement of each negative electrode clamp (32) is the same as the speed of movement of the plated flexible circuit board (FPC); the power system (35) is designed There is a DC power supply (351), a negative conductive mechanism and a positive lead. The negative clamp (32) moves from the inlet terminal (rd) to the outlet terminal (cd) through the negative conductive mechanism and the DC power source (351). A negative electrode is electrically connected; each of the positive plates (34) is installed in the inner cavity of the plating tank (31), and the positive plate (34) is electrically connected to the positive electrode of the DC power source (351) through the positive lead; however, it is stored A metal ion generated in an electroplating solution in the inner cavity of the electroplating cylinder (31) after each of the negative electrode clamps (32) and each of the positive electrode plates (34) is deposited on the plated flexible circuit board ( FPC), a layer of metal shell is formed to complete the plating of the plated flexible circuit board (FPC).

Wherein, the present invention realizes that "the movement process of the anode clamp (32) from the entrance end (rd) to the exit end (cd), the clamp drive control device (33) drives the anode clamp (32) to enter the entrance The specific structure of the terminal (rd) is opened before, closed during the movement from the inlet (rd) to the outlet (cd), and opened after leaving the outlet (cd) "is as follows: Referring to the fifteenth figure, the negative clamp (32) is provided with a mounting bracket (321), a left clamp (322), a right clamp (323), two clamp springs (324), and two guide rollers ( 325); the middle part of the left clamp body (322) and the middle part of the right clamp body (323) are respectively rotatably connected to the lower end of the mounting bracket (321), and one of the clamp springs (324) is installed on the left clamp body (324); 322) between the inner wall of the upper end portion and the mounting bracket (321), and the other clamp spring (324) is installed between the inner wall of the upper end portion of the right clamp body (323) and the mounting bracket (321), and Under the action of the spring force of the two clamp springs (324), the lower end portion of the left clamp body (322) and the lower end portion of the right clamp body (323) are clamped together, and the negative clamp (32) is closed; One of the guide rollers (325) is installed at the upper end portion of the left clamp body (322) and is located at the outer position, and the other of the guide rollers (325) is installed at the upper end portion of the right clamp body (323) and is located at the outer position.

Please refer to the eighth figure, the fixture driving control device (33) is installed above the electroplating cylinder (31), and it is provided with a fixture driving mechanism, an input end guide rail group (335) and an output end guide. Guide rail group (336); the clamp driving mechanism drives each of the negative clamps (32) to move counterclockwise in a closed trajectory, the closed trajectory includes a lower straight trajectory, an upper straight trajectory, and an entry end A semicircular trajectory and an outgoing semicircular trajectory, the lower straight trajectory and the upper straight trajectory are parallel to a movement direction (V) of the plated flexible circuit board (FPC), and the lower straight trajectory passes through the entrance end (rd) And the exit end (cd).

Referring to the ninth to thirteenth drawings, the in-side guide rail group (335) and the out-side guide rail group (336) are fixed at a lower position of the clamp driving mechanism, and the in-side guide rail group (335) Set near the semi-circular trajectory of the input end, and set the guide rail group (336) near the semi-circular trajectory of the output, the input guide rail group (335) and the output guide rail group ( 336) each include two guide slide rails which are opposite to each other with the inner side surface gradually protruding from both ends to a middle portion, and one of the two guide slide rails of the incoming guide slide group (335) The rear end portion is curved upward, the middle portion and a rear end portion extend along the lower straight trajectory, one front end portion of the two guide slide rails of the out-end guide rail group (336) extends along the lower straight trajectory, and the front end portion Bend upward, the foremost position of the two guide rails of the incoming guide rail group (335) is the entrance end (rd), and the last of the two guide rails of the outgoing guide rail group (336) The end position is the exit end (cd).

When each of the negative clamps (32) moves to a boundary position between the semicircular trajectory of the input end and the linear trajectory below, the two guide rollers (325) of the negative clamp (32) roll into the input guide rail. Between the two inner sides of the guide rail of the group (335), the two guide rails of the incoming guide rail group (335) pass through the two guide rollers (325) to the left clamp body (322) and The upper end portion of the right clamp body (323) generates a pressing force that overcomes the spring forces of the two clamp springs (324), so that the left clamp body (322) and the lower end of the right clamp body (323) The rear ends of the two guide rails (335) of the input guide rail group (335) are gradually opened, and the middle of the two guide rails of the input guide rail group (335) are opened to the maximum extent, Two front ends of the guide rail group (335) of the input guide rail group (335) are gradually closed; so that each of the negative clamps (32) is gradually opened when moving to the input guide rail group (335). And then gradually closed so that the negative When the pole clamp (32) moves above the plated flexible circuit board (FPC), it gradually opens and moves to close in the same direction as the movement direction (V) of the plated flexible circuit board (FPC). It is clamped at the upper edge of the plated flexible circuit board (FPC) when it reaches the entrance end (rd) after leaving the entry guide rail group (335).

And when each of the negative clamps (32) moves to the boundary position of the lower straight trajectory and the semi-circular trajectory of the output end, the two guide rollers (325) of the negative clamp (32) roll into the output guide rail. Between two inner sides of the guide rail of the group (336), the two guide rails of the outgoing guide rail group (336) pass through the two guide rollers (325) to the left clamp body (322) and The upper end portion of the right clamp body (323) generates a pressing force that overcomes the spring forces of the two clamp springs (324), so that the left clamp body (322) and the lower end portions of the right clamp body (323) are in the Two rear ends of the guide rail group (336) at the exit end gradually open, and the middle of the two guide rails of the guide rail group (336) at the exit end are opened to the maximum extent. Two front ends of the guide rail group (336) at the exit end are gradually closed; so that each of the negative clamps (32) gradually opens and then gradually moves to the exit guide rail group (336). Closed so that the negative electrode clamp (32) gradually opens when it moves to the exit end (cd), thereby releasing the clamping of the plated flexible circuit board (FPC) and detaching from the exit After the guide rail group (336) is closed again, the above movement is re-engaged. [Each negative electrode clamp (32) is gradually opened and then gradually closed when it moves to the outgoing guide rail group (336), so that the negative electrode is gradually closed. When the clamp (32) moves to the exit end (cd), it gradually opens, thereby releasing the clamping of the plated flexible circuit board (FPC) and closing again after leaving the guide rail group (336) at the exit end. ].

Among them, the specific structure of the present invention "the clamp driving control device (33) can drive each negative electrode clamp (32) in a loop motion between the entrance end (rd) and the exit end (cd)" is as follows:

Please refer to the tenth to thirteenth drawings. The fixture driving mechanism is composed of a main transmission motor (331), a transmission mechanism and the same two sets of sprocket chain mechanisms; both sets of the sprocket chain mechanisms include an active A sprocket (332), a driven sprocket (333), and a chain (334) sleeved on the driving sprocket (332) and the driven sprocket (333), two of the chains (334), respectively Located parallel to the plated flexible circuit board (FPC) is in two planes of the plane, and the plane of the plated flexible circuit board (FPC) is located between two planes in which the chain (334) is located; the main transmission motor (331) passes through the transmission mechanism Drive the two active sprocket wheels (332) to rotate synchronously and drive the two chains (334) to move synchronously.

In addition, the upper end portion of the mounting bracket (321) of the negative clamp (32) is a T-shaped portion, and a longitudinal rod portion of the T-shaped portion is connected to the lower end portion of the mounting bracket (321). Both ends of a transverse rod portion are respectively fixed on two of the chains (334) and perpendicular to the extending direction of the two chains (334).

The specific structure of the present invention "the negative electrode is electrically connected to the negative electrode of the DC power supply (351) through the negative electrode conductive mechanism during the movement of the negative electrode clamp (32) from the inlet terminal (rd) to the outlet terminal (cd)" is as follows: Please refer to FIGS. 16 to 19B. The negative electrode conductive mechanism of the power supply system (35) is provided with a negative electrode lead and a conductive slide rail (352), and one corresponding to each of the negative electrode clamps (32). A conductive slider (353) and a slider connection mechanism; the conductive slider (352) is fixed between the clamp driving mechanism and the plating cylinder (31), and the conductive slider (352) has flexibility along the plated A groove track provided in the moving direction (V) of the circuit board (FPC), and the conductive slide rail (352) is electrically connected to the negative electrode of the DC power supply (351) through the negative electrode wire; each of the conductive sliders ( 353) is mounted on the horizontal rod portion corresponding to the negative electrode clamp (32) through the slider connecting mechanism, and when each negative electrode clamp (32) moves to the entrance end (rd), the negative electrode clamp (32) The corresponding conductive slider (353) slides into the groove track of the conductive slide rail (352) and is pressed on the conductive slide rail (352) by the slider connection mechanism, so that the negative electrode clamp (32) is In sequence, through the corresponding slider connection mechanism, the conductive slider (353), the conductive slide rail (352), the negative lead and the negative of the DC power supply (351), The electrode is electrically connected; when each of the negative clamps (32) moves to the outlet end (cd), the conductive slider (353) corresponding to the negative clamp (32) is removed from the groove of the conductive slide (352) Slide out of track.

Referring to Figures 19A and 19B, the slider connecting mechanism is provided with a slider spring (354), a fixing bolt (355), a connecting screw (356), and a connecting wire; the negative clamp (32 ) The A transverse rod portion is provided with a through hole, and a rod portion of the fixing bolt (355) passes through the through hole corresponding to the negative electrode clamp (32) from top to bottom and is fixedly connected to a top of the conductive slider (353). A bolt head of the fixing bolt (355) is disposed on the top surface of the horizontal rod portion corresponding to the negative clamp (32), and the slider spring (354) is sleeved on the rod portion of the fixing bolt (355). And abutting between the bottom surface of the horizontal rod portion corresponding to the negative clamp (32) and the top of the conductive slider (353), one end of the connection wire is electrically connected through the connection screw (356) and fixed to The bolt head of the fixing bolt (355) and the other end of the connection lead are correspondingly fixed and electrically connected to the negative clamp (32).

In addition, to further maintain the stability of the plated flexible circuit board (FPC) when the plating solution is shaken, referring to Figures 14 and 15, the plating section (3) is provided with an auxiliary guide mechanism (36). The auxiliary guide mechanism (36) includes a left bracket (361), a right bracket (362), a left guide wheel (363) and a right guide wheel (364), the left bracket (361) and the right bracket (362). ) Are respectively fixed on the bottom surface of the inner cavity of the electroplating cylinder (31), the left guide wheel (363) and the right guide wheel (364) are semi-circular barrels, and the left guide wheel (363) is fixed on the left bracket (361), the right guide wheel (364) is fixed on the right bracket (362), and half arc surfaces of the left guide wheel (363) and the right guide wheel (364) are oppositely disposed with a gap left; The plated flexible circuit board (FPC) passes through the gap between the left guide wheel (363) and the right guide wheel (364). Wherein, for the plated flexible circuit board (FPC) having a thickness of 0.12 to 1.0 mm, the preferred width of the gap between the left guide wheel (363) and the right guide wheel (364) is 0.5 to 1.5 mm; The better material of the left guide wheel (363) and the right guide wheel (364) is made of Teflon material. The Teflon material is wear-resistant and tough, so the plated flexible circuit board (FPC) and the When the left guide wheel (363) and the right guide wheel (364) are in contact, the surface of the plated flexible circuit board (FPC) will not be scratched or scratched.

In order to further improve the plating uniformity of the plated flexible circuit board, referring to Figures 16 to 18, the plating section (3) is provided with a plurality of the positive plates (34); each of the positive plates (34) Are arranged in the inner cavity of the electroplating cylinder (31) and are divided into two rows, and the positive plates (34) of the two rows are respectively located in the power receiving On both sides of the plated flexible circuit board (FPC), each of the positive plates (34) in each row is evenly distributed along the movement direction of the plated flexible circuit board (FPC).

Referring to the twentieth figure, the pre-plating process includes a surface cleaning process. The pretreatment section (2) is provided with a cleaning chemical liquid spraying pipe (21) for spraying a cleaning chemical liquid onto the surface of the plated flexible circuit board (FPC), blocking the cleaning chemical liquid and preventing the cleaning chemical liquid. A roller box (22) for positioning the movement path of the electroplated flexible circuit board (FPC), a pre-treatment correction system (23) for adjusting the electroplated flexible circuit board (FPC) when gravity is dropped, and An exhaust device (24) for extracting exhaust gas generated when the cleaning chemical solution is extracted to clean the surface of the plated flexible circuit board (FPC). The roller box (22) can block the cleaning chemical liquid in the pre-processing section (2), prevent excessive splashing and overflow of the cleaning chemical liquid, and ensure the level cleaning of the surface of the board. The pre-processing correction system (23) is an EPC unit and belongs to the existing equipment. Its operation is shown in Figures 21A to 21C. The pre-processing correction system (23) ) The left side is fixed by a bearing, and the right side is controlled by a servo motor (231). When a sensor (233) of the EPC device senses that the plated flexible circuit board (FPC) falls, the The servo motor (231) operates to tilt the deflection and guiding device section (234) upward, and the plated flexible circuit board (FPC) is slowly moved upward by the principle of slope. On the contrary, if the plated flexible circuit board (FPC) ) When a sensor (233) is higher than an EPC device, the servo motor (231) runs to incline the EPC device section (234). The principle of inclination makes the electroplating flexible. The circuit board (FPC) is slowly moved downward to realize the function of adjusting the vertical height of the plated flexible circuit board (FPC).

Referring to the twenty-second figure, the post-plating treatment includes a cleaning treatment of residual chemical liquid on the surface of the plate and a blow drying process; the post-processing section (4) is provided with a cleaning chemical solution sprayed onto the plated flexible circuit. A cleaning liquid nozzle (41) on the surface of the FPC board, a roller box (42) for blocking the cleaning liquid and positioning the movement path of the plated flexible circuit board (FPC), for A processing and correction system (43) for adjusting the plated flexible circuit board (FPC) when it is dropped by gravity, and used for extracting the cleaning solution to clean the surface of the plated flexible circuit board (FPC). A ventilation device (44) for After the cleaning solution is cleaned, the water mist generated on the plated flexible circuit board (FPC) is blown with an air-drying blade (45) blown by normal temperature air and used to blow-dry the plated flexible circuit board (FPC). A drying air knife (46) for hot air drying. The post-processing section (4) cleans the chemical solution remaining on the surface of the plated flexible circuit board (FPC) after plating and blows and dries the board surface to ensure the plated flexible circuit board (FPC) board. The surface does not oxidize.

Wherein, the roller box (42) can block the cleaning chemical liquid in the post-processing section (4) to prevent excessive cleaning chemical liquid from splashing outside. As shown in Figures 21A to 21C, the functional principle of the post-processing correction system (43) is the same as that of the correction system (42), and details are not described herein again. The hot air generated by the drying air knife (46) is preferably between 70 ° C and 90 ° C, which can prevent the surface of the plated flexible circuit board (FPC) from being oxidized.

Please refer to FIG. 9 and FIG. 23. The inner cavity of the electroplating cylinder (31) is also installed with a plating solution for spraying the electroplated flexible circuit board (FPC) in the electroplating cylinder (31). An electroplating solution nozzle (311) in a part of the cavity. Further, the present invention is provided with a cleaning chemical liquid supply device for supplying the cleaning chemical liquid to the cleaning chemical liquid nozzle (21), and a cleaning for supplying the cleaning chemical liquid to the cleaning chemical liquid nozzle (41) Chemical solution supply device and a plating solution supply device for supplying the plating solution to the plating solution nozzle (311); the cleaning solution supply device, the cleaning solution supply device, and the plating solution supply device Each includes an auxiliary tank (61), a pump (62) and a filter barrel (63). The pump (62) can extract the medicinal solution stored in the auxiliary tank (61), and the extracted medicine The liquid passes through the filter barrel (63) for filtering impurities and is output; the auxiliary tank (61) of the cleaning chemical liquid supply device is used to store the cleaning chemical liquid, and is filtered by the filter barrel (63) of the cleaning chemical liquid supply device The output of the cleaning chemical liquid is supplied to the cleaning chemical liquid nozzle (21); the cleaning chemical liquid supply device is used for storing the cleaning chemical liquid, and the output of the cleaning chemical liquid is filtered by the filter barrel (63) of the cleaning chemical liquid supply device A cleaning solution is supplied to the cleaning solution nozzle (41); the plating solution supply device is used to store the plating Liquid, the plating liquid through the filter bucket (63) of the electroplating liquid supply device supplying the filter output to the electroplating liquid nozzle (311).

Based on the description of the above embodiments, the operation, use, and effects of the present invention can be fully understood, but the above embodiment is only a preferred embodiment of the present invention, and the scope of implementation of the present invention cannot be limited by this. That is, simple equivalent changes and modifications made in accordance with the scope of the patent application and the description of the invention are within the scope of the present invention.

Claims (9)

An electroplating clip conductive type roll-to-roll vertical continuous electroplating equipment includes: a unwinding machine, a pre-processing section, a plating section, a post-processing section and a winder; along the unwinder to the winder The pre-processing section, the electroplating section and the post-processing section are sequentially arranged between the unwinding machine and the winder, and a rolled flexible circuit board subjected to plating is released through the unwinding machine and A reel is wound by the winder, and a movement process of winding the plated flexible circuit board through the winder is performed. During the movement, the plated flexible circuit board is rolled by the unwinder and the winder. The machine is tensioned on a plane, and the pre-processing section, the electroplating section and the post-processing section sequentially perform a pre-plating treatment, a plating treatment and a post-plating treatment on the plated flexible circuit board during the movement process. Wherein, the plating section is provided with a plating tank, a plurality of negative clamps, a clamp driving control device, a positive plate and a power supply system; the plated flexible circuit board passes through an inner cavity of the plating cylinder, and the inner cavity is provided with Has two ends, one of which is close to the unwinder The upper position is marked as an inlet end, and the other end is directly above the winder as an outlet end. The clamp drive control device drives the negative clamp to move between the inlet end and the outlet end in a loop motion. During the loop motion, each of the negative clamps is spaced apart from each other. During the loop motion, the clamp driving control device can drive the negative clamp to open and move at the entrance end before entering the entrance end. Closed to the exit end and opened after leaving the exit end position, so that the negative electrode clamp is separated from the plated flexible circuit board before entering the entrance end, and is clamped in the plated part during movement from the entrance end to the exit end The upper edge of the flexible circuit board is separated from the plated flexible circuit board after leaving the exit end, and a clamping position of each negative electrode holder to the plated flexible circuit board is located on the plane where the plated flexible circuit board is located. In each of the negative clamps, the moving speed is the same as the moving speed of the plated flexible circuit board. A plurality of the positive electrode plates, wherein each of the positive electrode plates is disposed in the inner cavity of the electroplating cylinder and is divided into two rows, and the two positive electrode plates are respectively located on two sides of the plated flexible circuit board, and each row Each of the positive plates is uniformly distributed along the moving direction of the plated flexible circuit board; the power system is provided with a direct current power source, a negative conductive mechanism and a positive lead, and the negative clamp is connected to the DC power source through the negative conductive mechanism. A negative electrode; each of the positive plates is installed in the inner cavity, and the positive plate is connected to a positive electrode of the DC power source through the positive lead. For example, the electroplating clip conductive type roll-to-roll vertical continuous electroplating equipment described in item 1 of the patent application scope. Further, the negative electrode clamp is provided with a mounting bracket, a left clamp body, a right clamp body, two clamp springs, and two guides. A roller, the middle part of the left clamp body and the middle part of the right clamp body are respectively rotatably connected to the lower end of the mounting bracket; one of the clamp springs is arranged between an inner wall of an upper end portion of the left clamp body and the mounting bracket, and the other The clamp spring is disposed between an inner wall of an upper end portion of the right clamp body and the mounting bracket. Under the action of the spring force of the two clamp springs, a lower end portion of the left clamp body and a lower end portion of the right clamp body Clamp and close the negative clamp; one of the guide rollers is installed at the upper end of the left clamp body and is located at an outer position, and the other of the guide rollers is installed at the upper end of the right clamp body and is located at an outer side Position; the fixture driving control device is installed above the electroplating cylinder, and is provided with the fixture driving mechanism, an in-end guide rail group and an out-end guide rail group. The structure can drive each of the negative electrode clamps to move counterclockwise in a closed trajectory. The closed trajectory is composed of a lower straight trajectory, an upper straight trajectory, an inlet semicircular trajectory, and an outlet semicircular trajectory. Both the linear trajectory and the upper linear trajectory are parallel to a moving direction of the plated flexible circuit board, and the lower linear trajectory passes through the entrance end and the exit end; the incoming guide rail group and the outgoing guide rail group Both are fixed at a lower position of the clamp driving mechanism, and the input guide rail assembly is disposed near the semi-circular trajectory of the input end, and the output guide rail assembly is disposed near the semi-circular trajectory of the output end, the input end Both the guide rail group and the out-end guide rail group are provided with two guide rails with an inner side facing each other and the inner side gradually protruding from both ends to a middle part. A rear end portion of the guide rail is curved upward, the middle portion and a rear end portion extend along the lower straight trajectory, and a front end portion of two guide rails of the out-end guide slide group follows the lower straight trajectory. extend The front end portion is bent upward, the foremost end of the two guide rails of the incoming guide rail group is the inlet end, and the last end of the two guide rails of the outgoing guide rail group is the exit. When each of the negative clamps moves to a boundary position between the semi-circular trajectory of the input end and the linear trajectory below, the two guide rollers of the negative clamp roll into the two guides of the input guide rail group Between the inner sides of the slide rail, the two guide rails of the incoming end guide rail group generate the left clamp body and the upper end portion of the right clamp body through the two guide rollers to overcome the two clamps. A pressing force of a spring force causes the lower ends of the left and right clamps to gradually open when entering the rear ends of the two guide rails of the input guide rail group. When the middle portions of the two guide rail groups of the input guide rail group are opened to the maximum extent, the front ends of the two guide rail groups of the input guide rail group are gradually closed, so that each A negative trajectory of the negative clamp moves to the lower straight trajectory and the semicircle at the end At the boundary position of the track, the two guide rollers of the negative clamp roll into and slide between the two inner sides of the guide rail group of the out-end guide rail group, and the two guide wheels of the out-end guide rail group. The guide rail generates the pressing force that overcomes the spring force of the two clamp springs through the upper ends of the left clamp body and the right clamp body through the two guide rollers, so that the left clamp body and the right The lower end portion of the clip body gradually expands when entering the two rear end portions of the guide rail group of the exit guide rail, and the middle portion of the two guide rail groups of the guide rail group at the exit end gradually expands. When it is opened to the maximum extent, the front ends of the two guide rails of the out-end guide rail group are gradually closed. The electroplating clip conductive type roll-to-roll vertical continuous electroplating equipment as described in item 2 of the patent application scope, wherein the fixture driving mechanism includes a main drive motor, a drive mechanism and the same two sets of sprocket chain mechanisms; each The sprocket chain mechanism includes a driving sprocket, a driven sprocket, and a chain sleeved on the driving sprocket and the driven sprocket. The two chains are respectively located parallel to the plated flexible circuit board. In the two planes of the plane, the plated flexible circuit board is located between the two chains; the main drive motor drives the two active sprocket wheels to rotate synchronously through the transmission mechanism and drives the two chains to move synchronously; the negative electrode The upper end portion of the mounting bracket of the clamp is a T-shaped portion, a longitudinal rod portion of the T-shaped portion is connected to the lower end portion of the mounting bracket, and two ends of a lateral rod portion of the T-shaped portion are respectively fixed to two The chain is perpendicular to the extending direction of the two chains. The electroplating clip conductive roll-to-roll vertical continuous electroplating equipment as described in item 3 of the scope of patent application, wherein the negative electrode conductive mechanism of the power supply system is provided with a negative electrode lead and a conductive slide rail, and is corresponding to each of the negative electrode fixtures. There is a conductive slider and a slider connection mechanism; the conductive slide rail is fixed between the clamp driving mechanism and the electroplating cylinder, and the conductive slide rail has a groove arranged along the moving direction of the plated flexible circuit board Rail, the conductive slide rail is electrically connected to the negative electrode of the DC power source through the negative lead; each conductive slider is mounted on the horizontal rod portion corresponding to the negative clamp through the slider connection mechanism, and on each of the negative electrodes When the clamp moves to the entrance end, the conductive slider corresponding to the negative clamp slides into the groove track of the conductive slide, and is pressed on the conductive slide by the slider connection mechanism, so that the negative clamp Sequentially through the corresponding slider connection mechanism, the conductive slider, the conductive slide rail, and the negative lead of the DC power source through the negative lead; At the exit end, the conductive slider corresponding to the negative electrode clamp slides out of the groove track of the conductive slide rail. The electroplating clip conductive type roll-to-roll vertical continuous electroplating equipment as described in item 4 of the scope of patent application, wherein the slider connection mechanism is provided with a slider spring, a fixing bolt, a connection screw and a connection wire; the negative clamp The transverse rod portion is provided with a through hole, a rod portion of the fixing bolt passes through the corresponding through hole of the negative clamp from top to bottom and is fixedly connected to a top of the conductive slider, and a bolt head of the fixing bolt The slider spring is sleeved on the pole portion of the fixing bolt and abuts on the bottom surface of the transverse pole portion of the corresponding negative clamp and the conductive slide. Between the tops of the blocks, one end of the connection wire is electrically connected and fixed to the bolt head of the fixing bolt through the connection screw, and the other end of the connection wire is correspondingly fixed and electrically connected to the negative clamp. The electroplating clip conductive type roll-to-roll vertical continuous electroplating equipment described in item 1 of the scope of patent application, wherein the electroplating section is provided with an auxiliary guide mechanism; the auxiliary guide mechanism consists of a left bracket, a right bracket, and a left guide wheel. And a right guide wheel, the left bracket and the right bracket are respectively fixed on the bottom surface of the inner cavity of the electroplating cylinder, the left guide wheel and the right guide wheel are both semi-circular barrels, and the left guide wheel is fixed on the left On the bracket, the right guide wheel is fixed on the right bracket, and the left guide wheel and a half arc surface of the right guide wheel are opposite to each other and leave a gap; the plated flexible circuit board passes from the left guide wheel to the right The aforementioned gap between the guide wheels passes. The electroplating clip conductive type roll-to-roll vertical continuous electroplating equipment as described in item 1 of the patent application scope, wherein the pre-plating treatment includes a plate surface cleaning treatment, and the pre-treatment section is provided for spraying a cleaning solution onto the A cleaning liquid nozzle of the plated flexible circuit board surface, a roller box for blocking the cleaning liquid and positioning the movement path of the plated flexible circuit board, and a roller box for the plated flexible circuit board A pre-treatment rectification system which is adjusted when gravity is dropped, and an exhaust device for extracting exhaust gas generated when the cleaning chemical liquid is used to clean the surface of the plated flexible circuit board. The electroplating clip conductive type roll-to-roll vertical continuous electroplating equipment as described in item 7 of the scope of patent application, wherein the post-plating treatment includes a plate surface residual chemical liquid cleaning treatment and a blow drying drying treatment; the post-treatment section is provided There is a cleaning solution nozzle for spraying a cleaning solution onto the surface of the plated flexible circuit board, a roller box for blocking the cleaning solution and positioning the movement path of the plated flexible circuit board, A post-processing correction system for adjusting the electroplated flexible circuit board when it is dropped by gravity, an exhaust device for extracting exhaust gas generated when the cleaning chemical solution is used to clean the electroplated flexible circuit board), A blow-drying air knife for drying the water mist generated on the electroplated flexible circuit board after cleaning the cleaning liquid with normal temperature air, and a drying method for hot-air drying the electroplated flexible circuit board after being blow-dried. Dry wind knife. The electroplating clip conductive roll-to-roll vertical continuous electroplating equipment described in item 8 of the patent application scope, wherein the inner cavity of the electroplating cylinder is provided with an electroplating for spraying an electroplating solution onto the electroplated flexible circuit board. The chemical liquid nozzle is further provided with a cleaning chemical liquid supply device for supplying the cleaning chemical liquid to the cleaning chemical liquid nozzle, and a cleaning chemical liquid supply for supplying the cleaning chemical liquid to the cleaning chemical liquid nozzle. Device and a plating chemical liquid supply device for spraying and supplying the plating chemical liquid to the plating chemical liquid, the cleaning chemical liquid supply device, the cleaning chemical liquid supply device, and the plating chemical liquid supply device include an auxiliary tank, a pump Pumping a filter barrel, the pump extracts a medicinal solution stored in the auxiliary tank, and outputs the extracted medicinal solution through the filter barrel for impurity filtration and output; the auxiliary tank of the cleaning chemical liquid supply device is used for The cleaning chemical liquid is stored, and the cleaning chemical liquid filtered and output by the filter barrel of the cleaning chemical liquid supply device is supplied to the cleaning chemical liquid nozzle; the cleaning chemical liquid supply device is used to store the cleaning chemical liquid, and passes through the cleaning The cleaning chemical liquid filtered out by the filter barrel of the chemical liquid supply device is supplied to the cleaning chemical liquid nozzle; the electroplating chemical liquid supply device is used to store the electroplating chemical liquid, and is filtered by the filter barrel of the electroplating chemical liquid supply device The output plating solution is supplied to the plating solution nozzle.