TW201809368A - Suction plating apparatus - Google Patents

Abstract

A suction plating apparatus 1 is provided to perform a pretreatment step A, a plating step B, and a post-treatment step C. In the suction plating apparatus 1, a plating unit 2 for performing the plating step B at least consists of a plating tank 20 which a plating solution for plating the workpiece 40 is contained, a plurality of clips 10 for holding the upper end of the workpiece 40 and energizing the workpiece 40, a conveyor 30 for moving the clips 10 along the plating tank 20, and a circulation unit D for cycling the plating solution 21 is in the plating tank 20. The workpiece 40 is disposed to be parallel to the moving direction of the clips 10, and the clip 10 holds upper end of the workpiece 40. In the front end of the clip 10 for holding the workpiece 40, a portion not in contact with the workpiece 40 is insulated within a predetermined range, and the predetermined range of the clip after insulated is immersed together with the workpiece 40 in the plating solution 21 in the plating tank 20.

Description

Inhalation plating device

The present invention relates to a suction plating apparatus for plating a workpiece of a product in which a workpiece is vertically immersed in a plating solution by a nip conveying device. The movement is carried out in the plating solution to efficiently achieve good suction plating.

Patent Document 1 (JP-A-2001-196728) discloses a suction plating apparatus in which a blind blind via hole corresponding to a fine wiring circuit can be used in a multilayer printed wiring board. A uniform plating film is formed on the wall surface, so that it is a device for manufacturing a printed circuit board corresponding to a micro-integrated circuit with high yield, and is configured by arranging a plurality of vane suction plating devices on a non-airtight indoor floor. And plating the printed circuit board on the support body of the suction plating apparatus row, and the support body is provided according to the information of the loading and unloading opening of the printed circuit board, and the support body is vibrated On the other hand, a flow is generated in the plating solution, a defoaming treatment is performed, and an exhaust pump is connected to the non-airtight chamber, and plating is performed in a state where the non-airtight chamber is set to a reduced pressure environment.

Patent Document 2 (JP-A-2002-47599) discloses a plating jig for preventing a flow of a liquid in a plating tank in a plating process in a jig for printing a substrate. The printed substrate is bent (warped) to enhance the strength of the holding member, and when the jig is detached from the holding material, the engaging portion is engaged with the vertical wall portion, thereby preventing the jig from scattering due to the reaction force. In the cited document 2, in order to solve the problem, the support member is disposed at a substantially right angle with respect to the sandwiching member, and the support member is constituted by a pair of bifurcated support portions and is located on the downstream side in the flow direction of the plating solution. Thereby, the printed circuit board is prevented from being bent by the plating liquid circulating in the plating bath.

Patent Document 3 (Japanese Laid-Open Patent Publication No. 2003-73895) discloses a jig which is provided with a plated member for moving a plated product in a state of being suspended from a guide rail by continuous plating. The versatility associated with the size of the product. The jig has a structure in which the left and right longitudinal sides of the plated product are sandwiched between the center pillar and the pressing member, and the plated product is pressed against the center pillar by a spring provided on the pressing member. In this state, the plated product is formed in a U-shaped cross section, and the plated product is sandwiched from both outer sides in the thick wall direction, and the spring is inevitably carried out with the plated product due to the insertion of the clamp. The plate thickness is correspondingly compressed, and as a result, versatility can be ensured even for the plated products having different plate thicknesses.

Patent Document 4 (JP-A-2014-224300) discloses that in the plating treatment, in order to improve the processing efficiency of plating or to make the finished product good, the plating solution in the treatment tank is stirred. Patent Document 4 discloses an apparatus for removing a processing liquid in a processing tank more uniformly, and providing a take-out mechanism for taking out a processing liquid placed in the processing tank, and using the take-out mechanism by the take-out mechanism The micro-bubble microbubble generating body is derived from the treatment liquid and the separately supplied gas, and the treatment liquid is agitated by the microbubbles generated by the microbubble generating body, thereby being applied to the surface of the workpiece Make a film. [Prior Art Document] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-196728 [Patent Document 2] Japanese Patent Laid-Open Publication No. JP-A No. 2002-47599 (Patent Document 3) Japanese Patent Laid-Open Publication No. 2003-73895 (Patent Document 4) Publication No. 2014-224300

[Problems to be Solved by the Invention] Up to now, in the plating technology of the semiconductor industry, which requires a higher specification (spec), the technology that is 100% satisfied for the user's requirements does not exist yet. And have been trying each other to try to allow for the level. Since it is not only required to produce the quality of the product, but also requires the production without reducing the quality, it is produced while dealing with more difficult problems. Among them, in terms of electroplating, it is increasingly difficult to cope with the thinness of the workpieces produced each year. One of the main reasons is the limit of current and voltage that can be transmitted to the workpiece, which causes sparks, burn marks, uneven plating thickness, and poor plating.

Accordingly, the present invention investigates the structure of the apparatus and provides a suction plating apparatus that does not damage the workpiece and that can increase the production rate by a coordinated system.

Further, the suction plating apparatus of the present invention includes an improvement in the nip portion for holding the workpiece and an improvement in the liquid circulation of the plating solution.

The problem of the splicing and transporting method is that the energized contact portion of the workpiece does not generate a spark, and the workpiece is transported without stabilizing the soft workpiece by a stable constant tension, and the stray current is generated without unnecessary energization. The unevenness of the plating thickness on both sides can be adjusted, and the thickness of the workpiece up and down, left and right, and the like can be adjusted.

In addition, the problem of liquid circulation is to perform stable transfer while correcting warpage of the workpiece, and to ensure current density and stability when the amount of liquid exchange is increased without causing a decrease in the concentration of metal in the liquid; The liquid circulation can replace the liquid nearest to the workpiece; it can realize the rapid liquid renewal of the workpiece surface and the confirmation of the energization capacity; it can carry out large-capacity new liquid supply and liquid renewal; in order to achieve surface contamination removal effect (desmearing effect) ) With rapid plating effect, the workpiece surface is generated by rapid flow.

As described above, the present invention provides a suction plating apparatus that can solve the above problems. [Means for solving problems]

In the first aspect of the present invention, the product workpiece is vertically immersed in the plating solution and transported, and the conveyance is performed by a nip conveying device. The jig at this time functions as a current source (for grounding), and the condition is a conductive material. However, it is necessary to correspond to the chemical resistance of the plating solution. Therefore, for example, chrome-plated iron > titanium is used in descending order of current withstand capability. Stainless steel, etc. The portion of the jig that is immersed in the liquid must be covered with an insulator such as rubber, and only the portion in contact with the workpiece is strongly gripped from the workpiece from both sides. In this case, the insulation of the protective jig must be 99% or more so that current does not flow directly from the anode side to the jig without passing through the workpiece. It has been confirmed that the reason is that if it is 99% or more, the processing is not affected, and on the other hand, it is helpful to prevent contact failure. Further, in order to prevent the contact spark of the workpiece from the jig, the front end portion including the jig is sunk into the liquid.

Further, the advantage of the vertical conveyance is that the plating state of both sides can be symmetrical or can be changed to the required balance. Further, since the workpiece is erected, there is no fear of carrying dust, and since it is a nip conveyance, there is an advantage that unnecessary tension is not generated even if the treatment length is long. Further, by changing the interval of the jig, the allowable amount of energization is increased, whereby stability can be obtained.

Further, it has been known that in the immersion type plating tanks of the prior art, the stored chemical liquid is not agitated as expected, and the result is greatly affected. Even if a large-flow pump is used to feed the liquid, the flow will be stagnant, and the flow will be more likely to occur on the liquid surface side due to the influence of the hydraulic pressure, and the amount of convection will decrease as the liquid-facing surface faces downward. There is a stagnation that becomes far less than ideal agitation. Therefore, in the second aspect of the present invention, the liquid flow amount in the required range is increased intensively, and the liquid exchange around the workpiece necessary for plating is easily performed.

In view of the above, the present invention provides a suction plating apparatus including a pretreatment step including at least a hot water washing unit, a water washing unit, and an acid degreasing portion, a plating step, and a post-treatment step including at least a water washing unit and a drying unit. The plating portion that performs the plating step includes at least a plating tank that accommodates a plating solution for plating a workpiece, a plurality of clamps that clamp the upper end of the workpiece, and energize the workpiece, and the plurality of clamps a conveying device that moves along the plating tank, and a circulation portion that circulates the plating solution in the plating tank, the workpieces are arranged in parallel along a moving direction of the jig, and the jig is attached to the workpiece The upper end is clamped, and the portion of the front end portion of the clamp that is not in contact with the workpiece that is in contact with the workpiece is subjected to an insulation treatment within a predetermined range, so that the predetermined range of the insulation treatment of the clamp is buried with the workpiece In the plating solution of the plating tank.

Further, the jig includes: a pair of arms for sandwiching the workpiece, an electrode portion that faces the tip ends of the pair of arms, and an opening and closing mechanism that opens and closes the pair of arms, preferably The front end surface of each electrode portion is exposed to insulate the periphery of the electrode portion, and to insulate a predetermined range of the tip end portion of the arm. Further, it is preferable that the insulator around the electrode portion is disposed so as to slightly protrude from the front end surface of the electrode portion in a state where the arm is opened.

Thereby, the front end portion of the jig is buried in the plating solution together with the workpiece, so that the contact spark of the workpiece and the jig can be prevented. Further, since the tip end portion of the jig is insulated within a predetermined range, plating adhesion to the jig can also be prevented.

Preferably, the plating tank is provided with a suction port formed in the center of the bottom of the plating tank along the moving direction of the conveying device, and alternately on both sides of the workpiece in the traveling direction of the workpiece. The anode electrode plate and the discharge port of the plating solution are disposed opposite to the workpiece.

Further, it is preferable that the discharge port is disposed above the workpiece, or a plurality of the discharge ports may be disposed along the longitudinal direction of the workpiece.

Further, the circulation unit preferably includes at least a suction pump connected to the suction port, a plating liquid storage tank (management tank) connected to the suction pump, and a discharge pump connected to the discharge port. . Further, it is preferable to provide a filter for filtering the plating solution between the discharge pump and the discharge port.

In this case, the suction of the plating solution becomes suction from directly under the workpiece, so even if there is unnecessary defect or curling warpage in the workpiece body, the plating liquid of a very fast flow rate can be applied to both sides of the workpiece. Moving downwards also produces the effect of stretching the workpiece straight down to the lower side, resulting in stable transport.

In addition, since the suction capacity from the suction port is increased by the drop from the plating tank, even if the discharge pump is made large, the suction can be performed at an overwhelming speed, so that the balance is shifted upward. The discharge pipe is disposed partially to form a flow of the plating solution that is orthogonal to the workpiece, so that the low-concentration plating solution that supplies metal ions to the surface of the workpiece is immediately returned to the management tank, so that the surface of the workpiece can be continuously supplied. The new plating solution is adjusted so that high current density can be achieved.

Further, by allowing the plating solution to pass through the surface of the workpiece at a high speed in a thin curtain shape, an attractive force can be generated on the surface of the workpiece, which removes foreign matter adhering to the workpiece, and has a pattern of irregularities or through holes and via holes ( The surface contamination removal effect is generated in the via hole or the like, and the adhesion of the plating itself is good, and the flow of the smooth current is accelerated.

Furthermore, as a supplementary harvest, the recovery under the overflow has been relieved from the size of the transfer tube, or the treatment of the overflow liquid before and after the workpiece is removed, and the plating solution in the groove is further plated. The waves will also disappear, so various advantages or cost reductions can be achieved in the design of the device.

Regarding the current density of general electrolytic copper plating to date, 3 A/dm ² to 5 A/dm ² is the limit if stability is required, and 6 A/dm ² to 8 A/dm is required even when high-speed plating is pursued. ^{2 is} regarded as the limit, but according to the present invention, stable plating at 12 A/dm ² was actually verified, and high-speed plating up to 15 A/dm ² was achieved without causing damage to the workpiece at all. [Effects of the Invention]

According to the present invention, the front end portion of the jig is insulated, and the workpiece is immersed in the plating solution and moved by the tip end portion of the jig, so that the contact spark generated between the workpiece and the jig can be prevented, so that the execution efficiency is good. Plating. Further, since the suction port is provided at the center of the bottom of the plating tank corresponding to the movement range of the workpiece, and the plating liquid is circulated along the surface of the workpiece, the productivity can be improved without damaging the workpiece.

Hereinafter, embodiments of the invention will be described based on the drawings. [Examples]

As shown in FIG. 1, the suction plating apparatus 1 of the embodiment of the present invention is roughly classified into three stages of a pre-processing step A, a plating step B, and a post-processing step C. The pre-treatment step A is, for example, at least the first hot water washing unit A1 that performs hot water washing of the workpiece, and the degreasing and degreasing unit A2 that performs degreasing of the workpiece that has been washed by hot water, and is used for degreasing from the surface of the workpiece. The second hot water washing unit A3 washed out by the oil, the water washing unit A4 which further washes the surface of the workpiece, and the final acid treatment on the surface of the workpiece to remove the extremely thin oxide film to expose the acid activated portion A5 of the activated base surface. It is constructed and the surface of the workpiece is treated in such a manner that the surface of the workpiece can be well plated.

The plating unit 2 performs, for example, a plating step B on which copper sulfate plating is performed. Further, the post-processing step C is at least a water washing portion C1 for rinsing the plating solution, a rust preventing portion C2 for performing rustproof processing on the surface of the workpiece, a water washing portion C3 for performing rust-proof processing on the surface of the workpiece, and a workpiece The air portion C4 that blows air on the surface and blows off water or the like, and further forms a drying portion C5 that dries the surface of the workpiece.

As shown in FIGS. 2 to 4, the plating unit 2 includes a transfer device 30 that moves a plurality of jigs 10 that sandwich the workpiece 40 along the plating tank 20. The plating solution 21 is accommodated in the plating tank 20. The suction port 22 provided at the center of the bottom of the plating tank 20 is formed to have a predetermined length in the moving direction of the jig 10. In particular, the suction port 22 is located below the workpiece 40 held by the jig 10.

Further, the discharge pipe 23 and the anode electrode plate 24 having the discharge ports of the plating solution are alternately arranged in parallel with the moving direction along the moving direction of the workpiece 40. Further, the anode electrode plate 24 is connected to the connection screw 24b by the anode electrode wire 24a. The connecting screw 24b is formed of a conductive material.

Further, the plating unit 2 includes a circulation portion D including at least a suction pump 25 connected to the suction port 22 and a plating liquid storage tank (management tank) connected to the suction pump 25. 26. The discharge pump 27 is connected to the discharge pipe 23 having the discharge port via the filter 28. Further, a plurality of discharge ports are formed in the discharge pipe 23 in the longitudinal direction. Further, instead of the discharge pipe 23, a discharge pipe 23' located in the vicinity of the surface of the plating solution 21 of the plating tank 20 may be provided.

According to the above configuration, by driving the suction pump 25 and the discharge pump 27, the plating solution is discharged from the discharge port of the discharge pipe 23 to the workpiece 40, and the plating solution is sucked from the suction port 22, so that the plating solution 21 is as shown in FIG. As shown in the figure, the surface of the workpiece 40 is rapidly lowered, so that the workpiece 40 is straightly stretched downward, so that the deflection or warpage of the workpiece 40 can be prevented.

Further, the low-concentration plating solution which has finished supplying the metal ions to the surface of the workpiece is immediately returned to the management tank 26, so that the newly-adjusted plating solution can be continuously supplied to the surface of the workpiece 40, so that a high current density can be realized.

Further, as shown in FIGS. 5 and 6, the jig 10 is provided with a pair of arms 11, 11 and electrode portions 12, 12 which are provided to face each other at a front end of the pair of arms 11, 11. The pair of arms 11, 11 are rotatably supported via the support portions 13, 13 on the pivot point 32 provided on the rod 31 extending from the conveyor 30. Further, between the arms 11, 11 and the rod 31, springs 14, 14 for biasing the arms 11, 11 in the closing direction are disposed, and further, the other ends of the arms 11, 11 are provided. The clamp opening and closing rollers 15, 15. Furthermore, the jig 10 constitutes a cathode electrode via the transfer device 30. Further, as shown in FIG. 6, the jig 10 is biased by the opening/closing rails 15 and 16 by the clamp opening/closing rollers 15 and 15, and is opened, and is opened and closed by the jig 15 as shown in FIG. 15, the self-opening and closing rails 16, 16 are disengaged, and the workpieces are clamped by the springs 14, 14 being closed.

Further, the periphery of each of the electrode portions 12 and 12 of the jig 10 of the present invention and the predetermined range of the arms 11 and 11 are insulated to form an insulating coating. The insulating coating layer is composed of an arm-side insulating coating 50 that insulates a predetermined range of the arms 11, 11 and an electrode-side insulating coating 51 formed around each of the electrode portions 12, 12, and the electrode-side insulating coating 51 It is configured to extend from the electrode portions 12 and 12 by a predetermined range in a state where the jig 10 is opened.

The workpiece 40 is sandwiched by the jig 10, and the front end face 12a of the electrode portions 12, 12 of the jig 10 is in contact with the workpiece 40, whereby current flows from the anode electrode plate 24 to the workpiece 40 via the plating solution 21. The metal cation adheres to the surface of the workpiece 40 to form a plating on the surface of the workpiece 40.

The contact portion of the workpiece 40 with the electrode portions 12, 12 of the jig 10 is immersed in the plating solution 21, so that a contact spark between the workpiece and the jig 10 can be prevented. Further, since the insulating coating layers 50 and 51 are formed in the portion of the jig 10 that is immersed in the plating solution, plating adhesion to the jig 10 can be prevented.

A‧‧‧Pre-processing steps

A1‧‧‧1st hot water washing department

A2‧‧‧ Pickling and Degreasing Department

A3‧‧‧2nd hot water washing department

A4‧‧‧ Washing Department

A5‧‧‧ Acid Activation Department

B‧‧‧ plating step

C‧‧‧post processing steps

C1‧‧‧ Washing Department

C2‧‧‧Anti-rust department

C3‧‧‧ Washing Department

C4‧‧ Air Department

C5‧‧‧Drying Department

D‧‧‧Circulation Department

1‧‧‧Inhalation plating device

2‧‧‧ plating department

10‧‧‧Clamp

11‧‧‧ Arm

12‧‧‧Electrode

12a‧‧‧ front face

13‧‧‧Support

14‧‧‧ Spring

15‧‧‧Clamp opening and closing roller

16‧‧‧Open and close rails

20‧‧‧ plating tank

21‧‧‧ plating solution

22‧‧‧Inhalation

23, 23'‧‧‧Spray tube

24‧‧‧Anode electrode plate

24a‧‧‧Anode wire

24b‧‧‧Connecting screws

25‧‧‧Inhalation pump

26‧‧‧ plating liquid storage tank (management tank)

27‧‧‧Spray pump

28‧‧‧Filter

30‧‧‧Transfer

31‧‧‧ great

32‧‧‧Rotating pivot

40‧‧‧Workpiece

50‧‧‧ Arm side insulation coating

51‧‧‧Electrode side insulation coating

FIG. 1 is an explanatory view showing an example of an overall configuration of a suction plating apparatus according to the present invention. FIG. 2 is an explanatory view showing an example of a plated portion. 3 is a plan view showing an example of a plated portion. 4 is a cross-sectional structural view showing an example of a plating tank. Fig. 5 is an explanatory view showing a closed state of the jig. Fig. 6 is an explanatory view showing an open state of the jig.

Claims (6)

A suction plating apparatus comprising: a pretreatment step including at least a hot water washing unit, a water washing unit, and an acid degreaser portion; a plating step; and a post-treatment step including at least a water washing unit and a drying unit, the suction plating step The apparatus is characterized in that: the plating portion that performs the plating step includes at least a plating tank that accommodates a plating solution for plating a workpiece, a plurality of clamps that clamp the upper end of the workpiece, and energize the workpiece. a conveying device for moving the plurality of jigs along the plating tank, and a circulation portion for circulating the plating solution in the plating tank, the workpiece being parallel in a moving direction of the jig Arranging, and the clamp grips an upper end of the workpiece, and a portion of the front end portion of the clamp that is not in contact with the workpiece that is clamped to the workpiece is insulated in a predetermined range, so that The predetermined range of the insulating treatment of the jig is immersed in the plating solution of the plating tank together with the workpiece. The suction plating apparatus according to claim 1, wherein the jig includes: a pair of arms for sandwiching the workpiece; and an electrode portion disposed at a front end of each of the pair of arms facing each other And an opening and closing mechanism that opens and closes the pair of arms, and insulates the periphery of the electrode portion so that the front end surface of each of the electrode portions is exposed, and insulates a predetermined range of the tip end portion of the arm. The inhalation plating apparatus according to claim 1 or 2, wherein the plating tank is provided with the plating liquid formed in the center of the bottom of the plating tank along a moving direction of the conveying device The suction port further includes, on both sides of the workpiece, an anode electrode plate opposed to the workpiece and a discharge port of the plating solution alternately arranged in a traveling direction of the workpiece. The suction plating apparatus according to claim 3, wherein the discharge port is disposed above the workpiece. The suction plating apparatus according to claim 3, wherein the discharge port is disposed in plural along the longitudinal direction of the workpiece. The inhalation plating apparatus according to claim 3, wherein the circulation unit includes at least a suction pump connected to the suction port, a plating liquid storage tank connected to the suction pump, and A discharge pump in which the discharge port is connected.