KR101943403B1 - Roll-to-roll electroplating equipment with plating peeling function for clamp - Google Patents

Abstract

The present invention relates to a roll-to-roll electroplating system with a delaminating function for a plated clamp, and more specifically, a roll-to-roll electroplating system for automatically delaminating a plated clamp in equipment for performing electroplating while transferring a substrate using an FPCB or an FCCL in a roll-to-roll way. The roll-to-roll electroplating system includes: a process bath of an electroplating line (100); a process bath of a substrate post-processing line (300); and a process bath of a clamp delaminating line (200) to delaminate an unwanted electroplating on the surface of a clamp. The process baths are arranged such that a movement path of a substrate transferred in a roll-to-roll way is extended from the electroplating line (100) to the substrate post-processing line (300), and then, the process baths are arranged such that a movement path of the clamp is extended from the electroplating line to the clamp delaminating line. The process bath of the substrate post-processing line and the process bath of the clamp delaminating line are branched off at the rear end of the process bath of the electroplating line and are arranged in parallel, so that the substrate and the clamp are continuously moved in a line without stop.

Description

[0001] The present invention relates to a roll-to-roll electroplating equipment with plating peeling function for clamp,

The present invention relates to a roll-to-roll electroplating apparatus equipped with a plating peeling function of a clamp, and more particularly to a roll-to-roll electroplating apparatus equipped with a clamping function of a clamp, To a roll-to-roll electroplating apparatus for stripping and removing a plated metal object including a sticking deposit by a continuous automation process, and a roll-to-roll electroplating apparatus for sequentially performing a subsequent process of substrate electroplating.

A known technology for a roll-to-roll electroplating system is disclosed in Korean Patent Laid-Open Publication No. 10-2018-0003977 (hereinafter referred to as "prior art"), Vertical Continuous Electroplating Apparatus "

The prior art includes an unwinding machine, a pre-treatment stage, an electroplating stage, a post-treatment stage, and a winding machine, wherein the electroplating stage includes an electroplating cylinder, a plurality of cathode clamps, Plate and a power supply system are installed, and the clamp drive control device includes a period during which the cathode clamp is opened before entering the inlet end of the unwinding machine (unrewering machine) and moving from the inlet end to the outlet end of the winding machine And is driven to move apart from the exit end position. The electroplating uniformity is high and the application range of the flexible circuit board for electroplating is wide, and electroplating layering phenomenon does not occur on the electroplated plate Flexible circuit boards for electroplating with smaller occupied space and thinner thickness can be electroplated Work safety is high and a high reliability of the electroplating clip-conducting roll-to-roll structure presents a vertical continuous electroplating apparatus.

However, according to the prior art, as the current is supplied to the substrate through the cathode clamp, the surface of the clamp holding the substrate during the plating process of the substrate is electroplated together with the substrate. The contact between the clamp and the substrate becomes unstable due to the electroplating around the contact portion, the current supplied to the substrate becomes unstable and the uniformity of the plating is lowered. In addition, when the clamp holds the substrate, There is a problem that the substrate is scratched and damaged by plating.

Therefore, conventionally, in the process of in-line electroplating, not only the plating of the substrate but also the undesired plating of the clamp, the electroplating process is stopped in accordance with the process specification for removing the plating material of the clamp, and the clamp is manually peeled off There was a problem that we had to work.

[Patent Document 1] Korean Patent Laid-Open Publication No. 10-2018-0003977 (published on Aug. 10, 2018)

SUMMARY OF THE INVENTION The present invention has been conceived to solve the above-mentioned problems, and it is an object of the present invention to provide a plating apparatus capable of continuously performing a plating peeling process on a clamp without interruption of a process during roll- It is an object of the present invention to provide a two-roll electroplating apparatus.

Further, the present invention can eliminate plating deviation caused by unwanted clamp plating at the time of electroplating, and at the same time, leads to a step of performing automatic peeling removal of clamp plating in succession to electroplating, thereby preventing scratching of the substrate, And an object of the present invention is to provide a roll-to-roll electroplating apparatus capable of electroplating with uniform thickness for each substrate.

The problems to be solved by the present invention are not limited to the above-mentioned problems. Other technical subjects not mentioned will be apparent to those skilled in the art from the following description.

A roll-to-roll electroplating apparatus according to the present invention includes: an electroplating line; A clamp peeling line which is disposed in a straight line with the electroplating line behind the electroplating line and in which a peeling process for the electroplated metal is performed on the substrate transfer clamp; A post-treatment line branched from the electroplating line and the clamp peeling line, the post-treatment line performing a post-treatment process on the substrate passed through the electroplating line; A chain driven by a sprocket and extending along the electroplating line and the clamp peeling line; A plurality of clamps installed along the chain and gripping the substrate to be transported along the electroplating line; The clamp releasing means for releasing the holding state of the substrate passed through the electroplating line; And a substrate direction switching means for switching a traveling direction of the substrate passed through the electroplating line and guiding the substrate to the substrate post-processing line, wherein the clamp having released the holding state of the substrate is moved to the clamp peeling line And then return to the previous end of the electroplating inlet after the plating on the surface is peeled off.

The roll-to-roll electroplating apparatus according to the present invention further includes a clamp raising means for raising the clamp in which the holding state of the substrate is released by the grip releasing means to prevent interference between the clamp and the substrate when the substrate is turned .

In addition, the roll-to-roll electroplating apparatus according to the present invention may further include clamping means for maintaining the clamped state while the clamp passes through the clamp peeling line.

According to the present invention, when electroplating to form a metal thin film such as copper, nickel, gold, or the like on the surface of a substrate, a metal material plated on the surface of the clamp as well as the substrate passes through the clamp peeling line, And the cleaned clamp is returned to the electroplating line and is continuously and cyclically circulated. Thus, the substrate plating process can proceed without stopping the process, the uniformity of the plating can be improved even in the continuous plating, and scratching of the substrate can be prevented.

1 is a planar view of a roll-to-roll electroplating apparatus according to an embodiment of the present invention;
2 is a front view of a roll-to-roll electroplating apparatus according to an embodiment of the present invention;
3 is a side view of a clamp peeling line in a roll-to-roll electroplating apparatus according to an embodiment of the present invention.
Fig. 4 is a side view showing the clamp part in Fig. 3 of the present invention. Fig.
5 is a perspective view of Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. For convenience of explanation, elements shown in the drawings may be exaggerated, omitted, or schematically represented.

The roll-to-roll electroplating apparatus according to an embodiment of the present invention is a roll-to-roll electroplating apparatus that rolls a substrate to roll a substrate such as copper, nickel, gold, or the like, on which a flexible printed circuit board (FPCB) or a flexible copper clad layer (anode) and an electrode plate (cathode) while performing electroplating on a substrate held by a clamp in accordance with the current flow between the clamp (anode) and the electrode plate (cathode). All of the platings to be discussed below will be understood as electroplating for electroplating a metal thin film on a clamped substrate as described above.

1 to 5 according to an embodiment of the present invention, an electroplating line 100, a clamp peeling line 200, a substrate post-processing line 300, a chain 400, a clamp 500, A grip releasing means 600, a substrate direction switching means 700, a clamp rising means 800 and a clamping means 900. [

The roll-to-roll electroplating apparatus of the present invention basically obeys the electroplating process which has been conventionally used. Therefore, detailed description of the general description of various detailed process steps involved in the electroplating process will be omitted.

First, in the present invention as in the prior art, the substrate 10 is transported in a roll-to-roll manner as described above. To this end, as shown in FIG. 1, a feed roll 20 is provided in front of the electroplating line 100, and a recovery roll 30 is provided behind the substrate post-processing line 300.

In the present invention, the substrate 10 sequentially passes through the electroplating line 100, the substrate direction switching unit 700, and the substrate post-processing line 300 in the supply roll 20, .

In the present invention, the electroplating line 100 is for performing an electroplating process such as copper, nickel, and gold on the substrate 10, and the electroplating line 100 is shown in FIGS. 1 and 2 A plating bath 110 and an electrode plate 120 installed inside the plating bath 110 and used as an anode.

Although not shown in the drawing, a pretreatment line may be provided in front of the electroplating line 100 to perform processes such as degreasing and cleaning on the substrate 10. [

As shown in FIGS. 1 and 2, the clamp peeling line 200 is connected to the electroplating line 100 and the electroplating line 100 so that the stripping process can be performed in a fully automated manner continuously after the electroplating process, And are disposed so as to be arranged in a straight line. During the electroplating process of metal such as copper, nickel, and gold of the substrate 10 in the clamp peeling line 200, the peeling process for copper / gold plated on the clamp 500 is continuously and continuously performed. The clamp peeling line 200 is provided to remove the electroplated metal in the clamp 500 by an electrolytic stripping method or a chemical stripping method. 2 and 3, the clamp peeling line 200 is provided with a peeling tank 210 for electrolytic peeling and a polarizing plate 210 disposed inside the peeling tank 210 and having a polarity opposite to that during electroplating, And an electrode plate 220 connected to the bus bar and used as a cathode, and the clamp is connected to the + booth so as to be an anode.

The present invention can be configured as a chemical process tank for performing chemical separation instead of constituting the peeling tank 210 as a peeling tank for electrolytic peeling.

In addition, the present invention is not limited to the case where the peeling tank 210 for separating electrolytic peeling and chemical peeling is alternatively provided in the peeling tank 210 as described above, But it is of course possible to arrange them continuously regardless of the order of electrolytic peeling and chemical peeling.

Needless to say, the clamp peeling line 200 may further include a water reservoir 230 for washing the clamp 500 through the peeling tank 210.

Meanwhile, the substrate post-processing line 300 according to the embodiment of the present invention is installed to branch between the electroplating line 100 and the clamp peeling line 200 as shown in FIG. In this substrate post-treatment line 300, post-treatment processes such as pickling, washing, drying, and the like for the substrate 10 which has passed through the electroplating line 100 are continuously performed.

As shown in the figure, the substrate post-processing line 300 is disposed laterally spaced apart from the clamp peeling line 200 so that the process vessels are disposed in parallel with the electroplating line 100 and the clamp peeling line 200 have. However, the structure in which the process tanks and the laying apparatus of the substrate post-processing line 300 are arranged is installed orthogonally to the electroplating line 100 and the clamp stripping line 200, It is possible to change the arrangement of the process tanks for various purposes.

On the other hand, the electroplating line 100 and the clamp peeling line 200 are formed so that the substrate post-processing line 300 branches off between the electroplating line 100 and the clamp peeling line 200, 200 may be provided with a branch tank 1000, which may be replaced or understood as a space portion. The branch tank 1000 is formed so as to have a width wider than the plating tank 110 and protrudes out to one side of the plating tank 110. The clamp peeling line 200 is connected to one side of the rear side of the branch tank 1000 and the substrate post-processing line 300 is connected to the rear side of the rear side. The bifurcation tank 1000 provides a space for changing the direction of the substrate 10 by accommodating the substrate direction switching means 700 to be described later.

The chain 400 is for moving the clamp 500 along the electroplating line 100 and the clamp peeling line 200. The chain 400 is driven by the sprocket 410 and is connected to the electroplating line 100, (Not shown). The chain 400 is disposed on the upper side of the electroplating line 100 and the clamp peeling line 200 in two rows.

2, the sprocket 410 includes a drive sprocket 411 and a follower sprocket (not shown) provided at both ends of the chain 400, and a chain (not shown) between the drive sprocket 411 and the follower sprocket 400 disposed along the path of the guide sprocket 412. A drive motor 420 for driving the chain 400 is connected to the drive sprocket 411.

The chain 400 may be installed extending from the previous end of the electroplating line 100, that is, from the preprocessing line, through the electroplating line 100, to the clamp peeling line 200, although not shown in the drawing. Thus, the chain 400 moves the clamp 500 from the preprocessing line to the clamp peeling line 200 and then returns to the previous end of the electroplating inlet.

As shown in FIG. 2, a plurality of clamps 500 are installed along the chain 400, and the clamps 500 are gripped and transferred along the electroplating line 100. As shown in FIGS. 4 and 5, the clamp 500 includes a cross bar 510 installed to cross between the two side chains 400; A vertical stand 520 protruded downward from the center of the cross bar 510; Two rotating tables 530 pivotably coupled to both sides of the vertical table 520; And two wheels 540 rotatably coupled to the two rotatable wheels 530.

The two rotating tables 530 are rotatably coupled by brackets (not shown) mounted to connect the two rotating tables 530 to the middle portion of the vertical table 520, Or narrowed. The two swivel spans 530 are provided so that the lower ends of the swivel springs 530 can be maintained in a normally narrowed state by a 'C' shaped spring 550 connecting them.

The two wheels 540 are coupled to the upper ends of the two swivel spans 530, respectively. The two wheels 540 are installed so that their rotational axes are parallel to the longitudinal direction of the two rotating tables 530, respectively.

Although not shown, a power supply device for supplying current to the substrate 10 is connected to the clamp 500.

The grip releasing means 600 is provided at the rear end of the electroplating line 100 as shown in FIGS. 1 and 2, for releasing the clamp 500 holding the substrate 10. The grip releasing means 600 is composed of two release guides 610 which are rod-shaped and spaced apart from each other. A clamp 500 passing through the rear end of the electroplating line 100 passes between the two release guides 610. The two release guides 610 are in contact with the two wheels 540 of the clamp 500 passing between them.

As shown in FIG. 1, an entrance slope 611 and an exit slope 612 are formed on the side surfaces of the two release guides 610 facing each other. The entering inclined plane 611 is formed to be inclined so that the distance between the two release guides 610 becomes narrower toward the rear. The gap between the two release guides 610 narrowed by the entry slope 611 is inclined so that the distance between the two release guides 610 becomes wider as they are rearward.

As a result, the clamp 500 entering between the two release guides 610 moves the two wheels 540 on the entering slope 611, so that the lower ends of the two swivel spans 530 are opened, To release the holding state of the substrate 10. The lower ends of the two swivel spans 530 that pass through the entrance slopes 611 are gradually narrowed again by the restoring force of the springs 550 in the course of moving the two wheels 540 along the slopes 612 .

As shown in the drawing, the release guide 610 may have a rear portion thereof bent upward. At this time, the rear portion of the release guide 610 is formed to be bent in response to a section in which the chain 400 is lifted by the clamp lifting means 800, which will be described later, by means of the clamp lifting means 800, When the clamp 500 is lifted, the clamp 500 ascends in a state in which the clamp 500 is opened, i.e., in a state in which the substrate 10 is gripped and released, and deviates to the upper side of the substrate 10. [

Although not shown in the figure, the clamp 500 has the same or similar structure as that of the grip releasing means 600 to the electroplating line 100 or the preprocessing line, so that the clamp 500 is connected to the pretreatment line and the electroplating line 100 May be used as a means to enable the substrate 10 to pass therethrough. That is, by providing the front end of the electroplating line 100 or the pretreatment line having the same or similar structure as that of the grip releasing means 600, the upper end of the clamping plate 500 So that the substrate 10 can be gripped again.

As shown in FIGS. 1 and 2, the substrate direction switching unit 700 is disposed at the rear end of the electroplating line 100 and switches the direction of the substrate 10 through the electroplating line 100 To guide the substrate after-treatment line 300 to the substrate processing line 300.

The substrate direction switching means 700 includes a first switching roller 710 which is provided in the branch tank 1000 and supports the substrate 10 through the electroplating line 100 and guides the substrate 10 to the side of the electroplating line 100 And a second switching roller 720 for supporting the substrate 10 to be transported laterally of the electroplating line 100 by the first switching roller 710 and guiding the substrate 10 to the substrate processing line 300 So as to guide the substrate 10 so that the substrate 10 that has passed through the plating bath 110 can be introduced into the substrate after-treatment line 300.

The clamp lifting means 800 raises the clamp 500 in which the holding state of the substrate 10 is released by the grip releasing portion 600 as shown in FIG. (500) and the substrate (10). The clamp lifting means 800 includes a lifting sprocket 810 installed to raise the position of the chain 400 moved from the electroplating line 100 side to the clamp peeling line 200 side for a predetermined period of time .

The upward sprocket 810 is installed along the chain 400 and is installed so that the chain 400 can be lifted over a section corresponding to the length of the branch tank 1000. The lift sprocket 810 raises the clamp 500 to the upper side of the substrate 10 until the clamp 500 with the gripped state of the substrate 10 released passes through the branch tank 1000 .

The clamp 500 having passed through the branch tank 1000 is lowered together with the chain 400 by the guide sprocket 412 'provided adjacent to the rising sprocket 810 so that the lower end of the clamp 500 is separated from the peeling tank 210, So that it can be immersed in the release liquid contained in the cleaning liquid.

The clamping means 900 is installed along the clamping peeling line 200 as shown in Figs. 1 and 2, so that the clamp 500 is opened while the clamping 500 is opened To maintain the state. The clamping means 900 is composed of two embossing guides 910 arranged in a rod shape and spaced apart from each other in the left and right directions. The two spring guides 910 are extended along the clamp peeling line 200. The clamp 500 passing through the clamp peeling line 200 passes through the two bulging guides 910 as shown in FIGS. The two spring guides 910 are in contact with the two wheels 540 of the clamp 500 passing between them.

As shown in FIG. 5, the entrance slope 911 and the exit slope 912 are respectively formed at the front end and the rear end of the side face facing each other in the two opening guides 910. The inclined entrance surface 911 is inclined so that the distance between the two guide guides 910 at the front end of the two guide guides 910 becomes narrower toward the rear. The exit slope 912 is inclined so that the gap between the two slopes 910 narrowed by the slope 911 is widened toward the rear.

As a result, the lower end of the two swivel spans 530 is opened by moving the two wheels 540 on the entering slope 911, and the clamp 500 Is kept in a flared state until reaching the exit slope 912 and is immersed in the peeling liquid contained in the peeling tank 210. The clamp 500 that has reached the exit slope 912 is gradually narrowed again by the restoring force of the spring 550 in the course of moving the two wheels 540 on the exit slope 912.

Hereinafter, the operation of the roll-to-roll electroplating apparatus of the present invention will be described.

First, the substrate 10 is recovered to the recovery roll 30 via the pretreatment line, the electroplating line 100 and the substrate post-treatment line 300 in the supply roll 20. The clamp 500 is moved by the chain 400 and returns to the previous stage of the electroplating inlet after passing through the pretreatment line, the electroplating line 100 and the clamp delamination line 200.

The clamp 500 is moved while holding the upper portion of the substrate 10 until the substrate 10 passes through the electroplating line 100 and the substrate 10 is transferred to the electroplating line 100 The gripped state of the substrate 10 is released by the grip releasing means 600 and then raised by the clamp raising means 800 and deviated to the upper side of the substrate 10. [

The substrate 10 having passed through the electroplating line 100 is transferred to the substrate post-processing line 300 by the substrate direction switching means 700 after the holding state by the clamp 500 is released, 30).

The clamp 500 lifted out of the substrate 10 moves to the clamp peeling line 200 by the chain 400 and descends to the original height when reaching the clamp peeling line 200, (210).

Thereafter, the clamp 500 is moved along the clamp peeling line 200 while maintaining the state of being opened by the clamping means 900. After passing through the clamp peeling line 200, the clamp 500 is returned to the previous stage of the electroplating entrance And returned.

According to the roll-to-roll electroplating apparatus of the present invention, the metal electroplated to the surface of the clamp 500 at the time of electroplating the substrate 10 is clamped by the clamp separation line 200, And the metal-peeled clamp is returned to the electroplating line by the rotation of the chain by the motor drive, whereby the roll-to-roll electroplating as well as the clamp automatic peeling are performed, and accordingly, It is possible to improve the uniformity of the plating and to prevent scratching of the substrate.

According to the present invention, since the clamp 500 passing through the clamp peeling line 200 is maintained in a state in which the clamp 500 is opened, an electroplated metal plating around the contact portion of the clamp 500 with the substrate 10 is unnecessarily And can be smoothly peeled off in a continuous and continuous automation process.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the scope of protection of the present invention should be determined by the description of the claims and their equivalents.

100; Electroplating line 110; Plating bath
120; An electrode plate (anode) 200; Clamp peeling line
210; Peeling tank 220; The electrode plate (anode)
230; Water bath 300; Substrate post-processing line
400; Chain 410; Sprocket
411; A drive sprocket 412; Guide sprocket
420; A driving motor 500; clamp
510; Crossbar 520; Vertical stand
530; A swivel 540; Wheel
550; Spring 600; The grip releasing means
610; Release guide 611; Entry slope
612; Exit slope 700; Substrate direction switching means
710; A first switching roller 720; The second switching roller
800; Clamp rising means 810; Rising sprocket
900; Clamping means 910; Opening Guide
911; Entry ramp 912; Exit slope
1000; Quiver

Claims (6)

delete An apparatus for performing electroplating while transferring a substrate by a roll-to-roll method for electroplating a substrate on which FPCB or FCCL is used,
An electroplating line (100);
A step of removing the electroplated metal from the electroplating line 100 is performed on the clamp 500 which is installed in the rear of the electroplating line 100 in line with the electroplating line 100 and used as an electrode for holding the substrate and electrically connected to the substrate A clamp peeling line 200;
A substrate post-processing line (300) branched from the electroplating line (100) and the clamp peeling line (200) for performing a post-process on the substrate through the electroplating line (100);
A chain (400) driven by the sprocket (410) and extending along the electroplating line (100) and the clamp peeling line (200);
A plurality of clamps 500 installed along the chain 400 and gripping the substrate to be transported along the electroplating line 100;
A grip releasing means (600) for releasing the holding state of the substrate passed through the electroplating line (100) by the clamp (500); And
And a substrate direction switching unit (700) for switching the traveling direction of the substrate through the electroplating line (100) and guiding the substrate to the substrate after-treatment line (300)
After the electroplating, the substrate is redirected and transferred to the post-processing line by the roll-to-roll line. At the same time, the clamp 500, which is released from the substrate, is moved to the clamp peeling line 200 to remove the surface- It is configured to return to the previous stage,
Clamp raising means (not shown) for lifting the clamp 500 with the gripping state of the substrate released by the grip releasing means 600 and operating so as to prevent contact interference between the clamp 500 and the substrate upon switching of the substrate 800). ≪ / RTI > The roll-to-roll electroplating apparatus of claim < RTI ID = 0.0 > 1, < / RTI >
An apparatus for performing electroplating while transferring a substrate by a roll-to-roll method for electroplating a substrate on which FPCB or FCCL is used,
An electroplating line (100);
A step of removing the electroplated metal from the electroplating line 100 is performed on the clamp 500 which is installed in the rear of the electroplating line 100 in line with the electroplating line 100 and used as an electrode for holding the substrate and electrically connected to the substrate A clamp peeling line 200;
A substrate post-processing line (300) branched from the electroplating line (100) and the clamp peeling line (200) for performing a post-process on the substrate through the electroplating line (100);
A chain (400) driven by the sprocket (410) and extending along the electroplating line (100) and the clamp peeling line (200);
A plurality of clamps 500 installed along the chain 400 and gripping the substrate to be transported along the electroplating line 100;
A grip releasing means (600) for releasing the holding state of the substrate passed through the electroplating line (100) by the clamp (500); And
And a substrate direction switching unit (700) for switching the traveling direction of the substrate through the electroplating line (100) and guiding the substrate to the substrate after-treatment line (300)
After the electroplating, the substrate is redirected and transferred to the post-processing line by the roll-to-roll line. At the same time, the clamp 500, which is released from the substrate, is moved to the clamp peeling line 200 to remove the surface- It is configured to return to the previous stage,
The substrate direction switching means (700)
A first switching roller 710 for supporting the substrate 10 through the electroplating line 100 and guiding the substrate 10 to the side of the electroplating line 100; And
And a second switching roller 720 for supporting the substrate 10 transported laterally of the electroplating line 100 by the first switching roller 710 and guiding the substrate 10 to the substrate after-treatment line 300 Features a roll-to-roll electroplating system with clamping and peeling capabilities.
An apparatus for performing electroplating while transferring a substrate by a roll-to-roll method for electroplating a substrate on which FPCB or FCCL is used,
An electroplating line (100);
A step of removing the electroplated metal from the electroplating line 100 is performed on the clamp 500 which is installed in the rear of the electroplating line 100 in line with the electroplating line 100 and used as an electrode for holding the substrate and electrically connected to the substrate A clamp peeling line 200;
A substrate post-processing line (300) branched from the electroplating line (100) and the clamp peeling line (200) for performing a post-process on the substrate through the electroplating line (100);
A chain (400) driven by the sprocket (410) and extending along the electroplating line (100) and the clamp peeling line (200);
A plurality of clamps 500 installed along the chain 400 and gripping the substrate to be transported along the electroplating line 100;
A grip releasing means (600) for releasing the holding state of the substrate passed through the electroplating line (100) by the clamp (500); And
And a substrate direction switching unit (700) for switching the traveling direction of the substrate through the electroplating line (100) and guiding the substrate to the substrate after-treatment line (300)
After the electroplating, the substrate is redirected and transferred to the post-processing line by the roll-to-roll line. At the same time, the clamp 500, which is released from the substrate, is moved to the clamp peeling line 200 to remove the surface- It is configured to return to the previous stage,
Further comprising clamping means (900) for maintaining the clamping state of the clamp (500) while the clamp (500) passes through the clamp peeling line (200) to facilitate the peeling of the inner surface of the clamp A roll-to-roll electroplating system equipped with a plating peeling function.
3. The method of claim 2,
The clamp lifting means 800 raises a chain positioned between the electroplating line 100 and the clamp peeling line 200 to circulate and transfer the clamp 500 immediately after the electroplating line, And a chain height guide means for guiding the height of the chain to be lowered in the peeling line (200).
delete

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