CN101914790A - Gold plating solution for preventing gold immersion - Google Patents
Gold plating solution for preventing gold immersion Download PDFInfo
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- CN101914790A CN101914790A CN 201010240583 CN201010240583A CN101914790A CN 101914790 A CN101914790 A CN 101914790A CN 201010240583 CN201010240583 CN 201010240583 CN 201010240583 A CN201010240583 A CN 201010240583A CN 101914790 A CN101914790 A CN 101914790A
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- gold
- gold plating
- turmeric
- additive
- prevent
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Abstract
The invention relates to gold plating solution for preventing gold immersion. The solution comprises the following components in percentage by weight: 1 to 2 percent of gold potassium cyanide, 70 to 75 percent of cylinder opening agent, 0.01 to 5 percent of additive and 22 to 28 percent of water, wherein the additive is free cyanide. The invention provides the gold plating solution which can simplify a gold plating process and prevent the gold immersion of a non-plated position on the premise of not occupying any resource.
Description
Technical field
The present invention relates to a kind of craft of gilding working fluid, be specifically related to a kind of working fluid that do not need in craft of gilding, to prevent from gold-plated position turmeric.
Background technology
Have now in the selectivity craft of gilding in order to prevent turmeric, need plating one deck chemical nickel phosphorus plating layer as the blocking layer in wherein main a kind of technology, though chemical Ni-plating layer has positive effect to stoping the displacement gold, but owing to contain phosphorus in the chemical Ni-plating layer, and when high temperature aging, phase mutual diffusion between chemical Ni-plating layer and the gold layer, cause the variable color of gold layer serious, can not satisfy technical requirements, thereby need before lead-in wire is gold-plated, increase nickel layer as the blocking layer, the technical process complexity.And the nickel chemical plating technology service temperature is at 90 ℃, and energy consumption is big, and technology stability is poor, the use cost height.Even the use chemical nickel plating also is difficult to assurance and turmeric do not occur, the turmeric phenomenon appears and after, technology is adjusted difficulty.In the wherein another kind of technology, the technical process complexity needs 4 nickel of plating, 2 gold, conversion hanger 2 times, complex operation.If according to the flow process operation of present method, therefore not gold-plated position turmeric when plating bath soaks need plate one deck gold earlier to the housing all sites, last again to not needing gold-plated position nickel plating that Gold plated Layer is covered, and causes the gold waste.Because the technical process complexity, the hold facility resource is many, and energy consumption is big.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, provide a kind of craft of gilding that can make simple, and under the prerequisite that does not take resource, prevent the gold plating liquid of not plated part turmeric.
The present invention is achieved by the following technical solutions:
A kind of gold plating liquid that is used to prevent turmeric comprises and contains potassium cyanaurite and open the cylinder agent, also includes additive; Described additive is a free cyanide; The potassium cyanaurite weight percent is 1～2%; Opening cylinder agent weight percent is 70～75%; Weight of additive per-cent is 0.01～5%; The water weight percent is 22～28%.
A kind of gold plating liquid that is used to prevent turmeric, described free cyanide is specially potassium cyanide.
A kind of gold plating liquid that is used to prevent turmeric, described free cyanide is specially sodium cyanide.
A kind of gold plating liquid that is used to prevent turmeric, described free cyanide is specially prussic acid.
The present invention improves operability in order to optimize technical process, reduces cost, improves work efficiency, and the gold-plated and follow-up nickel plating of cancellation housing needs to solve the turmeric problem of housing when plating bath soaks.The present invention is by to after the gold plating liquid improvement in performance, and having solved housing does not preferably need the position turmeric problem of plating, and electroplates according to optimized flow process, and the turmeric problem does not appear in product.
The present invention improves the gold plating solution technical recipe, is not needing on the basis, chemical nickel plating blocking layer to realize directly gold-plated, and the displacement gold do not occur.Technical recipe is on commercially available gold-plated working fluid basis, add the additive free cyanide, the additive free cyanide obviously stops turmeric, after workpiece nickel plating can being cleaned, it is directly gold-plated to go between, the nickel plating housing soaks in gold plating solution, and housing nickel plating surface is soaked in solution above 20 minutes and the turmeric phenomenon do not occurred, and quality of coating satisfies military standard of China.The additive free cyanide mainly is made up of sequestrants such as potassium cyanide.Use gold plating solution of the present invention, make that operation is simplified, resource occupation is few, energy consumption reduces, process stabilizing, reliable, cost reduction, and can improve production capacity.
Embodiment
The condition that present inventor's gold plating liquid uses is: 45～65 ℃ of temperature, pH value 6～9, current density 0.1～1.0A/dm
2Sedimentation velocity 0.5～5 Grams Per Hour, employed power supply is a direct supply.
Embodiment 1
Unicircuit UP4529-32 shell, the matched seal shell that is assembled into by the chassis that can cut down the 4J29 material, lead-in wire and glass insulator.When using gold plating liquid of the present invention gold-plated, be 1.3～8.9 microns nickel through pre-treatment and plating one layer thickness in advance, the conversion hanger, it is directly gold-plated to go between, and when plated thickness reached 1.3～2.5 microns, the Gold plated Layer weldability was qualified; The salt fog resistance stand the test.The composition of gold plating liquid and condition are: potassium cyanaurite 12.0g/L; The commercially available cylinder agent 600mL/L that opens, additive is selected potassium cyanide solution 10mL/L, electroplating power supply, current density 0.3A/dm for use
2, 55 ℃ of temperature, pH value 7.2, electroplating time 12 minutes.
Embodiment 2
Additive is selected sodium cyanide for use, and all the other are all described with embodiment 1.
Embodiment 3
Additive is selected prussic acid for use, and all the other are all described with embodiment 1.
Claims (4)
1. gold plating liquid that is used to prevent turmeric comprises and contains potassium cyanaurite, opens cylinder agent and water, it is characterized in that also including additive; Described additive is a free cyanide;
The potassium cyanaurite weight percent is 1～2%;
Opening cylinder agent weight percent is 70～75%;
Weight of additive per-cent is 0.01～5%;
The water weight percent is 22～28%.
2. a kind of gold plating liquid that is used to prevent turmeric according to claim 1 is characterized in that described free cyanide is a potassium cyanide.
3. a kind of gold plating liquid that is used to prevent turmeric according to claim 1 is characterized in that described free cyanide is a sodium cyanide.
4. a kind of gold plating liquid that is used to prevent turmeric according to claim 1 is characterized in that described free cyanide is a prussic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010240583 CN101914790A (en) | 2010-07-27 | 2010-07-27 | Gold plating solution for preventing gold immersion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010240583 CN101914790A (en) | 2010-07-27 | 2010-07-27 | Gold plating solution for preventing gold immersion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101914790A true CN101914790A (en) | 2010-12-15 |
Family
ID=43322421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010240583 Pending CN101914790A (en) | 2010-07-27 | 2010-07-27 | Gold plating solution for preventing gold immersion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101914790A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108486618A (en) * | 2018-06-11 | 2018-09-04 | 深圳市博敏电子有限公司 | A method of improving thick metal plated uniformity |
| CN112813472A (en) * | 2020-12-29 | 2021-05-18 | 西安赛尔电子材料科技有限公司 | Local gold plating process for metal-glass packaging tube shell for hybrid integrated circuit |
| CN114059142A (en) * | 2021-11-22 | 2022-02-18 | 深圳市宏钢机械设备有限公司 | Hanger and local gold plating process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4913787A (en) * | 1988-09-06 | 1990-04-03 | C. Uyemura & Co., Ltd. | Gold plating bath and method |
| JPH02133594A (en) * | 1988-11-14 | 1990-05-22 | Shinko Electric Ind Co Ltd | Gold plating solution |
| CN1394987A (en) * | 2002-08-20 | 2003-02-05 | 中国科学院电子学研究所 | Goldplating solution unsubstituted with nickel |
-
2010
- 2010-07-27 CN CN 201010240583 patent/CN101914790A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4913787A (en) * | 1988-09-06 | 1990-04-03 | C. Uyemura & Co., Ltd. | Gold plating bath and method |
| JPH02133594A (en) * | 1988-11-14 | 1990-05-22 | Shinko Electric Ind Co Ltd | Gold plating solution |
| CN1394987A (en) * | 2002-08-20 | 2003-02-05 | 中国科学院电子学研究所 | Goldplating solution unsubstituted with nickel |
Non-Patent Citations (1)
| Title |
|---|
| 《镀金与节金新技术》 19910228 戴传忠等 镀金与节金新技术 上海科学普及出版社 镀金与节金新技术 1-4 , 1 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108486618A (en) * | 2018-06-11 | 2018-09-04 | 深圳市博敏电子有限公司 | A method of improving thick metal plated uniformity |
| CN108486618B (en) * | 2018-06-11 | 2021-01-01 | 深圳市博敏电子有限公司 | Method for improving uniformity of electroplated thick gold |
| CN112813472A (en) * | 2020-12-29 | 2021-05-18 | 西安赛尔电子材料科技有限公司 | Local gold plating process for metal-glass packaging tube shell for hybrid integrated circuit |
| CN114059142A (en) * | 2021-11-22 | 2022-02-18 | 深圳市宏钢机械设备有限公司 | Hanger and local gold plating process |
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Open date: 20101215 |