CN218779055U - Bearing structure for electroplating equipment and electroplating equipment - Google Patents

Abstract

The utility model relates to a circuit board processing equipment technical field relates to a bearing structure and electroplating device for electroplating device. The bearing structure comprises a bearing frame and a clamping frame; the clamping frame comprises a frame body and an insulating layer, the frame body and the bearing frame enclose to form an accommodating space for accommodating a circuit board, and at least part of the insulating layer is arranged on one side, facing the accommodating space, of the frame body. In the carrying structure of the embodiment, the insulating layer is arranged on the frame body and is positioned outside the accommodating space, when the electroplating equipment carries out electroplating operation on the circuit board in the accommodating space, the circuit board and the frame body are separated through the insulating layer, so that charges at the edge of the circuit board can be transferred to the frame body, and the current edge effect in the electroplating equipment is improved.

Description

Bearing structure for electroplating equipment and electroplating equipment

Technical Field

The utility model relates to a circuit board processing equipment technical field especially relates to a bearing structure and electroplating device for electroplating device.

Background

During the electroplating process of the circuit board, the substances constituting the plating layer are dissolved into the plating solution from the anode plate and reattached to the circuit board connected to the cathode to form the plating layer.

However, in the electroplating process, the edge effect of the current can cause the problem of non-uniformity of the electroplated layer on the electroplated surface of the circuit board, thereby affecting the process quality of the circuit board.

Therefore, there is a need for improvement in view of the above problems to change the present situation.

SUMMERY OF THE UTILITY MODEL

The utility model provides a bearing structure and electroplating device for there is the marginal effect of electric current and influence the problem of the technology quality of circuit board in improving traditional circuit board course of working.

The utility model provides a bearing structure for electroplating device, include:

a carrier; and

the clamping frame comprises a frame body and an insulating layer, the frame body and the bearing frame are enclosed to form an accommodating space for accommodating a circuit board, and the insulating layer is at least partially arranged on one side, facing the accommodating space, of the frame body.

According to an embodiment of the present invention, the insulating layer at least partially covers a side of the frame body facing the accommodating space.

According to the utility model discloses an embodiment, the connecting hole has been seted up to the insulating layer, the circuit board is in orthographic projection on the frame body at least partially with the connecting hole coincidence, just the opening orientation of connecting hole the edge of circuit board, so that the circuit board passes through via the plating solution the connecting hole with frame body electric connection.

According to the utility model discloses an embodiment, the quantity of connecting hole is a plurality of, and is a plurality of the connecting hole sets up along the extending direction interval of frame body.

According to an embodiment of the invention, the insulating layer is detachably connected to the frame body, and/or the position of the insulating layer relative to the frame body is adjustable.

According to an embodiment of the invention, the insulating layer is arranged parallel to and/or spaced apart from an edge of the circuit board.

According to an embodiment of the invention, the insulating layer comprises a teflon layer.

The utility model also provides an electroplating device, include:

the electroplating bath is internally provided with an electroplating cavity for conveying the circuit board;

the power supply device comprises an electroplating power supply and an electrode plate, and the electrode plate is accommodated in the electroplating bath; and

the conveying carrier is movably accommodated in the electroplating cavity and comprises a clamping mechanism and any one of the bearing structures, the clamping mechanism is used for clamping and fixing the circuit board, the clamping mechanism is arranged on the bearing structure, and the electroplating power supply is respectively and electrically connected with the electrode plate and the bearing structure.

According to the utility model discloses an embodiment, fixture's quantity is the multiunit, and wherein at least two sets of fixture centre gripping respectively in the edge of the different sides of circuit board.

According to the utility model discloses an embodiment, wherein two sets ofly fixture centre gripping respectively in the relative both sides of circuit board, two sets ofly the insulating layer is located respectively the other both sides of circuit board.

Implement the embodiment of the utility model provides a, following beneficial effect has:

in the bearing structure of this embodiment, by providing the insulating layer on the frame body, and the insulating layer is located outside the accommodating space, when the electroplating device performs the electroplating operation on the circuit board in the accommodating space, the circuit board and the frame body are separated by the insulating layer, so that the electric charge at the edge of the circuit board can be transferred to the frame body, thereby improving the current edge effect in the electroplating device.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Wherein:

fig. 1 is a schematic front view of a conveying carrier according to an embodiment of the present invention;

FIG. 2 is an enlarged view of detail A of FIG. 1;

FIG. 3 is an enlarged view of detail B of FIG. 1;

FIG. 4 is a schematic side view of a delivery vehicle according to an embodiment of the present invention;

FIG. 5 is an enlarged view of detail C of FIG. 4;

fig. 6 is a schematic view illustrating a combination state of the power receiving module and the conductive rail according to an embodiment of the present invention;

reference numerals:

10. conveying the carrier; 100. a load bearing structure; 110. a carrier; 111. an installation position; 112. a sensing part; 120. a power receiving component; 121. a conductive block; 122. a power receiving connector; 123. a power receiving elastic member; 130. a clamping frame; 131. a frame body; 1311. an adjustment groove; 132. an insulating layer; 1321. connecting holes; 140. adjusting the clamping jaw; 200. a clamping mechanism; 210. a clamping assembly; 211. a clamping member; 212. clamping the elastic piece; 220. a pre-tightening assembly; 221. a guide frame; 222. a moving structure; 2221. mounting a plate; 2222. a movable frame; 223. pre-tightening piece; 2231. pre-tightening the spring; 2232. pre-tightening the guide post; 300. a guide assembly; 310. a first guide member; 320. a second guide member; 330. a third guide member; 20. a circuit board; 30. and a conductive rail.

Detailed Description

To make the objects, technical solutions and advantages of the present invention clearer, the drawings of the present invention are combined to clearly and completely describe the technical solutions of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to 6, an embodiment of the present invention provides a conveying carrier 10 for an electroplating apparatus, which includes a bearing structure 100 and a clamping mechanism 200, wherein an accommodating space for accommodating a circuit board 20 is provided inside the bearing structure 100, and the bearing structure 100 is used for electrically connecting with an external electroplating power supply; the clamping mechanism 200 includes a plurality of sets of clamping components 210, the plurality of sets of clamping components 210 are respectively connected to the supporting structure 100, at least two sets of clamping components 210 are respectively disposed on different sides of the circuit board 20, and the clamping components 210 are electrically connected to the circuit board 20 and the supporting structure 100 respectively.

When the circuit board 20 is conveyed by using the conveying carrier 10 of the embodiment, different sides of the circuit boards 20 are fixedly clamped by the plurality of groups of clamping assemblies 210, so that the clamping stability of the clamping mechanism 200 for the circuit boards 20 is improved, the deformation of the circuit boards 20 is avoided, and the electroplating operation quality of electroplating equipment is improved.

It should be noted that the conveying carrier 10 of the embodiment may be mainly used for conveying flexible circuit boards such as IC carrier boards, and the plurality of sets of clamping assemblies 210 are arranged to fix different sides of the flexible circuit board 20, so as to ensure that the whole circuit board 20 is in a flat state, and the flat state is realized by clamping the clamping assemblies 210 outside the circuit board 20, compared with a conventional method of realizing flat state by using the self-gravity of the circuit board 20, the conveying carrier can effectively ensure that the circuit board 20 cannot be subjected to adverse conditions such as bending and the like in the conveying process due to external force, thereby ensuring the quality of electroplating operation of the circuit board 20. Of course, the conveying carrier 10 of the present embodiment may also be used to convey a hard circuit board such as a PCB, and the movement of the circuit board 20 may be limited by clamping and fixing multiple sides of the hard circuit board 20, so as to improve the processing accuracy of the circuit board 20.

As shown in fig. 1, in the present embodiment, two sets of clamping assemblies 210 are respectively disposed on the upper and lower sides of the circuit board 20, and the two sets of clamping assemblies 210 respectively clamp the upper and lower sides of the circuit board 20, so as to ensure the flat state of the circuit board 20 during the conveying process; in other embodiments, two sets of clamping assemblies 210 may be disposed on two adjacent sides, such as the upper side and the left side (right side), of the circuit board 20, so that the two sets of clamping assemblies 210 may limit the degrees of freedom of the circuit board 20 in two directions, and may also fix the circuit board 20, which is not limited herein.

Of course, in some embodiments, when a plurality of sets of clamping assemblies 210 are provided, for example, three sets of clamping assemblies 210 are respectively provided on the upper side, the left side and the right side of the circuit board 20 (or other three sides of the circuit board 20 may be selected), the clamping firmness of the clamping assemblies 210 may be further improved; it will be appreciated that the clamping robustness of the clamping mechanism 200 may be effectively improved by increasing the number of clamping assemblies 210.

Referring to fig. 2 and fig. 3, in an embodiment, the clamping assembly 210 includes a clamping member 211 and a clamping elastic member 212, the clamping member 211 is movably connected to the supporting structure 100, the clamping elastic member 212 is connected to the clamping member 211 and is used for driving the clamping member 211 to abut against an outer surface of the circuit board 20, and the clamping member 211 is electrically connected to the supporting structure 100.

When the clamping assembly 210 of the present embodiment is used, the circuit board 20 is firstly moved into the accommodating space, one side of the circuit board 20 corresponds to the clamping members 211 of the group of clamping assemblies 210, and the clamping members 211 are moved to open the clamping positions and move the circuit board 20 into the clamping positions of the clamping members 211, and then the clamping members 211 can clamp the circuit board 20 under the elastic force of the clamping elastic members 212, so as to realize the function of the clamping assemblies 210 for fixing the circuit board 20.

In this embodiment, the elastic clamping member 212 is a torsion spring, and the clamping member 211 is driven by the torsion spring to rotate, so that the whole clamping assembly 210 has a compact structure, and the occupied space of the clamping mechanism 200 is effectively reduced; in other embodiments, the clamping elastic member 212 may also be an elastic member such as a coil spring, a leaf spring, etc., and is not limited herein, and in some embodiments, the clamping elastic member 212 may also be a driving element such as a linear cylinder, an oil cylinder, etc., and the clamping firmness of the clamping assembly 210 may be further improved by driving the clamping member 211 through the driving element.

In one embodiment, the sets of clamping assemblies 210 on the same side of the circuit board 20 are spaced apart from each other.

With this arrangement, when the circuit board 20 is clamped and fixed by the plurality of sets of clamping assemblies 210 located on the same side of the circuit board 20, the uniformity of the clamping force between the clamping mechanism 200 and the circuit board 20 can be improved, so that the clamping stability and the clamping firmness of the clamping mechanism 200 are improved.

Further, referring to fig. 2, the clamping mechanism 200 further includes a pre-tightening assembly 220, and the pre-tightening assembly 220 is movably connected to the clamping assembly 210 and the carrying structure 100, and is configured to drive the clamping assembly 210 to move in a direction away from the accommodating space.

When the carrier 10 of this embodiment is used, after the circuit board 20 is clamped by the clamping assembly 210, the pre-tightening assembly 220 can drive the clamping assembly 210 to move in a direction away from the accommodating space, so as to further improve the flatness of the circuit board 20 when the circuit board 20 is conveyed by the carrier 10, and the using effect is good.

Referring to fig. 1 and 2, in particular, in one embodiment, the pretensioning assembly 220 comprises a guide frame 221, a moving structure 222 and a pretensioning member 223; the guide frame 221 is connected to the carrying structure 100 of the transport carrier 10; the moving structure 222 is movably connected to the guiding frame 221, and the clamping assembly 210 is disposed on the moving structure 222; the preload member 223 is connected to the moving structure 222 and the guide frame 221, respectively, and is used to drive the moving structure 222 to move away from the circuit board 20.

In the pre-tightening assembly 220 of the embodiment, the pre-tightening member 223 is arranged to drive the moving structure 222 to move relative to the guide frame 221, and after the clamping assembly 210 clamps the circuit board 20, the pre-tightening member 223 provides a pre-tightening force for the clamping assembly 210 to tighten the circuit board 20, so that the problem of deformation of the circuit board 20 during transportation is solved, and the processing quality of the circuit board 20 during processing is improved.

In one embodiment, the moving structure 222 includes a mounting plate 2221 and a moving frame 2222, the mounting plate 2221 is connected to the transport carrier 10, the moving frame 2222 is slidably engaged with the mounting plate 2221, the moving direction of the moving frame 2222 is parallel to the circuit board 20, and the clamping assembly 210 is disposed on the moving frame 2222.

With this arrangement, after the clamping assembly 210 clamps the circuit board 20, the pretensioning member 223 can be driven to move the clamping assembly 210 on the mounting plate 2221 relative to the carrying structure 100 by driving the moving frame 2222, so as to achieve the pretensioning function of the pretensioning assembly 220. By connecting the mounting plate 2221 and the moving frame 2222 in a sliding fit manner, the smoothness of movement between the two can be ensured, so that the circuit board 20 can be kept in a flat state after being stretched, and meanwhile, the pre-tightening assembly 220 can be prevented from damaging the circuit board 20 when the circuit board is stretched.

Specifically, the conveying carrier 10 includes a plurality of sets of clamping assemblies 210, and the plurality of sets of clamping assemblies 210 located on the same side of the circuit board 20 are disposed at intervals and connected to the mounting plate 2221 respectively.

In this embodiment, by connecting the plurality of sets of clamping assemblies 210 to the mounting plate 2221 at the same time, when the pre-tightening member 223 drives the moving frame 2222 to move, the plurality of sets of clamping assemblies 210 can be driven to move together, so as to ensure the uniformity of the edge stress of the circuit board 20, avoid damaging the circuit board 20, and improve the reliability of the clamping mechanism 200.

Further, referring to fig. 2 and 4, the pre-tightening assembly 220 further includes a guiding structure, the guiding structure includes a guiding hole and a pre-tightening guide post 2232, the guiding hole is slidably engaged with the pre-tightening guide post 2232, and the guiding hole and the pre-tightening guide post 2232 are respectively disposed on the guiding frame 221 and the moving structure 222.

With this arrangement, when the movable structure 222 moves relative to the guide frame 221 under the driving action of the preload piece 223, the movement of the movable structure 222 can be guided by the cooperation of the preload guide post 2232 and the guide hole; specifically, the axis of the guide hole may be parallel to the plane of the circuit board 20, whereby damage to the circuit board 20 caused when it is stretched can be reduced; of course, in some embodiments, the axis of the pre-tightening guide post 2232 may be adjusted to have an angle with the plane of the circuit board 20 according to the requirement, which is not limited herein.

In one embodiment, the number of the guiding structures is multiple sets, and the multiple sets of guiding structures are parallel and spaced apart along the extending direction of the moving structure 222.

In this embodiment, by providing a plurality of sets of guiding structures to connect the guiding frame 221 and the moving structure 222, the moving smoothness of the moving structure 222 can be further improved, and the using effect is good.

Specifically, the guiding frame 221 is provided with a movable slot and a guiding slot, the guiding slot is communicated with an inner wall of the movable slot, and the moving structure 222 is movably accommodated in the movable slot and is in sliding fit with the guiding slot.

With this arrangement, when the moving structure 222 moves relative to the guide frame 221, the movement of the moving structure 222 can be guided by the guide groove; in a preferred embodiment, the guiding grooves may be C-shaped grooves, and the guiding grooves are symmetrically disposed on two opposite sides of the moving structure 222, so that the sliding direction of the moving structure 222 can be limited, and the moving structure 222 can be prevented from being separated from the guiding grooves and the moving grooves; in addition, the moving structure 222 is movably disposed in the moving groove and the guiding groove, so that the entire pre-tightening assembly 220 has a more compact structure, which facilitates the installation and arrangement of the clamping mechanism 200. Specifically, in one embodiment, the clamping assembly 210 is disposed on the mounting plate 2221, and the mounting plate 2221 is slidably engaged with the guide slot.

In one embodiment, the tightening member 223 includes a tightening spring 2231, and the tightening spring 2231 abuts against the guide frame 221 and the moving structure 222, respectively, and is configured to drive the moving structure 222 to move away from the circuit board 20.

When the clamping mechanism 200 of the present embodiment is used, after the clamping assembly 210 clamps the edge of the circuit board 20, the moving structure 222 may move away from the accommodating space under the elastic force of the pre-tightening spring 2231 to stretch the circuit board 20 to ensure its surface is flat.

In another embodiment, the pretensioning assembly 220 further comprises a driving structure and a tension sensor, the tension sensor is connected to the driving structure and the moving structure 222, respectively, and the driving structure is used for driving the moving structure 222 to move in a direction away from the circuit board 20.

In this embodiment, the driving structure may be a linear driving element such as a linear cylinder, an oil cylinder, etc., and by arranging the tension sensor to connect the driving structure and the moving structure 222, the tension sensor may acquire tension data of the pre-tightening assembly 220 in real time, so as to avoid damage to the circuit board 20; certainly, in this embodiment, the pre-tightening assembly 220 may also include a control module, such as a PLC, an industrial personal computer, or a single chip, and the pre-tightening assembly is in signal connection with the tension sensor and the driving structure, so that the pre-tightening assembly 220 has a pre-tightening operation function of automatic control and negative feedback control.

Referring to fig. 1, 3 and 4, in particular, in one embodiment, the bearing structure 100 includes a bearing frame 110 and a clamping frame 130 in any one of the above embodiments; the clamping frame 130 includes a frame body 131 and an insulating layer 132, the frame body 131 and the carrier 110 enclose a receiving space for receiving the circuit board 20, and the insulating layer 132 is at least partially disposed on a side of the frame body 131 facing the receiving space.

In the carrying structure 100 of the embodiment, by providing the insulating layer 132 on the frame body 131 and locating the insulating layer 132 outside the accommodating space, when the electroplating device performs an electroplating operation on the circuit board 20 in the accommodating space, the circuit board 20 and the frame body 131 are separated by the insulating layer 132, so that charges at the edge of the circuit board 20 can be transferred to the frame body 131, thereby improving a current edge effect in the electroplating device.

Specifically, the insulating layer 132 at least partially covers a side of the frame body 131 facing the accommodating space.

In the embodiment, only the insulating layer 132 needs to be spaced between the frame body 131 and the circuit board 20, and when the insulating layer 132 is only disposed on the side of the frame body 131 facing the accommodating space, the insulating layer 132 does not need to be disposed on the side of the frame body 131 away from the accommodating space, so that the manufacturing cost of the clamping frame 130 can be reduced.

Referring to fig. 3 and 4, in an embodiment, the insulating layer 132 is formed with a connection hole 1321, an orthogonal projection of the circuit board 20 on the frame body 131 is at least partially overlapped with the connection hole 1321, and an opening of the connection hole 1321 faces an edge of the circuit board 20, so that the circuit board 20 is electrically connected to the frame body 131 through the connection hole 1321 by a plating solution.

By providing the connection hole 1321 on the insulating layer 132, it is ensured that the charge in the plating solution can be in contact with the frame body 131 through the connection hole 1321 to improve the charge state at the edge of the circuit board 20, thereby improving the current edge effect of the plating apparatus at the time of the plating operation.

Further, the number of the connection holes 1321 is plural, and the plural connection holes 1321 are provided at intervals in the extending direction of the frame body 131.

It can be understood that by disposing the plurality of connection holes 1321 at intervals along the edge of the circuit board 20, uniformity of contact of the electric charges with the frame body 131 can be ensured, and the electric charge transfer effect can be improved.

In some embodiments, the insulation layer 132 is removably attached to the frame body 131, and/or the position of the insulation layer 132 relative to the frame body 131 is adjustable.

With this arrangement, the insulating layer 132 can be detachably connected to the frame body 131 by, for example, magnetic attraction, adhesion, or snap connection, and the insulating layer 132 can be detached when not needed; or the position of the insulating layer 132 on the frame body 131 is adjusted to adjust the shielding position and range of the insulating layer 132, so that the using effect is good.

Specifically, referring to FIG. 1, the insulating layer 132 is disposed parallel to and/or spaced from the edge of the circuit board 20.

It will be appreciated that by disposing the insulating layer 132 in parallel and/or spaced apart from the circuit board 20, it is ensured that the charge is homogenized once in the plating solution therebetween, thereby increasing the shielding effect of the insulating layer 132 and further improving the current edge effect.

In one embodiment, the insulating layer 132 comprises a teflon layer.

It can be understood that the teflon layer has good wear resistance and insulating property, and the use of the teflon layer as the insulating layer 132 can effectively improve the durability of the insulating layer 132.

In an embodiment, referring to fig. 1 and fig. 4, the supporting structure 100 further includes a power receiving element 120, the power receiving element 120 is connected to the supporting frame 110, the power receiving element 120 is used for being movably connected to a plating tank of a plating apparatus, the supporting frame 110 is electrically connected to a plating power source through the power receiving element 120, and at least a portion of the clamping element 210 is disposed on the supporting frame 110.

The power receiving component 120 arranged on the bearing frame 110 is movably connected with the electroplating bath, so that the bearing frame 110 can be prevented from being directly contacted with the electroplating bath to generate abrasion; meanwhile, the power receiving component 120 made of the corresponding material can be selected according to the actual operation requirement of the electroplating equipment, when the wear occurs, only the corresponding power receiving component 120 can be replaced, the whole bearing structure 100 does not need to be replaced, and the maintenance cost is also reduced.

Specifically, referring to fig. 1, the power receiving assembly 120 includes a conductive block 121 and a power receiving connector 122, the power receiving connector 122 is movably connected to the conductive block 121 and the carrier 110, the conductive block 121 is movably connected to the electroplating tank and electrically connected to an electroplating power source, and the power receiving connector 122 is used for driving the conductive block 121 to press the conductive rail 30 on the electroplating tank.

In this embodiment, the power receiving connector 122 is disposed to connect the conductive blocks 121 and the carrier 110, and when the carrying structure 100 moves in the electroplating bath, the power receiving connector 122 can move relative to the two to enable the conductive blocks 121 at different positions to be tightly attached to the electroplating bath, so as to ensure the power receiving stability of the power receiving assembly 120, and further improve the electroplating quality of the circuit board 20.

Further, referring to fig. 4, the power receiving assembly 120 further includes a power receiving elastic member 123, and the power receiving elastic member 123 is respectively connected to the power receiving connector 122 and the carrier 110 and is used for driving the conductive block 121 to press the conductive rail 30.

From this setting, when carrying carrier 10 and moving for the plating bath, conductive block 121 can slide or rolling contact with the conductor rail 30 of plating bath, and the electric elastic piece 123 that receives through the setting orders about the electric connecting piece 122 that receives and drives conductive block 121 and move towards conductor rail 30, can make conductive block 121 and conductor rail 30 hug closely to guarantee the electric effect of receiving between the two. Specifically, the power receiving elastic member 123 may be an elastic element such as a torsion spring, a spring plate, and the like, which is not limited herein.

Referring to fig. 1, in an embodiment, the supporting structure 100 further includes a clamping frame 130, a position of the clamping frame 130 relative to the supporting frame 110 is adjustable, the clamping frame 130 and the supporting frame 110 enclose to form a receiving space, and at least one group of clamping assemblies 210 is disposed on the clamping frame 130.

When the carrier 10 of this embodiment is used, the relative position between the clamping frame 130 and the bearing frame 110 can be adjusted according to the actual size of the circuit board 20 to adjust the overall size of the accommodating space, so as to ensure that the clamping assembly 210 can be located at the optimal clamping position, and then the pre-tightening effect of the pre-tightening assembly 220 is supplemented, so as to ensure that the circuit board 20 can be smoothly and stably fixed on the clamping mechanism 200, and the using effect is good.

Specifically, referring to fig. 1 and 4, the supporting structure 100 further includes an adjusting claw 140 movably connected to the clamping frame 130, the clamping frame 130 is provided with a plurality of adjusting grooves 1311, and the adjusting claw 140 is used to be respectively engaged with different adjusting grooves 1311.

Therefore, after the clamping frame 130 and the carrier 110 are adjusted to a preset position, the adjusting claws 140 can be in clamping fit with the adjusting grooves 1311 at the corresponding positions of the frame body 131 to fix the position of the clamping frame 130; when the adjustment is needed, the adjusting claw 140 only needs to be moved to be separated from the adjusting groove 1311, so that the structure is simple, and the operation is convenient. Further, referring to fig. 1, the transportation carrier 10 further includes a guiding assembly 300, the guiding assembly 300 is disposed on the carrying structure 100, and the guiding assembly 300 includes a plurality of guiding elements, and the plurality of guiding elements are movably connected to the plating tank of the plating apparatus and the carrying structure 100, respectively.

Referring to fig. 5, in an embodiment, the guide assembly 300 includes a first guide 310, a second guide 320, and a third guide 330, and the first guide 310, the second guide 320, and the third guide 330 are rotatably connected to the carrier 110, the first guide 310 and the third guide 330 are spaced apart and arranged in parallel, and a rotation axis of the second guide 320 is perpendicular to the first guide 310.

With the arrangement, after the first guide part 310, the second guide part 320 and the third guide part 330 are matched with the electroplating bath, the horizontal movement of the transport carrier 10 can be limited through the arranged first guide part 310 and the third guide part 330, the second guide part 320 can be in rolling contact with the top of the electroplating bath, so that the vertical movement of the transport carrier 10 can be limited, the friction loss of the transport carrier 10 relative to the movement of the electroplating bath can be reduced through the matching of the first guide part 310, the second guide part 320 and the third guide part 330, and the use effect is good.

In other embodiments, the number of the guiding assemblies 300 may be two or more, and may be adjusted according to the actual transportation requirement of the transportation carrier 10, which is not limited herein.

Further, referring to fig. 6, the transportation carrier 10 is provided with a plurality of mounting locations 111 for mounting the power receiving component 120, and the plurality of mounting locations 111 are arranged at intervals.

As shown in fig. 6, in the embodiment, the electroplating apparatus simultaneously conveys at least four sets of conveying carriers 10, and the power receiving components 120 of the four sets of conveying carriers 10 are respectively disposed at different mounting positions, and at this time, four sets of circuit boards 20 corresponding to the four mounting positions are also disposed on the electroplating tank, so that the plurality of sets of conveying carriers 10 can be respectively electrically connected to different conductive rails 30, thereby improving the operation reliability of the electroplating apparatus, avoiding mutual interference between the plurality of sets of electroplating power supplies, and achieving a good use effect.

The utility model also provides an electroplating device, which comprises an electroplating bath, a power supply device and the conveying carrier 10 in any one of the embodiments; specifically, an electroplating chamber for conveying the circuit board 20 is arranged inside the electroplating bath; the power supply device comprises an electroplating power supply and an electrode plate, and the electrode plate is accommodated in the electroplating bath; the transport carrier 10 is movably accommodated in the electroplating chamber, and the electroplating power supply is electrically connected to the transport carrier 10 and the electrode plate respectively. In this embodiment, the plating power source may be a rectifier.

Referring to fig. 1 and 4, in an embodiment, the carrier 110 is further provided with a sensing portion 112, and the electroplating apparatus is further provided with a position sensor for acquiring a position signal of the sensing portion 112.

Specifically, in the embodiment shown in fig. 1, two sets of clamping mechanisms 200 are respectively clamped on two opposite sides of the circuit board 20, and two sets of insulating layers 132 are respectively disposed on the other two sides of the circuit board 20.

With this arrangement, the clamping assembly 210 can be mainly used to form a closed loop with the circuit board 20 for electroplating, and the insulating layer 132 is disposed on two opposite sides of the circuit board 20 to ensure uniformity of electric charge isolation of the insulating layer 132 (even though the clamping frames 130 on two opposite sides of the circuit board 20 can obtain electric charge), so as to further improve the effect of improving the current edge effect of the electroplating apparatus.

In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the embodiments of the present invention can be understood in specific cases by those skilled in the art.

In embodiments of the invention, unless expressly stated or limited otherwise, a first feature may be "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description of the present specification, references to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A load bearing structure for an electroplating apparatus, comprising:

a carrier; and

the clamping frame comprises a frame body and an insulating layer, the frame body and the bearing frame are enclosed to form an accommodating space for accommodating a circuit board, and the insulating layer is at least partially arranged on one side, facing the accommodating space, of the frame body.

2. The carrying structure for the electroplating apparatus according to claim 1, wherein the insulating layer at least partially covers a side of the frame body facing the accommodating space.

3. The carrying structure for the electroplating apparatus as claimed in claim 2, wherein the insulating layer is provided with a connecting hole, an orthographic projection of the circuit board on the frame body at least partially coincides with the connecting hole, and the opening of the connecting hole faces an edge of the circuit board, so that the circuit board is electrically connected with the frame body through the connecting hole via an electroplating solution.

4. The carrying structure for the electroplating apparatus according to claim 3, wherein the number of the connecting holes is plural, and the plural connecting holes are arranged at intervals along the extending direction of the frame body.

5. The carrying structure for the electroplating apparatus according to claim 1, wherein the insulating layer is detachably attached to the frame body, and/or a position of the insulating layer with respect to the frame body is adjustable.

6. The carrier structure for electroplating apparatuses of claim 1, wherein the insulating layer is disposed parallel to and/or spaced apart from an edge of the circuit board.

7. The load bearing structure for an electroplating apparatus of claim 1, wherein the insulating layer comprises a teflon layer.

8. An electroplating apparatus, comprising:

the electroplating bath is internally provided with an electroplating cavity for conveying the circuit board;

the power supply device comprises an electroplating power supply and an electrode plate, and the electrode plate is accommodated in the electroplating bath; and

the conveying carrier is movably accommodated in the electroplating cavity and comprises a clamping mechanism and the bearing structure of any one of claims 1 to 7, the clamping mechanism is used for clamping and fixing the circuit board, the clamping mechanism is arranged on the bearing structure, and the electroplating power supply is respectively and electrically connected with the electrode plate and the bearing structure.

9. The electroplating apparatus of claim 8, wherein the number of the clamping mechanisms is multiple groups, and at least two groups of the clamping mechanisms are respectively clamped on the edges of different sides of the circuit board.

10. The electroplating apparatus as claimed in claim 9, wherein the two sets of clamping mechanisms are respectively clamped at two opposite sides of the circuit board, and the two sets of insulating layers are respectively disposed at the other two sides of the circuit board.

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