WO2020015674A1

WO2020015674A1 - Transmission structure and electroplating device

Info

Publication number: WO2020015674A1
Application number: PCT/CN2019/096335
Authority: WO
Inventors: 陈德和
Original assignee: 东莞宇宙电路板设备有限公司
Priority date: 2018-07-20
Filing date: 2019-07-17
Publication date: 2020-01-23
Also published as: CN108774746A

Abstract

A transmission structure and an electroplating device. The transmission structure comprises a linear track (11), a mounting member (15) for mounting a circuit board, and at least one roller (16) that is connected to the mounting member (15) and rolls on the linear track (11), each roller (16) being provided with an annular groove (17) that fits the linear track (11); the linear track (11) comprises a first guide plate (13) and a second guide plate (14) that are provided at an interval in an up-and-down direction and are parallel to each other, the thicknesses of the first guide plate (13) and the second guide plate (14) each being set so as to fit the groove width of each annular groove (17), the first guide plate (13) being inserted from a position above the roller (16) downwardly into each annular groove (17), and the second guide plate (14) being inserted from a position below the roller (16) upwardly into each annular groove (17), and the bottom of each annular groove (17) being in abutting fit with the second guide plate (14).

Description

Transmission structure and electroplating equipment

This application claims priority from a Chinese patent application filed with the Chinese Patent Office on July 20, 2018 with application number 201810805538.8, the entire contents of which are incorporated herein by reference.

Technical field

The present application belongs to the technical field of electroplating equipment, for example, relates to a transmission structure and electroplating equipment.

Background technique

Electroplating is the use of electrolysis to make a metal film on the surface of a metal or other material. In the field of circuit board production, electroplating is usually used to process copper on the circuit board. The electroplating equipment generally includes a transmission structure for conducting electricity. The transmission structure in the related art easily causes the circuit board to deviate from the expected movement trajectory during the movement process.

Summary of the invention

The present application provides a transmission structure and electroplating equipment, which aims to solve the problem that the circuit board deviates from an expected motion trajectory during the related art in the related art.

An embodiment of the present application provides a transmission structure configured to be driven by a driving force to drive a circuit board to move along a preset trajectory. The transmission structure includes a linear track, a mounting member for mounting the circuit board, and at least one connection with the mounting member and Rollers rolling on a linear track, each of which is provided with an annular groove that cooperates with the linear track. The linear track includes a first guide plate and a second guide plate, which are arranged parallel to each other, and the first and second guide plates. The plate thickness is set to match the groove width of each annular groove. The first guide plate is inserted into each annular groove from above the roller, and the second guide plate is inserted into each annular groove from below the roller. The bottom of the groove abuts with the second guide plate.

An embodiment of the present application further provides a plating equipment including the above-mentioned transmission structure and a plurality of jigs. The plurality of jigs are fixedly mounted on the mounting members of the transmission structure and are configured to clamp the circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a plating equipment provided by an embodiment of the present application; FIG.

FIG. 2 is an exploded perspective view of an electroplating device according to an embodiment of the present application; FIG.

3 is an exploded perspective view of a roller, a bearing, and a rotating shaft according to an embodiment of the present application;

4 is a schematic diagram of a conductive structure of an electroplating device according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a conductive structure of another electroplating equipment according to an embodiment of the present application.

Reference sign description:

100. Electroplating equipment; 11. Linear track; 12. Supports; 13. First guide plate; 14. Second guide plate; 15. Mounting parts; 16. Roller; 17. Ring groove; 18. Rotary shaft; 19. Bearing 31, clamp 32, first clamping portion 33, second clamping portion 34, elastic compression member 40, conductive structure 41, conductive frame 42 conductive member 43, conductive member 44 sliding member 45, elastic pieces; 46, sliding surface, 47, containing structure; 48, chute; 49, mating surface.

detailed description

Hereinafter, embodiments of the present application will be described in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary, and are intended to explain the present application, and should not be construed as limiting the present application.

In the description of this application, when an element is referred to as being "fixed to" or "disposed to" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

The terms "length", "width", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom" " The directions or positional relations indicated by “inside” and “outside” are based on the positional or positional relations shown in the drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific The orientation and construction and operation in a specific orientation cannot be understood as a limitation on this application.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality" is two or more, unless specifically defined otherwise.

For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

As shown in FIG. 1 to FIG. 3, an embodiment of the present application provides a transmission structure configured to be driven by a driving force to drive a circuit board to move along a preset trajectory. The transmission structure includes a linear track 11 and a circuit board for mounting the circuit board. The mounting member 15 and at least one roller 16 connected to the mounting member 15 and rolling on the linear track 11. Each roller 16 is provided with an annular groove 17 that cooperates with the linear track 11. A guide plate 13 and a second guide plate 14 are provided. The thicknesses of the first guide plate 13 and the second guide plate 14 are set to match the groove width of each annular groove 17. The first guide plate 13 moves downward from above the roller 16. Each annular groove 17 is inserted, and the second guide plate 14 is inserted into each annular groove 17 from below the roller 16. The groove bottom of each annular groove 17 is in abutment with the second guide plate 14.

In this embodiment, the linear track 11 includes a first guide plate 13 and a second guide plate 14 which are spaced up and down and are arranged horizontally, wherein the first guide plate 13 and the second guide plate 14 are arranged at a parallel distance so that the roller 16 It can be installed on the linear track 11 (that is, between the first guide plate 13 and the second guide plate 14), and the horizontal positioning of the first guide plate 13 and the second guide plate 14 can ensure that the roller 16 always moves along the horizontal movement track.

In this embodiment, when the roller 16 rolls, the first guide plate 13 and the second guide plate 14 cooperate with each of the annular grooves 17, and the thicknesses of the first guide plate 13 and the second guide plate 14 are similar to each of the ring shapes. The groove width matching setting of the groove 17 can prevent the roller 16 from swaying to both sides, and can also prevent the circuit board from deviating from the expected motion trajectory, thereby ensuring that the circuit board always moves in the same vertical plane, which can improve each The plating quality of a circuit board can also improve the consistency of the plating effect of the same batch of circuit boards.

In this embodiment, the groove bottom of each annular groove 17 is in abutment with the second guide plate 14, which can prevent the roller 16 from driving the mounting member 15 downward, thereby preventing the circuit board from rolling downward by rolling, so that the circuit board Always moving at the same level, which can improve the plating quality of each circuit board, and also improve the consistency of the plating effect of the same batch of circuit boards.

In one embodiment, the first guide plate 13 cooperates with the groove bottom of each annular groove 17 to reduce the friction between the first guide plate 13 and the roller 16 and increase the smoothness of rolling of the roller 16.

In one embodiment, the transmission structure further includes a rotating shaft 18, and the rotating shaft 18 is disposed corresponding to the roller 16. In an embodiment, the transmission structure includes a plurality of spaced-apart rollers 16 and a plurality of rotating shafts 18 arranged one-to-one corresponding to the plurality of rollers 16. The plurality of rollers 16 extend along a horizontal line, and one end of each rotating shaft 18 is fixed. On the mounting member 15, the other end of each rotating shaft 18 passes through the roller 16 and is rotatably mounted with the roller 16. In this embodiment, a plurality of rollers 16 are arranged along a horizontal line, which can save layout space and reduce the size of the transmission structure in the vertical direction. The other end of the rotating shaft 18 passes through the roller 16 and is rotatably installed with the roller 16. The mounting member 15 can be moved along the linear track 11, so that the mounting member 15 can drive the circuit board to move along the linear track 11.

In an embodiment, as shown in FIG. 3, the transmission structure further includes two bearings 19 provided corresponding to each of the rotating shafts 18, and two bearings 19 are provided between each of the rotating shafts 18 and each of the rollers 16.

In this embodiment, two bearings 19 are provided between the rotating shaft 18 and the roller 16 to reduce the friction between the rotating shaft 18 and the roller 16, improve the efficiency of mechanical transmission, and reduce friction loss.

In an embodiment, the notch of the annular groove 17 is provided as a horn opening, and the width of the horn opening gradually expands outward in the radial direction. In this embodiment, the width of the horn opening gradually expands outward in the radial direction, which can increase the convenience of turning the roller 16 into the linear track 11, and also reduce the groove wall of the annular groove 17, the first guide plate 13, and the first The friction between the two guide plates 14 can further improve the smoothness of rolling of the roller 16.

In one embodiment, the linear guide 11 further includes a support member 12. The first guide plate 13 is locked on the support member 12, and the second guide plate 14 is locked on the support member 12.

In this embodiment, when the rollers 16 of different specifications are replaced, and the rollers 16 of different specifications have annular grooves 17 of different groove widths, the first guide plate 13 and the second of different thicknesses are selected according to the groove widths of the annular grooves 17. The guide plate 14 and the first guide plate 13 are locked on the support member 12, and the second guide plate 14 is locked on the support member 12, which facilitates replacement of the first guide plate 13 and the second guide plate 14.

An embodiment of the present application further provides a plating equipment 100, as shown in FIG. 1 to FIG. 5, including the above-mentioned transmission structure and a plurality of clamps 31. The plurality of clamps 31 are fixedly mounted on the mounting member 15 of the transmission structure, and are configured to be installed. Clip circuit board.

In one embodiment, each clamp 31 is made of a conductive material, and a plurality of clamps 31 are electrically connected to the mounting member 15.

In this embodiment, during the plating operation, the driving force drives the mounting member 15 to move. The movement of the mounting member 15 drives the clamp 31 and the circuit board clamped on the clamp 31 to move. The clamp 31 drives the circuit board to be transmitted to the mounting member 15 to Electroplating station for electroplating.

In an embodiment, the clamp 31 includes a first clamping portion 32 fixedly connected to the mounting member 15 and energized, a second clamping portion 33 hingedly mounted on the first clamping portion 32 and elastically abutting against the first clamping portion 32. An elastic compression member 34 between the portion 32 and the second clamping portion 33 is provided to keep the first clamping portion 32 and the second clamping portion 33 in a clamped state.

In this embodiment, the second clamping portion 33 and the first clamping portion 32 are hingedly mounted, and the external force drives the second clamping portion 33 to open relative to the first clamping portion 32 so that the second clamping portion 33 and the second The distance between the clamping portions 33 allows the circuit board to be inserted, and the elastic compression member 34 elastically abuts between the first clamping portion 32 and the second clamping portion 33 to maintain the first clamping portion 32 and the second clamping portion. The clamping state of the holding portion 33 can ensure that the circuit board is clamped in the clamp 31.

In one embodiment, the electroplating apparatus 100 further includes a conductive structure 40. The conductive structure 40 includes a conductive frame 41 made of a conductive material and a plurality of groups of conductive components 42 mounted on the conductive frame 41 and spaced from each other. Each group of conductive components 42 includes a conductive member 43 that is movably mounted on the conductive frame 41 and is electrically connected to the conductive frame 41, a slider 44 that is spaced from the conductive frame 41 and is made of a conductive material, has elastic restoring force, and the elastic restoring force acts on The conductive member 43 is an elastic member 45 that press-fits the conductive member 43 and the sliding member 44. The sliding member 44 has a sliding surface 46 that faces the conductive member 43 and slidingly cooperates with the conductive member 43. The conductive member 43 has a sliding fit with the sliding surface 46. The mating surface 49, the sliding surface 46, and the mating surface 49 are all flat, and the slider 44 is connected to the circuit board.

In this embodiment, the conductive structure 40 includes a conductive frame 41 made of a conductive material and a plurality of groups of conductive components 42 mounted on the conductive frame 41 and spaced from each other. Each group of the conductive components 42 includes a movable mount on the conductive frame 41. The conductive member 43 which is electrically connected to the conductive frame 41, the sliding member 44 which is spaced from the conductive frame 41 and is made of conductive material, and the sliding member 44 is connected to the circuit board. The sliding member 44 is driven by the driving force along the conductive member. The extending direction of 43 slides relative to the conductive member 43. The sliding member 44 drives the circuit board to move and transport the circuit board to the plating station. In this process, the electrical signal is transmitted from the conductive frame 41 to the conductive member 43 and the sliding member 44 in sequence until This electrical signal is conducted to a circuit board to electroplate the circuit board.

In this embodiment, the sliding member 44 has a sliding surface 46 facing the conductive member 43 and slidingly mates with the conductive member 43, and the conductive member 43 has a mating surface 49 that mates with the sliding surface 46. Both the sliding surface 46 and the mating surface 49 are Plane. During the sliding process of the sliding member 44, the sliding member 44 and the conductive member 43 are in surface-to-surface contact, and the contact area is large, which can avoid poor contact. When batch processing of circuit boards (the batch processing is to plate multiple circuit boards at the same time), it can ensure that each circuit board can be stably energized, improve the plating effect of each circuit board, and increase the plating effect of the same batch of circuit boards. Consistency.

In this embodiment, the elastic restoring force generated by the elastic member 45 acts on the conductive member 43 to press-fit the conductive member 43 and the sliding member 44. During the sliding process of the sliding member 44, the conductive member 43 is always pressed against the sliding member 44. The cooperation, that is, during the sliding process, the slider 44 and the conductive member 43 always maintain surface-to-surface contact, so as to prevent the slider 44 from swinging left and right due to the influence of other factors such as mechanical vibration. The contact area between the 43 and the sliding member 44 is reduced and the contact is poor. Therefore, the conductive structure 40 in the embodiment of the present application can ensure stable contact between the conductive member 43 and the sliding member 44, which can avoid poor contact, thereby improving the plating quality of a single circuit board and Improve the consistency of the plating effect of the secondary circuit boards plated in the same batch.

In one embodiment, the sliding member 44 is formed with a sliding slot 48 with a notch facing the conductive member 43. The sliding surface 46 is provided at the bottom of the slot 48. The sliding member 44 further includes a receptacle fixedly connected to an end of the bottom of the slot. The horizontal height of the structure 47 and the accommodating structure 47 is lower than the horizontal height of the groove bottom.

In this embodiment, the sliding member 44 slides relative to the conductive member 43. Due to the friction between the sliding member 44 and the conductive member 43, powder is generated. Since both the sliding member 44 and the conductive member 43 are made of a conductive material, Therefore, the powder is also a conductive powder. If the powder is dropped on the circuit board, it will affect the plating quality of the circuit board. During the sliding process of the sliding member 44, the powder is dropped from the gap between two adjacent sliding members 44. Since the sliding member 44 further includes a receiving structure 47 fixedly connected to the end of the groove bottom, the horizontal height of the receiving structure 47 is lower than the horizontal height of the groove bottom. Board, thereby improving the quality of plating.

Claims

A transmission structure includes a linear track (11), a mounting member (15) for mounting a circuit board, and at least one roller (16) connected to the mounting member (15) and rolling on the linear track (11). ), Each roller (16) is provided with an annular groove (17) that cooperates with the linear track (11), and the linear track (11) includes a first guide plate (13) and a first Two guide plates (14), and the thickness of the first guide plate (13) and the second guide plate (14) are matched with the groove width of each annular groove (17), and the first guide plate (13) Each ring groove (17) is inserted downward from above the roller (16), and the second guide plate (14) is inserted into each ring groove (17) upward from below the roller (16) , The groove bottom of each annular groove (17) is abutted against the second guide plate (14).
The transmission structure according to claim 1, further comprising: a rotating shaft (18), the rotating shaft (18) being disposed corresponding to the roller (16); in a case where the transmission structure includes a plurality of the rollers (16) Next, the plurality of rollers (16) are arranged at intervals, the plurality of rotating shafts (18) and the plurality of rollers (16) are arranged one-to-one correspondingly, and the plurality of rollers (16) extend along a horizontal line, One end of each rotating shaft (18) is fixed on the mounting member (15), and the other end of each rotating shaft (18) passes through the roller (16) and is rotatably mounted with the roller (16).
The transmission structure according to claim 2, further comprising two bearings (19) provided corresponding to each rotating shaft (18), and the two are provided between each rotating shaft (18) and each roller (16) Bearing (19).
The transmission structure according to any one of claims 1 to 3, wherein the notch of the annular groove (17) is provided as a horn opening, and the width of the horn opening gradually expands outward in the radial direction.
The transmission structure according to any one of claims 1 to 3, wherein the linear guide (11) further comprises a support (12), and the first guide plate (13) is locked to the support ( 12), the second guide plate (14) is locked on the support member (12).
An electroplating equipment, comprising the transmission structure according to any one of claims 1 to 5 and a plurality of clamps (31), the plurality of clamps (31) are fixedly mounted on a mounting member (15) of the transmission structure , Set to clamp the circuit board.
The electroplating apparatus according to claim 6, wherein each jig (31) is made of a conductive material, and the plurality of jigs (31) are electrically connected to the mounting member (15).
The electroplating apparatus according to claim 7, wherein the clamp (31) includes a first clamping portion (32) fixedly connected to the mounting member (15) and energized, and the first clamping portion (32) 32) The second clamping portion (33) hingedly mounted and the elastic compression member (34) elastically abutting between the first clamping portion (32) and the second clamping portion (33), so The elastic compression member (34) is configured to keep the first clamping portion (32) and the second clamping portion (33) in a clamped state.
The electroplating equipment according to claim 8, further comprising a conductive structure (40), the conductive structure (40) comprising a conductive frame (41) made of a conductive material and a plurality of groups mounted on the conductive frame (41) The conductive components (42) are arranged at a distance from each other. Each group of conductive components (42) includes a conductive member (43) movably mounted on the conductive frame (41) and electrically connected to the conductive frame (41), and The conductive frame (41) is provided with a sliding member (44) made of a conductive material, and has elastic restoring force, and the elastic restoring force acts on the conductive member (43) to make the conductive member (43) An elastic member (45) press-fitted with the sliding member (44), and the sliding member (44) has a sliding surface (46) facing the conductive member (43) and slidingly fitting with the conductive member (43). ), The conductive member (43) has a mating surface (49) slidingly mated with the sliding surface (46), the sliding surface (46) and the mating surface (49) are both flat, and the sliding member (44) Connected to the circuit board.
The electroplating apparatus according to claim 9, wherein the sliding member (44) is formed with a sliding groove (48) whose notch faces the conductive member (43), and the sliding surface (46) is provided on the sliding member. The groove bottom of the groove (48), the sliding member (44) further includes a receiving structure (47) fixedly connected to an end of the groove bottom, and the horizontal height of the receiving structure (47) is lower than the The horizontal height of the bottom of the tank.