CN104404589A - Copper plating device of printed circuit board with through holes and electroplating method of copper plating device - Google Patents
Copper plating device of printed circuit board with through holes and electroplating method of copper plating device Download PDFInfo
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- CN104404589A CN104404589A CN201410710003.4A CN201410710003A CN104404589A CN 104404589 A CN104404589 A CN 104404589A CN 201410710003 A CN201410710003 A CN 201410710003A CN 104404589 A CN104404589 A CN 104404589A
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- inside groove
- frame body
- circuit board
- printed circuit
- groove
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Abstract
The invention belongs to the field of printed circuit board manufacture, and relates to a through hole metallization machining method and equipment of a printed circuit board, in particular to a through hole copper plating device. The invention provides a copper plating device of a printed circuit board with through holes. The copper plating device comprises a power supply, an external slot, an internal slot, an internal slot support, an upper anode support, a lower anode support, an upper anode, a lower anode, a spring washer, a cathode assembly, a constant temperature heating device, an inflation pump, an inflation tube, an electrolyte circulation pump, an electrolyte circulation tube, a tee joint and a liquid storage tank. The device can realize electroplating of the through holes of the printed circuit board with a high radio of thickness to radius, has excellent deep plating capacity, greatly improves electroplating uniformity of the whole board at the same time, and has the advantages of convenience in operation, high labor efficiency and the like.
Description
Technical field
The invention belongs to printed circuit board and manufacture field, relate to printed circuit board via metal working method and equipment, especially through hole copper plating device.
Background technology
Along with the progress of electronic technology, one of key part in electronics-printed circuit board also develops into dual platen from single sided board, multi-ply wood.In multilayer printed circuit board, interlayer circuit realizes connecting by the micropore of metal.At present, in printed circuit board field, the technology realizing micropore metal mainly contains electroless plating technology, electroplating technology, and black holes electroplating technology and electro-conductive material consent technology, wherein the above two are industry mainstream technology.As can be seen here, electroplating technology has critical role in printed circuit board micropore metal technology, and electroplanting device is the basic equipment realizing electroplating technology.
In existing micropore metal equipment, its structure improves traditional plane electroplanting device, mainly contains tradition and inflate swing type electroplating groove, pulsed electrical coating bath and negative pressure electroplating groove three class.Swing type electroplating groove inflated for tradition, make mechanically to vacillate now to the left, now to the right the printed circuit board of negative electrode, and inflate in electroplate liquid and accelerate plating solution rate of exchange, anode adopts phosphorous copper balls or phosphorus copper plate, direct supply in addition between anode and cathode, this electroplanting device has the advantage of cheapness and preferable operability for the electroplates in hole of major diameter, low radius-thickness ratio, but for the through hole of high thickness to diameter ratio, swing type electroplating groove of inflating is difficult to meet plating requirement, particularly micro-holes.Pulsed electrical coating bath inflates swing type electroplating groove to tradition to improve, its feature is to use pulsed current to affect special efficacy and the electrode mass transfer process of kinetics of electrode process, thus improve electroplating evenness, promote quality of coating, but the program still cannot solve the high thickness to diameter ratio the electroplates in hole technical barrier because the circuit card number of plies increases, aperture reduces and brings.Chinese invention patent CN200610061541.0 provides a kind of PCB plate through hole negative pressure electroplating groove, and this plating tank is by spraying mineralization pressure thus improving the rate of exchange of plating solution in through hole.Concrete structure and principle of work are: the nozzle that row's jet direction is parallel to printed circuit board face is installed in square side under the cathode, and be staggered at the nozzle of printed circuit board heteropleural, adopt phosphorus-copper anode and direct supply plating, this plating tank promotes higher to printed circuit board plate face plating solution rate of exchange, but the negative pressure formed in through hole both sides is less, little on the impact of hole electrolyte inside mass transfer, be difficult to the covering power improving through hole.Japanese Patent (clear 60-177195) discloses a kind of electro-plating method with through hole circuit board, the core of the method plating tank is divided into two Room, left and right, by regulating the liquid level difference of two grooves, allow while the flowing of the electroplate liquid in through hole and implement electroplating operations to through-hole inner surface, this kind of plating mode greatly improves the mass transfer process of through hole electrolyte inside.But in the device for carrying out said of this patent disclosure, its plating piece is vertically put between the left room of plating tank and right ventricle, same has different hole on the printed circuit board plating piece of through hole to be in different liquid levels, the hydraulic pressure that it is subject to is different, make the electrolytic solution renewal rate in different micropore different, thus the homogeneity of entire plate plating is had an impact, in addition, this invention adopts mechanical system sealing negative electrode plating piece, and plating piece is changed very complicated.
In sum, current printed circuit board the electroplates in hole has the technical problems such as covering power difference, coating uniformity is poor, the replacing of high thickness to diameter ratio micropore lack of homogeneity, plating piece is difficult.
Summary of the invention
For above-mentioned existing problems, the invention provides a kind of copper plating device with through hole printed circuit board and electro-plating method thereof.
A kind of copper plating device with through hole printed circuit board provided by the invention, comprising: power supply, water jacket, inside groove, inside groove support, Anodic support, lower anode carrier, Anodic, lower anode, elastic washer, cathode assemblies, constant temperature heating device, inflating pump, air-inflating tube, electrolyte circulating pump, circulation of elecrolyte pipe, threeway and container for storing liquid.
The bottom of inside groove is embedding to be magnetic body and have window, the flexible packing ring of horizontal positioned and cathode assemblies on it, and inside groove is supported by the inside groove support being positioned over outer slot bottom and is fixed in water jacket;
Cathode assemblies is made up of the lower frame body placed successively from bottom to up, lower elastic washer, plating piece, upper elastic washer and upper frame body, the identical window of size is all offered except plating piece, cathode assemblies as whole device negative electrode and be placed horizontally on the elastic washer on bottom inside groove, the draw-in groove of fixing upper frame body is provided with in lower frame body, its upper surface is provided with the groove placing elastic washer and upper frame body, its groove outer is provided with the neck of hook, the size of upper and lower elastic washer and upper frame body and groove match;
Anodic and lower anode are supported in inside groove and water jacket by Anodic support and lower anode carrier respectively, and equal apart from the distance of cathode assemblies, and elastic washer is placed on bottom inside groove, and has the window with inside groove bottom windows formed objects;
Constant temperature heating device is arranged at outer slot bottom, inflating pump, and water jacket and inside groove are by air-inflating tube UNICOM, and water jacket outside is provided with the electrolyte circulating pump connected by circulation of elecrolyte pipe, threeway and container for storing liquid, and circulation of elecrolyte pipe is directly connected to inside groove and water jacket.
Described cathode assemblies also comprises a size and lower frame body matching grooves, offers the window with plating piece formed objects, is sleeved on the middle spring packing ring of plating piece periphery, and this packing ring can make sealing effectiveness better.
Described inside groove and water jacket can adopt a shared cell wall, save the object of material to reach, and the making material of its whole device all adopts corrosion resistant material due to the corrodibility of electrolytic solution.
Its electro-plating method comprises the following steps:
(1) elastic washer under placing in lower frame body groove, is then positioned over plating piece on lower elastic washer, then is positioned over after on plating piece by upper elastic washer, upper frame body is put into lower frame body and is fixed by draw-in groove, obtains cathode assemblies;
(2) lower anode is put on lower anode carrier, then elastic washer is put into bottom inside groove, then cathode assemblies is put on elastic washer, finally Anodic is put on Anodic support;
(3) electrolyte circulating pump is started, electrolytic solution in container for storing liquid is pumped among inside groove, and open constant temperature heating device, the flow regulating recycle pump is passed to by regulating three, when in electroplated groove, the liquid level difference of water jacket and the temperature of electrolytic solution reach default value and stablize constant, open pump-up device and direct supply, implement plating.
The plating piece periphery of described step one can be set with a size and lower frame body matching grooves, offers the middle spring packing ring of the window identical with plating piece size.
The present invention passes through: 1), design cathode assemblies by band window upper and lower two frameworks be held between the two by there being the printed electronic circuit plate level of through hole, and realize being separated and sealing of interior water jacket with elastic washer with the magnetic substance of cathode assemblies with defaulting in bottom inside groove, and the design of cathode assemblies be greatly convenient to electroplate time plating piece put into plating after taking-up, raise labour efficiency.2), during plating, electrolytic solution in interior water jacket can only form circulation loop by the through hole on the printed circuit board of horizontal positioned and external electrolyte circulating pump, realize the renewal of plating piece micropore electrolyte inside, through hole electrolyte inside renewal rate is improved by the liquid level difference increasing interior water jacket electrolytic solution, there is not the differences such as the solution composition in plating piece surface and hole, be highly suitable for the printed circuit board the electroplates in hole of high thickness to diameter ratio, the effective current efficiency promoted when electroplating.3), bottom inside groove and the magnetic field that produces of the embedding magnetic substance of lower frame body makes the coating crystal grain more fine uniform of printed circuit board, and fillibility is good, and improves coating sedimentation rate.4), because printed circuit board is placed horizontally in electrolytic solution, each through hole on plate is at same level liquid level, the hydraulic pressure that each through hole is subject to is identical, the speed that hole electrolyte inside upgrades is consistent, not only improve the homogeneity of micro-through-hole plating, also can promote the quality of the whole plate electroplating evenness of plating piece and plating piece.5), in inside and outside groove pump-up device is set, not only can maintains the homogeneity of electrolytic solution, electrolytic solution also can be prevented by the point effect in funneling effect during micropore and aperture.
In sum, the present invention not only can realize the printed circuit board the electroplates in hole of high thickness to diameter ratio, and has excellent covering power, greatly improves the homogeneity of whole plate plating simultaneously, and has the easy to operate advantage of replacing plating piece.
Accompanying drawing explanation
Vertical section figure when Fig. 1 is the copper plating device plating of band through hole printed circuit board of the present invention;
Fig. 2 is the vertical section figure of cathode assemblies in the present invention;
Fig. 3 is lower frame body vertical view in the present invention;
Fig. 4 is upper frame body vertical view in the present invention;
Fig. 5 is the vertical view of Elastic packing ring of the present invention;
Reference numeral: 1-power supply; 2-water jacket; 3-inside groove; 4-1-external groove sidevall; External groove sidevall in 4-2-shares; 5-outer slot bottom; 6-internal groove side wall; Bottom 7-inside groove; 8-magnetic substance; 9-inside groove support; 10-1-Anodic support; Anode carrier under 10-2-; 11-1-Anodic; Anode under 11-2-; 12-elastic washer; 13-cathode assemblies; The 14-neck of hook; 15-constant temperature heating device; 16-inflating pump; 17-air-inflating tube; 18-electrolyte circulating pump; 19-circulation of elecrolyte pipe; 20-threeway; 21-container for storing liquid; 22-water jacket liquid level; 23-inside groove liquid level;
13-1-lower frame body; 13-2-upper frame body; The upper elastic washer of 13-3-; The middle spring packing ring of 13-4-; Elastic washer under 13-5-; 13-6-is with the printed circuit board of through hole; 13-7-magnetic substance.
Concrete embodiment
A kind of flowing electrolytic solution printed circuit board through hole copper plating device as shown in Figure 1, comprise: power supply (1), water jacket (2), inside groove (3), outer slot bottom (5), bottom inside groove (7), magnetic substance (8), inside groove support (9), Anodic support (10-1), lower anode carrier (10-2), Anodic (11-1), lower anode (11-2), elastic washer (12), cathode assemblies (13), constant temperature heating device (15), inflating pump (16), air-inflating tube (17), electrolyte circulating pump (18), circulation of elecrolyte pipe (19), threeway (20) and container for storing liquid (21).Consider that described water jacket and inside groove can share a part of cell wall (4-2) for saving material.
(7) embedding body that is magnetic (8) bottom inside groove and have window, inside groove (3) is supported by the inside groove support (9) being positioned over outer slot bottom (5) and is fixed in water jacket (2); Anodic (11-1) and lower anode (11-2) are supported in water jacket and inside groove by Anodic support (10-1) and lower anode carrier (10-2) respectively, and it is equal apart from the distance of cathode assemblies (13), elastic washer (12) is placed in bottom inside groove, and has the window with inside groove bottom windows formed objects;
Cathode assemblies (13) is by the lower frame body placed successively from bottom to up (13-1), lower elastic washer (13-5), plating piece (13-6), middle spring packing ring (13-4), upper elastic washer (13-3) and upper frame body (13-2) composition, all offer except middle spring packing ring and plating piece with inside groove bottom the window of formed objects, middle spring packing ring size and lower frame body matching grooves, offer the window identical with plating piece size, be sleeved on plating piece periphery, cathode assemblies forms negative electrode when electroplating and is placed horizontally on elastic washer (12), lower frame body is embedded with the magnetic substance (13-7) corresponding with magnetic substance bottom inside groove (8), be provided with the draw-in groove of fixing upper frame body, its upper surface is provided with the groove placing elastic washer and upper frame body, its groove outer is provided with the neck of hook (14), the size of three elastic washers and upper frame body and groove match,
Constant temperature heating device (15) is arranged at outer slot bottom, inflating pump (16), water jacket and inside groove are by air-inflating tube (17) UNICOM, water jacket outside is provided with the electrolyte circulating pump (18) connected by circulation of elecrolyte pipe (19), threeway (20) and container for storing liquid (21), and circulation of elecrolyte pipe directly leads to inside groove and water jacket.
The making material of its whole device adopts erosion-resisting synthetic glass.
It is as follows that it electroplates concrete implementation step:
Step one: under placing in lower frame body after elastic washer by the thick 2.4mm of pre-treatment, have 6:1 respectively, the through hole printed circuit board of 8:1,9.6:1 tri-kinds of radius-thickness ratios, be put on lower elastic washer; Then put into middle spring packing ring through hole printed circuit board is fixed, then after it being put into elastic washer, upper frame body is put into the draw-in groove internal fixtion of lower frame body, obtain cathode assemblies.
Step 2: put into phosphorus copper plate on lower anode carrier, by cathode assemblies puts into after putting into elastic washer bottom inside groove, then puts on Anodic support by another phosphorus copper plate; The positive pole of upper and lower anode parallel connection access direct supply, through hole printed circuit board is as the negative pole of negative electrode access direct supply.
Step 3: start electroplate liquid water circulating pump, pumps into the electrolytic solution in container for storing liquid among inside groove, and opens constant temperature heating device; Regulate three to pass to the flow regulating recycle pump, in electroplated groove, the liquid level difference of water jacket is 3cm, and the temperature of electrolytic solution reaches preset temperature 25 DEG C, opens pump-up device and direct supply, implements plating.
Plating result:
Through hole printed circuit board takes out implement plating 50min in Haring cell under electric current 1.00A, airshed 3L/min condition after, hot-air seasoning after aftertreatment.Plating piece sample making metallography microscope is cut into slices, under metaloscope, measures the thickness of electrolytic coating, utilize 6 methods to calculate the covering power of each through hole, then get the mean value of ten hole covering powers.Radius-thickness ratio is the covering power in the hole of 6:1 is 67.23%, and radius-thickness ratio is the covering power in the hole of 8:1 is 54.97%, and radius-thickness ratio is the covering power in the hole of 9.6:1 is 50.45%.
Through hole printed circuit board takes out electroplate 50min in one band through hole printed circuit board copper plating device under electric current 1.00A, airshed 3L/min condition after, hot-air seasoning after aftertreatment.Plating piece sample making metallography microscope is cut into slices, under metaloscope, measures the thickness of electrolytic coating, utilize 6 methods to calculate the covering power of each through hole, then get the mean value of ten hole covering powers.Radius-thickness ratio is the covering power in the hole of 6:1 is 91.52%, and radius-thickness ratio is the covering power in the hole of 8:1 is 69.12%, and radius-thickness ratio is the covering power in the hole of 9.6:1 is 63.55%.
Claims (6)
1. the copper plating device with through hole printed circuit board, comprise: power supply, water jacket, inside groove, inside groove support, Anodic support, lower anode carrier, Anodic, lower anode, elastic washer, cathode assemblies, constant temperature heating device, inflating pump, air-inflating tube, electrolyte circulating pump, circulation of elecrolyte pipe, threeway and container for storing liquid, constant temperature heating device is arranged at outer slot bottom, inflating pump, water jacket and inside groove are by air-inflating tube UNICOM, water jacket outside is provided with the electrolyte circulating pump connected by circulation of elecrolyte pipe, threeway and container for storing liquid, and circulation of elecrolyte pipe is directly connected to inside groove and water jacket, it is characterized in that:
The bottom of inside groove has window, the flexible packing ring of horizontal positioned and cathode assemblies successively on it, and inside groove is supported by the inside groove support being positioned over outer slot bottom and is fixed in water jacket;
Cathode assemblies is made up of the lower frame body placed successively from bottom to up, lower elastic washer, plating piece, upper elastic washer and upper frame body, except plating piece, all offer the identical window of size, cathode assemblies as whole device negative electrode and be placed horizontally on the elastic washer on bottom inside groove; Be provided with the draw-in groove of fixing upper frame body in lower frame body, its upper surface is provided with the groove placing elastic washer and upper frame body, and its groove outer is provided with the neck of hook, the size of upper and lower elastic washer and upper frame body and groove match;
The magnetic substance of working in coordination is had with lower frame body is embedding bottom described inside groove;
Anodic and lower anode are supported in inside groove and water jacket by Anodic support and lower anode carrier respectively, and equal apart from the distance of cathode assemblies, and elastic washer is placed on bottom inside groove, and has the window with inside groove bottom windows formed objects.
2. be with the copper plating device of through hole printed circuit board as claimed in claim 1, it is characterized in that: described cathode assemblies also comprises a size and lower frame body matching grooves, offer the window identical with plating piece size, during plating, be enclosed within the middle spring packing ring of plating piece periphery.
3. be with the copper plating device of through hole printed circuit board as claimed in claim 1, it is characterized in that: described anode carrier height adjustable.
4. as described in as arbitrary in claim 1-3, the copper plating device of band through hole printed circuit board, is characterized in that: described inside groove and water jacket adopt a shared cell wall.
5. be with the plating implementation method of the copper plating device of through hole printed circuit board as claimed in claim 1, comprise the following steps:
Step one, in lower frame body groove place under elastic washer, then plating piece is positioned on lower elastic washer, upper elastic washer is positioned over after on plating piece, upper frame body is put into lower frame body and is fixed by draw-in groove, obtain cathode assemblies;
Step 2, lower anode to be put on lower anode carrier, then elastic washer is put into bottom inside groove, then cathode assemblies is put on elastic washer, finally Anodic is put on Anodic support;
Step 3, start electrolyte circulating pump, the electrolytic solution in container for storing liquid is pumped among inside groove, and opens constant temperature heating device; By regulating three to pass to the flow regulating recycle pump, when the liquid level difference of water jacket and the temperature of electrolytic solution reach default value and stablize constant in electroplated groove, opening pump-up device and direct supply, implementing plating.
6. electroplate implementation method as claimed in claim 5, it is characterized in that: before the plating piece placement of described step one, its outer race is equipped with a size and lower frame body matching grooves, offers the middle spring packing ring of the window identical with plating piece size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410710003.4A CN104404589B (en) | 2014-11-28 | 2014-11-28 | Copper plating device of printed circuit board with through holes and electroplating method of copper plating device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410710003.4A CN104404589B (en) | 2014-11-28 | 2014-11-28 | Copper plating device of printed circuit board with through holes and electroplating method of copper plating device |
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| CN104404589A true CN104404589A (en) | 2015-03-11 |
| CN104404589B CN104404589B (en) | 2017-02-22 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110528054A (en) * | 2019-08-31 | 2019-12-03 | 珠海市万顺睿通科技有限公司 | The device and method that a kind of pcb board does not stop slot electric deposition nickel |
| CN111910242A (en) * | 2020-07-24 | 2020-11-10 | 广州兴森快捷电路科技有限公司 | Electroplating method and device for printed circuit board |
| CN112680760A (en) * | 2020-12-10 | 2021-04-20 | 广东天承科技股份有限公司 | Electroplating device and electroplating method for printed circuit board |
| CN114016095A (en) * | 2021-12-17 | 2022-02-08 | 深圳市天熙科技开发有限公司 | Process method for uniformly electroplating inorganic non-metal substrate |
| CN114703523A (en) * | 2022-04-01 | 2022-07-05 | 电子科技大学 | Through hole filling electroplating method and electroplating device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111910242B (en) * | 2020-07-24 | 2021-12-24 | 广州兴森快捷电路科技有限公司 | Electroplating method and device for printed circuit board |
| CN112680760A (en) * | 2020-12-10 | 2021-04-20 | 广东天承科技股份有限公司 | Electroplating device and electroplating method for printed circuit board |
| CN114016095A (en) * | 2021-12-17 | 2022-02-08 | 深圳市天熙科技开发有限公司 | Process method for uniformly electroplating inorganic non-metal substrate |
| CN114703523A (en) * | 2022-04-01 | 2022-07-05 | 电子科技大学 | Through hole filling electroplating method and electroplating device |
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