CN104404589B - Copper plating device of printed circuit board with through holes and electroplating method of copper plating device - Google Patents
Copper plating device of printed circuit board with through holes and electroplating method of copper plating device Download PDFInfo
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- CN104404589B CN104404589B CN201410710003.4A CN201410710003A CN104404589B CN 104404589 B CN104404589 B CN 104404589B CN 201410710003 A CN201410710003 A CN 201410710003A CN 104404589 B CN104404589 B CN 104404589B
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- groove
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- printed circuit
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Abstract
The invention belongs to the field of printed circuit board manufacture, and relates to a through hole metallization machining method and equipment of a printed circuit board, in particular to a through hole copper plating device. The invention provides a copper plating device of a printed circuit board with through holes. The copper plating device comprises a power supply, an external slot, an internal slot, an internal slot support, an upper anode support, a lower anode support, an upper anode, a lower anode, a spring washer, a cathode assembly, a constant temperature heating device, an inflation pump, an inflation tube, an electrolyte circulation pump, an electrolyte circulation tube, a tee joint and a liquid storage tank. The device can realize electroplating of the through holes of the printed circuit board with a high radio of thickness to radius, has excellent deep plating capacity, greatly improves electroplating uniformity of the whole board at the same time, and has the advantages of convenience in operation, high labor efficiency and the like.
Description
Technical field
The invention belongs to printed circuit board manufactures field, it is related to printed circuit board via metal processing method and sets
Standby, especially through hole copper plating device.
Background technology
With the progress of electronic technology, one of critical component in electronic equipment printed circuit board also develops from single sided board
To dual platen, multi-layer sheet.In multilayer printed circuit board, interlayer circuit is to realize connecting by the micropore of metal.At present, in print
Field of circuit boards processed, the technology realizing micropore metal mainly has electroless plating technology, electroplating technology, black holes electroplating technology and conduction
Material consent technology, wherein the above two are industry mainstream technology.As can be seen here, electroplating technology is in printed circuit board micropore metal
There is in technology critical role, and electroplanting device is the basic equipment realizing electroplating technology.
In existing micropore metal equipment, its structure is to improve traditional plane electroplanting device, mainly has tradition to beat
Gas swing type electroplating groove, pulse plating groove and negative pressure electroplating groove three class.Swing type electroplating groove inflated for tradition, using machinery side
Method is vacillated now to the left, now to the right the printed circuit board of negative electrode, and inflates acceleration plating solution exchange rate in electroplate liquid, anode adopt phosphorous copper balls or
Phosphorus copper plate, DC source in addition between anode and cathode, this electroplanting device for major diameter, low radius-thickness ratio the electroplates in hole have honest and clean
Valency and the advantage of preferable operability, but the through hole for high thickness to diameter ratio, swing type electroplating groove of inflating is difficult to meet plating requirement,
Particularly micro hole.Pulse plating groove is tradition to be inflated with swing type electroplating groove improved, and its feature is to use pulse
Electric current affects specially good effect and the electrode mass transport process of kinetics of electrode process, thus improving electroplating evenness, lifts quality of coating, but
The high thickness to diameter ratio the electroplates in hole technology that the program still cannot solve because the circuit board number of plies increases, aperture reduces and brings is difficult
Topic.Chinese invention patent CN200610061541.0 provides a kind of PCB plate through hole negative pressure electroplating groove, and this electroplating bath passes through injection
Form pressure thus improving exchange rate in through hole for the plating solution.Concrete structure and operation principle are：Square side peace under the cathode
Fill the nozzle parallel to printed circuit plate face for the row's jet direction, and the nozzle in printed circuit board heteropleural is staggered, adopt
Phosphorus-copper anode and DC source plating, this electroplating bath is higher to the lifting of printed circuit board plate face plating solution exchange rate, but in through hole
The negative pressure that both sides are formed is less, and device to hole electrolyte inside mass transfer affects little it is difficult to improve the covering power of through hole.Japan Patent is (clear
60-177195) disclose a kind of electro-plating method with through hole circuit board, the core of the method is that electroplating bath is divided into left and right
Two Room, by adjusting the liquid level difference of two grooves, allow the electroplate liquid flowing in through hole while electroplating operations are implemented to through-hole inner surface,
This kind of plating mode greatly improves the mass transport process of through hole electrolyte inside.But in the implementation of this patent disclosure, its plating
Part is vertically put between the left room of electroplating bath and right ventricle, and same has different holes on the printed circuit board plating piece of through hole to be in not
Same liquid level, the hydraulic pressure that it is subject to is different so that the electrolyte renewal rate in different micropores is different, thus electroplating to entire plate
Uniformity produce impact, in addition, this invention adopt mechanical system seal negative electrode plating piece, plating piece change sufficiently complex.
In sum, current printed circuit board the electroplates in hole there are that covering power is poor, coating uniformity is poor, high thickness to diameter ratio
Micropore lack of homogeneity, plating piece change the technical problems such as difficulty.
Content of the invention
For above-mentioned existing problems, the invention provides a kind of copper plating device with through hole printed circuit board and its plating side
Method.
A kind of copper plating device with through hole printed circuit board that the present invention provides, including：Power supply, water jacket, inside groove, inside groove prop up
Frame, Anodic support, lower anode carrier, Anodic, lower anode, elastic washer, cathode assemblies, constant temperature heating device, inflate
Pump, air-inflating tube, electrolyte circulating pump, electrolyte circulation pipe, threeway and fluid reservoir.
The bottom of inside groove is embedding to be magnetic body and have window, the flexible packing ring of horizontal positioned and cathode assemblies thereon,
Inside groove is fixed in water jacket by being positioned over the inside groove support of outer slot bottom and supporting；
Cathode assemblies are by the lower frame body being sequentially placed from bottom to up, lower elastic washer, plating piece, upper elastic washer and upper ledge
Body forms, and all offers size identical window in addition to plating piece, and cathode assemblies are as the negative electrode of whole device and horizontal positioned
On the elastic washer on inside groove bottom, it is provided with the draw-in groove of fixing upper frame body in lower frame body, its upper surface is provided with placement elasticity
Packing ring and the groove of upper frame body, its groove outer is provided with the neck of hook, the size of upper and lower elastic washer and upper frame body and groove phase
Join；
Anodic and lower anode are supported in inside groove and water jacket by Anodic support and lower anode carrier respectively, and away from cathode sets
The distance of component is equal, and elastic washer is placed on inside groove bottom, and has the window with inside groove bottom windows formed objects；
Constant temperature heating device is arranged at outer slot bottom, inflating pump, and water jacket and inside groove pass through air-inflating tube UNICOM, set outside water jacket
There are the electrolyte circulating pump connecting by electrolyte circulation pipe, threeway and fluid reservoir, and in electrolyte circulation pipe is directly connected to
Groove and water jacket.
Described cathode assemblies also include a size and lower frame body matching grooves, offer the window with plating piece formed objects
Mouthful, it is sleeved on the middle spring packing ring of plating piece periphery, this packing ring can make sealing effectiveness more preferable.
Described inside groove and water jacket can adopt a shared cell wall, to reach the purpose saving material, the system of its whole device
The corrosivity making material due to electrolyte are all using corrosion-resistant material.
Its electro-plating method comprises the following steps：
(1) elastic washer under placing in lower frame body groove, then plating piece is positioned on lower elastic washer, then
After upper elastic washer is positioned on plating piece, upper frame body is put in lower frame body and is fixed by draw-in groove, obtain cathode assemblies；
(2) lower anode is put on lower anode carrier, then elastic washer is put into inside groove bottom, then by cathode assemblies
It is put on elastic washer, finally put into Anodic on Anodic support；
(3) start electrolyte circulating pump, the electrolyte in fluid reservoir is pumped among inside groove, and open heated at constant temperature dress
Put, by adjust three pass to adjust circulating pump flows, in groove to be electroplated the liquid level difference of water jacket and the temperature of electrolyte reach pre-
If value and when stablizing constant, open pump-up device and DC source, implement plating.
The plating piece periphery of described step one can be set with a size and lower frame body matching grooves, offers and plating piece size phase
The middle spring packing ring of same window.
The present invention passes through：1), design cathode assemblies will have the printing electricity of through hole by upper and lower two frameworks with window
Road plate level is held between the two, and with elastic washer and defaults in inside groove bottom and the magnetic realization of cathode assemblies
The separation of water jacket and sealing, and the design of cathode assemblies greatly be convenient to electroplate when plating piece put into plating after take
Go out, raise labour efficiency.2), during plating, the electrolyte in interior water jacket can only pass through logical on the printed circuit board of horizontal positioned
Hole and external electrolyte circulating pump constitute closed circuit, realize the renewal of plating piece micropore electrolyte inside, by water jacket in increasing
The liquid level difference of electrolyte improves through hole electrolyte inside renewal rate, there is not plating piece surface and the differences such as the solution composition of in the hole,
It is highly suitable for the printed circuit board the electroplates in hole of high thickness to diameter ratio, effectively current efficiency during lifting plating.3), inside groove bottom
The magnetic field that the magnetic embedding with lower frame body produces makes the coating crystal grain more fine uniform of printed circuit board, and fillibility is good, and carries
High coating sedimentation rate.4), because printed circuit board is placed horizontally in electrolyte, each through hole on plate is in same level
Liquid level, the hydraulic pressure that each through hole is subject to is identical, and the speed that in the hole electrolyte updates is consistent, not only improves the uniform of micro- through-hole plating
Property, also can lift the quality of plating piece imposite electroplating evenness and plating piece.5), pump-up device is set in inside and outside groove, not only can
Maintain the uniformity of electrolyte, pass through the point effect of funneling effect during micropore and aperture prevented also from electrolyte.
In sum, the present invention not only can realize the printed circuit board the electroplates in hole of high thickness to diameter ratio, and has excellent
Covering power, greatly improve the uniformity of imposite plating simultaneously, and have and change the easy to operate advantage of plating piece.
Brief description
Fig. 1 is the vertical section figure during plating of the copper plating device with through hole printed circuit board of the present invention；
Fig. 2 is the vertical section figure of cathode assemblies in the present invention；
Fig. 3 is lower frame body top view in the present invention；
Fig. 4 is upper frame body top view in the present invention；
Fig. 5 is the top view of elastic washer in the present invention；
Reference：1- power supply；2- water jacket；3- inside groove；4-1- external groove sidevall；4-2- shares interior external groove sidevall；5- outer slot bottom；
6- internal groove side wall；7- inside groove bottom；8- magnetic；9- inside groove support；10-1- Anodic support；Anode carrier under 10-2-；11-1-
Anodic；Anode under 11-2-；12- elastic washer；13- cathode assemblies；The 14- neck of hook；15- constant temperature heating device；16- inflates
Pump；17- air-inflating tube；18- electrolyte circulating pump；19- electrolyte circulation pipe；20- threeway；21- fluid reservoir；22- water jacket liquid level；
23- inside groove liquid level；
13-1- lower frame body；13-2- upper frame body；The upper elastic washer of 13-3-；The middle spring packing ring of 13-4-；Elasticity under 13-5-
Packing ring；The printed circuit board with through hole for the 13-6-；13-7- magnetic.
It is embodied as example
A kind of flowing electrolyte printed circuit board through hole copper plating device as shown in Figure 1, including：Power supply (1), water jacket (2), interior
Groove (3), outer slot bottom (5), inside groove bottom (7), magnetic (8), inside groove support (9), Anodic support (10-1), lower anode prop up
Frame (10-2), Anodic (11-1), lower anode (11-2), elastic washer (12), cathode assemblies (13), constant temperature heating device
(15), inflating pump (16), air-inflating tube (17), electrolyte circulating pump (18), electrolyte circulation pipe (19), threeway (20) and fluid reservoir
(21).Consider that described water jacket and inside groove can share a part of cell wall (4-2) for saving material.
The embedding body that is magnetic in inside groove bottom (7) (8) and have window, inside groove (3) is by being positioned over the interior of outer slot bottom (5)
Groove support (9) supports and is fixed in water jacket (2)；Anodic (11-1) and lower anode (11-2) are respectively by Anodic support (10-1)
It is supported in water jacket and inside groove with lower anode carrier (10-2), and the distance away from cathode assemblies (13) is equal, elastic washer (12)
It is placed in inside groove bottom, and there is the window with inside groove bottom windows formed objects；
Cathode assemblies (13) are by the lower frame body (13-1) being sequentially placed from bottom to up, lower elastic washer (13-5), plating piece
(13-6), middle spring packing ring (13-4), upper elastic washer (13-3) and upper frame body (13-2) composition, except middle elastic washer with
All offer the window with inside groove bottom formed objects, middle spring packing ring size and lower frame body matching grooves outside plating piece, open up
Have and plating piece size identical window, be sleeved on plating piece periphery, cathode assemblies constitute negative electrode during plating and are placed horizontally at
On elastic washer (12)；Lower frame body is embedded with the magnetic (13-7) corresponding with inside groove bottom magnetic (8), is provided with fixation
The draw-in groove of upper frame body, its upper surface is provided with the groove placing elastic washer and upper frame body, and its groove outer is provided with the neck of hook (14), and three
The size of individual elastic washer and upper frame body and groove match；
Constant temperature heating device (15) is arranged at outer slot bottom, and inflating pump (16), water jacket and inside groove pass through air-inflating tube (17) and join
Logical, it is provided with the electrolyte circulating pump (18) connecting by electrolyte circulation pipe (19), threeway (20) and fluid reservoir outside water jacket
, and electrolyte circulation pipe is passed directly to inside groove and water jacket (21).
The making material of its whole device adopts erosion-resisting lucite.
Its plating specific implementation step is as follows：
Step one：By the thick 2.4mm front processing after elastic washer under placing in lower frame body, have 6 respectively:1,8:1,
9.6:The through hole printed circuit board of 1 three kinds of radius-thickness ratios, is put on lower elastic washer；It is then placed in middle spring packing ring to print through hole
Circuit board processed is fixed, then puts into upper frame body after putting into elastic washer thereon fixing in the draw-in groove in lower frame body, obtains negative electrode
Molectron.
Step 2：Put into phosphorus copper plate on lower anode carrier, by cathode assemblies after elastic washer is put in inside groove bottom
Put into, more another phosphorus copper plate is put on Anodic support；The anode positive pole accessing DC source in parallel up and down, through hole prints electricity
Road plate accesses the negative pole of DC source as negative electrode.
Step 3：Start electroplate liquid water circulating pump, the electrolyte in fluid reservoir is pumped among inside groove, and open constant temperature and add
Thermal；Adjust three and pass to the flow adjusting circulating pump, in groove to be electroplated, the liquid level difference of water jacket is 3cm, the temperature of electrolyte reaches
To 25 DEG C of predetermined temperature, open pump-up device and DC source, implement plating.
Plating result:
After through hole printed circuit board implements plating 50min under the conditions of electric current 1.00A, throughput 3L/min in Haring cell
Take out, hot-air seasoning after post processing.Plating piece sample making metallography microscope is cut into slices, measures the thickness of electrodeposited coating under metallurgical microscope
Degree, calculates the covering power of each through hole using 6 points of methods, then the meansigma methodss taking ten hole covering powers.Radius-thickness ratio is 6:1
Hole covering power be 67.23%, radius-thickness ratio be 8:The covering power in 1 hole is 54.97%, and radius-thickness ratio is 9.6:1 hole
Covering power be 50.45%.
Through hole printed circuit board is under the conditions of electric current 1.00A, throughput 3L/min in a kind of band through hole printed circuit board plating
Take out after plating 50min in copper device, hot-air seasoning after post processing.Plating piece sample making metallography microscope is cut into slices, shows in metallographic
Measure the thickness of electrodeposited coating under micro mirror, calculate the covering power of each through hole using 6 points of methods, then take ten hole covering powers
Meansigma methodss.Radius-thickness ratio is 6:The covering power in 1 hole is 91.52%, and radius-thickness ratio is 8:The covering power in 1 hole is
69.12%, radius-thickness ratio is 9.6:The covering power in 1 hole is 63.55%.
Claims (6)
1. a kind of copper plating device with through hole printed circuit board, including：Power supply, water jacket, inside groove, inside groove support, Anodic support,
Lower anode carrier, Anodic, lower anode, elastic washer, cathode assemblies, constant temperature heating device, inflating pump, air-inflating tube, electrolysis
Liquid circulating pump, electrolyte circulation pipe, threeway and fluid reservoir, constant temperature heating device is arranged at outer slot bottom, inflating pump, water jacket and interior
Groove passes through air-inflating tube UNICOM, is provided with the electrolyte circulating pump connecting by electrolyte circulation pipe, threeway and fluid reservoir outside water jacket,
And electrolyte circulation pipe be directly connected to inside groove and water jacket it is characterised in that：
The bottom of inside groove has window, thereon the flexible packing ring of horizontal positioned and cathode assemblies successively, and inside groove passes through to be positioned over
The inside groove support of outer slot bottom supports and is fixed in water jacket；
Cathode assemblies are by the lower frame body being sequentially placed from bottom to up, lower elastic washer, plating piece, upper elastic washer and upper frame body group
Become, all offer size identical window in addition to plating piece, cathode assemblies are as the negative electrode of whole device and in being placed horizontally at
On elastic washer on trench bottom；It is provided with the draw-in groove of fixing upper frame body, its upper surface is provided with placement elastic washer in lower frame body
With the groove of upper frame body, its groove outer is provided with the neck of hook, the size of upper and lower elastic washer and upper frame body and groove match；
Described inside groove bottom and lower frame body is embedding the magnetic worked in coordination；
Anodic and lower anode are supported in inside groove and water jacket by Anodic support and lower anode carrier respectively, and away from cathode assemblies
Distance equal, elastic washer is placed on inside groove bottom, and has the window with inside groove bottom windows formed objects.
2. as claimed in claim 1 the copper plating device with through hole printed circuit board it is characterised in that：Described cathode assemblies also wrap
Include a size and lower frame body matching grooves, offer and plating piece size identical window, be enclosed within during plating in plating piece periphery
Between elastic washer.
3. as claimed in claim 1 the copper plating device with through hole printed circuit board it is characterised in that：Described anode carrier height can
Adjust.
4. the described copper plating device with through hole printed circuit board as arbitrary in claim 1-3 it is characterised in that：Described inside groove is with outward
Groove adopts a shared cell wall.
5. the plating implementation of the copper plating device with through hole printed circuit board as claimed in claim 1, comprises the following steps：
Step one, place in lower frame body groove under elastic washer, then plating piece is positioned on lower elastic washer, then by upper bullet
Property packing ring be positioned on plating piece after, upper frame body is put in lower frame body and is fixed by draw-in groove, obtain cathode assemblies；
Step 2, lower anode is put on lower anode carrier, then elastic washer is put into inside groove bottom, then by cathode assemblies
It is put on elastic washer, finally put into Anodic on Anodic support；
Step 3, start electrolyte circulating pump, the electrolyte in fluid reservoir is pumped among inside groove, and open heated at constant temperature dress
Put；By adjust three pass to adjust circulating pump flows, in groove to be electroplated the liquid level difference of water jacket and the temperature of electrolyte reach pre-
If value and when stablizing constant, open pump-up device and DC source, implement plating.
6. as claimed in claim 5 plating implementation it is characterised in that：Before the plating piece of described step one is placed, its periphery set
Equipped with a size and lower frame body matching grooves, offer the middle spring packing ring with plating piece size identical window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410710003.4A CN104404589B (en) | 2014-11-28 | 2014-11-28 | Copper plating device of printed circuit board with through holes and electroplating method of copper plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410710003.4A CN104404589B (en) | 2014-11-28 | 2014-11-28 | Copper plating device of printed circuit board with through holes and electroplating method of copper plating device |
Publications (2)
| Publication Number | Publication Date |
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| CN104404589A CN104404589A (en) | 2015-03-11 |
| CN104404589B true CN104404589B (en) | 2017-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410710003.4A Expired - Fee Related CN104404589B (en) | 2014-11-28 | 2014-11-28 | Copper plating device of printed circuit board with through holes and electroplating method of copper plating device |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110528054B (en) * | 2019-08-31 | 2021-05-18 | 江西豪越群电子有限公司 | Device and method for electrodepositing nickel on PCB without stopping groove |
| CN111910242B (en) * | 2020-07-24 | 2021-12-24 | 广州兴森快捷电路科技有限公司 | Electroplating method and device for printed circuit board |
| CN112680760B (en) * | 2020-12-10 | 2021-12-21 | 广东天承科技股份有限公司 | Electroplating device and electroplating method for printed circuit board |
| CN114016095A (en) * | 2021-12-17 | 2022-02-08 | 深圳市天熙科技开发有限公司 | Process method for uniformly electroplating inorganic non-metal substrate |
| CN114703523A (en) * | 2022-04-01 | 2022-07-05 | 电子科技大学 | Through hole filling electroplating method and electroplating device |
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| CN102791084A (en) * | 2012-08-24 | 2012-11-21 | 电子科技大学 | Printed-circuit board through hole copper plating device |
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|---|---|---|---|---|
| JPS60177195A (en) * | 1984-02-22 | 1985-09-11 | Sukeo Kai | Plating method of wiring board having through-hole |
| JPS6199693A (en) * | 1984-10-18 | 1986-05-17 | Hitachi Plant Eng & Constr Co Ltd | Method and device for plating of printed circuit board |
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| CN87104909A (en) * | 1986-07-19 | 1988-06-29 | 舍林股份公司 | Electroplating treatment device for plate-shaped material |
| CN1688753A (en) * | 2002-09-04 | 2005-10-26 | 埃托特克德国有限公司 | Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| CN101713094A (en) * | 2009-11-27 | 2010-05-26 | 深圳市五株电路板有限公司 | Electroplating clamp for printed circuit board (PCB) |
| CN102791084A (en) * | 2012-08-24 | 2012-11-21 | 电子科技大学 | Printed-circuit board through hole copper plating device |
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