CN102791084A - Printed-circuit board through hole copper plating device - Google Patents
Printed-circuit board through hole copper plating device Download PDFInfo
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- CN102791084A CN102791084A CN2012103038054A CN201210303805A CN102791084A CN 102791084 A CN102791084 A CN 102791084A CN 2012103038054 A CN2012103038054 A CN 2012103038054A CN 201210303805 A CN201210303805 A CN 201210303805A CN 102791084 A CN102791084 A CN 102791084A
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Abstract
The invention relates to a printed-circuit board through hole copper plating device and belongs to the field of printed-circuit board manufacture. The printed-circuit board through hole copper plating device comprises a power supply, a tank, anode phosphorus copper plates, an isolation plate and a water suction pump. A printed-circuit board needs through hole copper plating is clamped on the isolation plate, the printed-circuit board and the isolation plate cooperate with each other to isolate the tank into two electroplating sub-tanks, and copper plating liquid is pumped from one electroplating sub-tank to the other electroplating sub-tank by the water suction pump, so that the plating liquid levels of the two electroplating sub-tanks form a set height difference, and the set height difference is maintained during copper plating. Based on the forced convection electrocoppering principle, rapid exchange of the plating liquid in through holes of the printed-circuit board is achieved by means of pressure difference formed by the height difference of the plating liquid levels on two sides of the printed-circuit board, and the pressure difference on two sides of the printed-circuit board is maintained by the aid of the water suction pump. The plating liquid can flow through the through holes of different diameters by adjusting the pressure difference on two sides of the through holes, so that rapid exchange of solution in the holes during electroplating of the through holes, particularly the tiny through holes with high thickness-diameter ratio is achieved, and the depth capacity of the printed-circuit board through hole electrocoppering is improved.
Description
Technical field
The invention belongs to printed circuit board and make the field, relate to printed circuit board via metal processing method and equipment, especially the through hole copper plating device.
Background technology
The electroplates in hole copper is the requisite operation of via metalization in the printed circuit board manufacturing process, and it mainly acts on is to realize being electrically connected between the printed circuit board levels.Plating needs to use electroplating bath, and the design of electroplating bath has direct influence to the quality of the electroplates in hole.Different according to the method for electro-coppering, the through hole copper plating device that uses now mainly contains tradition and inflates three types of swing electroplating bath, Pulse Electric coating bath, negative pressure electroplating grooves etc.
Tradition is inflated the structure and the operation principle of swing electroplating bath and is: use the mechanical means cathode circuit plate of vacillating now to the left, now to the right, inflate in the electroplate liquid and quicken the plating bath exchange rate, anode adopts phosphorous copper balls or phosphorus copper plate, DC power supply in addition between the anode and cathode.For major diameter, the through hole of low radius-thickness ratio, the swing electroplating bath of inflating is the device of one type of cheapness, preferable operability; Extensive use in the printed circuit board the electroplates in hole; But for the through hole of high thickness to diameter ratio, swing electroplating bath is difficult to satisfy plating requirement, particularly micro hole.The Pulse Electric coating bath is that tradition is inflated improving of swing electroplating bath, and the titanium net that anode adopts does not use phosphor-copper, needs constantly to add the copper sulphate that consumes in the electroplating process.Pulse dc power in addition between the anode and cathode can improve the copper facing thickness ratio of printed board hole wall and plate face, i.e. degree of depth ability well.The Pulse Electric coating bath is workable, and electroplating effect is good, but this equipment has high input plating solution maintenance difficulty height.In addition, for micro-through-hole copper facing, this electroplating bath is difficult to realize plating bath exchange in the through hole, can't reach the plating requirement.
To the forced convertion electric plating method, Liu Debo etc. have invented pcb board through hole negative pressure electroplating groove.Thereby this electroplating bath can form the exchange rate of pressure raising plating bath in through hole through spraying; Concrete structure and operation principle are: a side is installed the nozzle that row's jet direction is parallel to the printed circuit board face below negative electrode; The nozzle of printed circuit board heteropleural is staggered; Anode adopts phosphor-copper, adopts DC power supply to electroplate.Owing to the different negative pressure that form of the both sides electroplate liquid flow velocity in the same hole of printed circuit board; Thereby promote exchange velocity and the effect of electroplate liquid in the hole, but the negative pressure that this electroplating bath forms in the through hole both sides is less, plating bath exchange velocity in the hole is slow; For micro hole, even can't exchange.Simultaneously, spray and improved printed board plate face plating bath exchange rate, thereby it is thick to have increased plate face copper, is difficult to improve the degree of depth ability of through hole.(list of references: [1] Liu Debo, Kong Lingwen .PCB plate negative pressure electroplating method. Chinese invention patent .CN200610061541.0)
Summary of the invention
The present invention provides a kind of printed circuit board through hole copper plating device; This device is based on forced convertion electro-coppering principle; Utilize printed circuit board that electroplating bath is isolated into two of high and low liquid levels and electroplate pilot trench; Form high low level plating bath liquid level in the printed circuit board both sides, the pressure differential of utilizing printed circuit board both sides plating bath face difference in height to form realizes plating bath quick exchange in the hole, and keeps the pressure differential of printed circuit board both sides through suction pump.Through adjustment through hole both sides plating bath pressure differential, can make the plating bath through hole of different-diameter of flowing through, thereby realize solution quick exchange in the through hole, particularly micro-through-hole electroplating process mesopore, improve the degree of depth ability of printed circuit board the electroplates in hole copper.
Technical scheme of the present invention is following:
A kind of printed circuit board through hole copper plating device, as shown in Figure 1, comprise power supply 1, cell body 2, anodic phosphorous copper plate 3, division board 6, suction pump 7; Be fixed with the printed circuit board clamping device on the said division board 6; When said printed circuit board through hole copper plating device uses: contain copper plating bath in the cell body 2; Need the copper-plated printed circuit board 8 of via metalization to be held on the division board 6, the two cooperatively interacts cell body 2 is isolated into two plating pilot trench 4 and 5; Two blocks of anodic phosphorous copper plates 3 place two copper plating baths of electroplating pilot trench 4 and 5 respectively; Power supply 1 anode is electrically connected with anodic phosphorous copper plate 3, and power supply 1 negative electrode is electrically connected with the copper-plated printed circuit board 8 of needs via metalization; Suction pump 7 is evacuated to another plating pilot trench with a copper plating bath of electroplating pilot trench, makes two plating bath faces of electroplating pilot trench form the differences in height of a setting, and in printed circuit board through hole copper facing process, keeps the difference in height of setting.
The also configurable liquid level difference measurements of said printed circuit board through hole copper plating device device (various rulers or liquid level meter).Said printed circuit board through hole copper plating device also has control device; Said control device can be regulated the pump-out size according to two measurement results of electroplating the plating bath face difference in height of pilot trench, to keep two plating bath face differences in height of electroplating pilot trench in the error range of set point.
In the said printed circuit board through hole copper plating device, comprise cell body, division board and water pump, and liquid level difference measurements device all need adopt the material of acidproof, anti-copper sulphate corrosion.
Operation principle of the present invention and beneficial effect can be described below:
The present invention is based on forced convertion electro-coppering principle; Utilize printed circuit board that electroplating bath is isolated into two of high and low liquid levels and electroplate pilot trench; Form high low level plating bath liquid level in the printed circuit board both sides; The pressure differential of utilizing printed circuit board both sides plating bath face difference in height to form realizes plating bath quick exchange in printed circuit board through hole 9, and keeps the pressure differential of printed circuit board both sides through suction pump.The electroplate liquid of head tank constantly flows to Lower tank through through hole, uses water pump that the Lower tank electroplate liquid is extracted in the high-order electric bath groove, guarantees that the through hole pressure at both sides is constant in the electroplating process.Through adjustment through hole both sides plating bath pressure differential, can make the plating bath through hole of different-diameter of flowing through, thereby realize solution quick exchange in through hole, particularly the high thickness to diameter ratio micro-through-hole electroplating process mesopore, improve the degree of depth ability of printed circuit board the electroplates in hole copper.
Description of drawings
Fig. 1 is the copper-plated electroplating bath sketch map of through hole of the present invention.
Among the figure: 1 expression power supply; 2 expression cell bodies; 3 expression anodic phosphorous copper plates; The high plating bath face groove of 4 expressions; The low plating bath face groove of 5 expressions; 6 expression division boards; 7 expression suction pumps; 8 expressions need the copper-plated printed circuit board of via metalization; 9 expressions need the through hole on the copper-plated printed circuit board of via metalization.
Embodiment
Use ABS resin to make electroplating bath cell body, two grooves of cell body intermediate fabrication.Cell body is of a size of 20cm * 15cm * 40cm, groove size and division board size match, and wide for 0.8cm, 0.8cm is dark.Stick scale in the groove both sides respectively,, can be easy to read liquid level because ABS is transparent.
Division board uses ABS resin, uses two clamping plates.The first clamping plate thickness is 0.5cm, and the second clamping plate thickness is 0.8cm, and first clamping plate are of a size of 12cm * 16cm, and second clamping plate are 15cm * 45cm.Two clamping plates is reserved printed circuit board in identical zone and is electroplated window, and clamping plate use PVC plastics screw that printed circuit board is interposed in reserved window.Printed circuit board reserved window size is 8cm * 8cm.
Small pump is installed to be extracted into the Lower tank plating bath in the head tank.Adjust the pump-out of water pump according to the level change of plating bath in the electroplating process.
The cell body anode is installed the phosphorus copper plate of 4cm * 30cm, and high-order bath trough and Lower tank respectively use two phosphorus copper plates.
Claims (4)
1. a printed circuit board through hole copper plating device comprises power supply (1), cell body (2), anodic phosphorous copper plate (3), division board (6), suction pump (7); Said division board is fixed with the printed circuit board clamping device on (6); When said printed circuit board through hole copper plating device uses: contain copper plating bath in the cell body (2); Need the copper-plated printed circuit board of via metalization (8) to be held on the division board (6), the two cooperatively interacts cell body (2) is isolated into two plating pilot trench (4 and 5); Two blocks of anodic phosphorous copper plates (3) place two copper plating baths of electroplating pilot trench (4 and 5) respectively; Power supply (1) anode is electrically connected with anodic phosphorous copper plate (3), and power supply (1) negative electrode is electrically connected with the copper-plated printed circuit board of needs via metalization (8); Suction pump (7) is evacuated to another plating pilot trench with a copper plating bath of electroplating pilot trench, makes two plating bath faces of electroplating pilot trench form the differences in height of a setting, and in printed circuit board through hole copper facing process, keeps the difference in height of setting.
2. printed circuit board through hole copper plating device according to claim 1 is characterized in that, said printed circuit board through hole copper plating device also has liquid level difference measurements device.
3. printed circuit board through hole copper plating device according to claim 2 is characterized in that, said liquid level difference measurements device comprises various rulers or liquid level meter.
4. printed circuit board through hole copper plating device according to claim 1; It is characterized in that; Said printed circuit board through hole copper plating device also has control device; Said control device can be regulated the pump-out size according to two measurement results of electroplating the plating bath face difference in height of pilot trench, to keep two plating bath face differences in height of electroplating pilot trench in the error range of set point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103038054A CN102791084A (en) | 2012-08-24 | 2012-08-24 | Printed-circuit board through hole copper plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103038054A CN102791084A (en) | 2012-08-24 | 2012-08-24 | Printed-circuit board through hole copper plating device |
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| CN102791084A true CN102791084A (en) | 2012-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012103038054A Pending CN102791084A (en) | 2012-08-24 | 2012-08-24 | Printed-circuit board through hole copper plating device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104313657A (en) * | 2014-11-10 | 2015-01-28 | 临安振有电子有限公司 | Electro-deposition device of through hole of HDI printed circuit board |
| CN104404589A (en) * | 2014-11-28 | 2015-03-11 | 电子科技大学 | Copper plating device of printed circuit board with through holes and electroplating method of copper plating device |
| CN110493976A (en) * | 2019-08-23 | 2019-11-22 | 生益电子股份有限公司 | A kind of PCB electroplanting device |
| CN111304720A (en) * | 2018-12-12 | 2020-06-19 | 欣兴电子股份有限公司 | Electroplating device and electroplating method |
| CN111910242A (en) * | 2020-07-24 | 2020-11-10 | 广州兴森快捷电路科技有限公司 | Electroplating method and device for printed circuit board |
| CN113502516A (en) * | 2021-08-09 | 2021-10-15 | 博敏电子股份有限公司 | Jet flow method for improving deep plating capability of VCP (vertical continuous plating) electroplating line and improving copper-free property in hole |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60177195A (en) * | 1984-02-22 | 1985-09-11 | Sukeo Kai | Plating method of wiring board having through-hole |
| CN2123537U (en) * | 1992-01-17 | 1992-12-02 | 个旧市矿产加工总厂 | Multiple-hole side-in-and side-out electrolytic deposition cell |
| US20060081478A1 (en) * | 2004-10-19 | 2006-04-20 | Tsuyoshi Sahoda | Plating apparatus and plating method |
| CN102102962A (en) * | 2010-12-28 | 2011-06-22 | 贾书洪 | Energy-saving regulating and control method and device of industrial cooling water towering pump |
-
2012
- 2012-08-24 CN CN2012103038054A patent/CN102791084A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60177195A (en) * | 1984-02-22 | 1985-09-11 | Sukeo Kai | Plating method of wiring board having through-hole |
| CN2123537U (en) * | 1992-01-17 | 1992-12-02 | 个旧市矿产加工总厂 | Multiple-hole side-in-and side-out electrolytic deposition cell |
| US20060081478A1 (en) * | 2004-10-19 | 2006-04-20 | Tsuyoshi Sahoda | Plating apparatus and plating method |
| CN102102962A (en) * | 2010-12-28 | 2011-06-22 | 贾书洪 | Energy-saving regulating and control method and device of industrial cooling water towering pump |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104313657A (en) * | 2014-11-10 | 2015-01-28 | 临安振有电子有限公司 | Electro-deposition device of through hole of HDI printed circuit board |
| CN104404589A (en) * | 2014-11-28 | 2015-03-11 | 电子科技大学 | Copper plating device of printed circuit board with through holes and electroplating method of copper plating device |
| CN104404589B (en) * | 2014-11-28 | 2017-02-22 | 电子科技大学 | Copper plating device of printed circuit board with through holes and electroplating method of copper plating device |
| CN111304720A (en) * | 2018-12-12 | 2020-06-19 | 欣兴电子股份有限公司 | Electroplating device and electroplating method |
| CN111304720B (en) * | 2018-12-12 | 2021-04-16 | 欣兴电子股份有限公司 | Electroplating device and electroplating method |
| CN110493976A (en) * | 2019-08-23 | 2019-11-22 | 生益电子股份有限公司 | A kind of PCB electroplanting device |
| CN110493976B (en) * | 2019-08-23 | 2022-03-15 | 生益电子股份有限公司 | PCB electroplating device |
| CN111910242A (en) * | 2020-07-24 | 2020-11-10 | 广州兴森快捷电路科技有限公司 | Electroplating method and device for printed circuit board |
| CN111910242B (en) * | 2020-07-24 | 2021-12-24 | 广州兴森快捷电路科技有限公司 | Electroplating method and device for printed circuit board |
| CN113502516A (en) * | 2021-08-09 | 2021-10-15 | 博敏电子股份有限公司 | Jet flow method for improving deep plating capability of VCP (vertical continuous plating) electroplating line and improving copper-free property in hole |
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Application publication date: 20121121 |