CN105862112B - For the fixture and electrochemical depositer and electrochemical deposition method of electrochemical deposition - Google Patents
For the fixture and electrochemical depositer and electrochemical deposition method of electrochemical deposition Download PDFInfo
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- CN105862112B CN105862112B CN201510029460.1A CN201510029460A CN105862112B CN 105862112 B CN105862112 B CN 105862112B CN 201510029460 A CN201510029460 A CN 201510029460A CN 105862112 B CN105862112 B CN 105862112B
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Abstract
The present invention relates to the fixture for electrochemical deposition and electrochemical depositers and electrochemical deposition method.The fixture includes the clamping plate (1) for clamping growth substrate, for carrying the tablet (2) to electrode, for disposing the support element of reference electrode (3) and pedestal (4), clamping plate (1) and pedestal (4) are fixed together by pillar (5), by pillar (5), (y) is adjustably mounted between clamping plate (1) and pedestal (4) tablet (2) along a first direction, and clamping plate (1), tablet (2) and pedestal (4) are mutually parallel, the support element (3) is arranged between clamping plate (1) and tablet (2).The electrochemical depositer includes electrolytic cell (6), above-mentioned fixture and electrochemical workstation (7), and the electrolytic cell (6) is for placing the fixture.The uniformity of material prepared by electrochemical depositer using the present invention can be greatly improved.
Description
Technical field
The invention belongs to field of electrochemical deposition, and in particular, to a kind of fixture and electrification for electrochemical deposition
Learn precipitation equipment and electrochemical deposition method.
Background technology
Electrochemical deposition is one of important method for preparing metal and metal oxide nanostructure array.Electro-deposition system
Device includes fixture, constant temperature water bath apparatus, electrochemical workstation, connecting line, other auxiliary devices etc..With three in experiment and production
Electrode or two electrode forms carry out electrodeposited material preparation.
It carries out in large area electrodeposition process, traditional electric deposition device system is deposited technology urgently to be resolved hurrily both ways and asked
Topic.On the one hand, conventional brace upper end is exposed in air (as shown in Figure 1), lower end electrode (working electrode 71, to electrode 72, ginseng
Than electrode 73) electrolyte is immersed, print 10 is put into electrolyte vertically.Due to print 10 vertically place, constant temperature water bath apparatus plus
Hot device is usually located at below water-bath, therefore temperature and the distribution of the gradient of concentration of electrolyte cause the material prepared uneven in the presence of longitudinal direction
Even property.On the other hand, when preparing small area print, the constant temperature water bath apparatus for heating water bath electrolytic cell 6 is usually that glass is burnt
Cup or crystallising dish may determine that reference electrode immerses electrolyte depth from transparent side surfaces.And when carrying out the preparation of large area print,
Usual water bath device is stainless steel, thus from side can not from reference electrode immersion depth.The steaming generated due to water-bath
Vapour block vision is also difficult to judge immersion depth from top.The uncertain accuracy for making deposition process of reference electrode position without
Method ensures.Therefore, it is necessary to new metal and metal oxide electro-deposition method and technology are explored, effectively to solve electro-deposition skill
Critical issue in art practical application.
Invention content
The purpose of the present invention is overcoming the drawbacks described above present in existing electrochemical depositer, a kind of new use is provided
In the fixture and electrochemical depositer and electrochemical deposition method of electrochemical deposition.
The present invention provides a kind of fixture for electrochemical deposition, which includes the folder for clamping growth substrate
Plate, for carry to the tablet of electrode, for disposing the support element of reference electrode and pedestal, clamping plate and pedestal are fixed by pillar
Together, tablet is adjustably mounted between clamping plate and pedestal along a first direction by pillar, and clamping plate, tablet and pedestal
It is mutually parallel, the support element is arranged between clamping plate and tablet.
Preferably, the clamping plate includes cover board and bottom plate, and at least two circle silica gel strips are provided between cover board and bottom plate, and
A circle is provided between two circle silica gel strips for fixing the fixing groove of working electrode.
It is further preferred that be provided with two circle silica gel strips on the cover board, be provided on the bottom plate circle silica gel strip and
One encloses the fixing groove for fixing working electrode.
It is highly preferred that print card slot is provided on the cover board, the fixation for being used to fix working electrode on the bottom plate
Slot is located between the print card slot outer edge on the silica gel strip and the cover board on the bottom plate.
Preferably, the thickness of the bottom plate is not more than 2cm, more preferably no more than 1.5cm, further preferably no more than 3mm.
Preferably, the pillar is provided with nut and sets along a first direction multiple for being inserted into anti-skidding locating rod
Hole, the tablet is by nut and anti-skidding locating rod stabilization on the pillar.
Preferably, the support element includes setting along third direction and the adjustable first support bar in position along the first direction,
And it is optionally adjustably disposed in first support bar along third direction and vertical with the first support bar
The through-hole for being inserted into reference electrode is provided in two supporting rods, the first support bar and the second support bar.
It is highly preferred that the pillar is provided with nut and sets along a first direction multiple for being inserted into anti-skidding locating rod
Hole, the first support bar is by nut and anti-skidding locating rod stabilization on the pillar.
Preferably, the material of the fixture is polyether-ether-ketone, polytetrafluoroethylene (PTFE), polyimides, polyphenylene sulfide or polyethers acyl
Imines.
The present invention also provides a kind of electrochemical depositer, which includes electrolytic cell, above-mentioned folder provided by the invention
Tool and electrochemical workstation, the electrolytic cell is for placing the fixture, and the electrochemical workstation is equipped with working electrode, reference
Electrode and to electrode contact, the working electrode, the reference electrode and described be installed in electrode in the fixture and lead to
Conducting wire is crossed with the connector of electrochemical workstation to be connected.
The present invention also provides the method that electrochemical deposition is carried out using above-mentioned electrochemical depositer, this method includes：
Working electrode, reference electrode will be connected and the fixture of electrode is immersed in the electrolyte of the electrolytic cell, then carry out electricity
Chemical deposition.
In the electrochemical depositer provided by the invention, installment work electrode, reference electrode and the folder to electrode
Tool can carry out electrochemical deposition in a manner of being totally submerged in electrolyte, so as to accurately control reference electrode and electrolyte
Contact area, ensure apply current potential accuracy；Moreover, the fixture can be horizontal, vertical or be placed at other angles
In electrolyte, avoid when preparing large area material, discontinuity of materials caused by temperature gradient and electrolyte concentration gradient；
In addition, it is adjustable to the position of electrode and reference electrode, so as to enhance the flexibility of electrochemical depositer.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Description of the drawings
Fig. 1 is the structure diagram of traditional electrochemical depositer；
Fig. 2 is the structure diagram of fixture provided by the invention；
Fig. 3 is the structure diagram of the cover board in the clamping plate of fixture provided by the invention；
Fig. 4 is the structure diagram of the bottom plate in the clamping plate of fixture provided by the invention；
Fig. 5 is the structure diagram of electrochemical depositer provided by the invention；
Fig. 6 is the photo of nano structure of zinc oxide material prepared by embodiment；
Fig. 7 is the luminescence generated by light collection of illustrative plates of nano structure of zinc oxide material prepared by embodiment；
Fig. 8 is the optical quality uniformity test figure of nano structure of zinc oxide material prepared by embodiment.
Specific embodiment
The specific embodiment of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific embodiment stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
The present invention provides a kind of fixture for electrochemical deposition, as shown in Fig. 2, the fixture includes clamping growth
The clamping plate 1 of substrate, for carrying to the tablet 2 of electrode, for disposing the support element 3 of reference electrode and pedestal 4, clamping plate 1 and bottom
Seat 4 is fixed together by pillar 5, and by pillar 5, y is adjustably mounted at clamping plate 1 and pedestal 4 to tablet 2 along a first direction
Between, and clamping plate 1, tablet 2 and pedestal 4 are mutually parallel, the support element 3 is arranged between clamping plate 1 and tablet 2.
It, can be with y along a first direction to the position of the tablet 2 of electrode for carrying in the fixture provided by the invention
It adjusts, so as to adjust to the distance between electrode and growth substrate.Moreover, clamping plate 1, tablet 2 and pedestal 4 are mutually parallel,
The placed angle of growth substrate is controlled by adjusting the placed angle of fixture so that growth substrate can with it is horizontal, vertically with
And other angles are placed in the electrolytic solution.
In the fixture provided by the invention, it is preferably double-layer structure for clamping the clamping plate 1 of growth substrate, that is, includes
Cover board 11 and bottom plate 12, growth substrate are clamped between cover board 11 and bottom plate 12.In a preferred embodiment, described
Print card slot 15 (as shown in Figure 3) is set on cover board 11 or bottom plate 12, and growth substrate is embedded into the print card slot 15.
Under normal conditions, working electrode is contacted with growth substrate.In the fixture provided by the invention, working electrode is excellent
Choosing is mounted between cover board 11 and bottom plate 12.It is further preferred that electrolyte connects with connecting the conducting wire of working electrode in order to prevent
It touches, at least two circle silica gel strips 13 is set between cover board 11 and bottom plate 12, and are provided with a circle between two circle silica gel strips 13
For fixing the fixing groove 14 of working electrode, in this way by the installment work electrode in fixing groove 14, can realize makes work electric
Pole contacts next conductive with four Monday of growth substrate circle.It is further preferred that it as shown in Figures 3 and 4, is provided on the cover board 11
Two enclose silica gel strips 13, and a circle silica gel strip 13 and a circle are provided on the bottom plate 12 for fixing the fixing groove 14 of working electrode,
And the setting face of the silica gel strip on cover board 11 and the setting face of the silica gel strip on bottom plate 12 and fixing groove 14 be it is opposed facing,
That is, when cover board 11 and bottom plate 12 are combined, the setting face of the silica gel strip on cover board 11 and the silica gel strip on bottom plate 12 and
The setting face of fixing groove contacts with each other.
Most preferably, as shown in figure 3, print card slot 15 is set on the cover board 11, when cover board 11 and bottom plate 12 close
When together, the fixing groove 14 for being used to fix working electrode on the bottom plate 12 is located at silica gel strip 13 and institute on the bottom plate 12
It states between 15 outer edge of print card slot on cover board 11.
In the fixture provided by the invention, the middle part of the bottom plate 12 is provided with opening so that 11 He of cover board
After the bottom plate 12 clamps the growth substrate wherein, the surface opposite with to electrode can be used for sinking in growth substrate
Product substance.It can set or be not provided with to be open in the cover board 11, be more advantageous to observing if setting and being open.Also, work as institute
It states when opening is not provided in cover board 11, the inner ring of the cover board 11 can not have to setting silica gel strip；It is set when in the cover board 11
During opening, the inner ring of the cover board 11 needs to set silica gel strip, to prevent contact of the liquid from the cover board 11 with growth substrate
Face is penetrated into.
In the fixture provided by the invention, in order to avoid large quantity of air stays in during electrochemical deposition is carried out
The surface of growth substrate, the thickness of the bottom plate 12 are preferably no greater than 2cm, more preferably no more than 1.5cm, most preferably no greater than
3mm.When setting sample card slot on the bottom plate 12, and when growth substrate is in the sample card slot, the thickness of the bottom plate 12
Degree refers to the base plate thickness at the sample card slot.
In the fixture provided by the invention, to allow the tablet 2 between clamping plate 1 and pedestal 4 along first
Direction y adjusting positions, the set-up mode that this field routine may be used are realized.In one embodiment, as shown in Fig. 2,
Nut 51 and along a first direction multiple holes for being used to be inserted into anti-skidding locating rod 52 of y arrangements on pillar 5 are set, can be led in this way
It crosses nut 51 and anti-skidding locating rod 52 to stablize tablet 2 on the pillar 5, and anti-skidding by the adjustment of y along a first direction
The position of locating rod 52 and nut 51 can realize the distance of adjustment tablet 2 and clamping plate 1.
In the fixture provided by the invention, the support element 3 for disposing reference electrode is preferably arranged such that reference
The installation position of electrode be it is adjustable, can y, second direction x and third direction z be adjustable along a first direction.A kind of excellent
It selects in embodiment, the tectonic sieving of the support element 3 is：Including along third direction z settings and its position y along the first direction
Adjustable first support bar 31 and be optionally adjustably disposed in first support bar 31 along third direction z and
The second support bar 32 vertical with the first support bar 31 is set in the first support bar 31 and the second support bar 32
It is useful for being inserted into the through-hole of reference electrode.According to above-mentioned preferred implementation, reference electrode y, second along a first direction can be realized
Direction x and third direction z adjustment position.In one embodiment, by second support bar 32 along third direction z adjustably
The mode being arranged in first support bar 31 can be：Second support bar 32 is inserted into the first support bar 31 along third
On the arbitrary through-hole of direction z arrangements, second support bar 32 can be realized by adjusting the insertion position of second support bar 32 in this way
Position is adjusted along third direction z.
It is further preferred that by setting nut 51 on pillar 5 and being used to insert with the multiple of the arrangements of y along a first direction
Enter the hole of anti-skidding locating rod 52, can be stablized the support element 3 in the branch by nut 51 and anti-skidding locating rod 52 in this way
On column 5, particularly the first support bar 31 is stablized on the pillar 5, and anti-skidding by the adjustment of y along a first direction
The position of locating rod 52 and nut 51 can realize the position for adjusting the support element 3 in a first direction on y.
In the present invention, the material of the fixture can be physico with insulation, high temperature resistant, chemical resistance corrosion etc.
Learn the high molecular material of performance.In the preferred case, the material of the fixture may be selected from but be not limited to polyether-ether-ketone, polytetrafluoroethyl-ne
Alkene, polyimides, polyphenylene sulfide and polyetherimide.The material of the fixture refers to the material of the material of main part of fixture, mainly
Refer to the material of clamping plate 1, tablet 2, support element 3, pedestal 4 and pillar 5.
In the present invention, waterproof gasket is preferably configured in nut and screw for being used in the fixture etc..
The present invention also provides a kind of electrochemical depositer, as shown in figure 5, the device includes electrolytic cell 6, the present invention carries
The above-mentioned fixture and electrochemical workstation 7 supplied, the electrolytic cell 6 for placing the fixture, be furnished with by the electrochemical workstation 7
Working electrode 71, reference electrode 72 and the connector to electrode 73.When implementing electrochemical deposition, by the working electrode 71, institute
It states reference electrode 72 and described the corresponding position of the fixture is installed in electrode 73 and passes through conducting wire and electrochemical workstation
Connector be connected, specifically, make working electrode 71 be mounted between cover board 11 and bottom plate 12, be preferably mounted at consolidating on bottom plate 12
Determine on slot 14；Reference electrode 72 is made to be mounted on support element 3；Make to electrode 73 mounted on the upper surface of tablet 2.
In one embodiment, when chemical deposition process needs heating, the electrochemical depositer preferably also wraps
Heating unit 8 (such as constant temperature water bath apparatus) is included, for being heated to the electrolyte in electrolytic cell 6.
The present invention also provides the method that electrochemical deposition is carried out using electrochemical depositer of the present invention, the party
Method includes：Working electrode (WE), reference electrode (RE) will be connected and the electrolytic cell is immersed in the fixture of electrode (CE)
In electrolyte, electrochemical deposition is then carried out.When necessary, it is right using heating unit 8 (such as water bath with thermostatic control heating unit)
Electrolyte is heated.
Specifically, the operating process of electrochemical deposition is carried out using electrochemical depositer of the present invention to be included
Following steps：
(1) fixture provided by the invention is assembled, and installs working electrode, reference electrode and to electrode；
(2) electrolytic cell for filling electrolyte is put into water bath with thermostatic control heating unit and is heated to suitable temperature；
(3) growth substrate is mounted in the clamping plate of fixture, and is come into full contact with working electrode；
(4) working electrode, reference electrode will be installed and the fixture of electrode is put into electrolyte and preheated；
(5) by the conducting wire of three electrodes of the connection of extraction (i.e. working electrode, to electrode and reference electrode) respectively with electrification
It learns the working electrode of work station, be connected to electrode with reference electrode connector；
(6) suitable sedimentation potential and sedimentation time are set, come into effect electrochemical deposition；
(7) after electrochemical deposition is implemented, fixture is taken out, is rinsed well with deionized water, taking out deposition has target production
The growth substrate of product is rinsed well with deionized water and is dried up with nitrogen.
Compared with prior art, the advantage of the invention is that：
(a) when preparing large area material, the contact area of reference electrode and electrolyte can be accurately controlled, ensures experiment
The middle accuracy for applying current potential；
(b) growth substrate with horizontal, vertical or other angles can be placed in electrochemical deposition process, avoids and preparing
During large area material, discontinuity of materials caused by temperature gradient and electrolyte concentration gradient；
(c) it is adjustable to the distance of electrode and growth substrate；
(d) reference electrode position is adjustable in three dimensions, greatly enhances the flexibility of novel electric deposition device system；
(e) electrode with growth substrate surrounding is contacted, ensure that the uniformity of electric field in electrodeposition process.
Therefore, it is provided by the present invention can immersion electrochemical depositer can improve metal and metal oxide nano
The uniformity of structural material, and with great flexibility.
It is described further by the following examples with the comparative example present invention.
The electrolyte used in following embodiment and comparative example is：The aqueous solution of zinc nitrate and ammonium nitrate, and zinc nitrate
A concentration of 5mmol/L, a concentration of 6mmol/L of ammonium nitrate.
The growth substrate used in following embodiment and comparative example is the stannic oxide substrate (FTO substrates) of fluorine doped, is purchased from
MB Group Plc, model A8.
Embodiment
Using fixture shown in Fig. 2, make to be clamped in the growth substrate level in fixture and be put into electrolyte and carry out electrochemistry
Deposition, the condition of electrochemical deposition are：Current potential is -1.41V, and time 1800s, temperature is 76 DEG C, obtains zinc-oxide nano knot
Structure materials A 1.The photo of the material as shown in fig. 6, its luminescence generated by light collection of illustrative plates as shown in fig. 7, its optical quality uniformity test figure
As shown in Figure 8.
Comparative example
Electrochemical deposition is carried out using Conventional electrochemical precipitation equipment shown in FIG. 1, the condition of electrochemical deposition is with more than
Embodiment obtains nano structure of zinc oxide material D1.
Pass through the optical property of the nano structure of zinc oxide material prepared by luminescence generated by light test evaluation.Luminescence generated by light is tested
Excitation light source used uses He-Cd laser of the wavelength for 325nm, and test environment is room temperature.As shown in fig. 7, by calculating sample
The ratio of nearly band-edge emission intensity of the piece near 380nm and visual field defect state emissive porwer determines prepared nanostructured material
The optical quality of material.Luminescence generated by light collection of illustrative plates in test sample as shown in Figure 8 at 9 different locations obtains corresponding nearly band edge
Emissive porwer and 1-X9 of defect state emissive porwer ratio X.The optical quality inhomogeneities of print is defined as follows：
Optical quality inhomogeneities=(Xmax-Xmin)/2X
Wherein Xmax is the maximum value in 9 test points, and Xmin is minimum value in 9 test points, and X is 9 numbers of test points
The arithmetic mean of instantaneous value of value.
According to above-mentioned test and result of calculation, the nano structure of zinc oxide material prepared using Conventional electrochemical precipitation equipment
Optical quality inhomogeneities for 55.7%, and the nano structure of zinc oxide material that the electrochemical depositer of the present invention is used to prepare
The optical quality inhomogeneities of material reduces 57.8%, reaches 23.5%.As it can be seen that electrochemical depositer system using the present invention
The uniformity of standby material is greatly improved.In addition, staying in surface without a large amount of bubbles in deposition process, further ensure
The uniformity of material prepared.
The preferred embodiment of the present invention is described in detail above in association with attached drawing, still, the present invention is not limited to above-mentioned realities
The detail in mode is applied, within the scope of the technical concept of the present invention, a variety of letters can be carried out to technical scheme of the present invention
Monotropic type, these simple variants all belong to the scope of protection of the present invention.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should also be regarded as the disclosure of the present invention.
Claims (11)
1. a kind of fixture for electrochemical deposition, which is characterized in that the fixture includes the clamping plate for clamping growth substrate
(1), for carrying to the tablet (2) of electrode, for disposing the support element of reference electrode (3) and pedestal (4), clamping plate (1) and bottom
Seat (4) is fixed together by pillar (5), and by pillar (5), (y) is adjustably mounted at folder to tablet (2) along a first direction
Between plate (1) and pedestal (4), and clamping plate (1), tablet (2) and pedestal (4) are mutually parallel, and the support element (3) is arranged on clamping plate
(1) between tablet (2)；
Wherein, the clamping plate (1) includes cover board (11) and bottom plate (12), and at least two are provided between cover board (11) and bottom plate (12)
Silica gel strip is enclosed, and a circle is provided with for fixing the fixing groove of working electrode between two circle silica gel strips；
The material of the fixture is polyether-ether-ketone, polytetrafluoroethylene (PTFE), polyimides, polyphenylene sulfide or polyetherimide.
2. fixture according to claim 1, wherein, two circle silica gel strips (13), the bottom are provided on the cover board (11)
A circle silica gel strip (13) and a circle are provided on plate (12) for fixing the fixing groove (14) of working electrode.
3. fixture according to claim 2, wherein, it is provided with print card slot (15), the bottom plate on the cover board (11)
(12) silica gel strip (13) and the cover board of the fixing groove (14) for being used to fix working electrode on the bottom plate (12) on
(11) between print card slot (15) outer edge on.
4. fixture according to claim 1, wherein, the thickness of the bottom plate (12) is not more than 2cm.
5. fixture according to claim 4, wherein, the thickness of the bottom plate (12) is not more than 1.5cm.
6. fixture according to claim 5, wherein, the thickness of the bottom plate (12) is not more than 3mm.
7. fixture according to claim 1, wherein, the pillar (5) is provided with nut (51) and along a first direction (y)
Multiple holes for being used to be inserted into anti-skidding locating rod (52) of setting, the tablet (2) pass through nut (51) and anti-skidding locating rod (52)
Stablize on the pillar (5).
8. fixture according to claim 1, wherein, the support element (3) along third direction (z) including setting and along second
The adjustable first support bar in direction (y) position (31) and optionally first is adjustably disposed in along third direction (z)
On strut (31) and the second support bar (32) vertical with the first support bar (31), the first support bar (31) and institute
State the through-hole being provided in second support bar (32) for being inserted into reference electrode.
9. fixture according to claim 8, wherein, the pillar (5) is provided with nut (51) and along a first direction (y)
Multiple holes for being used to be inserted into anti-skidding locating rod (52) of setting, the first support bar (31) pass through nut (51) and anti-skidding positioning
Bar (52) is stablized on the pillar (5).
10. a kind of electrochemical depositer, which includes the fixture described in any one in electrolytic cell (6), claim 1-9
With electrochemical workstation (7), the electrolytic cell (6) is for placing the fixture, and the electrochemical workstation (7) is equipped with work electricity
Pole (71), reference electrode (72) and to electrode (73) connector, the working electrode, the reference electrode and described pacify electrode
In the fixture and pass through conducting wire and be connected with the connector of electrochemical workstation.
11. carrying out the method for electrochemical deposition using electrochemical depositer according to any one of claims 10, this method includes：It will be even
It connects working electrode, reference electrode and the fixture of electrode is immersed in the electrolyte of the electrolytic cell, then carry out electrochemistry
Deposition.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410837107 | 2014-12-29 | ||
| CN2014108371071 | 2014-12-29 |
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| CN105862112A CN105862112A (en) | 2016-08-17 |
| CN105862112B true CN105862112B (en) | 2018-06-15 |
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| CN201510029460.1A Active CN105862112B (en) | 2014-12-29 | 2015-01-21 | For the fixture and electrochemical depositer and electrochemical deposition method of electrochemical deposition |
| CN201520042082.6U Active CN204570074U (en) | 2014-12-29 | 2015-01-21 | For fixture and the electrochemical depositer of electrochemical deposition |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520042082.6U Active CN204570074U (en) | 2014-12-29 | 2015-01-21 | For fixture and the electrochemical depositer of electrochemical deposition |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105862112B (en) * | 2014-12-29 | 2018-06-15 | 神华（北京）光伏科技研发有限公司 | For the fixture and electrochemical depositer and electrochemical deposition method of electrochemical deposition |
| CN106637318A (en) * | 2015-10-29 | 2017-05-10 | 神华集团有限责任公司 | A nanostructured array and a preparing method thereof |
| CN105463563B (en) * | 2015-11-20 | 2017-07-04 | 苏州光韵达光电科技有限公司 | A kind of laser template polishing clamp |
| CN106681078A (en) * | 2016-12-21 | 2017-05-17 | 北京工业大学 | Large-area, uniform and fast-responding WO3 electrochromic device and preparation method thereof |
| CN106939911A (en) * | 2017-04-26 | 2017-07-11 | 国家海洋局第三海洋研究所 | A kind of fixed mechanism and its attachment device of fouling organism lamina affixad |
| CN108842177B (en) * | 2018-07-10 | 2023-12-26 | 深圳拓扑精膜科技有限公司 | Electrochemical deposition bracket for preparing nano material |
| CN109239168B (en) * | 2018-09-12 | 2020-06-16 | 太原科技大学 | Electrochemical deposition device |
| CN112981506A (en) * | 2021-02-09 | 2021-06-18 | 苏州晶洲装备科技有限公司 | Electrochemical deposition equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105862112A (en) | 2016-08-17 |
| CN204570074U (en) | 2015-08-19 |
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