JP2005008962A - Apparatus and process for plating - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating apparatus for easily plating many articles to be plated and obtaining a plated product of high quality, and to provide a plating method for facilitating a transfer of the article between steps even when the plating process has a plurality of steps such as dehydrogenation treatment, and reducing a labor for a rackwork and the number of the steps to reduce a manufacturing cost. <P>SOLUTION: The plating apparatus 1 has the article to be plated 2 connected to a cathode 3 and an anode 4, placed in a plating tank 11 filled with a plating liquid 12, and passes an electric current between both electrodes 3 and 4 to plate the article. The cathode 3 is made of a plurality of electroconductive porous mesh plates 31 which are approximately horizontally and releasably placed in the plating tank 11, and loosely hold many articles 2 to be plated inside openings 32 and make an outer circumferential flange 22 abut to the verge of the openings, when the articles are plated. After the articles have been plated, many plated articles 2 can be heat-treated in the state of being held in the electroconductive porous plates 31, so that the labor for the rackwork is eliminated and the plating process is simplified. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a plating apparatus and a plating method suitable for plating a large amount of small parts such as automobile parts.
[0002]
[Prior art]
Products used in harsh environments, such as automotive parts, are usually products that have been subjected to post-treatment such as chromate treatment after electroplating such as galvanization to form a plating film in order to improve corrosion resistance. It is said. In general, electroplating is performed by immersing an object to be plated and an electrode plate in a plating solution in which a metal for plating is dissolved, and passing an electric current between the electrode plate and the object to be plated as a cathode side. . The object to be plated is usually supported by a jig connected to the cathode. A general method of galvanizing is described in, for example, Patent Document 1.
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 2001-131864
On the other hand, in order to obtain a plated product efficiently at a low cost by plating a large amount of small parts such as automobile parts, it is proposed to use a large jig capable of holding a large number of objects to be plated. . As such a jig, a frame-shaped jig 101 having a large number of branch-like holding portions 102 as shown in FIG. 7 is conventionally used.
Then, for example, a cylindrical object to be plated (not shown) is extrapolated to each of the many branch-like holding parts 102, and then the entire jig is suspended in a plating tank (not shown). Then, the plating treatment is performed by immersing in a plating solution filled in the plating tank. Here, the jig 101 is in a state in which the metal is exposed only at the tip of the holding portion 102 that contacts the object to be plated, and the other portions are covered with an insulating material so that the jig cannot be plated. I am doing so.
[0005]
[Problems to be solved by the invention]
Here, when the object to be plated is a special steel material, it is necessary to add a dehydrogenation process between the plating process and the chromate process. However, the dehydrogenation treatment is usually performed at a high temperature of about 200 ° C. Generally, since the conventional jig 101 is not suitable for this treatment, the object to be plated is removed from the jig 101 each time. Had gone. This is because the insulating member of the conventional jig 101 does not have high-temperature durability, and it is necessary to manually remove and remove a large number of objects to be plated for each processing step, resulting in high costs. There was an easy problem. In addition, since the jig is large, even if the heat resistance is ensured, the apparatus is enlarged to process the jig together, and it takes a lot of labor to move between the jig and the process. There was a bug.
[0006]
Therefore, an object of the present invention is to realize a plating apparatus that can easily plate a large number of objects to be plated and obtain a high-quality plated product, and has a plurality of steps such as dehydrogenation. Another object of the present invention is to provide a plating method that is easy to move between processes, can reduce the labor and man-hours of the work, and can greatly reduce the production cost.
[0007]
[Means for Solving the Problems]
In the plating apparatus according to claim 1 of the present invention, an object to be plated and an anode electrode connected to a cathode electrode are disposed in a plating tank filled with a plating solution, and a plating process is performed by energizing both electrodes. It is like that. The cathode electrode is made of a conductive porous plate that is disposed substantially horizontally and detachably in the plating tank, and holds or loosely holds an object to be plated in the hole of the conductive porous plate. The plating process is performed in a state in which the opening edge portion is in contact with the outer peripheral portion of the object to be plated.
[0008]
According to the said structure, since the cathode electrode was made into the electroconductive porous plate provided so that attachment or detachment with respect to the plating tank was carried out, a cathode electrode and a to-be-plated object can be moved integrally. In addition, since the object to be plated is fitted in the hole of the conductive porous plate, the setting work is simplified. Since the conductive porous plate is not covered with an insulating material as in the conventional jig of FIG. 7, it can be used as it is for a processing step requiring heat treatment. Time and effort can be omitted. Therefore, the workability is improved, the movement between processes is easy, and the plating process can be simplified.
[0009]
In the plating apparatus according to claim 2 of the present invention, the object to be plated has a flange portion or a plurality of projecting portions on the outer periphery, and the hole of the conductive porous plate has the flange portion or the plurality on the opening edge. The protruding portion is shaped so as to be able to contact and support.
[0010]
When holding the object to be plated in the holes of the conductive porous plate, if the object to be plated has, for example, a shape having a flange portion or a plurality of protrusions on the outer periphery, these flange portions are formed at the opening edge of the hole. Or it can support reliably by making a some protrusion-shaped part contact | abut. Moreover, since it is not necessary to adhere a to-be-plated object to the opening edge of a hole, the appearance of a to-be-plated object becomes favorable and quality improves.
[0011]
In the plating apparatus according to claim 3 of the present invention, the conductive porous plate has a mesh plate shape.
[0012]
When a net-like conductive perforated plate is used, the contact area with the object to be plated can be reduced, so that the influence on the plating quality is small, and there is elasticity, and the contact with the object to be plated is easy. Moreover, since it is easy to manufacture and inexpensive, and has a large number of holes, the object to be plated can be easily held. Furthermore, since it is comprised with a wire, it is hard to adhere plating and the removal of the attached plating is also easy.
[0013]
In the plating apparatus according to claim 4 of the present invention, the wire material forming the mesh of the conductive porous plate is formed in a wavy shape.
[0014]
When the conductive porous plate is made of wavy lines, it is easy to come into contact with the object to be plated, and since the contact becomes point contact, no contact mark remains and a higher quality plating film can be obtained.
[0015]
In the plating apparatus according to claim 5 of the present invention, the cathode electrode is disposed so as to be slightly inclined with respect to the plating solution surface.
[0016]
If it does in this way, a plating solution will distribute | circulate easily and it will be easy to form a uniform plating film.
[0017]
In the plating apparatus according to claim 6 of the present invention, the electrode surface of the anode electrode is disposed so as to be substantially perpendicular to the plate surface of the conductive porous plate to be the cathode electrode.
[0018]
By disposing the anode electrode and the cathode electrode so as not to face each other so as to face each other, it is possible to suppress plating from adhering to the conductive porous plate and to protrude from the conductive porous plate to face the anode electrode. The effect of promoting the formation of a plating film on the object to be plated can be obtained.
[0019]
In the plating apparatus according to the seventh aspect of the present invention, a plurality of conductive porous plates to be the cathode electrodes are provided and stacked in the plating tank.
[0020]
Since the conductive porous plate is disposed substantially horizontally, it is possible to hold a larger number of objects to be plated by stacking in the vertical direction. Thereby, since a large number of objects to be plated can be plated at the same time, productivity is improved and cost reduction is effective.
[0021]
In the plating apparatus according to claim 8 of the present invention, an auxiliary electrode connected to the anode electrode is disposed between the plurality of stacked cathode electrodes.
[0022]
If it does in this way, the variation in the current density by the site | part in a plating tank will be made small, and the effect of forming a uniform plating film in many to-be-plated objects will be acquired.
[0023]
A plating apparatus according to a ninth aspect of the present invention shows another configuration for solving the above-described problem. In a plating tank filled with a plating solution, an object to be plated and an anode electrode connected to a cathode electrode, In the plating apparatus that performs plating by energizing between both electrodes, the cathode electrode is a conductive porous plate disposed substantially horizontally and detachably in the plating tank, and the conductive porous plate It is assumed that the plating process is performed in a state where the object to be plated is suspended and supported by a support tool protruding downward.
[0024]
Instead of adopting a configuration in which the object to be plated is held in the hole of the conductive porous plate, a support tool protruding downward can be provided on the conductive porous plate to support the object to be plated. When the object to be plated is a large heavy object, the object to be plated cannot be held in the hole, but the same effect can be obtained by providing a support for supporting the object to be suspended. In addition, since the conductive porous plate is arranged substantially horizontally, a plurality of heavy objects can be stably suspended and supported, and the movement is easy.
[0025]
Claim 10 is an invention of a plating method, in which an object to be plated connected to a cathode electrode and an anode electrode are placed in a plating tank filled with a plating solution, and a plating process is performed by energizing both electrodes. In the plating method for heat treatment, a conductive porous plate is disposed substantially horizontally and detachably in the plating tank as a cathode electrode, and an object to be plated is fitted or held loosely in the hole of the conductive porous plate. In addition, the plating process is performed in a state where the opening edge of the hole is in contact with the outer periphery of the object to be plated. Next, the conductive porous plate holding the object to be plated is removed from the plating tank, and the object to be plated is subjected to heat treatment while being held by the conductive porous plate.
[0026]
By using a detachable conductive porous plate serving as a cathode electrode, the conductive porous plate and the object to be plated can be used together in the next heat treatment step after plating. Further, since it is not necessary to remove the object to be plated between the processes and the movement is easy, the plating process can be simplified and the cost can be reduced.
[0027]
In the plating method according to the eleventh aspect, after the heat treatment, the object to be plated is post-treated while being held by the conductive porous plate.
[0028]
After the heat treatment step, the conductive porous plate can be subjected to a post-treatment step in the next step together with the object to be plated. In this way, by performing a plurality of treatments on the object to be plated while being held on the conductive porous plate, the plating process can be simplified and the cost can be reduced.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1B is a schematic configuration diagram of the plating apparatus 1 of the present invention, and is suitable for mass plating of small parts such as automobile parts, for example. Fig.1 (a) is a figure which shows an example of the line plating process including the galvanization process process using the plating apparatus 1 of this invention. In FIG. 1B, the plating apparatus 1 arranges an object to be plated 2 connected to the cathode electrode 3 and the anode electrode 4 in a plating tank 11 filled with a plating solution 12, and performs a plating process. It is like that. In the present embodiment, the cathode electrode 3 is composed of a plurality of conductive porous plates 31 that are disposed substantially horizontally and detachably in the plating tank 11, and a large number of holes are formed in the many holes of the conductive porous plate 31. The object to be plated 2 is loosely held.
[0030]
The plurality of conductive perforated plates 31 are stacked and spaced apart in the vertical direction, and a plurality of anode electrodes 4 are erected on the left and right sides thereof with spacing. As described above, when the angle formed between the electrode surfaces of the cathode electrode 3 and the anode electrode 4 is substantially vertical, the formation of a plating film on the surface of the workpiece 2 protruding above and below the cathode electrode 3 is promoted. On the other hand, it is possible to prevent the plating from adhering to the constituent material of the cathode electrode 3 as much as possible. Further, the anode electrode 4 can be disposed uniformly on both side portions (left and right or front and rear) of the plurality of laminated conductive porous plates 31 so that the plating process can be performed uniformly.
[0031]
As the conductive porous plate 31 to be the cathode electrode 3, for example, as shown in FIG. The conductive porous plate 31 is formed of a wire rod stretched in a lattice shape in a rectangular frame, and has a large number of rectangular openings 32.
The wire constituting the conductive porous plate 31 is preferably made of a material that is electrically conductive and has low electrical resistance, is excellent in high temperature resistance, acid resistance, and alkali resistance and can withstand repeated use. The wire may be linear, but preferably it is wavy as shown. Thus, if the wire is made non-linear, contact with the object to be plated 2 held in the opening 32 can be point contact, and jig traces that impair the appearance can be minimized. Such a net-plate-like conductive perforated plate 31 is easy to mold and can be manufactured at a low cost. Further, since it is made of a thin wire, there is an advantage that plating is difficult to adhere and less waste.
[0032]
The object to be plated 2 held by the conductive porous plate 31 is made of, for example, an iron-based material such as special steel, and is subjected to plating treatment such as galvanization for the purpose of rust prevention treatment. Of course, it is possible to use a plating object 2 made of other steel, stainless steel, or a composite material and perform plating treatment other than galvanization. Although the shape of the to-be-plated thing 2 is not specifically limited, If it has a flange part or several protrusion part on the outer periphery, these will be on the wire which comprises the opening edge of many opening 32 of the electroconductive porous board 31. Can be abutted and supported.
For example, as shown in FIG. 2A, the object to be plated 2 of the present embodiment has a shape having a flange portion 22 on the entire outer periphery of the intermediate portion of the cylindrical main body portion 21, and the cylindrical main body portion 21 is electrically conductive. It is loosely fitted in the opening 32 of the porous porous plate 31, and the flange portion 22 is supported by being placed on the opening edge portion of the opening 32 (FIGS. 2B, 2C, and 2D). In this configuration, since the flange portion 22 is held on the opening edge portion and electrical contact is ensured, the cylindrical main body portion 21 does not need to be fitted into the opening 32, and the outside of the cylindrical main body portion 21 is not necessary. By setting the diameter to be loosely fitted into the opening 32, jig traces can be reduced and the appearance can be improved.
[0033]
Here, the flange portion does not need to be formed on the entire circumference, and may have a shape having a plurality of protruding portions that protrude radially outward from a plurality of locations on the outer periphery. Alternatively, the object to be plated 2 may be a stepped shape having a large and small two-step diameter, or may be a tapered shape that gradually increases in diameter, and is supported on or within the opening edge of the conductive porous plate 31. Any shape can be used. Further, as long as it can be fitted and held in the opening 32, it may be a cylindrical body or a columnar body having a constant outer diameter without having a protruding portion on the outer periphery.
[0034]
When performing plating using the plating apparatus 1, first, as shown in FIG. 3, a large number of objects to be processed 2 are opened with gaps such that adjacent objects 2 do not come into contact with each other. The porous porous plate 31 is fitted and held in the openings 32. The required number of conductive porous plates 31 thus prepared (the number of sheets processed at once by the plating apparatus 1) is prepared and arranged at intervals in the vertical direction. At this time, as shown in FIGS. 4 and 5, when the periphery of each conductive porous plate 31 is held by a frame-like holding member 5 and a fixing stand 6 that connects the holding members 5 to each other is used, a large number of The conductive porous plate 31 can be easily installed.
[0035]
4 and 5, each holding member 5 has a U-shaped frame shape and holds three sides of the peripheral portion of the conductive porous plate 31. On the inner side surface of the holding member 5, a groove for holding the peripheral edge of the conductive porous plate 31 is formed, and the conductive porous plate 31 is detachable by sliding the conductive porous plate 31 to the U-shaped opening side. Here, each holding member 5 is fixed at both sides of the U-shape by the fixing stand 6 in a state slightly inclined from the horizontal direction so that the U-shaped opening side faces upward. Thus, if it arrange | positions so that it may incline a little with respect to a liquid level, the flow of the plating solution 12 on the electroconductive porous plate 31 will become easy to be obtained. Although the inclination angle is not particularly limited, the angle formed between the liquid surface and the conductive porous plate 31 is usually 45 ° or less, preferably in the range of about 5 ° to 30 °.
[0036]
Further, it is more preferable that auxiliary electrodes 41 connected to the anode electrode 4 are disposed between the layers of the laminated conductive porous plates 31. As these auxiliary poles 41, for example, as shown in FIG. 4, a net-like one in which conductive wires are stretched in parallel in a rectangular frame is used, and a plurality of rod-like support portions 42 fixed to the fixed stand 6 are used. Supported by These auxiliary electrodes 41 are preferably sized to cover the entire object to be plated held by the conductive porous plate 31 and are inclined with respect to the liquid surface so as to be substantially parallel to the conductive porous plate 31. The shape of the auxiliary electrode 41 is not particularly limited, and may of course be a lattice network like the conductive porous plate 31. By disposing these auxiliary electrodes 41 between the layers of the conductive porous plate 31, it is possible to eliminate variations in plating due to the arrangement and location of the object to be plated 2 and to make the thickness of the plating film more uniform.
[0037]
Thus, in the plating apparatus 1 of the present embodiment, the conductive porous plate 31 is used as the cathode electrode 3 and the object to be plated 2 is held in the large number of openings 32. The object to be plated 2 can be easily set, and the electrical connection with the cathode electrode 3 can be made easily and reliably. It is easy to move and remove while it is set.
In particular, when the conductive porous plate 31 is a mesh plate using a wavy wire rod, the contact is a point contact, so the appearance is good. Further, since the anode electrode 4 is disposed so as to be substantially perpendicular to the plate surface of the cathode electrode 3, it is difficult for the plating to adhere to the conductive porous plate 31, and the loss of the plating solution can be reduced, and the attached plating can be removed. Easy. Furthermore, by arranging the cathode electrode 3 slightly inclined from the horizontal and using the auxiliary electrode 41, a more uniform plating film can be obtained.
[0038]
Further, by using a plurality of detachable conductive porous plates 31, the number of conductive porous plates 31 can be adjusted according to the number of treatments of the object to be plated 2, the size of the plating tank 11, etc. It can be done efficiently. For example, as shown in FIG. 5, if a plurality of U-shaped holding members 5 fixed to the fixed stand 6 are used, a large number of conductive porous plates 31 can be stacked in a small space. The product 2 can be processed, and the productivity is greatly improved. For example, in the case of FIGS. 3 to 5, 600 conductive objects 2 can be processed at a time by laminating 10 conductive porous plates 31 each having 60 objects to be plated 2 fitted and held. In addition, a significant cost reduction can be expected as compared with the number (usually about 200) that can be processed by the above-described conventional plating apparatus (same capacity).
[0039]
Furthermore, since the entire conductive porous plate 31 functions as the cathode electrode 3 and is not covered with an insulating material as in a conventional jig, it can be used as it is in a plating process including a heat treatment process. Therefore, when performing a plurality of processes continuously, it is possible to reduce the labor of setting work of the workpiece 2. This will be described next. Fig.1 (a) shows an example of the line plating process of the to-be-plated object 2 which consists of special steel materials, and after performing pre-processing (process (1)), the galvanization process using the said plating apparatus 1 is carried out. (Step (2)) and a dehydrogenation treatment as a heat treatment is performed (Step (3)). Thereafter, chromate treatment is performed (step (4)) to obtain a product. In the present invention, first, a predetermined number of objects to be plated 2 are set on each of the plurality of conductive porous plates 31 as shown in FIG. 3 prior to the pretreatment step. In this state, a known pretreatment such as degreasing, pickling and alkaline electrolysis is sequentially performed, and then a galvanizing treatment is performed using the plating apparatus 1 shown in FIG.
[0040]
At this time, the plurality of conductive porous plates 31 are mounted and stacked on the holding member 5 as shown in FIGS. This is immersed in a plating tank 11 filled with a plating solution 12, energized between the cathode electrode 3 and the anode electrode 4, and held in the plating solution 12 adjusted to about 25 ° C. for a predetermined time, thereby obtaining zinc. A plating film is formed. Thereafter, the plurality of conductive porous plates 31 are removed from the holding member 5 and are subjected to a dehydrogenation process in a state where the object to be plated 2 is held. The dehydrogenation treatment is performed by raising the temperature to a predetermined temperature (for example, about 200 ° C.) and performing the treatment for a predetermined time (about 2 hours). Furthermore, the to-be-plated object 2 hold | maintained at the electroconductive porous plate 31 is immersed in the chromate process liquid adjusted to about 25 degreeC, and a chromate film | membrane (for example, black chromate) is formed in the surface.
[0041]
Thus, by moving and processing the object to be plated 2 together with the conductive porous plate 31 during the entire process of the line plating process, it is possible to eliminate the trouble of setting and removing the object to be plated 2 between the processes. In addition, since a large number of objects to be plated 2 are held in a plurality of conductive porous plates 31, movement between the steps is easy, and the number of treatments can be easily made according to the processing capability of the apparatus used in each step. It is possible to perform efficient processing such as being able to make adjustments. Therefore, the time required for a series of steps can be greatly shortened, and the number of processes is increased, so that the cost reduction effect is great. Furthermore, the removal of the product after the chromate treatment can be done simply by inverting the conductive porous plate 31 on which the object to be plated 2 is loosely fitted as shown in FIG. Become.
[0042]
In the first embodiment, the case where the net-like conductive perforated plate 31 is used has been described. However, the punching in which the conductive perforated plate 31 is provided with a number of holes according to the shape of the workpiece 2 is formed. It can also be metal.
[0043]
In the first embodiment, the structure in which a large number of small objects to be plated 2 are held in the openings 32 of the conductive porous plate 31 and plated is described. A heavy object can be suspended and supported on the perforated plate 31. FIG. 6A is a diagram showing a cathode electrode structure which is a main part of the plating apparatus 1, and a conductive porous plate 31 to be the cathode electrode 3 is fixed to a fixing member 33, and a plurality of substantially disc-shaped objects to be plated. 21 is disposed. The conductive perforated plate 31 has a net-like shape, and as shown in FIG. 6 (b), hook-like support tools 34 for hanging are fixed at a plurality of locations on the net. A substantially disk-shaped object 21 is suspended from each support 34. It is also possible to stack a plurality of conductive porous plates 31, suspend the object to be plated 21 on the upper conductive porous plate 31, and support the legs 22 on the lower conductive porous plate 31.
[0044]
The basic configuration of the plating apparatus 1 is the same as that of the first embodiment. Also in the present embodiment, the same effect can be obtained by immersing the conductive porous plate 31 together with the object to be plated 21 in the plating solution 12 of the plating apparatus 1, and performing a plating process by energization. That is, since the conductive porous plate 31 that is the cathode electrode 3 has a net-like shape and is disposed substantially perpendicular to the anode electrode 4, the plating is hardly applied to the conductive porous plate 31. A plating film can be efficiently formed on the object 21. Moreover, since it can heat-process as it is, it can apply to the to-be-plated object 21 which consists of special steel materials which require a dehydrogenation process, and can reduce cost. Furthermore, the heavy article can be supported more stably than the case where it hangs to a vertical jig | tool by making it the structure which suspends the to-be-plated object 21 to the electroconductive perforated plate 31 arrange | positioned horizontally. Therefore, a larger number of objects to be plated 21 can be stably processed and moved easily.
[0045]
As described above, according to the present invention, even if an additional process such as a dehydrogenation process occurs, it is possible to move between processes without removing the object to be plated. Therefore, workability is improved and the line plating process can be greatly simplified. In addition, since setting and removal of the object to be plated may be performed at the beginning and the end of the line plating process, it is possible to eliminate the manual work between the processes and to completely automate the process, thereby greatly reducing the cost.
[Brief description of the drawings]
FIG. 1 shows a first embodiment of the present invention, (a) is a line plating process diagram using the plating apparatus of the present invention, and (b) is a schematic configuration diagram of the plating apparatus of the present invention.
2A is an overall perspective view showing the shape of an object to be plated used in the first embodiment, FIG. 2B is a front view of a conductive porous plate serving as a cathode electrode, and FIG. It is a partially enlarged view showing a state in which the object to be plated is loosely fitted on the porous plate, and (d) is a partially enlarged side view showing a state in which the object to be plated is loosely fitted on the conductive porous plate.
FIG. 3 is a top view showing a state in which a large number of objects to be plated are mounted on a conductive porous plate.
FIG. 4 is a partial perspective view showing a state in which conductive porous plates are laminated.
FIG. 5 is an overall perspective view showing a state where conductive porous plates are laminated.
FIG. 6 is a top view showing a state in which an object to be plated is suspended and supported between laminated conductive porous plates according to the second embodiment of the present invention.
FIG. 7 is an overall perspective view showing a configuration of a jig used in a conventional plating apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Plating apparatus 11 Plating tank 12 Plating solution 2 To-be-plated object 21 Main part 22 Flange part 3 Cathode electrode 31 Conductive porous plate 32 Opening 33 Spacer 34 Support tool 4 Anode electrode 41 Auxiliary electrode 42 Support part 5 Holding member 6 Fixed stand

Claims (11)

In a plating tank filled with a plating solution, an object to be plated connected to a cathode electrode and an anode electrode are disposed, and a plating apparatus for performing a plating process by energizing between both electrodes, the cathode electrode, The conductive perforated plate is disposed substantially horizontally and detachably in the plating tank. The object to be plated is fitted or loosely held in the hole of the conductive perforated plate, and the opening edge of the hole is formed. A plating apparatus for performing a plating process in a state of being in contact with an outer peripheral portion of an object to be plated. The object to be plated has a flange or a plurality of protrusions on the outer periphery, and the holes of the conductive porous plate can abut and support these flanges or the plurality of protrusions on the opening edge. The plating apparatus according to claim 1, which has a shape. The plating apparatus according to claim 1, wherein the conductive porous plate has a mesh plate shape. The plating apparatus according to any one of claims 1 to 3, wherein the wire forming the mesh of the conductive porous plate is wavy. The plating apparatus according to claim 1, wherein the cathode electrode is disposed with a slight inclination with respect to the plating solution surface. The plating apparatus according to claim 1, wherein an electrode surface of the anode electrode is disposed so as to be substantially perpendicular to a plate surface of the conductive porous plate to be the cathode electrode. The plating apparatus according to any one of claims 1 to 6, wherein a plurality of conductive porous plates serving as the cathode electrode are provided and laminated in the plating tank. The plating apparatus according to claim 7, wherein an auxiliary electrode connected to the anode electrode is disposed between the plurality of cathode electrodes. In a plating tank filled with a plating solution, an object to be plated connected to a cathode electrode and an anode electrode are disposed, and a plating apparatus for performing a plating process by energizing between both electrodes, the cathode electrode, It consists of a conductive porous plate disposed substantially horizontally and detachably in the plating tank, and is subjected to plating in a state in which the object to be plated is suspended and supported by a support projecting downward from the conductive porous plate. A plating apparatus characterized by In the plating method in which the object to be plated connected to the cathode electrode and the anode electrode are placed in a plating tank filled with a plating solution, and the plating process is performed by energizing both electrodes, and then heat treatment is performed. The conductive porous plate is disposed substantially horizontally and detachably as a cathode electrode, and an object to be plated is fitted or loosely held in the hole of the conductive porous plate, and the opening edge of the hole is covered. Plating is performed in contact with the outer peripheral portion of the plated object, and then the conductive porous plate holding the object to be plated is removed from the plating tank and the conductive porous plate is held in the conductive porous plate. A plating method characterized by subjecting a plated product to a heat treatment. The plating method according to claim 10, wherein after the heat treatment, the object to be plated is post-treated while being held by the conductive porous plate.

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