CN110724976A - Aluminum/lead anode plate and preparation method thereof - Google Patents
Aluminum/lead anode plate and preparation method thereof Download PDFInfo
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- CN110724976A CN110724976A CN201911199298.2A CN201911199298A CN110724976A CN 110724976 A CN110724976 A CN 110724976A CN 201911199298 A CN201911199298 A CN 201911199298A CN 110724976 A CN110724976 A CN 110724976A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C11/00—Alloys based on lead
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/12—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of lead or alloys based thereon
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Abstract
The invention relates to the technical field of anode plate preparation, in particular to an aluminum/lead anode plate and a preparation method thereof. The preparation method provided by the invention comprises the following steps: casting an alloy solution of lead-silver alloy by taking a substrate with a copper layer on the outer surface as a matrix to obtain an anode plate pre-product; sequentially carrying out heat treatment and rolling on the anode plate pre-product to obtain an aluminum/lead anode plate; the lead-silver alloy is an alloy using lead and silver as matrix elements. The copper layer forms intermetallic compounds between aluminum and lead, so that the bonding performance and the conductivity between the lead and the aluminum can be effectively improved, the resistance of the whole anode plate can be greatly reduced, and the electric energy consumption caused by overlarge resistance can be reduced. Meanwhile, the aluminum framework in the aluminum/lead anode plate obtained by the preparation method can be recycled after reaching the service life, and a new composite material is manufactured again, so that the resource recycling is facilitated.
Description
Technical Field
The invention relates to the technical field of anode plate preparation, in particular to an aluminum/lead anode plate and a preparation method thereof.
Background
Hydrometallurgy has very important significance and function in modern metallurgical industry, in the current hydrometallurgy industry, most refining modes can not be electrolyzed, and when electrolytic refining is used, unnecessary waste and consumption are caused by the defects of an anode plate, for example, the required current area is reached because the resistance of the anode plate is overlarge, the voltage of a cell needs to be increased, and the consumption of electric quantity is increased; secondly, too large a cell voltage also tends to cause electrochemical corrosion of the anode plate during electrolysis, which greatly shortens the service life of the anode plate. Therefore, the solution to the problems of the anode plate with excessive resistance and electrochemical corrosion is the current research focus.
Lead has important applications in the hydrometallurgical industry. The existing lead pole plate is mainly cast by using lead-silver alloy liquid or lead liquid, the conductivity of the material cannot be effectively improved by using the lead-silver alloy as the pole plate, the lead-silver alloy can be obviously bent after being used for a period of time, and the lead pole plate and the lead plate cannot be well combined together when being cast, so that the conductivity of the material cannot be effectively improved.
Disclosure of Invention
The invention aims to provide an aluminum/lead anode plate and a preparation method thereof, the aluminum/lead anode plate prepared by the preparation method has good conductivity, and can effectively avoid electrochemical corrosion on the anode plate caused by overlarge cell voltage in the electrolytic process.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides a preparation method of an aluminum/lead anode plate, which comprises the following steps:
casting an alloy solution of lead-silver alloy by taking a substrate with a copper layer on the outer surface as a matrix to obtain an anode plate pre-product;
sequentially carrying out heat treatment and rolling on the anode plate pre-product to obtain an aluminum/lead anode plate; the lead-silver alloy is an alloy using lead and silver as matrix elements.
Preferably, the substrate with the copper layer on the outer surface is an aluminum-copper composite plate or an aluminum plate plated with a copper layer.
Preferably, the method for preparing the aluminum plate plated with the copper layer comprises the following steps:
sequentially punching, electroplating and thermally treating the aluminum plate to obtain an aluminum plate plated with a copper layer;
after the punching, the volume of the rest aluminum plate is 30-70% of the volume before the punching;
the current density of the electroplating is 100-500A/m2The electroplating time is 1-3 h;
the heat treatment temperature is 400-500 ℃, and the heat treatment time is 2-5 h.
Preferably, the preparation method of the aluminum-copper composite plate comprises the following steps:
placing an aluminum plate between two copper plates, and rolling for 8-12 min at 500-550 ℃ to obtain an aluminum-copper composite plate;
or placing the aluminum plate in molten copper liquid, and performing hot dip plating for 1-3 s at 1100-1200 ℃ to obtain the aluminum-copper composite plate.
Preferably, before the casting, the substrate having the copper layer on the outer surface is immersed in a lead solution;
the dipping temperature is 300-600 ℃, and the dipping time is 10-30 min.
Preferably, the mass content of silver in the lead-silver alloy is 1-15%.
Preferably, the temperature of the alloy liquid of the lead-silver alloy is 600-700 ℃.
Preferably, the temperature of the heat treatment is 260-500 ℃, and the heat preservation time is 3-10 h.
Preferably, before the heat treatment, the method further comprises rolling the anode plate pre-product;
the rolling temperature is 250 ℃, and the rolling time is 5-10 min.
The invention also provides the aluminum/lead anode plate prepared by the preparation method in the technical scheme.
The invention provides a preparation method of an aluminum/lead anode plate, which comprises the following steps: casting an alloy solution of lead-silver alloy by taking a substrate with a copper layer on the outer surface as a matrix to obtain an anode plate pre-product; sequentially carrying out heat treatment and rolling on the anode plate pre-product to obtain an aluminum/lead anode plate; the lead-silver alloy is an alloy using lead and silver as matrix elements. According to the invention, the copper layer is added between the aluminum and the lead, and the copper layer simultaneously forms an intermetallic compound between the aluminum and the lead, so that the bonding performance and the conductivity between the lead and the aluminum can be effectively improved, the resistance of the whole anode plate can be greatly reduced, the electric energy consumption caused by overlarge resistance is reduced, the electrochemical corrosion generated by the anode plate in the electrolytic process is effectively reduced, the anode plate can be ensured to be always kept in an upright state in the using process, the bending condition is avoided, and the phenomena of uneven and loose metal electrodes on the cathode plate caused by the bending of the traditional anode plate due to corrosion after the traditional anode plate is used for a period of time are avoided. Meanwhile, the aluminum framework in the aluminum/lead anode plate obtained by the preparation method can be recycled after the service life is reached, and a new composite material is manufactured again, so that the resource recycling is facilitated.
Drawings
Fig. 1 is a schematic structural view of an aluminum/lead anode plate according to embodiment 1 of the present invention;
figure 2 is a cross-sectional micrograph of an aluminum/lead anode plate according to example 1 of the present invention.
Detailed Description
The invention provides a preparation method of an aluminum/lead anode plate, which comprises the following steps:
casting an alloy liquid of lead alloy by taking a substrate with a copper layer on the outer surface as a matrix to obtain an anode plate pre-product;
sequentially carrying out heat treatment and rolling on the anode plate pre-product to obtain an aluminum/lead anode plate;
the aluminum-silver alloy is an alloy with lead and silver as matrix elements.
In the present invention, all the raw material components are commercially available products well known to those skilled in the art unless otherwise specified.
The invention uses the base plate with copper layer on the outer surface as the base body to cast the alloy liquid of the lead-silver alloy, and obtains the anode plate pre-product. In the invention, the mass content of silver in the lead-silver alloy is preferably 1-15%, more preferably 5-13%, and most preferably 7-12%, and the temperature of the alloy liquid of the lead-silver alloy is preferably 600-700 ℃, more preferably 620-680 ℃, and most preferably 640-660 ℃. In the invention, the temperature of the lead-silver alloy can further ensure that the alloy liquid of the lead-silver alloy has good fluidity and the alloy liquid can be better diffused into copper at the temperature. In the present invention, the lead-silver alloy is an alloy containing lead and silver as base elements, and the specific type of the lead-silver alloy is not particularly limited, and may be any type known to those skilled in the art.
In the present invention, the substrate having the copper layer as the outer surface is preferably an aluminum-copper composite plate or an aluminum plate plated with a copper layer.
In the present invention, the aluminum plate plated with a copper layer is preferably prepared by a method, which preferably includes the steps of:
sequentially punching, electroplating and thermally treating the aluminum plate to obtain an aluminum plate plated with a copper layer;
after the punching, the volume of the rest aluminum plate is 30-70% of the volume before the punching;
the current density of the electroplating is 100-500A/m2The electroplating time is 1-3 h;
the heat treatment temperature is 400-500 ℃, and the heat treatment time is 2-5 h.
The present invention does not have any particular limitation on the manner of the perforation, and the perforation may be performed by a perforation method known to those skilled in the art. After the punching, the volume of the residual aluminum plate is 30-70%, preferably 40-60%, more preferably 45-50%, and most preferably 50% of the volume before the punching; the volume of the residual aluminum plate is controlled to be more favorable for improving the overall conductivity of the aluminum plate in the volume ratio before punching, and when the volume ratio is 50%, the conductivity of the aluminum plate is improved by more than 1 time compared with that of the aluminum plate which is not punched. In the present invention, the above volume ratio is preferably achieved by controlling the number and the pore size of the perforations. In a specific embodiment of the invention, holes are punched in a 1000 x 6mm aluminum plate; the number of the holes is 110, and the arrangement mode of the holes is that the holes are longitudinally arranged into 10 and transversely arranged into 11.
After the punching is finished, the punched aluminum plate is preferably put into 10mol/L hydrochloric acid for acid washing for 1 min.
In the invention, the electrolyte used in the electroplating method is preferably a 1mol/L copper sulfate solution; the current density of the electroplating method is preferably 100-500A/m2More preferably 150 to 300A/m2Most preferably 200A/m2(ii) a The electroplating time is preferably 1 to 3 hours, more preferably 1.5 to 2.5 hours, and most preferably 2 hours. In the invention, the temperature of the heat treatment is preferably 400-500 ℃, and more preferably 400 ℃; the time of the heat treatment is preferably 2-5 h, and more preferably 5 h.
In the present invention, the thickness of the copper layer in the aluminum plate plated with the copper layer is preferably 50 to 200 μm, more preferably 75 to 150 μm, and most preferably 100 μm.
In the present invention, the method for preparing the aluminum-copper composite plate preferably includes the following steps:
placing an aluminum plate between two copper plates, and rolling for 8-12 min at 500-550 ℃ to obtain an aluminum-copper composite plate;
or placing the aluminum plate in molten copper liquid, and performing hot dip plating for 1-3 s at 1100-1200 ℃ to obtain the aluminum-copper composite plate.
Placing an aluminum plate between two copper plates, and rolling for 8-12 min at 500-550 ℃ to obtain an aluminum-copper composite plate; in the invention, the thickness of the aluminum plate is preferably 4-10 mm, and more preferably 6 mm; the thickness of the two copper plates is preferably 1-3 mm independently, and more preferably 2 mm. In the invention, the rolling temperature is preferably 500-550 ℃, more preferably 510-550 ℃, and most preferably 520-550 ℃; the rolling time is preferably 8-12 min, more preferably 9-11 min, and most preferably 10 min. The thickness of the rolled copper layer is preferably 1.5-2 mm, and more preferably 1.8 mm; the thickness of the aluminum plate is preferably 4-10 mm, and more preferably 6 mm.
In the present invention, the rolling can further obtain a substrate having a dense bond and good conductivity.
After the rolling is finished, the aluminum-copper composite plate obtained by rolling is preferably cut into a required shape.
The aluminum plate is placed in molten copper liquid and is subjected to hot dip plating for 1-3 s at 1100-1200 ℃, and the aluminum-copper composite plate is obtained. In the present invention, the temperature of the hot dip plating is preferably 1150 ℃, and the time of the hot dip plating is preferably 2 s. In the invention, the metal compound is formed between the aluminum plate and the copper plating layer after the hot dip coating, and the metal compound is beneficial to enhancing the conductivity between the aluminum and the copper, so that a matrix with good conductivity can be obtained. In the present invention, the aluminum plate in the hot dip coating method is a perforated aluminum plate or a non-perforated aluminum plate.
In the invention, when the flow rate of the electrolyte is required to be more than 0.5m/s in the electrolytic process of manganese electrolysis and other severe environments, a perforated aluminum plate plated with a copper layer is preferably selected; when the flow rate of the electrolyte is required to be 0.1-0.5 m/s in the electrolysis process with a mild environment such as zinc electrolysis, the aluminum-copper composite plate is preferably selected.
In the present invention, before the casting, the substrate having the copper layer on the outer surface is preferably immersed in a lead solution; in the invention, the dipping temperature is preferably 300-600 ℃, more preferably 350-550 ℃, and most preferably 400-500 ℃; the dipping time is preferably 10-30 min, more preferably 15-25 min, and most preferably 18-22 min. After the dipping, the substrate with the copper layer on the outer surface is preferably pulled out of the lead solution, and the pulling process known to those skilled in the art can be used without any particular limitation in the present invention.
In the invention, the dipping and pulling processes can enable the copper layer to be plated with a lead layer in the high-temperature lead liquid, further ensure that the matrix and the silver-lead alloy are better combined together in the subsequent casting step, and effectively improve the conductivity.
In the invention, the concrete casting process is preferably to place the substrate with the copper layer on the outer surface into a mold, pour the alloy liquid of the lead-silver alloy into the mold, and take out the substrate after the substrate is completely cooled to obtain the anode plate pre-product.
After the anode plate pre-product is obtained, the anode plate pre-product is sequentially subjected to heat treatment and rolling to obtain the aluminum/lead anode plate. In the invention, the temperature of the heat treatment is preferably 260-500 ℃, more preferably 270-300 ℃, and most preferably 280 ℃; the heat preservation time is preferably 3-10 h, more preferably 6-9 h, and most preferably 7-8 h.
In the present invention, the heat treatment ensures that a composite material with good bonding and good electrical conductivity is obtained.
In the invention, the anode plate pre-product is preferably rolled before the heat treatment, other conditions of the rolling are not particularly limited, and rolling conditions known to those skilled in the art can be adopted (the thickness of the composite material before the rolling is 15-16 mm, and the thickness of the composite material after the rolling is 14-15 mm).
In the invention, the rolling treatment is carried out on the anode plate pre-product before the heat treatment, so that the bonding degree of the interface can be further improved, and the effect of the subsequent heat treatment process is improved.
After the heat treatment is finished, the rolling temperature is preferably 250 ℃, and the rolling time is preferably 5-10 min. In the invention, the thickness before rolling is preferably 14-15 mm, and the thickness after rolling is preferably 12-13 mm.
The invention also provides the aluminum/lead anode plate prepared by the preparation method in the technical scheme.
The aluminum/lead anode plate and the method for manufacturing the same according to the present invention will be described in detail with reference to examples, but they should not be construed as limiting the scope of the present invention.
Example 1
Uniformly punching 1000 × 6mm aluminum plates, wherein the number of punched holes is 110, the holes are longitudinally arranged in 10 and transversely arranged in 11 (the volume of the rest of the aluminum plates is 50% of the volume before punching);
placing the punched aluminum plate in 10mol/L hydrochloric acid for pickling for 1min, placing in an electrolytic tank (electrolyte is 1mol/L copper sulfate solution), and performing acid pickling at 200A/m2Electroplating for 1h under the current density of the aluminum alloy to obtain an aluminum plate plated with a copper layer;
placing the aluminum plate plated with the copper layer in a mold, and casting an alloy solution (600 ℃) of a lead-silver alloy with the silver content of 8 wt% into the mold to obtain an anode plate pre-product;
sequentially carrying out heat treatment (300 ℃, 5h) and rolling (250 ℃, 5min) on the anode plate pre-product to obtain an aluminum/lead anode plate with the thickness of 12-13 mm (the volume of the aluminum plate accounts for 30% of the aluminum/lead anode plate, and the structural schematic diagram is shown in figure 1);
the section of the aluminum/lead anode plate is subjected to a microscope test, and the test result is shown in fig. 2, as can be seen from fig. 2, the aluminum and the copper plating layer at the interface are well combined, the copper plating layer and the lead are well combined, and the well combined interface is beneficial to improving the conductivity of the material and further improving the performance of the material;
the corrosion depth of the aluminum/lead anode plate is 1.5mm after the aluminum/lead anode plate is used for 10 months in a simulated zinc electrolysis experiment; the conductivity is 51.6iacs, and the service life is 18-20 months.
Example 2
Placing 1000 × 6mm aluminum plates between two copper plates with the same size, and rolling (550 ℃, 10min) to obtain an aluminum-copper composite plate (the thickness of the aluminum plate is 5mm, and the thickness of the single-layer copper layer is 1.8 mm); cutting the aluminum-copper composite plate into a required shape;
dipping the aluminum-copper composite plate in a lead liquid (400 ℃, 10min), and then pulling out the lead liquid to obtain an aluminum-copper plate with lead;
placing the aluminum-copper plate with the lead in a mould, and casting an alloy liquid (600 ℃) of a lead-silver alloy with the silver content of 8 wt% into the mould to obtain an anode plate pre-product;
sequentially carrying out heat treatment (300 ℃, 5h) and rolling (250 ℃, 5min) on the anode plate pre-product to obtain an aluminum/lead anode plate with the thickness of 10 mm;
the corrosion depth of the aluminum/lead anode plate is 1.5mm after the aluminum/lead anode plate is used for 10 months in a simulated zinc electrolysis experiment; the conductivity is 51.8iacs, and the service life is 18-20 months.
Example 3
Uniformly punching 1000 × 6mm aluminum plates, wherein the number of punched holes is 110, the holes are longitudinally arranged in 10 and transversely arranged in 11;
placing the punched aluminum plate in 10mol/L hydrochloric acid for pickling for 1min, placing in an electrolytic tank (electrolyte is 1mol/L copper sulfate solution), and adding into the electrolytic tank at 100A/m2Electroplating for 1h under the current density of the aluminum alloy to obtain an aluminum plate plated with a copper layer;
dipping the aluminum plate plated with the copper layer in a lead solution (400 ℃, 10min), and then pulling out the lead solution to obtain a lead-coated aluminum plate;
placing the aluminum plate with the lead in a mould, and casting an alloy liquid (600 ℃) of a lead-silver alloy with the silver content of 8 wt% into the mould to obtain an anode plate pre-product;
sequentially carrying out heat treatment (300 ℃, 5h) and rolling (250 ℃, 5min) on the anode plate pre-product to obtain an aluminum/lead anode plate with the thickness of 12-13 mm;
the corrosion depth of the aluminum/lead anode plate is 1.5mm after the aluminum/lead anode plate is used for 10 months in a simulated zinc electrolysis experiment; the conductivity is 53.2iacs, and the service life is 18-20 months.
Example 4
Uniformly punching 1000 × 6mm aluminum plates, wherein the number of punched holes is 110, the holes are longitudinally arranged in 10 and transversely arranged in 11;
placing the punched aluminum plate in 10mol/L hydrochloric acid for pickling for 1min, placing in an electrolytic tank (electrolyte is 1mol/L copper sulfate solution), and adding into the electrolytic tank at 100A/m2Electroplating for 1h under the current density of the aluminum alloy to obtain an aluminum plate plated with a copper layer;
placing the aluminum plate plated with the copper layer in a mold, and casting an alloy solution (600 ℃) of a lead-silver alloy with the silver content of 8 wt% into the mold to obtain an anode plate pre-product;
sequentially rolling, thermally treating (300 ℃, 5h) and rolling (250 ℃, 5min) the anode plate pre-product to obtain an aluminum/lead anode plate with the thickness of 12-13 mm;
the corrosion depth of the aluminum/lead anode plate is 1.5mm after the aluminum/lead anode plate is used for 10 months in a simulated zinc electrolysis experiment; the conductivity is 53.3iacs, and the service life is 18-20 months.
Example 5
Placing 1000 × 6mm aluminum plates in molten copper liquid at the temperature of 1150 ℃ for hot dip coating for 2s (the thickness of the aluminum plates is 6mm, and the thickness of the single copper layer is 0.8mm) to obtain the aluminum-copper composite plate;
dipping the aluminum-copper composite board in a lead liquid (400 ℃, 10min), and then pulling out the lead liquid to obtain the aluminum-copper composite board with lead;
placing the aluminum-copper composite plate after the lead is hung in a mould, and casting an alloy liquid (600 ℃) of a lead-silver alloy with the silver content of 8 wt% into the mould to obtain an anode plate pre-product;
sequentially carrying out heat treatment (300 ℃, 5h) and rolling (250 ℃, 5min) on the anode plate pre-product to obtain an aluminum/lead anode plate with the thickness of 10 mm;
the corrosion depth of the aluminum/lead anode plate is 1.5mm after the aluminum/lead anode plate is used for 10 months in a simulated zinc electrolysis experiment; the conductivity is 55.8iacs, and the service life is 18-20 months.
According to the embodiment, the anode plate prepared by the preparation method provided by the invention has higher conductivity and longer service life.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. The preparation method of the aluminum/lead anode plate is characterized by comprising the following steps:
casting an alloy solution of lead-silver alloy by taking a substrate with a copper layer on the outer surface as a matrix to obtain an anode plate pre-product;
sequentially carrying out heat treatment and rolling on the anode plate pre-product to obtain an aluminum/lead anode plate;
the lead-silver alloy is an alloy using lead and silver as matrix elements.
2. The method according to claim 1, wherein the substrate having the outer surface of the copper layer is an aluminum-copper composite plate or an aluminum plate plated with a copper layer.
3. The method of manufacturing an aluminum plate plated with a copper layer according to claim 2, comprising the steps of:
sequentially punching, electroplating and thermally treating the aluminum plate to obtain an aluminum plate plated with a copper layer;
after the punching, the volume of the rest aluminum plate is 30-70% of the volume before the punching;
the current density of the electroplating is 100-500A/m2The electroplating time is 1-3 h;
the heat treatment temperature is 400-500 ℃, and the heat treatment time is 2-5 h.
4. The method of manufacturing the aluminum-copper composite panel according to claim 2, comprising the steps of:
placing an aluminum plate between two copper plates, and rolling for 8-12 min at 500-550 ℃ to obtain an aluminum-copper composite plate;
or placing the aluminum plate in molten copper liquid, and performing hot dip plating for 1-3 s at 1100-1200 ℃ to obtain the aluminum-copper composite plate.
5. The method according to claim 1, wherein the substrate having the copper layer on the outer surface thereof is immersed in a lead solution before the casting;
the dipping temperature is 300-600 ℃, and the dipping time is 10-30 min.
6. The preparation method according to claim 1, wherein the mass content of silver in the lead-silver alloy is 1-15%.
7. The method according to claim 1, wherein the temperature of the alloy liquid of the lead-silver alloy is 600 to 700 ℃.
8. The preparation method according to claim 1, wherein the heat treatment temperature is 260 to 500 ℃ and the holding time is 3 to 10 hours.
9. The method of claim 1 or 8, wherein prior to the heat treatment, further comprising rolling the anode plate pre-product;
the rolling temperature is 250 ℃, and the rolling time is 5-10 min.
10. The aluminum/lead anode plate prepared by the preparation method of any one of claims 1 to 9.
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| CN113122885A (en) * | 2021-04-05 | 2021-07-16 | 莫日根 | Application of aluminum alloy composite board |
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| CN102212849A (en) * | 2011-04-22 | 2011-10-12 | 昆明理工恒达科技有限公司 | Method for preparing novel anode plate for electrodeposition of non-ferrous metal |
| CN102925834A (en) * | 2012-11-06 | 2013-02-13 | 武汉科技大学 | Method for producing lead belt of battery plate |
| CN205376641U (en) * | 2015-12-21 | 2016-07-06 | 洛阳铜一金属材料发展有限公司 | Aluminium copper -lead composite polar plate and lead -acid batteries for lead -acid batteries |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102212849A (en) * | 2011-04-22 | 2011-10-12 | 昆明理工恒达科技有限公司 | Method for preparing novel anode plate for electrodeposition of non-ferrous metal |
| CN102925834A (en) * | 2012-11-06 | 2013-02-13 | 武汉科技大学 | Method for producing lead belt of battery plate |
| CN205376641U (en) * | 2015-12-21 | 2016-07-06 | 洛阳铜一金属材料发展有限公司 | Aluminium copper -lead composite polar plate and lead -acid batteries for lead -acid batteries |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113122885A (en) * | 2021-04-05 | 2021-07-16 | 莫日根 | Application of aluminum alloy composite board |
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