JP5487576B2 - Electrolytic plating jig and electrolytic plating method - Google Patents
Electrolytic plating jig and electrolytic plating method Download PDFInfo
- Publication number
- JP5487576B2 JP5487576B2 JP2008209549A JP2008209549A JP5487576B2 JP 5487576 B2 JP5487576 B2 JP 5487576B2 JP 2008209549 A JP2008209549 A JP 2008209549A JP 2008209549 A JP2008209549 A JP 2008209549A JP 5487576 B2 JP5487576 B2 JP 5487576B2
- Authority
- JP
- Japan
- Prior art keywords
- plated
- support means
- support
- plating
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 38
- 238000009713 electroplating Methods 0.000 title claims description 18
- 238000007747 plating Methods 0.000 claims description 45
- 239000007788 liquid Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
本発明は、電解めっき治具とこれを用いためっき方法に関する。 The present invention relates to an electrolytic plating jig and a plating method using the same.
被めっき物に対して電解めっきをする際は、被めっき物の形状、重量などを考慮し、方法や治具を選定する。 When electrolytic plating is performed on an object to be plated, a method and a jig are selected in consideration of the shape and weight of the object to be plated.
例えば、孔を有する被めっき物をめっきするに際しては、孔部分の上下をばね付きフックで支持する方法が一般的である。 For example, when plating an object to be plated having a hole, a method of supporting the upper and lower portions of the hole portion with a hook with a spring is common.
しかしこの方法は、治具と被めっき物の接電部分が接触し固定されるため、その部分はめっき液に触れず、めっき未析出が起こる。 However, in this method, since the electric contact portion of the jig and the object to be plated comes into contact and is fixed, the portion does not touch the plating solution, and the plating is not deposited.
この問題点を解決するために、被めっき物の孔部を1つのフックで引っ掛け、被めっき物を常に揺動させて、被めっき物と治具接触部とを非固定化することで、めっき未析出を抑制する方法がある。 In order to solve this problem, the hole of the object to be plated is hooked with one hook, the object to be plated is constantly swung, and the object to be plated and the jig contact part are not fixed. There is a method of suppressing unprecipitation.
しかしこの方法では、被めっき物が安定しないため、治具が被めっき物をキズ付けやすく、また作業中被めっき物がめっき槽に落下するなどして、治具として不安定であり、当然、品質的にも問題が多い。
他方、接電部分が固定された治具を使用しながらも、作業者がめっき処理中、治具と被めっき物の接触部分を付け替えるなどして、めっき未析出を抑制する方法もある。
しかし、この方法は、治具と被めっき物の接触部分を付け替える数分間は、被めっき物を大気中に晒すことになるため、析出層が酸化されやすく、また、皮膜の厚さの均一性に欠けるなど品質上問題もあり、また手作業で行われるため、作業効率上量産には不向きである。
他方、特許文献１には、めっき処理中に接電部分を移動させ、めっき未析出を抑制する方法が開示されている。
しかし、この方法は、接電部分が被めっき物上を当接して移動し、接電部分の先端が被めっき物を引きずるため、被めっき物の母材そのものにキズが付くばかりでなく、接電部分周辺のめっき被膜も剥がれ落ち、製品不良となることが懸念され、十分なめっき未付着改善効果が得られない。
On the other hand, there is also a method of suppressing plating non-deposition by using a jig in which the contact portion is fixed while an operator changes the contact portion between the jig and the object to be plated during the plating process.
However, this method exposes the plating object to the atmosphere for several minutes when changing the contact part between the jig and the object to be plated, so that the deposited layer is easily oxidized, and the film thickness is uniform. There is also a problem in quality such as lacking, and since it is performed manually, it is not suitable for mass production due to work efficiency.
On the other hand, Patent Document 1 discloses a method of moving a contact portion during plating to suppress unplated plating.
However, in this method, the contact portion moves while contacting the object to be plated, and the tip of the contact portion drags the object to be plated. The plating film around the electric part is also peeled off, and there is a concern that the product will be defective, and a sufficient effect of improving the non-plating cannot be obtained.
本発明は、上記に掲げた問題点を解消すべく、めっき槽内の被めっき物を落下させることなく、電解めっきにおける治具の接電部でのめっき未付着を改善し、かつ、めっき中の酸化を防ぎ膜質を維持しつつ、量産性、作業性に優れた電解めっき治具とこれを用いためっき方法を提供することを課題とするものである。 In order to solve the above-mentioned problems, the present invention improves the plating non-adherence at the contact portion of the jig in electrolytic plating without dropping the object to be plated in the plating tank, and during plating It is an object of the present invention to provide an electrolytic plating jig excellent in mass productivity and workability and a plating method using the same while preventing oxidation of the film and maintaining the film quality.
上記の課題を解決するために、請求項１の発明は、被めっき物（２）を支持する第１の支持手段と第２の支持手段を備えた電解めっき治具であって、前記第１の支持手段は、前記被めっき物を把持する複数の支持部材（４ａ、４ｂ）を有し、前記第２の支持手段は、前記被めっき物を把持する複数の支持部材（４ｃ、４ｄ）を有し、前記第１の支持手段と前記第２の支持手段は、それぞれ前記被めっき物（２）の異なる箇所を把持するように構成され、前記被めっき物（２）を把持する前記支持部材（４ａ、４ｂ、４ｃ、４ｄ）に連結された開閉リンク機構を備え、前記開閉リンク機構は、前記第１の支持部材により前記被めっき物（２）を把持し、めっき処理中に、前記第２の支持部材により前記被めっき物（２）を把持し、前記第１の支持部材による把持を解除し、めっき処理終了後に、前記第２の支持手段による把持が解除するように、前記支持部材（４ａ、４ｂ、４ｃ、４ｄ）を駆動することを特徴とする。
請求項２の発明は、前記被めっき物（２）を把持する前記支持部材（４ａ、４ｂ、４ｃ、４ｄ）の端部には、前記被めっき物（２）を把持するフック部（５）を有することを特徴とする。
請求項３の発明は、被めっき物（２）を支持する第１の支持手段と第２の支持手段を備え、前記第１の支持手段は、前記被めっき物を把持する複数の支持部材（４ａ、４ｂ）を有し、前記第２の支持手段は、前記被めっき物を把持する複数の支持部材（４ｃ、４ｄ）を有し、前記第１の支持手段と前記第２の支持手段は、それぞれ前記被めっき物（２）の異なる箇所を把持する電解めっき治具を用いた電解めっき方法であって、前記被めっき物（２）が、前記第１の支持手段により把持された状態でめっき処理液中に浸漬され、めっき処理を開始し、めっき処理半ばで、前記第２の支持手段により把持された後、前記第１の支持手段による把持が解除され、前記第２の支持手段により把持された状態でめっき処理され、めっき処理を終了し、前記被めっき物（２）は、前記第２の支持手段による把持が解除されることを特徴とする。
In order to solve the above problems, the invention of claim 1 is an electroplating jig provided with a first support means and a second support means for supporting an object (2) to be plated, wherein the first The support means includes a plurality of support members (4a, 4b) for gripping the object to be plated, and the second support means includes a plurality of support members (4c, 4d) for gripping the object to be plated. And the first support means and the second support means are configured to grip different portions of the object to be plated (2), respectively, and support members for gripping the object to be plated (2) (4a, 4b, 4c, 4d). The opening / closing link mechanism holds the object (2) to be plated by the first support member, and during the plating process, The object to be plated (2) is gripped by two support members, and the first support Releasing the gripping by members, after the plating process is completed, the so gripped by the second supporting means for releasing, and drives the support member (4a, 4b, 4c, 4d ).
In the invention of claim 2, the hook portion (5) for holding the object to be plated (2) is provided at the end of the support member (4a, 4b, 4c, 4d) for holding the object (2) to be plated. It is characterized by having.
Invention of Claim 3 is provided with the 1st support means and 2nd support means which support to-be-plated object (2), and said 1st support means is a some support member (Grip | tipping said to-be-plated object ( 4a, 4b), the second support means has a plurality of support members (4c, 4d) for gripping the object to be plated, and the first support means and the second support means are And an electroplating method using an electroplating jig for gripping different portions of the object to be plated (2), wherein the object to be plated (2) is gripped by the first support means. After being immersed in the plating solution and starting the plating process, and being gripped by the second support means in the middle of the plating process, the gripping by the first support means is released, and the second support means The plating process is performed in the gripped state, the plating process is finished, Serial object to be plated (2), characterized in that gripping by the second supporting means is released.
本発明の電解めっき治具とこれを用いためっき方法は、治具と被めっき物の接電部分の支持機構を、二段階の切替え構造とすることで、めっき処理中に槽内で接電部を切替えることが可能となり、フックによるキズ付きも少なく、また膜質を維持しつつ、接電部のめっき未付着を防ぎ、外観不良のない、量産性、作業性の優れた効果を有する。 The electrolytic plating jig and the plating method using the same according to the present invention have a two-stage switching structure for the support mechanism for the contact portion of the jig and the object to be plated, so that the contact can be made in the tank during the plating process. It is possible to switch the part, there are few scratches due to the hook, and while maintaining the film quality, the non-adhering of the contact part is prevented, and there is no appearance defect, and the mass productivity and workability are excellent.
以下、本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
図１は本発明の治具１の切替え動作を示す構成図であり、図２は治具１の切替え動作のタイムチャートである。 FIG. 1 is a configuration diagram showing the switching operation of the jig 1 of the present invention, and FIG. 2 is a time chart of the switching operation of the jig 1.
まず、本実施例の治具１の構成について説明する。 First, the configuration of the jig 1 of this embodiment will be described.
図１の（ａ）ないし図１の（ｃ）に示すように、本発明の治具１は、導電性材質からなる支持体３に、被めっき物２を支持する支持部材４ａ、４ｂ、４ｃ、４ｄが設けられている。 As shown in FIGS. 1 (a) to 1 (c), the jig 1 of the present invention has support members 4a, 4b, 4c for supporting an object to be plated 2 on a support 3 made of a conductive material. 4d are provided.
前記支持部材４ａ、４ｂと支持部材４ｃ、４ｄは弾性を有する導電性材質からなり、それらはそれぞれ対をなしている。 The support members 4a and 4b and the support members 4c and 4d are made of a conductive material having elasticity, and they form a pair.
支持部材４ａ、４ｂと支持部材４ｃ、４ｄの端部は、被めっき物を確実に支持するため接電用フック５が形成され、被めっき物２のそれぞれ異なる少なくとも二つの箇所を順次切替て弾性的に支持する。 The end portions of the support members 4a and 4b and the support members 4c and 4d are formed with contact hooks 5 to securely support the object to be plated, and are elastically switched by sequentially switching at least two different portions of the object 2 to be plated. Supportive.
図１の（ａ）ないし図１の（ｃ）に示すように、支持部材４ａ、４ｂ、４ｃ、４ｄの端部を形成する前記接電用フック５のフックの向きは、被めっき物２の外側面２ａを支持部材４ａ、４ｂにて弾性的に把持して支持する場合には、フックは互いに向かい合うように設けられている。
As shown in FIG. 1A to FIG. 1C, the direction of the hook of the contact hook 5 that forms the ends of the support members 4a, 4b, 4c, and 4d depends on the object 2 to be plated. When the outer surface 2a is elastically gripped and supported by the support members 4a and 4b, the hooks are provided so as to face each other.
他方、支持部材４ｃ、４ｄにて被めっき物２の孔部内側面２ｂから拡開して弾性的に押さえつけるように支持する場合には、フックは互いに外方向に向けて設けられる。 On the other hand, when supporting by supporting members 4c and 4d so as to expand from the hole inner side surface 2b of the object to be plated 2 and elastically hold it down, the hooks are provided outward.
なお、図示はしないが、前記支持部材４ａ、４ｂと支持部材４ｃ、４ｄは、被めっき物２の接電位置を変更／切替て支持するために、例えば、支持体３に隣接してなる開閉リンク機構と連結されており、当該リンク機構を外部から操作することにより、被めっき物２の支持・解除などの一連の変更／切替等の動作を行うように構成されている。 Although not shown, the support members 4a and 4b and the support members 4c and 4d are, for example, opened and closed adjacent to the support body 3 in order to change / switch the contact position of the workpiece 2 to be supported. It is connected to a link mechanism, and is configured to perform a series of operations such as change / switching such as support / release of the object to be plated 2 by operating the link mechanism from the outside.
本実施例では、１つの被めっき物２に対し、対をなす２つの支持部材（４ａ、４ｂ又は４ｃ、４ｄ）により変更／切替て支持しているが、被めっき物２の形状や重量によっては、支持部材４ａ、４ｂと支持部材４ｃ、４ｄの配置を変更することも、あるいは支持部材自体を増やすことも想定されている。 In this embodiment, one object 2 is supported by changing / switching the two support members (4a, 4b or 4c, 4d) in pairs, depending on the shape and weight of the object 2 to be plated. It is assumed that the arrangement of the support members 4a and 4b and the support members 4c and 4d is changed, or that the support members themselves are increased.
また、接電用フック５も、被めっき物２の形状や性質に応じて、異なる形状を有するフックや、またそれらを複数設けることも可能であり、本実施例で示した形態に限定されるものではない。 In addition, the contact hook 5 can also be provided with a hook having a different shape or a plurality of the hooks depending on the shape and properties of the workpiece 2 and is limited to the form shown in the present embodiment. It is not a thing.
次に、電解めっき方法を図２のタイムチャートに即し説明する。 Next, the electrolytic plating method will be described with reference to the time chart of FIG.
図２の横軸（Ｔ）は時間を示したもので、縦軸は電解めっき処理の通電／解除及び支持部材（４ａ、４ｂ又は４ｃ、４ｄ）の被めっき物２の支持／解除を示したものである。
（１）取付け工程
＜図２：横軸Ｔ1 縦軸４ｃ、４ｄ支持開始＞
以下、横軸、縦軸の記載を省略する。
The horizontal axis (T) in FIG. 2 indicates time, and the vertical axis indicates the energization / release of the electrolytic plating process and the support / release of the workpiece 2 of the support member (4a, 4b or 4c, 4d). Is.
(1) Mounting process <FIG. 2: horizontal axis T 1 vertical axis 4c, 4d support start>
Hereinafter, description of the horizontal axis and the vertical axis is omitted.
図１の（ａ）に示すように、被めっき物２は、めっき処理前、支持部材４ｃ、４ｄを被めっき物２の孔部内に挿入し、支持部材４ｃ、４ｄを外方向に拡開しながら孔部内側面２ｂを接電用フック５で押さえ弾性的に支持される。
（２）浸漬工程
＜図２：Ｔ2 めっき処理通電開始＞
支持部材４ｃ、４ｄに支持された被めっき物２は、槽内の処理液中に浸漬される。
As shown in FIG. 1 (a), the object to be plated 2 has the support members 4c and 4d inserted into the holes of the object to be plated 2 before the plating process, and the support members 4c and 4d are expanded outward. However, the inner surface 2b of the hole is pressed and elastically supported by the contact hook 5.
(2) immersing step <Figure 2: T 2 plating energization start>
The to-be-plated object 2 supported by the supporting members 4c and 4d is immersed in the processing liquid in a tank.
めっき処理槽の中では、被めっき物２は支持部材４ｃ、４ｄに支持された状態で通電され、電気処理が開始され、図１には図示されていない陽極と被めっき物２との間で、めっき液を通して電解反応が行われ、被めっき物２の表面にめっき層が形成される。
（３）切替え工程
（ｉ）＜図２：Ｔ3 支持部材（４ａ、４ｂ）支持開始＞
図１の（ｂ）に示すように、めっき処理半ばで、図示されない開閉リンク機構を操作して、被めっき物２は槽内処理液中に浸漬された状態で支持部材４ｃ、４ｄによって支持されつつ、支持部材４ａ、４ｂへの切替えが開始される。
In the plating treatment tank, the object to be plated 2 is energized while being supported by the supporting members 4c and 4d, and the electric treatment is started. Between the anode not shown in FIG. Then, an electrolytic reaction is performed through the plating solution, and a plating layer is formed on the surface of the object to be plated 2.
(3) Switching step (i) <Figure 2: T 3 support members (4a, 4b) supporting start>
As shown in FIG. 1B, in the middle of the plating process, an opening / closing link mechanism (not shown) is operated, and the object to be plated 2 is supported by the support members 4c and 4d in a state of being immersed in the treatment liquid in the tank. Meanwhile, switching to the support members 4a and 4b is started.
開閉リンク機構の操作により、被めっき物２の孔部内側面２ｂを支持している支持部材４ｃ、４ｄは、その支持している状態を保ちながら、支持部材４ａ、４ｂが内方向へ閉じて、被めっき物２の外側面２ａの安定箇所を接電用フック５にて弾性的に把持して支持する。
（ｉｉ）＜図２：Ｔ3−Ｔ4 支持部材（４ｃ、４ｄ）（４ａ、４ｂ）支持＞
この段階では、被めっき物２は、槽内処理液中に浸漬された状態で支持部材４ｃ、４ｄと支持部材４ａ、４ｂにより支持されている。
（ｉｉｉ）＜図２：Ｔ4 支持部材（４ｃ、４ｄ）解除＞
その後、開閉リンク機構を操作して、支持部材４ｃ、４ｄは、被めっき物２の支持を解除し、被めっき物２は、支持部材４ａ、４ｂのみによって支持され、支持部材４ｃ、４ｄから支持部材４ａ、４ｂへの接電部の切替えが完了する。
By operating the opening / closing link mechanism, the supporting members 4c and 4d supporting the hole inner surface 2b of the workpiece 2 are closed inward while maintaining the supporting state. The stable portion of the outer surface 2a of the workpiece 2 is elastically gripped and supported by the contact hook 5.
(Ii) <Figure 2: T 3 -T 4 supporting members (4c, 4d) (4a, 4b) supporting>
At this stage, the object to be plated 2 is supported by the supporting members 4c and 4d and the supporting members 4a and 4b in a state of being immersed in the in-vessel treatment liquid.
(Iii) <Figure 2: T 4 support member (4c, 4d) released>
Thereafter, by operating the opening / closing link mechanism, the support members 4c and 4d release the support of the object to be plated 2, and the object to be plated 2 is supported only by the support members 4a and 4b and supported by the support members 4c and 4d. The switching of the contact portion to the members 4a and 4b is completed.
被めっき物２の電気処理は、支持部材４ｃ、４ｄから支持部材４ａ、４ｂへ接電部の切替え中も行われるため、被めっき物２が治具１から離れることなく安定しためっき処理が可能となる。
（４）取外し工程
（ｉ）＜図２：Ｔ5 めっき処理解除＞
図１の（ｃ）に示めすように、支持部材４ａ、４ｂにて支持され、電気処理されている被めっき物２は、所定の時間が経過した後、通電が解除され電気処理は終了する。
（ｉｉ）＜図２：Ｔ6 支持部材（４ａ、４ｂ）解除＞
通電が解除された後、支持部材４ａ、４ｂは、被めっき物２の支持を解除して、一連のめっき処理は終了する。
このように、治具１の支持機構を、二段階の切替え可動構造（支持部材４ｃ、４ｄから支持部材４ａ、４ｂへの切替え）にすることで、以下のような効果がある。
１）めっき処理中槽内で接電部を切替えることが可能となり、析出層が酸化されることがなく量産性、作業性に優れためっき処理が可能となる。
２）接電部の切替えにおいて接電用フック５の先端が被めっき物２を引きずることがないため、被めっき物２に対するキズを必要最小限度に抑え、安定した膜質を確保することができる。
３）支持部材（４ｃ、４ｄ）（４ａ、４ｂ）を順次切替えて被めっき物を支持するため、めっきの未付着を防ぎ、外観不良のない品質上優れためっき処理が可能となる。
Since the electroplating of the object to be plated 2 is performed even while the contact portion is switched from the support members 4c and 4d to the support members 4a and 4b, the plating object 2 can be stably plated without leaving the jig 1. It becomes.
(4) removing step (i) <Figure 2: T 5 plating released>
As shown in FIG. 1 (c), the plated object 2 supported by the supporting members 4a and 4b and subjected to the electrical processing is de-energized after a predetermined time and the electrical processing is completed. .
(Ii) <Figure 2: T 6 support members (4a, 4b) released>
After the energization is released, the support members 4a and 4b release the support of the workpiece 2 and the series of plating processes is completed.
As described above, the support mechanism of the jig 1 has a two-stage switching movable structure (switching from the support members 4c and 4d to the support members 4a and 4b), thereby providing the following effects.
1) It is possible to switch the contact portion in the tank during the plating process, and the plating process is excellent in mass productivity and workability without oxidizing the deposited layer.
2) Since the tip of the contact hook 5 does not drag the object to be plated 2 in switching the contact part, it is possible to minimize scratches on the object to be plated 2 and to secure a stable film quality.
3) Since the support members (4c, 4d) (4a, 4b) are sequentially switched to support the object to be plated, plating non-adherence is prevented, and an excellent plating process with no appearance defect is possible.
１ 治具
２ 被めっき物
２ａ 被めっき物の外側面
２ｂ 被めっき物の孔部の内側面
３ 支持体
４ａ、４ｂ、４ｃ、４ｄ 支持部材
５ 接電用フック
DESCRIPTION OF SYMBOLS 1 Jig 2 To-be-plated object 2a To-be-plated object outer surface 2b To-be-plated object inner surface 3 Support body 4a, 4b, 4c, 4d Support member 5 Contacting hook
Claims (3)
前記第１の支持手段は、前記被めっき物を把持する複数の支持部材（４ａ、４ｂ）を有し、
前記第２の支持手段は、前記被めっき物を把持する複数の支持部材（４ｃ、４ｄ）を有し、
前記第１の支持手段と前記第２の支持手段は、それぞれ前記被めっき物（２）の異なる箇所を把持するように構成され、
前記被めっき物（２）を把持する前記支持部材（４ａ、４ｂ、４ｃ、４ｄ）に連結された開閉リンク機構を備え、
前記開閉リンク機構は、前記第１の支持部材により前記被めっき物（２）を把持し、めっき処理中に、前記第２の支持部材により前記被めっき物（２）を把持し、前記第１の支持部材による把持を解除し、めっき処理終了後に、前記第２の支持手段による把持が解除するように、前記支持部材（４ａ、４ｂ、４ｃ、４ｄ）を駆動することを特徴とする電解めっき治具。 An electroplating jig provided with a first support means and a second support means for supporting an object (2) to be plated,
The first support means includes a plurality of support members (4a, 4b) for holding the object to be plated.
The second support means has a plurality of support members (4c, 4d) for holding the object to be plated.
The first support means and the second support means are each configured to grip different portions of the object to be plated (2) ,
An open / close link mechanism connected to the support members (4a, 4b, 4c, 4d) for gripping the object to be plated (2);
The opening / closing link mechanism grips the object to be plated (2) by the first support member, and grips the object to be plated (2) by the second support member during the plating process. The support member (4a, 4b, 4c, 4d) is driven so that the grip by the second support means is released after the end of the plating process. jig.
前記第１の支持手段は、前記被めっき物を把持する複数の支持部材（４ａ、４ｂ）を有し、
前記第２の支持手段は、前記被めっき物を把持する複数の支持部材（４ｃ、４ｄ）を有し、
前記第１の支持手段と前記第２の支持手段は、それぞれ前記被めっき物（２）の異なる箇所を把持する電解めっき治具を用いた電解めっき方法であって、
前記被めっき物（２）が、前記第１の支持手段により把持された状態でめっき処理液中に浸漬され、
めっき処理を開始し、
めっき処理半ばで、
前記第２の支持手段により把持された後、前記第１の支持手段による把持が解除され、
前記第２の支持手段により把持された状態でめっき処理され、
めっき処理を終了し、
前記被めっき物（２）は、前記第２の支持手段による把持が解除されることを特徴とする電解めっき方法。 A first support means and a second support means for supporting the object to be plated (2);
The first support means includes a plurality of support members (4a, 4b) for holding the object to be plated.
The second support means has a plurality of support members (4c, 4d) for holding the object to be plated.
The first support means and the second support means are each an electroplating method using an electroplating jig that holds different portions of the object to be plated (2) ,
The object to be plated (2) is immersed in a plating treatment solution in a state of being gripped by the first support means,
Start plating process,
In the middle of the plating process,
After being gripped by the second support means, the gripping by the first support means is released,
Plating is performed while being gripped by the second support means,
Finish the plating process,
The electrolytic plating method, wherein the object to be plated (2) is released from being held by the second support means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008209549A JP5487576B2 (en) | 2008-08-18 | 2008-08-18 | Electrolytic plating jig and electrolytic plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008209549A JP5487576B2 (en) | 2008-08-18 | 2008-08-18 | Electrolytic plating jig and electrolytic plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010043340A JP2010043340A (en) | 2010-02-25 |
| JP5487576B2 true JP5487576B2 (en) | 2014-05-07 |
Family
ID=42014937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008209549A Active JP5487576B2 (en) | 2008-08-18 | 2008-08-18 | Electrolytic plating jig and electrolytic plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5487576B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021021126A (en) * | 2019-07-30 | 2021-02-18 | 三共株式会社 | Plating jig, and plating method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07188998A (en) * | 1993-12-28 | 1995-07-25 | Fujikura Ltd | Electroplating method and device therefor |
| JPH09195093A (en) * | 1996-01-09 | 1997-07-29 | Ibiden Co Ltd | Continuous electrolytic device |
| JPH09195092A (en) * | 1996-01-09 | 1997-07-29 | Ibiden Co Ltd | Continuous electrolytic device |
| JP2008038240A (en) * | 2006-08-07 | 2008-02-21 | Taiyo Yuden Co Ltd | Method of plating chip-shaped electronic component |
| JP2010270381A (en) * | 2009-05-25 | 2010-12-02 | Kida Seiko Kk | Holder for plating cylindrical and sac-like workpiece |
-
2008
- 2008-08-18 JP JP2008209549A patent/JP5487576B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010043340A (en) | 2010-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6077886B2 (en) | Plating equipment | |
| EP1369099B1 (en) | Improvements in stent manufacture | |
| JP2012505965A (en) | Metal anodizing treatment method and system | |
| JP4719497B2 (en) | Electrolytic plating method and electrolytic plating line | |
| JP5487576B2 (en) | Electrolytic plating jig and electrolytic plating method | |
| JP4813935B2 (en) | Transport hanger | |
| JP2013237890A (en) | Pretreatment method for plating of steel wire for arc welding | |
| CN106521611B (en) | Electroplating device with automatic stripping and hanging system | |
| JP3895707B2 (en) | Plating apparatus and plating method | |
| JP6695264B2 (en) | Plating apparatus, plating method and plated product manufacturing method | |
| CN103290447A (en) | Pre-copper plating second-order up-flowing process | |
| TW202243561A (en) | Electroless nickel immersion gold manufacturing method and system capable of reducing chemical processing steps capable of reducing the consumption of cleaning water and various chemicals and reducing expenditure costs | |
| KR20050088620A (en) | Substrate hanger rack structure of plating apparatus | |
| JP2019031701A (en) | Hot-dip galvanizing treatment method | |
| JP5164694B2 (en) | Plating method | |
| US664550A (en) | Electrolytic treatment of iron for preservation thereof. | |
| KR102057507B1 (en) | Plating system | |
| JP7419983B2 (en) | Mold surface treatment method | |
| KR102031042B1 (en) | A electroless plating jig for terminal plate | |
| JPS5919991B2 (en) | Two-stage pickling method for pure silicon steel materials | |
| JPH09195092A (en) | Continuous electrolytic device | |
| CN217600878U (en) | A get and hang device for electroplating production line | |
| SU926081A1 (en) | Apparatus for making parts by electroplating | |
| JP3918156B2 (en) | Chromium-plated component manufacturing method and chrome-plated component | |
| JP2007239063A (en) | METHOD OF MANUFACTURING Sn-Zn PLATING STEEL PLATE |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110812 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130809 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130820 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131017 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131112 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131224 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140128 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140210 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5487576 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |