TW202243561A - Electroless nickel immersion gold manufacturing method and system capable of reducing chemical processing steps capable of reducing the consumption of cleaning water and various chemicals and reducing expenditure costs - Google Patents
Electroless nickel immersion gold manufacturing method and system capable of reducing chemical processing steps capable of reducing the consumption of cleaning water and various chemicals and reducing expenditure costs Download PDFInfo
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本發明為一種電路板製造之技術領域,尤其指一種涉及化學鎳金所採用之製程及系統。The invention relates to the technical field of circuit board manufacturing, in particular to a process and system used in electroless nickel and gold.
化學鎳金(Electroless Nickel/Immersion Gold,簡寫為ENIG,又稱化鎳金、沉鎳金或者無電鎳金)是通過化學反應在銅的表面置換鈀,再在鈀核的基礎上化學沉積一層鎳磷合金層,然後再通過置換反應在鎳的表面置換上一層金。化學鎳金主要用於電路板後續組裝製程的表面處理。Electroless Nickel/Immersion Gold (Electroless Nickel/Immersion Gold, abbreviated as ENIG, also known as chemical nickel gold, immersion nickel gold or electroless nickel gold) replaces palladium on the surface of copper through a chemical reaction, and then chemically deposits a layer of nickel on the basis of the palladium core. Phosphorus alloy layer, and then a layer of gold is replaced on the surface of nickel by displacement reaction. Electroless nickel gold is mainly used for surface treatment of circuit board subsequent assembly process.
化學鎳金製程在電路板加工中的處理流程包括:前處理、化學沉積和後處理。前處理的步驟包括:刷磨→水洗→噴砂→水洗→超音波清洗→微蝕→水洗→酸洗→水洗→吹乾→烘乾。化學沉積的步驟包括:清潔→水洗→微蝕→水洗→前酸浸→水洗→預浸→活化→水洗→後酸浸→水洗→化學沉積鎳→水洗→化學沉積金→水洗→乾燥。後處理的步驟包括:酸洗→水洗→超音波清洗→水洗→吹乾→烘乾。The treatment process of the chemical nickel gold process in the circuit board processing includes: pre-treatment, chemical deposition and post-treatment. The pre-treatment steps include: brushing→water washing→sandblasting→water washing→ultrasonic cleaning→microetching→water washing→pickling→water washing→drying→drying. The steps of chemical deposition include: cleaning → water washing → microetching → water washing → pre-acid leaching → water washing → pre-soaking → activation → water washing → post-acid leaching → water washing → chemical deposition of nickel → water washing → chemical deposition of gold → water washing → drying. The post-processing steps include: pickling→water washing→ultrasonic cleaning→water washing→drying→drying.
因此習用化學鎳金製程所採用的系統就必須包括三組設備,分別為前處理設備(如圖1A所示)、化學沉積設備(如圖1B所示)及後處理設備(如圖1C所示)。前處理設備包括:刷磨槽101、水洗槽102、噴砂槽103、水洗槽104、超音波清洗槽105、微蝕槽106、水洗槽107、酸洗槽108、水洗槽109、吹乾槽110、烘乾槽111。當電路板淨化後,須由人工將電路板逐片放置於一吊籃200內。Therefore, the system used in the conventional chemical nickel-gold process must include three sets of equipment, namely pre-processing equipment (as shown in Figure 1A), chemical deposition equipment (as shown in Figure 1B) and post-processing equipment (as shown in Figure 1C ). The pre-treatment equipment includes:
化學沉積設備包括:清潔槽121及數水洗槽122、微蝕槽123及數水洗槽124、前酸浸槽125、水洗槽126、預浸槽127、活化槽128、水洗槽129、交換槽130、後酸浸槽131、水洗槽132、化學沉積鎳槽133、數水洗槽134、化學沉積金槽135、數水洗槽136、乾燥槽137。生產作業方式是將已放置複數片(例如20~40片)電路板的吊籃200,利用兩台吊第一移行車201、第二吊移行車202依序移動至前述反應槽室之間,帶動吊籃200垂直上升或下降。當吊籃200由第一吊移行車201依序移動至交換位槽127後,將由第二吊移行車202接手移動至後續反應槽室內作業。Chemical deposition equipment includes:
後處理設備包括:酸洗槽141、水洗槽142、超音波清洗槽143、水洗槽144、吹乾槽145、烘乾槽146。在後處理過程中,仍必須由人工自吊籃200內逐片取出電路板,放置設備中依序進行相關作業。The post-processing equipment includes: a
綜合以上所述,在上述三道加工流程中,如前處理、化學沉積和後處理皆必須使用大量清洗水及化學藥水,不僅費用高,且使用後廢水的收回再處理,又是一筆費用。另外過程中皆必須利用人力進行於吊籃中移出或移入電路板的作業,費時又費工。Based on the above, in the above three processing processes, such as pre-treatment, chemical deposition and post-treatment, a large amount of cleaning water and chemical solutions must be used. Not only is the cost high, but also the recovery and reprocessing of waste water after use is another cost. In addition, manpower must be used to remove or move the circuit board in the hanging basket, which is time-consuming and labor-intensive.
在化學鎳金製程的前一道製程為綠漆(Solder Mask)製程。電路板在綠漆製程最後會有一道烘烤處理程序,溫度為攝氏180度,烘烤時間為50分鐘,烘烤處理完後電路板表面已嚴重氧化,且因生產時程安排的因素,而將電路板暫時放置在一旁,時間可能長達數小時至一天,電路板表面因此加重氧化及被環境汙染,故電路板在進行化學鎳金製程時,會有刷磨、噴砂、微蝕、酸洗等程序以去除電路板表面的氧化層。再者,習用化學鎳金製程分為三道加工流程:前處理、化學沉積、後處理,在每道加工流程之間都會等待放置一段時間及人工搬運接觸的問題造成電路板表面氧化和汙染,故在化學沉積和後處理的加工流程,都會在加工流程前段加入微蝕或酸洗或超音波清洗等程序,目的都是在去除電路板表面的氧化層和汙染物。The previous process of the chemical nickel gold process is the green paint (Solder Mask) process. The circuit board will have a baking process at the end of the green paint process. The temperature is 180 degrees Celsius and the baking time is 50 minutes. Putting the circuit board aside temporarily may take several hours to a day, and the surface of the circuit board will be more oxidized and polluted by the environment. Therefore, when the circuit board is undergoing the chemical nickel-gold process, there will be brushing, sandblasting, micro-etching, acid Washing and other procedures to remove the oxide layer on the surface of the circuit board. Furthermore, the conventional chemical nickel-gold process is divided into three processing processes: pre-treatment, chemical deposition, and post-processing. Between each processing process, there will be a waiting period of time and the problem of manual handling and contact will cause the surface of the circuit board to oxidize and pollute. Therefore, in the process of chemical deposition and post-treatment, procedures such as micro-etching, pickling or ultrasonic cleaning are added in the early stage of the process to remove the oxide layer and pollutants on the surface of the circuit board.
為此本發明人思考改良的方法,針對製程中所使用的化學沉積槽設計了幾種逐片連續生產的化學沉積設備,分別申請且獲准專利,為發明證書第I661753號之『運用載具採逐片連續生產的化學沉積方法及設備』及發明證書第I689523號之『水平斜置方式逐片連續生產的化學沉積設備及方法』。如此大大減少了昂貴之化學藥水的使用量。但本發明人並不因此而自滿,由於此過程中仍須使用前處理及後處理設備,本發明人思考若能將整組化學鎳金製程系統加以整合為單一系統,必能減少多道去除氧化層及汙染物的工序,產生更大的效益。For this reason, the inventor of the present invention thought about an improved method, and designed several chemical deposition equipment for continuous production one by one for the chemical deposition tank used in the manufacturing process, and applied for and obtained patents respectively. Chemical deposition method and equipment for piece-by-piece continuous production” and Invention Certificate No. I689523 “Chemical deposition equipment and method for piece-by-piece continuous production in horizontal inclined mode”. This greatly reduces the amount of expensive chemicals used. But the inventor is not complacent because of this, because pre-processing and post-processing equipment must be used in this process, the inventor thinks that if the entire group of chemical nickel-gold process systems can be integrated into a single system, it will be possible to reduce multiple removal processes. The process of removing oxide layer and pollutants produces greater benefits.
本發明之主要目的係提供一種可以減少化學處理步驟的化學鎳金製程方法及系統,主要是將原有製程設備與本發明先前設計採逐片連續生產的化學沉積設備加以重新組織及整合,產生一種創新的化學鎳金製程方法及系統,如此可同步減少清洗水及各類化學藥劑的使用量,節省使用量相對減少支出成本,而且減少多道工序,對電力、人工、化學廢液及廢水處理的成本也產生了顯著地減少。The main purpose of the present invention is to provide a chemical nickel-gold process method and system that can reduce chemical treatment steps, mainly by reorganizing and integrating the original process equipment with the chemical deposition equipment previously designed in the present invention for continuous production piece by piece, resulting in An innovative chemical nickel-gold process method and system, which can simultaneously reduce the consumption of cleaning water and various chemicals, save consumption and reduce expenditure costs, and reduce multiple processes. The cost of handling also results in a significant reduction.
為實現前述目的,本發明採用了如下技術方案:To achieve the aforementioned object, the present invention adopts the following technical solutions:
本發明為一種可減少化學處理步驟的化學鎳金製程方法,其步驟包括將電路板板逐片採用水平輸送方式進行:酸性清潔、水洗、微蝕、水洗、噴砂、超音波清洗、水洗、前酸浸、水洗、預浸、活化、水洗、後酸浸、水洗,之後翻轉電路板成垂直狀且採用逐片連續移動方式進行:化學沉積鎳、水洗、化學沉積金、回收水洗,之後再翻轉電路板逐片採用水平輸送方式進行:水洗、吹乾、烘乾等作業。The present invention is a chemical nickel-gold process method that can reduce chemical treatment steps. The steps include carrying out the circuit boards one by one in a horizontal conveying manner: acid cleaning, water washing, micro-etching, water washing, sandblasting, ultrasonic cleaning, water washing, pre-processing Acid leaching, water washing, pre-soaking, activation, water washing, post-acid leaching, water washing, and then turning the circuit board into a vertical shape and adopting a piece-by-piece continuous movement method: chemical deposition of nickel, water washing, chemical deposition of gold, recycling water washing, and then turning over The circuit boards are carried out by horizontal conveying method one by one: washing, drying, drying and other operations.
再者,本發明為一種可減少化學處理步驟的化學鎳金製程系統,是由依序串聯並排的酸性清潔槽、第一水洗槽、微蝕槽、第二水洗槽、噴砂槽、超音波清洗槽、第三水洗槽、前酸浸槽、第四水洗槽、預浸槽、活化槽、第五水洗槽、後酸浸槽、第六水洗槽、化學沉積鎳槽、第七水洗槽、化學沉積金槽、回收水洗槽、第八水洗槽、吹乾槽、烘乾槽所構成。Furthermore, the present invention is a chemical nickel-gold process system that can reduce chemical treatment steps. It is composed of an acid cleaning tank, a first washing tank, a micro-etching tank, a second washing tank, a sandblasting tank, and an ultrasonic cleaning tank arranged in series. , third washing tank, pre-acid leaching tank, fourth washing tank, pre-soaking tank, activation tank, fifth washing tank, post-acid leaching tank, sixth washing tank, chemical deposition nickel tank, seventh washing tank, chemical deposition Gold tank, recycling washing tank, eighth washing tank, drying tank, and drying tank.
作為較佳優選實施方案之一,化學沉積鎳槽與化學沉積金槽是使用一種逐片連續生產的化學沉積設備。As one of the preferred embodiments, the chemical deposition nickel tank and the chemical deposition gold tank use a piece-by-piece continuous production of chemical deposition equipment.
與現有技術相比,本發明具有下列具體的功效: 1. 本發明的設計能省去習用前處理中的刷磨、水洗、微蝕、水洗、酸洗、水洗、吹乾、烘乾及人工收集電路板等作業及工序,相對地省節包括化學藥水、清洗水、電力、人工、化學廢液及廢水處理等成本。 2. 本發明的設計也能節省習用後處理中的酸洗、超音波清洗等工序,相對地節省包括化學藥水、清洗水、電力、人工、化學廢液及廢水處理等成本。 3.本發明將原本前處理設備、化學沉積設備及後處理設備三個設備整合為單一個系統所取代,減少了多項設備的成本支出,也由於整合為單一系統,設備長度因而縮短,使所需廠房面積減少,也讓廠房的空間能更有效的運用。 4. 運用本發明其所產出的電路板,表面光澤度較為光亮,但以掃描式電子顯微鏡(SEM)觀察,其沉積金層的結構較為粗糙, Compared with the prior art, the present invention has the following specific effects: 1. The design of the present invention can save operations and procedures such as brushing, water washing, micro-etching, water washing, pickling, water washing, blow-drying, drying and manual collection of circuit boards in the conventional pre-treatment, and relatively saves chemical The cost of liquid medicine, cleaning water, electricity, labor, chemical waste liquid and wastewater treatment. 2. The design of the present invention can also save the pickling, ultrasonic cleaning and other processes in the conventional post-treatment, and relatively save costs including chemical liquid, cleaning water, electricity, labor, chemical waste liquid and wastewater treatment. 3. The present invention integrates the original pre-processing equipment, chemical deposition equipment and post-processing equipment into a single system, which reduces the cost of a number of equipment, and because of the integration into a single system, the length of the equipment is shortened, making all The required factory area is reduced, and the space of the factory can be used more effectively. 4. Using the circuit board produced by the present invention, the surface gloss is relatively bright, but observed with a scanning electron microscope (SEM), the structure of the deposited gold layer is relatively rough,
下面將結合具體實施例和附圖,對本發明的技術方案進行清楚、完整地描述。本文所使用的所有技術和科學術語與屬於本發明技術領域的技術人員通常理解的含義相同。本文中所使用的術語只是為了描述具體實施例的目的,不是旨在限制本發明。本文所使用的術語「和/或」包括一個或多個相關的所列項目的任意的和所有的組合。The technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments and accompanying drawings. All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
首先對製程中所使用的名詞作一簡單說明: 酸性清潔是利用有機酸或無機酸去電路板上銅面輕微氧化物。微蝕 (Micor-etching):是由微蝕液去除電路板上銅面氧化層。酸洗(Acid dip):浸泡於稀硫酸液以去除微蝕後的銅面氧化物。預浸( Pre-dip):浸泡於反應液中,使銅面無氧化物存在。活化:在銅面置換一層鈀,以作為化學鎳反應之觸媒。化學沉積鎳:在銅面鍍上一層含鎳的合金,作為阻絕金與銅之間遷移 ( Migration ) 或擴散 ( Diffusion ) 的障蔽層。化學沉積金:於在銅面上的鎳面置換沉積出金層。First, a brief description of the terms used in the process: Acid cleaning is the use of organic or inorganic acids to remove slight oxides on the copper surface of the circuit board. Microetching (Micor-etching): It is a microetching solution to remove the oxide layer of the copper surface on the circuit board. Pickling (Acid dip): Soak in dilute sulfuric acid to remove oxides on the copper surface after microetching. Pre-dip (Pre-dip): Soak in the reaction solution to make the copper surface free of oxides. Activation: Replace a layer of palladium on the copper surface as a catalyst for chemical nickel reaction. Electroless nickel deposition: A nickel-containing alloy is plated on the copper surface as a barrier layer to prevent migration (Migration) or diffusion (Diffusion) between gold and copper. Electroless gold deposition: a gold layer is deposited on the nickel surface on the copper surface.
如圖2所示,為本發明可減少化學處理步驟的化學鎳金製程的流程圖。其步驟包括將電路板依序進行酸性清潔301、水洗302、微蝕303、水洗304、噴砂305、超音波清洗306、水洗307、前酸浸308、水洗309、預浸310、活化311、水洗312、後酸浸313、水洗314、化學沉積鎳315、水洗316、化學沉積金317、回收水洗318、水洗319、吹乾320、烘乾321等作業。As shown in FIG. 2 , it is a flowchart of the chemical nickel-gold process that can reduce chemical treatment steps in the present invention. The steps include
本發明的設計是經由上述流程,讓最初電路板,經一系列的化學鎳金製程步驟,完成電路板的表面處理作業。為此,電路板須採逐片水平輸送方式進行酸性清潔301、水洗302、微蝕305、水洗306、噴砂307、超音波清洗308、水洗309、前酸浸308、水洗309、預浸310、活化311、水洗312、後酸浸313、水洗314等步驟。The design of the present invention is to allow the initial circuit board to undergo a series of chemical nickel-gold process steps to complete the surface treatment of the circuit board through the above process. For this reason, the circuit board must be acid-cleaned 301, washed 302, micro-etched 305, washed 306, sand blasted 307, ultrasonic cleaned 308, washed 309, pre-acid leached 308, washed 309, pre-dipped 310,
接著,電路板將被翻轉為垂直狀且採用逐片連續移動方式進行:、化學沉積鎳315、水洗316、化學沉積金317、回收水洗318等步驟。Next, the circuit board will be turned upside down and carried out in a continuous moving manner one by one:
之後再將電路板再翻轉為水平狀並採用水平輸送方式進行: 水洗319、吹乾320、烘乾321等步驟。Afterwards, the circuit board is turned over again to be horizontal and carried out by means of horizontal transportation: washing 319 , drying 320 , drying 321 and other steps.
如圖3、圖4所示,為本發明可減少化學處理步驟的化學鎳金製程系統的側視圖及俯視圖。該系統包括依序串聯並排的酸性清潔槽401、第一水洗槽402、微蝕槽403、第二水洗槽404、噴砂槽405、超音波清洗槽406、第三水洗槽407、前酸浸槽408、第四水洗槽409、預浸槽410、活化槽411、第五水洗槽412、後酸浸槽413、第六水洗槽414、化學沉積鎳槽415、第七水洗槽416、化學沉積金槽417、回收水洗槽418、第八水洗槽419、吹乾槽420、烘乾槽421。各槽皆設有相關輸送機構以將電路板呈水平或垂直狀送至各槽內進行處理。另外上述所列之水洗槽並非僅限單一槽體,可視清洗需要串聯1~5個,達到所需之潔淨度。As shown in Fig. 3 and Fig. 4, it is a side view and a top view of the chemical nickel-gold process system which can reduce the chemical treatment steps of the present invention. The system includes an
再者,酸性清潔槽401、第一水洗槽402、微蝕槽403、第二水洗槽404、噴砂槽405、超音波清洗槽406、第三水洗槽407、前酸浸槽408、第四水洗槽409、預浸槽410、活化槽411、第五水洗槽412、後酸浸槽413、第六水洗槽414是本身於槽內設有水平輸送機構,以利電路板呈水平狀依序逐片進入各槽中進行相關的清洗、活化電路板表面等程序。之後電路板由水平翻轉為垂直狀且採逐片移動方式於各槽至進行沉積、清洗等作業。其中化學沉積鎳槽415及化學沉積金槽417可採用本發明人先前設計的逐片連續生產的化學沉積設備。之後再將電路板翻轉成水平狀,經第八水洗槽419、吹乾槽420、烘乾槽421內本身設置的水平輸送機構,呈水平狀依序進行水洗、吹乾、烘乾等作業。Furthermore, the
運用本發明的製程流程,其所產出的電路板,表面光澤度較為光亮,但以掃描式電子顯微鏡(SEM)觀察,其沉積金層的結構較為粗糙,但此並不會影響後續加工的良率,廠商可採依本身的需求選用適合的製程。Using the process flow of the present invention, the surface gloss of the circuit board produced is relatively bright, but the structure of the deposited gold layer is relatively rough when observed by a scanning electron microscope (SEM), but this will not affect the quality of subsequent processing. Yield rate, manufacturers can choose a suitable process according to their own needs.
由上述之說明可知,使用本發明化學鎳金製程,並不需分拆幾道不同的工序且於不同的設備中進行。單一電路板送入本發明之系統,依照本發明之製程步驟,即可利用化學鎳金製程完成電路板的表面處理,與習用相較,大幅減少多道流程及設備,如前處理中的刷磨、水洗、微蝕、水洗、酸洗、水洗、吹乾、烘乾及後處理中的酸洗、超音波清洗等,大量減少化學藥水及清洗水的使用量,讓廠商降低生產的成本,該成本包括化學藥水、清洗水、電力、人工、化學廢液及廢水處理等成本,進而讓生產更具市場競爭力的產品,符合專利之申請要件。From the above description, it can be known that using the chemical nickel-gold process of the present invention does not need to separate several different processes and carry out in different equipments. A single circuit board is fed into the system of the present invention. According to the process steps of the present invention, the surface treatment of the circuit board can be completed by using the chemical nickel-gold process. Grinding, water washing, micro-etching, water washing, pickling, water washing, drying, drying and post-processing pickling, ultrasonic cleaning, etc., greatly reduce the use of chemical medicine and cleaning water, allowing manufacturers to reduce production costs, The cost includes the cost of chemical potion, cleaning water, electricity, labor, chemical waste liquid and wastewater treatment, etc., so that the production of products with more market competitiveness meets the requirements for patent application.
以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施例之範圍。即凡依本發明申請專利範圍所作的均等變化及修飾,皆為本發明之專利範圍所涵蓋。The above are only preferred embodiments of the present invention, and are not intended to limit the scope of the embodiments of the present invention. That is, all equivalent changes and modifications made according to the patent scope of the present invention are covered by the patent scope of the present invention.
101:刷磨槽 102:水洗槽 103:噴砂槽 104:水洗槽 105:超音波清洗槽 106:微蝕槽 107:水洗槽 108:酸洗槽 109:水洗槽 110:吹乾槽 111:烘乾槽 121:清潔槽 122:水洗槽 123:微蝕槽 124:水洗槽 125:前酸浸槽 126:水洗槽 127:預浸槽 128:活化槽 129:水洗槽 130:交換位槽 131:後酸浸槽 132:水洗槽 133:化學沉積鎳槽 134:水洗槽 135:化學沉積金槽 136:水洗槽 137:乾燥槽 141:酸洗槽 142:水洗槽 143:超音波清洗槽 144:水洗槽 145:吹乾槽 146:烘乾槽 200:吊籃 201:第一吊移行車 202:第二吊移行車 301:酸性清潔 302:水洗 303:微蝕 304:水洗 305:噴砂 306:超音波清洗 307:水洗 308:前酸浸 309:水洗 310:預浸 311:活化 312:水洗 313:後酸浸 314:水洗 315:化學沉積鎳 316:水洗 317:化學沉積金 318:回收水洗 319:水洗 320:吹乾 321:烘乾 401:酸性清潔槽 402:第一水洗槽 403:微蝕槽 404:第二水洗槽 405:噴砂 406:超音波清洗 407:第三水洗槽 408:前酸浸槽 409:第四水洗槽 410:預浸槽 411:活化槽 412:第五水洗槽 413:後酸浸槽 414:第六水洗槽 415:化學沉積鎳槽 416:第七水洗槽 417:化學沉積金槽 418:回收水洗槽 419:第八水洗槽 420:吹乾槽 421:烘乾槽 101: Brush grinding groove 102: washing tank 103: Sand blasting tank 104: washing tank 105: Ultrasonic cleaning tank 106: micro-etching groove 107: washing tank 108: pickling tank 109: washing tank 110: Blow drying tank 111: drying tank 121: cleaning tank 122: washing tank 123: micro-etching groove 124: washing tank 125: Front pickling tank 126: washing tank 127: Prepreg tank 128: activation tank 129: washing tank 130: exchange position slot 131: post-acid leaching tank 132: washing tank 133: Electroless nickel deposition bath 134: washing tank 135: Chemical deposition gold tank 136: washing tank 137: drying tank 141: pickling tank 142: washing tank 143: Ultrasonic cleaning tank 144: washing tank 145: Blow drying tank 146: drying tank 200: hanging basket 201: The first crane moves the crane 202: The second crane moves the crane 301: acid cleaning 302: washed 303: Microetching 304: washed 305: sandblasting 306: Ultrasonic cleaning 307: washed 308: Pre-pickling 309: washed 310: Prepreg 311: activation 312: washed 313: post acid leaching 314: washed 315: Electroless nickel deposition 316: washed 317: Chemically deposited gold 318: Recycled washing 319: washed 320: blow dry 321: drying 401: acid cleaning tank 402: The first washing tank 403: micro-etching groove 404: Second washing tank 405: sandblasting 406: Ultrasonic cleaning 407: The third washing tank 408: Front pickling tank 409: The fourth washing tank 410: prepreg tank 411: activation tank 412: Fifth washing tank 413: post-acid leaching tank 414: The sixth washing tank 415: Electroless nickel deposition bath 416: The seventh washing tank 417: Chemical deposition gold bath 418: Recycling washing tank 419: Eighth washing tank 420: Blow drying tank 421: drying tank
圖1A為習用化學鎳金製程所採用的前處理設備的側視圖。FIG. 1A is a side view of the pre-processing equipment used in the conventional chemical nickel-gold process.
圖1B為習用化學鎳金製程所採用的化學沉積設備的側視圖。FIG. 1B is a side view of an electroless deposition equipment used in a conventional electroless Ni-Au process.
圖1C為習用化學鎳金製程所採用的後處理設備的側視圖。FIG. 1C is a side view of the post-processing equipment used in the conventional electroless Ni-Au process.
圖2為本發明可減少化學處理步驟的化學鎳金製程的流程圖。FIG. 2 is a flow chart of the chemical nickel-gold process that can reduce chemical treatment steps in the present invention.
圖3為本發明可減少化學處理步驟的化學鎳金製程系統的側視圖。FIG. 3 is a side view of the chemical nickel-gold process system capable of reducing chemical processing steps according to the present invention.
圖4為本發明可減少化學處理步驟的化學鎳金製程系統的俯視圖。FIG. 4 is a top view of an electroless nickel-gold process system capable of reducing chemical processing steps according to the present invention.
301:酸性清潔 301: acid cleaning
302:水洗 302: washed
303:微蝕 303: Microetching
304:水洗 304: washed
305:噴砂 305: sandblasting
306:超音波清洗 306: Ultrasonic cleaning
307:水洗 307: washed
308:前酸浸 308: Pre-pickling
309:水洗 309: washed
310:預浸 310: Prepreg
311:活化 311: activation
312:水洗 312: washed
313:後酸浸 313: post acid leaching
314:水洗 314: washed
315:化學沉積鎳 315: Electroless nickel deposition
316:水洗 316: washed
317:化學沉積金 317: Chemically deposited gold
318:回收水洗 318: Recycled washing
319:水洗 319: washed
320:吹乾 320: blow dry
321:烘乾 321: drying
Claims (3)
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CN116970933A (en) * | 2023-07-31 | 2023-10-31 | 信丰福昌发电子有限公司 | Gold precipitation process for production of automobile main control circuit board |
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CN116970933A (en) * | 2023-07-31 | 2023-10-31 | 信丰福昌发电子有限公司 | Gold precipitation process for production of automobile main control circuit board |
CN116970933B (en) * | 2023-07-31 | 2024-04-09 | 信丰福昌发电子有限公司 | Gold precipitation process for production of automobile main control circuit board |
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