KR100626827B1 - A process system for conductive metal plated polyimide substrate - Google Patents

Abstract

A system for fabricating conductive metal plated polyimide film is provided to improve physical properties including releasing strength, to prevent the film from being twisted or distorted, and to smoothly transport the film. A system consists of a processing device part for automatically feeding the polyimide film, and a washing device part. The system comprises: an unwinding part(2) that has an unwinding device(100) for transporting polyimide film(5) from a film roll(111); a cleaning part(10) that has a cleaning device(11) and a washing device(12) to clean and wash surface of the polyimide film; an etching part(20) that repeatedly etches and washes the surface of the polyimide film; a neutralizing part(30) that neutralizes and washes the polyimide film after surface etching; a coupling part(40) that conducts acid coupling and washes the polyimide film by a coupling device(41) and an acid washing device(42); a catalyst adding part(50) that makes catalyst adsorbed and washes the polyimide film by an activation device(51) and a washing device(52); a bottom plating part(60) that forms first conductive metal layer on surface of the polyimide film by a bottom plating device(61); a plating part(70) that forms second conductive metal layer on the polyimide film by a plating device(71); a drying part(80) that dries the polyimide film by a dryer(400); an auxiliary driving part(90) that applies transportation force to the polyimide film; and a winding part(3) that winds the completed film around a winding roll after adding a protective film to the film.

Description

Conductive Metal-Plated Polyimide Film Manufacturing System {A PROCESS SYSTEM FOR CONDUCTIVE METAL PLATED POLYIMIDE SUBSTRATE}

1 is a process chart showing a conductive metal plated polyimide film production system according to the present invention.

2 to 7 is an enlarged partial view showing the main portion of the conductive metal plated polyimide film production system according to the present invention, respectively.

Explanation of symbols on the main parts of the drawings

1: Conductive Metal Plating Polyimide Film Manufacturing System 2: Unwinding Process

3: Winding process part 5: Polyimide film 6.8: Protective film

7: conductive metal-plated polyimide film 10: degreasing process

20: etching step 30: neutralization step 40: coupling step

50: catalyst imparting process 60: lower plating process 70: plating process

80: drying process unit 90: auxiliary drive unit 100: unwinding device housing

200: function execution device 300: flushing device 400: winding device

500: auxiliary drive

The present invention relates to a conductive metal plated polyimide film production system for plating a conductive metal on a single surface or both surfaces of a polyimide film wound in a roll by a wet method.

In more detail, a degreasing process, an etching process, a neutralization process, a coupling process, a catalyst, which comprises a process execution device for performing a specific process and a water washing device for washing with water, while supplying a polyimide film wound in a roll shape, The application process, the lower plating process and the plating process are carried out sequentially and continuously to plate the conductive metal on one or both sides of the polyimide film by a wet method, and the polyimide film coated with the conductive metal is dried by a drying apparatus. An object of the present invention is to provide a conductive metal plated polyimide film production system for winding a dried plated polyimide film onto a winding roll by a winding device.

The conductive metal plated polyimide substrate is the most important material for manufacturing a flexible printed circuit (FPC), and the representative one is a flexible copper clad laminate (FCCL). And the like).

In general, FPC uses polyester, polyimide, liquid crystal polymer, and fluororesin film as an insulating film layer. Among them, polyimide film having excellent heat resistance, dimensional stability, and solderability is preferred.

Examples of the conductive metal material laminated on the outer surface of the insulating film layer (polyimide film) include gold and copper having low electrical resistance and excellent conductivity, and copper which is advantageous in terms of price is mainly used.

On the other hand, FCCL is composed of a polyimide layer layer and a conductive metal layer (copper thin film layer) laminated on the outer surface thereof. The two-layered FCCL composed of (copper thin film layer) and the two-layered FCCL composed of polyimide layer and conductive metal layer (copper thin film layer) are roughly classified into two types.

However, in terms of physical properties, the three-layer type FCCL has difficulty in forming a fine pattern after the completion of a circuit, has a problem of poor flexibility, and can also be subjected to a high temperature process such as soldering due to the low heat resistance of the adhesive. There is no problem, and due to these problems, a two-layer type FCCL is preferred.

As a method of manufacturing FCCL, a lamination manufacturing method, a casting manufacturing method, a plating manufacturing method, and the like are known.

In the above laminate manufacturing method, by applying an adhesive consisting of a liquid polyimide as a main component on a polyimide film, baking in an oven to fix the adhesive, by placing a copper thin film on the outside of the adhesive and thermally pressing with a press to laminate FCCL It is a method of manufacturing.

The casting manufacturing method is a method of coating liquid polyimide on a copper thin film, casting, and manufacturing a laminated FCCL.

Plating production method is a method for producing FCCL by directly forming a copper layer on a polyimide film in a plating environment.

In the manufacturing method of the FCCL as described above, the laminated manufacturing method and the casting manufacturing method has a problem that the kind of polyimide film and adhesive that can be used in each method is limited.

On the contrary, the plating manufacturing method does not require a commercially available copper thin film, but also has an advantage of being able to be manufactured while controlling the thickness of the copper thin film during plating.

However, the FCCL produced by the plating method known to date has a problem that the physical properties such as peel strength is lower than the physical properties such as peel strength of the FCCL produced by other methods, such that FCCL improved physical properties such as peel strength, A conductive plating polyimide film is eagerly needed.

The present invention is to provide a conductive metal-plated polyimide film manufacturing system with a significant improvement in physical properties by solving the problem as described above.

The present invention provides a degreasing process unit, an etching process unit, a neutralization process unit, a coupling process unit, and a catalyst, each comprising a process execution apparatus for performing a specific process and a water washing apparatus for washing with water while supplying a polyimide film wound in a roll shape. The coating process part, the lower plating process part and the plating process part are carried out sequentially and continuously to plate the conductive metal on one or both sides of the polyimide film, and the polyimide film plated with the conductive metal is dried by a drying device, and dried. An object of the present invention is to provide a conductive metal-plated polyimide film manufacturing system for winding the plated polyimide film on a winding roll by a winding device unit.

Another object of the present invention, while moving the polyimide film to be supplied a predetermined liquid material in the degreasing step, the etching step, the neutralization step, the coupling step, the catalyst applying step, the bottom plating step, the plating step When washing with water after each passing, by performing a wet method of repeatedly washing the water by passing the polyimide film in the immersion state of the liquid material and immersing and withdrawing it in the washing water, physical properties such as peel strength are improved. The present invention provides a conductive metal plated polyimide film production system capable of producing a two-layer FCCL.

Still another object of the present invention is to immerse a predetermined liquid material in a degreasing step, an etching step, a neutralization step, a coupling step, a catalyst applying step, a lower plating step, and a plating step while moving the polyimide film. When passing it through, the immersion time (passing time) can be shortened or lengthened according to the characteristics of each process so that the characteristics of each process can be efficiently carried out, and the polyimide film withdrawn from the liquid material and moved to the washing process can be pressed. The present invention provides a system for manufacturing a conductive metal plated polyimide film capable of preventing inflow and leakage of liquid materials into a process other than a reaction tank by squeezing one or both surfaces thereof.

Still another object of the present invention is to twist the polyimide film by adjusting the tension while moving the movable roller provided between the fixed rollers up and down during the unwinding step of supplying the polyimide film and the winding-up step of discharging. The present invention provides a conductive metal-plated polyimide film manufacturing system capable of smoothly transferring a polyimide film by discharging the at least one auxiliary driving device at a predetermined position of the process unit so as to be transported without twisting or twisting.

The above and other objects of the present invention,

In coating a conductive metal on the outer surface while supplying the polyimide film 5,

A unwinding process unit 2 provided with a unwinding device 100 for controlling and conveying the tension while separating the polyimide film 5 wound on the roll 111 from the protective film 6;

A degreasing step (10) for degreasing and washing the surface of the polyimide film (5) supplied from the unwinding step (2) by a degreasing device (11) and a water washing device (12) to remove foreign substances;

Etching process part for repeatedly etching and washing the surface of the polyimide film 5 to which the foreign matter is removed and transported by the first etching apparatus 23, the second etching apparatus 25, and the water washing apparatus 24, 26. 20;

A neutralization step part 30 for neutralizing and washing the polyimide film 5 whose surface is etched and transported by the neutralization device 31 and the water washing device 32;

A coupling process part 40 for coupling and washing the surface of the polyimide film 5 which is neutralized and conveyed by a coupling agent and an acid by the coupling device 41 and the pickling device 42;

A catalyst imparting step (50) for adsorbing and washing the catalyst to the polyimide film (5) whose surface is coupled and conveyed by the activator (51) and the water washing device (52);

A lower plating process part 60 for forming a first conductive metal layer on the surface of the polyimide film 5 to which the catalyst is adsorbed and transported by the lower plating device 61 and the water washing device 62 and washing the water;

A plating process unit 70 for forming a second conductive metal layer by the plating apparatus 71 and the washing device 72 to which a current is applied to the polyimide film 5 to which the first conductive metal layer is formed and transported;

A drying process unit 80 for drying the polyimide film 5, on which the second conductive metal layer is formed and transported, by the drying apparatus 400;

An auxiliary driving unit 90 for adding a feeding force to the polyimide film 5 to be transported by installing the auxiliary driving device 600 in the middle of a predetermined process unit;

Winding process unit for the conductive metal plated polyimide film 7 formed by completely drying the second conductive metal layer 7 is added to the protective film 8 by the winding device 400 and wound around the winding roll 460 while adjusting the tension. It is achieved by the conductive metal plated polyimide film production system (1), characterized in that it comprises (3).

The above and other objects and features of the present invention will be more clearly understood by the following detailed description based on the accompanying drawings.

1 to 7 is an exemplary view showing a conductive metal-plated polyimide film production system 1 according to the present invention, Figure 1 is a process diagram showing the present invention, Figures 2 to 7 are the main part of the present invention Partly enlarged view of each excerpt.

Conductive metal-plated polyimide film production system 1 according to the present invention, the unwinding process unit (2) for transferring (feeding) the polyimide film (5) wound on the roll 111; Degreasing process unit 10 for degreasing the surface of the polyimide film (5) to be transferred; An etching process unit 20 repeatedly etching the surface of the degreased polyimide film 5; A neutralization process unit 30 for neutralizing the polyimide film 5 whose surface is etched; A coupling process part 40 coupling the neutralized polyimide film 5; A catalyst imparting step (50) for adsorbing a catalyst on the surface-coupled polyimide film (5); A lower plating process part 60 for forming a first conductive metal layer on the surface by the polyimide film 5 on which the catalyst is adsorbed; A plating process part 70 for forming a second conductive metal layer on the polyimide film 5 having the first conductive metal layer formed thereon; A drying process unit 80 for drying the polyimide film 5 having the second conductive metal layer formed thereon; An auxiliary driving unit 90 which adds a conveying force to the polyimide film 5 which is installed in the middle of a predetermined process part and conveyed; Winding process unit (3) for winding the formed conductive metal plated polyimide film (7) on the winding roll 460; was formed sequentially.

The unwinding process part 2 which supplies the polyimide film 5 wound by the roll 111. As shown in FIG.

The unwinding process unit 2 was formed of an unwinding apparatus 100 as illustrated in FIG. 2, and the unwinding apparatus 100 was formed as follows.

The unwinding device frame 101 was formed in the shape of a rectangular parallelepiped, and a normal support leg 102 and a caster 103 were installed at each corner of the bottom surface of the bottom plate so as to be easily transported and fixed.

In the inside of the unwinding machine frame 101, a film roll mounting stand 110 is installed at the inlet side, and a protective film 6 is wound around the upper and lower sides of the film roll mounting stand 110 from the polyimide film 5. The protective film recovery roll 112 to be recovered, and the polyimide film 5 and the protective film 6 were connected to each other so as to be attached to and detached from the rolled film roll 111.

A table 131 is installed in the middle of the unwinding device frame 101, and the supply guide roll 120 and the end connection device 170 and the direction change roll 130 which are pre-supplied are sequentially arranged on the upper side of the table 131. Although not shown in detail by installing the starting motor 113 inside the lower side by using a pulley and a belt or a sprocket and a chain, the rotating shaft on which the film roll 111 is mounted is wound on the film roll 111. The polyimide film 5 was released to be supplied to the next process unit.

The feed guide roll 120 guides the polyimide film 5 supplied from the film roll 111, and the end connecting device 170 leads to the rear end and the following of the pre-supplied polyimide film 5. The front end of the polyimide film 5 to be supplied can be fused in one piece, and the polyimide film 5 supplied by the direction change roll 130 can be turned upward to be supplied.

In the second half of the unwinding device frame 101, the tension adjusting device was installed by adjusting the tension of the polyimide film 5, and the fixed rollers 140 were spaced at equal intervals from the upper side, and fixed rollers were installed. Between the 140 is installed so as to move the movable roller 150 up and down, the movable roller 150 is installed in the mandrel to the moving table 151 and the guide rail 160 on both sides of the moving table 151 By installing vertically, the mobile unit 151 was coupled to the guide rails 160, and the mobile unit 151 was moved up and down to fix and adjust the height of the moving roller 150.

A degreasing step (10) for degreasing the surface of the polyimide film (5).

The degreasing step 10 removes impurities (pollutants, fats and oils, human fingerprints, etc.) adhered to the surface of the polyimide film 5 and removes impurities attached to the surface of the polyimide film 5. If not removed, the peel strength of the FCCL (Peel Strength) is low heat to prevent this.

 As illustrated in FIG. 3, a degreasing apparatus 11 for removing impurities (pollutants, fats and oils, human fingerprints, etc.) adhered to the surface of the polyimide film 5, and the degreased polyimide film 5. It was formed into a washing device (12) for washing with wash water.

The functional frame 200 of the degreasing device 11 and the flushing frame 300 of the flushing device 12 may be formed separately or integrally as shown.

A common support leg 201 and a caster 202 are respectively installed at each corner of the bottom of the bottom plate so that they can be easily transported and fixed. 11) and the flushing device 12, the transition roller 205 which is covered with a cover 207 on the upper end and the rear of the partition wall 203 and the upper and rear of the functional device frame 200 and the flushing device frame 300. ) Were installed to allow induction or discharge of the polyimide film (5).

The degreasing device 11 was installed by supporting the liquid tank 210 which is opened upward in the upper portion of the functional device frame 200 by the pedestal 204, and the liquid tank 210 as the liquid substance 250. The degreasing solution was filled, and the inside of the liquid tank 210 was installed to be divided up and down while maintaining the feed rollers 211 at equal intervals, so as to be sufficiently immersed in the degreasing solution, so that the polyimide film 5 was inside the degreasing solution. In the upper and lower zigzag induced to be transported.

On the upper side of the degreasing liquid at the upper end of the feed roller 211 positioned at the final rear end, a squeezing part 230 composed of a pair of rollers 231 is installed to smear the degreasing liquid adhered to the outer surface of the polyimide film 5. It was allowed to quench.

The washing device 12 is installed on the inner upper side of the washing machine frame 300 by spaced up and down, and the inside of the washing device 12 is partitioned by a partition wall 314. A washing tank 310 divided into three first, second, and third washing chambers 311, 312, and 313 was installed, and a pumping motor 350 was installed above the pedestal 301 to wash the washing tank ( By supplying the washing water to 310) to keep the washing water constant.

Inside the first, second and third wash chambers 311, 312 and 313, washing rollers 32 were installed, respectively, so as to be sufficiently immersed in the washing water 340 to be filled, and the partition wall 314. The dehydration rollers 330 were respectively installed on the upper side, and the polyimide film 5 was washed when passing through the washing roller 32 and dehydrating when passing through the dewatering roller 330.

The degreasing liquid of the liquid material 250 is filled in the liquid tank 210 in the above, but the components are not largely limited, but may include alkali rinse or shampoo, and degreasing for about 5 minutes in the temperature range of 20 to 28 ℃ Although it is preferable to carry out the degreasing at 20 ° C. or lower, degreasing effect cannot be sufficiently obtained by deactivation of the degreasing liquid, whereas when degreasing at 28 ° C. or higher, it is difficult to control the processing time.

Surface etching process part 20 of the polyimide film 5 degreased.

The etching process unit 20 is a process of modifying the surface of the polyimide film 5 by etching with an etching solution, and formed of a first etching process unit 21 and a second etching process unit 22. In addition, the first etching process part 21 and the second etching process part 22 were formed of the first etching apparatus 23, the washing | cleaning apparatus 24, the 2nd etching apparatus 25, and the washing | cleaning apparatus 26, respectively. .

The first etching device 23 of the first etching process part 21, the second etching device 25 of the second etching process part 22, and each of the water cleaning devices 24, 26 are illustrated in FIG. 3. As described above, since they are formed in the same structures as the degreasing device 11 and the water washing device 12 of the degreasing step 10, detailed descriptions of these structures (structures) will be omitted.

The etching solution as the liquid material 250 filled in each liquid tank 210 of the first etching apparatus 23 and the second etching apparatus 25 may be chromium (chromic anhydride), sulfuric acid, alkali (KOH, ethylene glycol). And KOH mixed solution). In particular, chromium is preferable as the first etching solution, and alkali is preferable as the second etching solution.

In particular, when the first etching solution filled in the first etching apparatus 23 is chromium, as illustrated in FIG. 4, the feed roller 211 installed inside the liquid bath 210 is superior to other apparatuses. In many cases, the etching was sufficiently performed by the chromium solution.

The etching process is preferably carried out by immersion in the etching solution within a maximum of 30 minutes in the temperature range of 45 to 80 ℃, when the temperature of the etching process is 45 ℃ or less, the etching property is low, the etching effect is not sufficiently achieved. In addition, damage may occur on the layer of the polyimide film 5 due to a long time reaction, and when the temperature is 80 ° C. or higher, uniformity of the entire surface of the polyimide film 5 may be caused by rapid etching. Falls and there is difficulty in controlling the speed of continuity.

By etching by this etching process part 20, the surface of the polyimide film 5 can maximize the contact | adhesion of a plating layer and a polyimide layer at the time of carrying out a plating process later, and can increase peeling strength, and polyimide The imide ring of cleavage may be converted to an amide group (-CONH) or a carboxyl group (-COOH) to increase (improve) the reactivity.

The neutralization process part 30 which neutralizes the polyimide film 5 by which the surface was etched.

The neutralization process unit 30 is a process of neutralizing the surface of the polyimide film 5 whose surface is modified by the etching process unit 20, and the neutralization device 31 in which the neutralization solution is filled and neutralized. And a washing device 32 for washing the neutralized solution with water.

Since the neutralizing device 31 and the washing device 32 are formed in the same structure as the degreasing device 11 and the washing device 12 of the degreasing step 10, respectively, as illustrated in FIG. Detailed description will be omitted.

The neutralization solution as the liquid substance 250 filled in the liquid tank 210 of the neutralization device 31 is neutralized by filling an acid neutralization solution when the etching solution used in the etching step 20 is alkali, When the etching solution is acidic, it is preferably neutralized by filling the alkali neutralizing solution, and particularly, while maintaining the temperature in the temperature range of 10 to 40 ° C.

When neutralization is carried out by the neutralization solution of the neutralizing device 31, the etching process unit 20 is performed to interact with the existing amide group (-CONH) or carboxyl group (-COOH) or K ⁺ ions. Cr ³⁺ ions are removed by substitution with H ⁺ in an acid solution.

If a substance such as K ⁺ ions or Cr ³⁺ ions remains as a reaction by-product on the surface of the polyimide film 5, K remaining during the subsequent coupling process (polar granting step) ^{The +} ions or Cr ³⁺ ions compete with the coupling ions for imparting polarity, thereby preventing the coupling ions from reacting with the amide group or the carboxyl group.

In particular, when the neutralization solution temperature is maintained at 10 ° C. or lower during neutralization, the activity of the reaction solution is lowered, and thus, the polyimide film 5 is partially damaged. On the other hand, if the temperature of the neutralization solution is maintained above 40 ℃ it is difficult to control the overall uniformity and continuity while the reaction is made rapidly.

Coupling process part 40 which couples the neutralized polyimide film (5).

This step is to impart polarity by reacting the surface of the polyimide film 5 modified in the neutralization step part 30 with a coupling solution to facilitate the progress of the subsequent plating process and to improve the peel strength of the product. Will be improved.

The coupling process unit 40 bonds the coupling ions to a portion where the imide ring formed on the surface of the polyimide film 5 is cleaved by the etching process unit 20 to impart polarity on the polyimide film 5. The coupling device 41 and the coupled polyimide film 5 were formed of an pickling device 42 for washing with an acid solution.

Since the coupling device 41 and the pickling device 42 are formed in the same structures as the degreasing device 11 and the water washing device 12 of the degreasing step 10, respectively, as illustrated in FIG. Detailed description thereof will be omitted.

The liquid tank 210 of the coupling device 41 is filled with a silane coupling agent or an amine coupling agent as a coupling solution for the liquid material 250.

As an amine coupling agent, the alkali coupling agent manufactured by mixing sodium hydroxide and monometal amine, and the acid coupling agent produced by mixing ethylenediamine and hydrochloric acid are mentioned.

The present coupling process is subject to different reaction conditions depending on the characteristics of the coupling agent used, and when using a silane coupling agent, it is generally carried out by immersion within 15 minutes at a temperature of 25 to 45 ℃.

In addition, the polyimide film 5 coupled (constitution) by the coupling device 41 is washed (immersion washed) with an acid (acid) solution maintained at room temperature by the pickling device 42. Coupling ions that are not bound to the cleavage site are removed.

In the case of pickling by the pickling device 42, when the process is long or the acid solution is an extremely strong acid solution, the coupled coupling can be removed at a temperature, so that the reaction conditions are properly maintained. It is preferable.

A catalyst imparting step (50) for adsorbing a catalyst on the polyimide film (5).

The process unit immerses the polyimide film 5 coupled (polarized) by the coupling process unit 40 in the catalyst solution to adsorb a catalyst material such as palladium as a catalyst on the surface of the polyimide film 5. It is a process to let.

The catalyst imparting process unit 50 is formed of an activator 51 for adsorbing the catalyst solution on the surface of the polyimide film 5 and a washing device 52 for washing the activating material. The activator 51 and Since the washing device 52 is formed in the same structure as the degreasing device 11 and the washing device 12 of the degreasing process part 10, as shown in FIG. 3, the detailed description of these structures is abbreviate | omitted.

The liquid tank 210 of the activator 51 may be prepared by diluting and filling palladium chloride (PdCl ₂ ) and tin tin chloride (SnCl 2) in hydrochloric acid at a specific volume ratio as a catalyst solution of the liquid substance 250. It's okay.

If the feed roller 211 installed in the liquid tank 210 is too small when the catalyst applying process is performed, and the reaction time becomes too short, adsorption of the catalyst solution (palladium and tin) onto the surface of the polyimide film 5 will occur. When the rate is low, the desired catalytic effect cannot be obtained, and when the feed roller 211 is installed too much, and the reaction time becomes too long, the adverse effect of corrosion of the surface of the polyimide film 5 by hydrochloric acid in the process solution occurs. Therefore, it is desirable to properly install the feed roller 211 to maintain the reaction time most efficiently.

A lower plating process part 60 for forming a first conductive metal layer on the surface of the polyimide film 5.

This step is a step of plating the first conductive metal layer by immersing the catalyst-added polyimide film 5 in the lower plating solution.

The lower plating process unit 60 is a lower plating apparatus 61 for plating the lower plating solution on the surface of the polyimide film 5 by dipping and a washing apparatus 62 for washing with water after plating is performed. Since the lower plating device 61 and the water washing device 62 are formed in the same structure as the degreasing device 11 and the water washing device 12 of the degreasing step 10, respectively, as illustrated in FIG. The detailed description of these structures is abbreviate | omitted.

In the liquid bath 210 of the lower plating apparatus 61, as the lower plating solution of the liquid material 250, sulfuric copper lower plating solution prepared by mixing EDTA aqueous solution, caustic soda aqueous solution, formalin aqueous solution and sulfuric acid aqueous solution, hypophosphorous acid, etc. Fill the nickel sulfate underplating solution prepared by mixing sodium, sodium citrate, ammonia and nickel sulfate solution.

By adding a polishing component and a stabilizer component to the lower plating solution, the metallic properties can be maximized, and the added polishing agent and stabilizer allow the lower plating solution to be recycled and stored for a long time.

In the case of using the copper sulfate lower plating solution as the lower plating solution, an electroless plating method is performed by immersing the polyimide film 5 to which the catalyst is added for 25 to 30 minutes in a temperature range of 38 to 42 ° C. without applying a current. The thickness of the lower plating can be appropriately formed by adjusting the plating time to appropriately form the thickness of the lower plating layer (first conductive metal layer).

As described above, when the reaction temperature is generally 38 ° C. or lower when the lower plating is carried out, the plating solution is not activated (because it is not active), so that unplating occurs or the plating proceeds partially, so that the lower plating layer cannot be formed. At 75 ° C. or higher, the plating proceeds rapidly, resulting in unevenness of the lower plating layer (first conductive metal layer) and inferior adhesion.

In addition, when the nickel sulfate lower plating solution is used as the lower plating solution, the polyimide film 5 to which the catalyst is added is immersed for a predetermined time in a temperature range of 45 to 80 ° C.

This process is a lower plating to smoothly perform the subsequent plating process, it is preferable to perform the lower plating layer (first conductive metal layer) to a thickness of approximately 0.1 ㎛ to 0.2 ㎛, so that the unplated portion is eliminated You may do it.

The plating process part 70 which forms a 2nd conductive metal layer in the polyimide film 5 in which the 1st conductive metal layer was formed.

In this step, the polyimide film 5 having the lower plating layer (the first conductive metal layer) is immersed in a plating solution, and plating is performed while applying a current to deposit (form) a second conductive metal layer. The electroplating apparatus 71 performed and the washing | cleaning apparatus 72 which wash the plating solution were formed.

Since the electroplating apparatus 71 and the washing apparatus 72 are each formed in the same structure as the degreasing apparatus 11 and the washing apparatus 12 of the degreasing process part 10, as shown in FIG. Detailed description thereof will be omitted.

The liquid bath 210 of the electroplating apparatus 71 is filled with a plating solution of the liquid material 250 and filled with a commercial plating solution (Enthone OMI, noble metal, NMP, etc.), or an aqueous copper sulfate solution (CuSO _4- ). The plating solution prepared by diluting H ₂ O), sulfuric acid (H ₂ SO ₄ ), and hydrochloric acid (HCl) mixed solution with distilled water (or ion-exchanged water) can be filled. Can be added.

When the polyimide film 5 is immersed in the plating solution by the electroplating apparatus 71 to plate the second conductive plating layer, a current of 2 to 4 A / dm ² is applied at a temperature range of about 40 to 45 ° C. Plating is performed for 30 minutes to form a polyimide film 5 on which a copper plating layer (second conductive plating layer) is plated.

When performing the plating as described above, it is preferable to actively stir the plating solution of the electroplating apparatus 71 to maintain the concentration of the plating solution uniformly, and the plating condition is that of the copper plating layer (second conductive metal layer) to be obtained. It can adjust suitably according to thickness.

A drying process unit 80 for drying the polyimide film 5 having the second conductive metal layer formed thereon.

In this process, the polyimide film 5, in which the copper plating layer (second conductive metal layer) is plated (deposited) by the plating process unit 70, is dried by a drying apparatus 400, and the conductive metal plated polyimide film, which is the final object, is used. (7) That is, it is a process of obtaining FCCL of a two-layer structure.

 The drying apparatus 400 was formed as illustrated in FIG.

The drying apparatus frame 401 was formed in the shape of a rectangular parallelepiped, and the conductive transition metal plating polyimide film was mounted on the upper ends of the drying apparatus frame 401 by mounting an inlet transition roller 404 and an outlet transition roller 405, respectively. 7) was introduced into the interior of the drying apparatus frame 401 and to be discharged from the inside to the outside (next process), the bottom of the bottom plate bottom of the drying apparatus frame 401 is a conventional support leg 402 and the caster (403) ), Respectively, to allow the drying apparatus frame 401 to be easily moved (transported) and fixedly installed.

The heating chamber 410 and the drying chamber 420 are formed in the inner middle and the upper side of the drying apparatus frame 401, the heating chamber 410, although not shown specifically installed a heating device such as a heater, drying chamber ( 420, the conductive metal plated polyimide film introduced from the transfer roller 404 for the inlet by repeatedly installing the up and down repeatedly while maintaining the feed roller 421 at equal intervals, but more than the feed roller 211 of the other devices ( 7) was allowed to completely dry while passing through the top and bottom zigzag, and the completely dried conductive metal plated polyimide film 7 was discharged to the outside (next process) through the discharge transition roller 405.

Auxiliary drive unit 90 for adding a conveying force to the polyimide film (5) is installed in the middle of the predetermined process portion.

In order to smoothly transfer the polyimide film 5 by applying auxiliary power to the polyimide film 5 which is installed at a predetermined position in the degreasing process unit 10 or the drying process unit 80 configured as described above. It was.

As the auxiliary driving unit 90 is specifically illustrated in FIG. 5, a mandrel of one driving roller 610 and a plurality of interlocking rollers 620 is installed on the upper side of the apparatus frame to zigzag the polyimide film 5. It was connected to the axis of the start roller 610 to the rotation axis of the auxiliary drive motor 630 to rotate the start roller 610, the polyimide film (5) to transfer while rotating the start roller (610). By rotating the peristaltic rollers 620, the polyimide film 5 was transported while maintaining a parallel state without twisting.

The auxiliary driving device 90 is installed between the washing device 32 of the neutralization process unit 30 and the coupling device 41 of the coupling process unit 40 as illustrated in FIGS. 1 and 5, It may be installed between the washing apparatus 72 of the plating process unit 70 and the drying apparatus 400 of the drying process unit 70, and may be installed in another apparatus unit regardless of position although not specifically illustrated. have.

Winding process unit (3) for winding the formed conductive metal plated polyimide film (7) on the winding roll (460).

The process is a process of winding the conductive metal plated polyimide film 7 formed through the drying apparatus 400 and formed as a final object on the winding roll 560 by the winding apparatus 500.

The winding device 500 was formed as illustrated in FIG.

The winding device frame 501 was formed in a rectangular parallelepiped shape, and each of the bottom surfaces of the bottom plate was provided with a conventional support leg 502 and a caster 503 so as to be easily moved and fixed.

In the upper part of the winding device frame 501, the plurality of feed rollers 510 were repeatedly installed in the upper part of the inlet so that the conductive metal-plated polyimide film 7 introduced therein was kept stable without being twisted or twisted.

On the discharge side (inner side) of the transfer roller 510, a tension adjusting device for adjusting the tension of the conductive metal-plated polyimide film 7 was installed. On the upper side, a pair of fixed rollers 520 were spaced apart from each other. , Between the fixed roller 520 is installed to move the movable roller 530 up and down, the movable roller 530 to the mandrel installed on the moving table 531 guide rails (both sides of the moving table 531) 540 is installed vertically to couple the movable base 531 to the guide rail 540, and to move the movable stage 531 up and down so that it can be fixed while adjusting (moving) the height of the movable roller 530. It was.

The table 552 is installed on the discharge side of the tension control device, and the direction changing roller 550 and the discharge roller 551 are installed on both sides of the upper surface of the table 552.

On the outside of the table 552 on which the turning roller 550 and the discharge roller 551 are installed, a winding roll mounting stand 560 is installed, and a protective film 8 is provided on the upper and lower sides of the winding roll mounting stand 560. The protective film supply roll 580 to be supplied and the bale 8 and the conductive metal-plated polyimide film 7 are connected to each other so as to be detachable.

Although not shown in detail by installing a starting motor 553 in the lower side of the table 552, the take-up roll 570 can be rotated by using a transmission means such as a pulley and a belt or a sprocket and a chain.

Hereinafter, the operating principle of the conductive metal plated polyimide film production system 1 according to the present invention configured as described above will be described.

Conductive metal-plated polyimide film manufacturing system 1 according to the present invention, as illustrated in FIG. 2, the protective film 6 in the film roll mount 110 in the unwinding device 100 of the unwinding process unit 2. The protective film recovery roll 112 and the protective film 6 and the polyimide film 5 which can be recovered and wound up are connected to each other to mount the rolled film roll 111.

The film roll 111 is rotated to release the polyimide film 5 and then walked to the fixed roll 140 and the moving roller 150 through the supply guide roll 120 and the turning roll 130. The protective film 6 to be peeled off is wound around the protective film recovery roll 112.

As described above, the polyimide film 5 hung on the unwinding device 100 includes an etching process unit 20, a neutralization process unit 30, a coupling process unit 40, a catalyst applying unit 50, and a lower view. It is sequentially applied to the winding device 500 of the safe depository part 60, the plating process part 70, the drying process part 80, the drying apparatus 400 of the drying process part 80, and the winding process part 3. .

In particular, before the start of operation (initial stage), the winding device 500 supplies the protective film 8 from the protective film supply roll 580 mounted on the upper side of the winding roll mounting table 570 to conduct conductive metal plating polyimide. It winds up to the winding roll 570, making it contact with the film 7. As shown in FIG.

In the state in which the polyimide film 5 is sequentially walked along each process unit as described above, the movable table 151 of the unwinding apparatus 100 and the movable table 531 of the winding apparatus 500 are moved up and down. The position of the rollers 150 and 530 is adjusted to adjust the tension of the polyimide film 5 or the conductive metal-plated polyimide film 7, and the operation is started when the tension adjustment is completed.

When the main switch (not specifically shown) is turned on, the starter motor 113 of the unwinding process unit 2 is operated to rotate the film roll 111 to release the polyimide film 5 while protecting the film recovery roll ( By rotating 112, the protective film 6 separated from the polyimide film 5 is peeled off, and the auxiliary driving motor 630 of each auxiliary driving unit 90 operates to rotate the starting roller 610. The protective film 8 and the conductive metal which are connected by rotating the winding roll 570 while the starting motor 553 of the winding process unit 3 is operated. While winding the plated polyimide film 7, it is wound around the take-up roll 570.

The unwinding device 100 of the unwinding process unit 2 is a polyimide film 5 released from the film roll 111 is guided horizontally from the feed guide roll 120 installed on the table 131 (end connecting device ( After passing through 170, the direction is changed upward from the turning roll 130, the fixed roller 140 and the moving roller 150 pass through the upper and lower zigzag to be supplied to the degreasing device 11 of the degreasing unit 10. At the same time, the protective film 6 released from the film roll 111 is recovered while being wound on the protective film recovery roll 112.

As illustrated in FIG. 3, the polyimide film 5 introduced into the degreasing device 11 of the degreasing process unit 10 passes through a transition roller 205 and is a degreasing solution (alkaline rinse) as the liquid substance 250. Or a shampoo) is introduced into the inside of the liquid tank 210 filled with, the polyimide film 5 introduced into the liquid tank 210 is the transfer roller 211 is immersed in the liquid material (250) The impurities (contaminants, fats, fingerprints, and the like) adhering to the outer surface of the polyimide film 5 are removed while passing through the upper and lower zigzag.

As the polyimide film 5 from which impurities are removed rises to the upper side of the degreasing liquid, the polyimide film 5 passes between the rollers 231 forming the squeezing portion 230, and the polyimide film 5 is disposed between the rollers 231. When passing through the squeegee, the degreasing liquid on the outer surface is removed, and the polyimide film 5 from which impurities are removed and the degreasing liquid is removed is introduced into the washing apparatus 12 through the transition roller 206.

The degreased polyimide film 5 introduced into the washing device 12 is washed with water in the first washing chamber 311, the second washing chamber 312 and the third washing chamber 313 of the washing tank 310. The washing roller 320 stored in the 340 and the dewatering roller 330 installed above the partition wall 314 are repeatedly immersed / drawn while being washed, and the washed polyimide film 5 is a transition roller 380. ) Is transferred (transferred) to the next etching process unit 20.

The etching process unit 20 is formed of a first etching process unit 21 and a second etching process unit 22, and each of the first etching process unit 21 and the second etching process unit 22 is shown in FIG. The first and second etching devices 23 and 25 and the water washing devices 24 and 26 as illustrated in Fig. 3 are respectively provided. In this embodiment, the liquid tank 210 of the first etching device 23 is provided. ) Is filled with the chromium etching liquid as the liquid material 250, and the liquid tank 210 of the second etching apparatus 25 is filled with the alkali etching liquid as the liquid material 250, so that etching is performed twice.

The degreased and washed polyimide film 5 introduced into the degreasing unit 12 of the degreasing unit 10 is sequentially disposed in the first etching unit 23 and the washing unit 24 of the first etching unit 21. It is pulled in.

The polyimide film 5 introduced into the liquid bath 210 of the first etching apparatus 23 is primarily etched while repeatedly moving up and down along the feed roller 211 immersed in the chrome etching liquid, and the squeegee 230 As the squeezed while passing between the rollers 231 of the) is maintained in a uniform state, the etched and squeezed polyimide film 5 is drawn into the washing device 24 while the washing water 340 is filled. A dewatering roller installed above the washing roller 320 and the partition wall 314 of each of the first washing chamber 311, the second washing chamber 312, and the third washing chamber 313 of the washing tank 310. It is washed while repeatedly immersed / withdrawn along 330.

The polyimide film 5 etched as described above is moved (transferred) to the second etching process unit 22 through the transfer roller 380.

The primary etched polyimide film 5, which is transferred (transferred) to the secondary etching process section 22, is immersed in an alkali etching solution as an etching material in the liquid bath 210 of the second etching apparatus 25. The secondary etching is performed while repeatedly moving up and down along the roller 211, while the alkaline etching solution is squeezed while passing between the rollers 231 of the squeegeeing portion 230, and the secondary etched polyimide film 5, the first washing chamber 311 and the second washing chamber 312 and the third washing chamber 313 of the washing tank 310 filled with the washing water 340 while being introduced into the washing device 26. The washing roller 320 and the partition wall 314 are repeatedly immersed / drawn along the dehydration roller 330 installed on the upper side, thereby completing the etching.

The polyimide film 5 whose etching is completed in the etching process unit 20 is introduced into the neutralization process unit 30 composed of the neutralizing device 31 and the water washing device 32 as illustrated in FIG. 3.

The etched polyimide film 5 introduced into the neutralizing device 31 is a feed roller 211 immersed in an acidic or alkaline neutralizing solution that is a liquid material 250 in the liquid tank 210 of the neutralizing device 31. Neutralized while repeatedly moving up and down along the way, while neutralizing the solution is squeezed while passing between the rollers 231 of the squeegee 230, the neutralized polyimide film (5) is washed with a washing device (32) The washing roller 320 and the partition wall of each of the first washing chamber 311, the second washing chamber 312, and the third washing chamber 313 of the washing tank 310 filled with washing water 340 while being drawn in ( Repeatedly immersed / withdrawn along the dewatering roller 330 installed on the upper side of the 314 to complete the neutralization.

The neutralized polyimide film 5 is composed of the coupling device 41 and the pickling device 42 as illustrated in FIG. 40).

The neutralized polyimide film 5 introduced into the coupling process part 40 may be added to the silane coupling agent solution or the amine coupling agent solution, which is the liquid substance 250, in the liquid tank 210 of the coupling device 41. The polarity is imparted while repeatedly moving up and down along the feed roller 211 which is immersed, and the coupling agent solution is maintained in a uniform state while being squeezed while passing between the rollers 231 of the squeegeeing part 230. The polyimide film 5 to be applied is introduced into the pickling device 42 and the first pickling chamber 311 and the second pickling chamber 312 of the pickling tank 310 in which the acid solution 340 is filled. The pickling roller 320 of the third pickling chamber 313 and the pickling roller 330 installed above the partition wall 314 are pickled and repeatedly pickled while being pickled, thereby completing the coupling process.

The polarized polyimide film 5 is introduced into the catalyst imparting process unit 50 composed of an activator 51 and a water washing device 52 as illustrated in FIG. 3.

The polarized polyimide film 5 introduced into the catalyst imparting step 50 is a feed roller 211 immersed in the catalyst solution which is the liquid material 250 in the liquid tank 210 of the activator 51. Palladium is adsorbed as a catalyst while repeatedly moving up and down along), and squeezes through the rollers 231 of the squeegeeing part 230 to maintain a uniform solution, and the catalyst (palladium) is adsorbed. The polyimide film 5 is introduced into the washing device 32 and each of the first washing chamber 311 and the second washing chamber 312 and the third washing chamber of the washing tank 310 filled with the washing water 340. The washing roller 320 and the partition wall 314 of 313 are repeatedly immersed / drawn along the dewatering roller 330 installed on the upper side, thereby completing the catalyst application process.

The catalyst-adsorbed polyimide film 5 is introduced into the lower plating process part 60 composed of the lower plating device 61 and the water washing device 62 as illustrated in FIG. 3 to form the lower plating layer (first conductive metal layer). Is formed.

The polyimide film 5 introduced into the lower plating process unit 60 may transfer the feed roller 211 immersed in the lower plating solution, which is the liquid material 250, in the liquid tank 210 of the lower plating apparatus 61. The lower plating is carried out while repeatedly moving up and down, the squeegeeing passes through the rollers 231 of the squeegeeing portion 230, and the lower plating solution is maintained in a uniform state, and the lower-plated polyimide film 5 Is the washing roller of each of the first washing chamber 311, the second washing chamber 312 and the third washing chamber 313 of the washing tank 310 is filled with the washing water 340 is filled into the washing device (32) Repeatedly immersed / withdrawn along the dehydration roller 330 installed on the upper side of the 320 and the partition wall 314 to complete the lower plating process.

The polyimide film 5 having the lower plating layer (first conductive metal layer) formed therein is introduced into the plating process part 70 formed of the plating apparatus 71 and the water washing apparatus 72 as illustrated in FIG. Conductive metal layer) is formed.

The polyimide film 5 introduced into the plating process part 70 is repeatedly moved up and down along the feed roller 211 immersed in the plating solution, which is the liquid material 250, in the liquid tank 210 of the plating apparatus 71. Plating is carried out while moving to, the plating solution applied while squeezing through the rollers 231 of the squeegee portion 230 is maintained in a uniform state, the plated polyimide film (5) is a washing device ( 72 and the washing roller 320 of each of the first washing chamber 311 and the second washing chamber 312 and the third washing chamber 313 of the washing tank 310 is filled with the washing water 340 and The plating process is completed by being rinsed while repeatedly being immersed / drawn along the dewatering roller 330 installed above the partition wall 314.

The plated conductive metal-plated polyimide film 7 is introduced into the drying apparatus 400 of the drying process unit 80 as illustrated in FIG. 6 while being powered by the auxiliary driving unit 90.

The conductive metal-plated polyimide film 7 introduced into the drying apparatus 400 of the drying process unit 80 through the transition roller 404 is zigzag up and down along the transfer roller 421 spaced vertically in the drying chamber 420. Heated by the heating device (not specifically shown) installed in the heating chamber 410, which is transported to the drying chamber 420 is moved to the drying chamber 420, the conductive metal plated polyimide film transferred along the feed roller 421 ( It will dry 7).

The conductive metal plated polyimide film 7 completely dried while passing through the drying apparatus 400 is introduced into the winding apparatus 500 of the winding process section 5 via the transition roller 405.

The conductive metal-plated polyimide film 7 drawn into the winding device 500 of the winding process unit 3 passes through a plurality of feed rollers 510 installed at the inlet in a vertical zigzag, and the posture (twist or deformation) is corrected. The conductive metal plated polyimide film 7 whose posture is corrected passes through the fixed roller 520 and the moving roller 530 in a vertical zigzag, and has a direction changing roller 550 and an induction roller installed on the table 552. It is wound on the winding roll 560 which is operated (rotated) by the starting motor 553 via 551.

When the conductive metal plated polyimide film 7 passing through the discharge guide roller 551 is wound on the take-up roll 560, the protective film 8 wound on the protective film supply roll 580 is a conductive metal plated polyimide film. It is connected to (7) is wound on the take-up roll (560).

The conductive metal plated polyimide film production system 1 according to the present invention is a conductive metal having a copper plating layer formed on the outer surface of the polyimide film 5 supplied from the unwinding device 100 while the devices of each process unit are operated as described above. The plated polyimide film 7 is prepared.

Although specific embodiments of the present invention have been described and illustrated above, it will be apparent to those skilled in the art that various modifications may be made, and embodiments that may be modified as such are individually understood from the spirit or technical configuration of the present invention. It should not be, but naturally belong to the claims of the present invention.

The conductive metal-plated polyimide film production system according to the present invention comprises a degreasing process part and an etching process part, each of which comprises a process execution device for performing a specific process and a water washing device for washing with water, while supplying a polyimide film wound in a roll shape. , The neutralization process, the coupling process, the catalyst imparting process, the lower plating process, and the plating process are carried out sequentially and continuously to plate the conductive metal on one or both sides of the polyimide film, and the conductive metal plated polyimide film Drying the coated polyimide film on the take-up roll by the winding-up unit, and the polyimide film was immersed in the liquid state during each step while moving the polyimide film. Implement a wet method that passes repeatedly and immerses and draws out the wash water. As a two-layered FCCL with improved physical properties such as peel strength, it is possible to squeeze a polyimide film immersed in a predetermined liquid material by pressing roller in each process to apply liquid material with uniform thickness. When carrying out the unwinding process of feeding the polyimide film and the unwinding process of discharging, the moving rollers installed between the fixed rollers are moved up and down to adjust the tension so that the polyimide film is transported without twisting or twisting. In addition, since one or more auxiliary driving devices are installed at predetermined positions of the process unit, the polyimide film can be smoothly transferred.

Claims (8)

In coating a conductive metal on the outer surface while supplying the polyimide film 5, A unwinding process unit 2 having a unwinding device 100 for controlling and conveying the tension while separating the polyimide film 5 wound on the film roll 111 from the protective film 6; A degreasing step (10) for degreasing and washing the surface of the polyimide film (5) supplied from the unwinding step (2) by a degreasing device (11) and a water washing device (12) to remove foreign substances; Etching process part for repeatedly etching and washing the surface of the polyimide film 5 to which the foreign matter is removed and transported by the first etching apparatus 23, the second etching apparatus 25, and the water washing apparatus 24, 26. 20; A neutralization process unit 30 for neutralizing and washing the polyimide film 5 whose surface is etched and transported by the neutralizing device 31 and the water washing device 32; A coupling process part 40 for coupling and washing the surface of the polyimide film 5 which is neutralized and conveyed by a coupling agent and an acid by the coupling device 41 and the pickling device 42; A catalyst imparting step (50) for adsorbing and washing the catalyst to the polyimide film (5) whose surface is coupled and conveyed by the activator (51) and the water washing device (52); A lower plating process part 60 for forming a first conductive metal layer on the surface of the polyimide film 5 to which the catalyst is adsorbed and transported by the lower plating device 61 and the water washing device 62 and washing the water; A plating process unit 70 for forming a second conductive metal layer by the plating apparatus 71 and the washing device 72 to which a current is applied to the polyimide film 5 to which the first conductive metal layer is formed and transported; A drying process unit 80 for drying the polyimide film 5, on which the second conductive metal layer is formed and transported, by the drying apparatus 400; An auxiliary driving unit 90 for adding a feeding force to the polyimide film 5 to be transported by installing the auxiliary driving device 600 in the middle of a predetermined process unit; Winding process unit for the conductive metal plated polyimide film 7 formed by completely drying the second conductive metal layer 7 is added to the protective film 8 by the winding device 400 and wound around the winding roll 460 while adjusting the tension. (3); conductive metal plated polyimide film manufacturing system comprising a. The method of claim 1, wherein the unwinding device 100 of the unwinding process unit 2; In the case where the normal support leg 102 and the caster 103 were respectively provided in the bottom face bottom edge of the rectangular parallelepiped unwinding machine frame 101; An upper side and a lower side of the film roll mount 110 provided at the inner inlet side of the unwinding apparatus 101 to be detachable from the protective film recovery roll 112 and the film roll 111; Installing the starting motor 113 on the bottom surface of the film roll mount 110 to rotate the film roll 111; On the upper side of the table 131 installed in the middle of the unwinding device 101, the feed guide roll 120, the end connecting device 170 and the direction change roll 130 are installed in sequence; A tension adjusting device for adjusting the tension of the polyimide film 5 in the inner second half of the unwinding device 101; Conductive metal-plated polyimide film manufacturing system comprising a. The degreasing step (10), the first etching step (21), the second etching step (22), the neutralization step (30), the coupling step (40), the catalyst applying step (50). ), The degreasing device 11, the first etching device 23, the second etching device 25, the neutralizing device 31, and the coupling device of the lower plating process part 60, the plating process part 70 ( 41), activating device 51, lower plating device 61, plating device 71; In the case where the normal supporting leg 201 and the caster 202 are respectively provided in each corner of the bottom face of the functional device frame 200 formed from the rectangular parallelepiped; Supported by the pedestal 204 to the liquid tank 210 that is open to the upper upper portion of the functional device frame 200; The liquid tank 210 is filled with a liquid material 250; The liquid tank 210 is installed to be divided up and down while maintaining the feed roller 211 at equal intervals, but installed so as to be sufficiently immersed in the liquid material 250; A squeegee portion 230 composed of a pair of rollers 231 is installed on the upper side of the degreasing liquid on the line of the final feed roller 211 at the rear end; Conductive metal-plated polyimide film manufacturing system, characterized in that it includes; the upper and both sides of the functional device frame 200 is provided with a transition roller (205, 206) that covers the cover (207). The degreasing step (10), the first etching step (21), the second etching step (22), the neutralization step (30), the coupling step (40), the catalyst applying step (50). ), Each of the washing apparatuses 12, 24, 26, 32, 42, 52, 62 and 72 of the lower plating process section 60 and the plating process section 70; In the case where the normal supporting leg 201 and the caster 202 are respectively provided in each corner of the bottom face of the washing machine frame 300 which has a rectangular parallelepiped shape; In the upper portion of the washing machine frame 300, a washing tank 310 supported by a pedestal 302 is provided, and the washing tank 310 is formed by a partition wall 314, and the inside of the washing tank 310 is first, second, and the like. Divided into third wash chambers 311, 312 and 313 to fill the washing water 340; Supporting the pumping motor 350 for supplying the washing water to the washing tank 310 by the pedestal 301 in the lower side of the support plate 302; Inside the first, second and third wash chambers 311, 312 and 313, washing rollers 32 are provided so as to be sufficiently immersed in the washing water 340, and a dewatering roller above the partition wall 314. 330 are respectively installed so that the polyimide film 5 passes through the washing roller 32 and the dehydrating roller 330 repeatedly; Conductive metal-plated polyimide film manufacturing system, characterized in that it comprises; each installed on the upper both sides of the washing machine frame 300, the cover rollers 206, 380 is covered. The method according to claim 1, Drying apparatus 400 of the drying process unit 80; In the case where the normal supporting leg 402 and the caster 403 are respectively provided in each corner of the bottom face of the drying apparatus frame 401 formed in a rectangular parallelepiped shape; An upper end of the drying apparatus frame 401 is provided with a transfer roller 404 and a discharge roller 405 for discharge, respectively; A heating chamber 410 and a drying chamber 420 formed in the drying apparatus frame 401; Heating device is installed in the heating chamber 410, the inside of the drying chamber 420 is repeatedly installed up and down while maintaining the feed roller 421 at equal intervals; conductive metal plating polyimide film, characterized in that it includes Manufacturing system. The method of claim 1, wherein the winding unit 500 of the winding step unit 3; In the case of installing the normal support leg 502 and the caster 503 in each corner of the bottom face of the winding device frame 501 formed in a rectangular parallelepiped shape; In the upper part of the inlet of the winding device frame 501 repeatedly installed a plurality of feed rollers 510 for holding the conductive metal plated polyimide film 7 safely up and down; An inner side of the feed roller 510 is provided with a tension adjusting device for adjusting the tension of the conductive metal-plated polyimide film 7; A table 552 is installed on the discharge side of the tension control device, and the direction change roller 550 and the discharge roller 551 are installed on both sides of the upper surface; The outer side of the table 552 is provided with a take-up roll mounting stand 560, the upper and lower side of the take-up roll mounting stand 560 is installed to detach the protective film supply roll 580 and the take-up roll 570. With; Conductive metal-plated polyimide film manufacturing system, characterized in that it includes; the lower side of the inside of the table 552 to install a starting motor (553) to rotate the take-up roll (570). The method of claim 1, wherein the auxiliary driving device 600 of the auxiliary driving unit 90 for adding a conveying force to the polyimide film 5 to be transferred; One mandatory roller 610 and a plurality of interlocking rollers 620 were zigzagly installed on the upper side of the apparatus frame to hang the polyimide film 5; To rotate the start roller 610 of the auxiliary drive motor (630); conductive metal plating polyimide film manufacturing system, characterized in that. The tension adjusting device according to claim 2 or 6, wherein the tension adjusting device for adjusting the tension of the polyimide film (5) or the conductive metal-plated polyimide film (7); An inner upper side of the apparatus frame having a plurality of stationary rollers 140 and 520 spaced at equal intervals and installed in a shaft; Between the fixed roller 140, the moving rollers 150, 530 has a mandrel movable table (151, 5312); The guide rollers 160 are vertically installed on both sides of the movable rollers 151 and 530 where the movable rollers 150 and 530 are installed, and the movable rollers 151 and 530 are coupled to the guide rails 160. ; Conductive metal plated polyimide film manufacturing system, characterized in that it comprises; to move while fixing the height of the movable rollers (150, 530) while moving the movable table (151, 530) up and down.

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