CN214937936U - Ultrathin film electroplating equipment - Google Patents
Ultrathin film electroplating equipment Download PDFInfo
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- CN214937936U CN214937936U CN202120540673.1U CN202120540673U CN214937936U CN 214937936 U CN214937936 U CN 214937936U CN 202120540673 U CN202120540673 U CN 202120540673U CN 214937936 U CN214937936 U CN 214937936U
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Abstract
The utility model discloses an ultrathin film electroplating device, including first plating bath, second plating bath and membrane transport mechanism, first plating bath and second plating bath set up side by side, membrane transport mechanism is used for conveying and bearing to treat that the plated film gets into in proper order first plating bath and second plating bath and make and treat the plated film and be in first electroplating openly electroplate, carry out reverse side electroplating in the second plating bath. When the electroplating equipment provided by the utility model is used for electroplating, one side is electroplated and the other side is electroplated, so that the influence of the buoyancy of the electroplating solution on the electroplating is small, and the electroplating uniformity is ensured; the electroplating equipment provided by the utility model can enable the film to enter the first electroplating bath and the second electroplating bath for electroplating with bearing through the film conveying mechanism, so that the wrinkling phenomenon can not occur, and the electroplating is uniform; in addition, the electroplating equipment provided by the utility model does not need clamping plate clamping, and can not lead to the uneven tension of the electroplating film to be treated, thereby the electroplating is even.
Description
Technical Field
The utility model relates to the technical field of electroplating, in particular to ultrathin film electroplating equipment.
Background
The PET electroplating film is often applied to the fields of lithium battery cathodes, FPC (flexible printed circuit board) and the like, the PET electroplating film comprises a PET substrate layer, a crude copper layer deposited on the surface of the PET substrate layer and an electroplating layer electroplated on the surface of the crude copper layer, the PET substrate layer and the crude copper layer are electroplated and laminated to be called as an electroplating film, and the electroplating layer can be copper/nickel/tin electroplating and the like.
During the final step of producing the PET electroplating film, namely the electroplating process, electroplating equipment is adopted for electroplating, the traditional electroplating equipment horizontally conveys the film to be electroplated into an electroplating bath through a plurality of rollers, electroplating liquid is soaked in the film to be electroplated for double-sided electroplating, and when the film to be electroplated enters the electroplating bath, the two sides of the film to be electroplated are clamped by clamping plates so as to keep the balance of the film to be electroplated in the electroplating liquid.
However, the conventional plating apparatus has at least the following problems:
1) since the plating film is plated on both sides simultaneously, the plating solution has a certain buoyancy and fluctuates, thereby causing uneven film plating.
2) Treat the in-process of plated film at the gyro wheel conveying, the gyro wheel can treat that the plated film produces tensile stress, owing to treat that the conductive film is very thin, treat that the inhomogeneous phenomenon of tension appears easily in the rear of plated film to the phenomenon that the rear corrugates appears, the phenomenon of corrugating just appears in the front even, and then leads to electroplating inhomogeneous, leads to electroplating the electrically conductive inhomogeneous of the PET plated film after accomplishing then.
3) Because the both sides of waiting the plated film are by the splint centre gripping of a plurality of settings side by side respectively, and the clamping-force of splint is not even, can lead to waiting that the tension of plated film is inhomogeneous to lead to electroplating inhomogeneous, and then lead to electroplating the electrically conductive inhomogeneous of the PET plated film after accomplishing.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model discloses an ultrathin film electroplating device.
In order to achieve the above object, the utility model discloses a following technical scheme realizes:
the utility model discloses an ultrathin film electroplating device, including first plating bath, second plating bath and membrane transport mechanism, first plating bath and second plating bath set up side by side, membrane transport mechanism is used for conveying and bearing to treat that the plated film gets into in proper order first plating bath and second plating bath and make and treat the plated film and be in first electroplating openly electroplate, carry out reverse side electroplating in the second plating bath.
Preferably, the film conveying mechanism comprises a film releasing wheel, a first carrier wheel, a front-back conversion assembly and a second carrier wheel, the first carrier wheel and the second carrier wheel are respectively and horizontally arranged in the first electroplating tank and the second electroplating tank, the rotating directions of the first carrier wheel and the second carrier wheel are consistent, and the first carrier wheel and the second carrier wheel are respectively driven by a motor to rotate;
the film release wheel is used for releasing a film to be electroplated into the first electroplating tank;
the first carrier wheel is used for enabling the reverse side of the film to be electroplated to be attached to the periphery of the wheel and move into the electrolyte, and is attached to the periphery of the wheel and move out of the electrolyte;
the second carrier wheel is used for enabling the front surface of the film to be electroplated to be attached to the periphery of the wheel and move into the electrolyte, and is attached to the periphery of the wheel and move out of the electrolyte;
the front-back conversion assembly is used for enabling the front side and the back side of the electroplating film from the first electroplating tank to face backwards and then enter the second electroplating tank for electroplating on the other side.
Further preferably, the film conveying mechanism further comprises a first transition wheel, a second transition wheel, a third transition wheel and a fourth transition wheel;
the first transition wheel and the second transition wheel are respectively horizontally arranged above the first electroplating bath and positioned at two sides of the upper part of the first carrier wheel, and the first transition wheel and the second transition wheel are respectively used for guiding a film to be electroplated to move into the first electroplating bath and guiding an electroplated film to move out of the first electroplating bath;
the third transition wheel and the fourth transition wheel are respectively arranged above the second electroplating bath and positioned at two sides of the upper part of the second carrier wheel, and the third transition wheel and the fourth transition wheel are respectively used for guiding a film to be electroplated to move into the second electroplating bath and guiding an electroplated film to move out of the second electroplating bath.
Still further preferably, the front-back conversion assembly comprises a fixed frame positioned between the first plating tank and the second plating tank and a first conversion wheel arranged on the fixed frame, the first conversion wheel is higher than the first carrier wheel and the second carrier wheel, and the first conversion wheel is used for supporting the plated film which is reversely folded after being moved out from the tail end of the first plating tank.
Preferably, the front-back conversion assembly further comprises a second conversion wheel and a third conversion wheel horizontally fixed on the fixing frame, and the second conversion wheel and the third conversion wheel are located on two sides of the first conversion wheel and are lower than the first conversion wheel.
Still further preferably, the ultra-thin film plating apparatus further comprises a first conductive mechanism and a second conductive mechanism, wherein the first conductive mechanism and the second conductive mechanism are respectively used for attracting ions to deposit on the film in a conductive manner.
Still further preferably, the first conductive mechanism comprises a first conductive synchronous belt and a plurality of first synchronous wheels, wherein the first conductive synchronous belt rotates circularly, one part of the first conductive synchronous belt is positioned in the first electroplating tank and the other part of the first conductive synchronous belt is positioned outside the first electroplating tank during the circulating rotation process, the part of the first conductive synchronous belt positioned in the first electroplating tank surrounds and is close to the lower wheel circumference of the first carrier wheel, and the first conductive synchronous belt rotates circularly along with the rotation of the second carrier wheel;
the second conductive mechanism comprises a second conductive synchronous belt and a plurality of second synchronous wheels, the second conductive synchronous belt rotates circularly, one part of the second conductive synchronous belt is positioned in the second electroplating tank, the other part of the second conductive synchronous belt is positioned outside the second electroplating tank in the process of rotating circularly, the part of the second conductive synchronous belt positioned in the second electroplating tank surrounds and is close to the lower wheel periphery of the second carrier wheel, and the second conductive synchronous belt rotates circularly along with the rotation of the second carrier wheel.
Preferably, first electrically conductive hold-in range sets up two, the electrically conductive hold-in range of second also sets up two, two first electrically conductive hold-in range is located respectively the axial both sides of first carrier wheel, two the electrically conductive hold-in range of second is located respectively the axial both sides of second carrier wheel.
Preferably, the first conductive synchronous belt and the second conductive synchronous belt each include a rubber layer and a metal conductive layer, and the metal conductive layer is opposite to the circumference of the first carrier wheel or the second carrier wheel.
Preferably, the bottom ends of the first electroplating bath and the second electroplating bath are respectively provided with a liquid inlet hole, two sides of the first electroplating bath and the second electroplating bath are respectively provided with an overflow hole, the overflow holes are communicated with a collecting box, and the collecting box is communicated with the first electroplating bath and the second electroplating bath through a water pump and a pipeline.
Compared with the prior art, the utility model discloses an at least, following advantage has:
the utility model provides an ultra-thin film plating equipment has electroplated the one side and has electroplated the another side again when electroplating, and the buoyancy of plating solution is less to the influence of electroplating like this, has guaranteed the homogeneity of electroplating.
The utility model provides an ultra-thin film plating equipment can make the membrane can have entering into of bearing electroplate in first plating bath and the second plating bath through membrane transport mechanism, the phenomenon of corrugating can not appear, electroplate evenly.
In addition, the utility model provides an ultra-thin film electroplating device need not the splint centre gripping, can not lead to waiting that the tension of plated film is inhomogeneous, consequently electroplates evenly.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic structural view of an ultra-thin film electroplating apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a partial structure of an ultra-thin film electroplating apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of the first conductive mechanism and the second conductive mechanism disclosed in the embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments and the accompanying drawings so that those skilled in the art can implement the invention with reference to the description.
Referring to fig. 1-3, the embodiment of the utility model discloses an ultra-thin film electroplating device, including first plating bath 1, second plating bath 2 and membrane transport mechanism 3, first plating bath 1 and second plating bath 2 set up side by side, and membrane transport mechanism 3 is used for conveying and bearing to wait that the plated film gets into first plating bath 1 and second plating bath 2 in proper order and make and wait that the plated film carries out front electroplating, carries out reverse side electroplating in second plating bath 2 at first electroplating.
The film conveying mechanism 3 comprises a film releasing wheel 31, a first carrier wheel 32, a front-back conversion assembly and a second carrier wheel 33, the first carrier wheel 32 and the second carrier wheel 33 are respectively horizontally arranged in the first electroplating tank 1 and the second electroplating tank 2, the rotating directions of the first carrier wheel 32 and the second carrier wheel 33 are consistent, and the first carrier wheel 32 and the second carrier wheel 33 are respectively driven by a motor to rotate;
the film releasing wheel 31 is used for releasing the film to be electroplated into the first electroplating tank 1;
the first carrier wheel 32 is used for enabling the reverse side of the film to be electroplated to be attached to the periphery of the wheel and move into the electrolyte, and is attached to the periphery of the wheel and move out of the electrolyte;
the second carrier wheel 33 is used for enabling the front surface of the film to be electroplated to be attached to the periphery of the wheel and move into the electrolyte, and is attached to the periphery of the wheel and move out of the electrolyte;
the front-back conversion assembly is used for enabling the front side and the back side of the electroplated film from the first electroplating tank 1 to face backwards and then enter the second electroplating tank 2 for electroplating on the other side.
The film transfer mechanism 3 further includes a first transition wheel 34, a second transition wheel 35, a third transition wheel 36, and a fourth transition wheel 37;
the first transition wheel 34 and the second transition wheel 35 are respectively horizontally arranged above the first plating tank 1 and positioned at two sides of the upper part of the first carrier wheel 32, and the first transition wheel 34 and the second transition wheel 35 are respectively used for guiding a film to be plated to move into the first plating tank 1 and guiding the plated film to move out of the first plating tank 1;
the third transition wheel 36 and the fourth transition wheel 37 are respectively disposed above the second plating tank 2 and on both sides of the upper portion of the second carrier wheel 33, and the third transition wheel 36 and the fourth transition wheel 37 are respectively used to guide the to-be-plated film to move into the second plating tank 2 and to guide the plated film to move out of the second plating tank 2.
The first transition wheel 34, the second transition wheel 35, the third transition wheel 36 and the fourth transition wheel 37 play a role in transition, play a role in transition and connection in the film conveying process, reduce the suspended part in the film conveying process and reduce the wrinkling phenomenon.
The front-back conversion assembly includes a fixing frame 38 positioned between the first plating tank 1 and the second plating tank 2, and a first conversion wheel 39 provided on the fixing frame 38, the first conversion wheel 39 being positioned at a height higher than that of the first carrier wheel 32 and the second carrier wheel 33, the first conversion wheel 39 being configured to support the plated film that is reversely folded back after being removed from the end of the first plating tank 1. The transfer direction of the film can be adjusted by the switching wheel, and the front and back sides of the film are just opposite by reverse folding, so that the film enters the second electroplating tank 2 to be electroplated on the other side.
The front-back conversion assembly further comprises a second conversion wheel 30a and a third conversion wheel 30b which are horizontally and fixedly arranged on the fixed frame 38, and the second conversion wheel 30 and the third conversion wheel 30b are positioned at two sides of the first conversion wheel 39 and are lower than the first conversion wheel 39.
The ultrathin film electroplating equipment further comprises two first conductive mechanisms 4 and two second conductive mechanisms 5, wherein the first conductive mechanisms 4 and the second conductive mechanisms 5 are respectively used for attracting ions to deposit on the film in a mode of contacting the film so as to realize electroplating.
The first conductive mechanism 4 comprises two first conductive synchronous belts 41 which rotate circularly and a plurality of first synchronous wheels 42 matched with the first conductive synchronous belts 41, the two first conductive synchronous belts 41 are respectively positioned at two axial sides of the first carrier wheel 32, one part of the first conductive synchronous belts 41 is positioned in the first electroplating bath 1 and the other part is positioned outside the first electroplating bath 1 in the process of rotating circularly, the part of the first conductive synchronous belts 41 positioned in the first electroplating bath 1 surrounds and is close to the lower part of the first carrier wheel 32, and the first conductive synchronous belts 41 rotate circularly along with the rotation of the second carrier wheel 33;
the second conductive mechanism 5 includes two second conductive synchronous belts 51 rotating circularly and a plurality of second synchronous wheels 52 matching with the second conductive synchronous belts 51, the two second conductive synchronous belts 51 are respectively located at two axial sides of the second carrier wheel 33, a part of the second conductive synchronous belts 51 are located in the second plating tank 2 and the other part of the second conductive synchronous belts are located outside the second plating tank 2 during the process of rotating circularly, the part of the second conductive synchronous belts 51 located in the second plating tank 2 surrounds and is close to the lower wheel circumference of the second carrier wheel 33, and the second conductive synchronous belts 51 rotate circularly along with the rotation of the second carrier wheel 33.
Each of the first conductive timing belt 41 and the second conductive timing belt 51 includes a rubber layer and a metal conductive layer (e.g., a copper layer) which is opposed to the circumference of the first carrier wheel 32 or the second carrier wheel 33 and which is in contact with the film, thereby completing the electroplating. The metal conductive layer is in contact with the membrane to attract ions in the electroplating solution to the membrane, thereby achieving the purpose of electroplating.
The bottom end parts of the first electroplating bath 1 and the second electroplating bath 2 are respectively provided with a liquid inlet hole, the two sides of the first electroplating bath 1 and the second electroplating bath 2 are respectively provided with an overflow hole, the overflow holes are communicated with a collecting box, and the collecting box is communicated with the first electroplating bath 1 and the second electroplating bath 2 through a water pump and a pipeline. The electrolyte can flow through the overflow holes, so that turbulence is increased, and the electroplating effect is improved; the electrolyte can be recycled through a water pump and a pipeline.
The ultrathin film electroplating device provided by the embodiment of the utility model is operated, a film releasing wheel 31 is provided with a material coil, a motor drives a carrier wheel to rotate, a film on the material coil on the film releasing wheel 31 is released into a first electroplating bath 1, the film is attached to the first carrier wheel 32, moves along with the rotation of the first carrier wheel 32 until the film is moved out of the first electroplating bath 1, after the film is moved out of the first electroplating bath 1, the film is reversely folded back to a first conversion wheel 39, a second conversion wheel 30a and a third conversion wheel 30b, and then enters a second electroplating bath 2, the other surface of the film is attached to the second carrier wheel 33, moves along with the rotation of the second carrier wheel 33 until the film is moved out of the second electroplating bath 2, in the process of film movement, a first conductive synchronous belt 41 and a second conductive synchronous belt 51 respectively rotate under the driving of the first carrier wheel 32 and the second carrier wheel 33, the conductive synchronous belts are attached to the film, the conductive synchronous belt and the carrier wheel play a role of clamping the membrane together, so that the supporting effect on the membrane is further improved; in addition, due to the conductivity of the conductive synchronous belt, copper ions/nickel ions and the like can be attracted to the film, so that electroplating is completed, and the part of the film, which is in contact with the conductive synchronous belt, is cut off after the electroplating is completed, so that the process edge is formed.
Through the technical scheme, the embodiment of the utility model provides an ultra-thin membrane plating equipment is equipped with two plating baths, when electroplating, carries out electroplating treatment respectively to the two sides of membrane through two plating baths, and the buoyancy of so plating bath is less to the influence of electroplating, has guaranteed the homogeneity of electroplating.
The ultrathin film plating equipment can make the non-plating surface of the film be attached to the corresponding carrier wheel through the first carrier wheel 32 and the second carrier wheel 33, so that the film has a certain bearing force during plating, and cannot sway and ripple in plating solution, thereby improving the plating uniformity and ensuring the conduction uniformity of a final product.
Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An ultra-thin film electroplating device is characterized in that: the electroplating device comprises a first electroplating tank, a second electroplating tank and a film conveying mechanism, wherein the first electroplating tank and the second electroplating tank are arranged side by side, and the film conveying mechanism is used for conveying and supporting a film to be electroplated to sequentially enter the first electroplating tank and the second electroplating tank so that the film to be electroplated is subjected to front electroplating in the first electroplating tank and back electroplating in the second electroplating tank.
2. An ultra-thin film plating apparatus according to claim 1, wherein: the film conveying mechanism comprises a film releasing wheel, a first carrier wheel, a front-back conversion assembly and a second carrier wheel, the first carrier wheel and the second carrier wheel are respectively and horizontally arranged in the first electroplating tank and the second electroplating tank, the rotating directions of the first carrier wheel and the second carrier wheel are consistent, and the first carrier wheel and the second carrier wheel are respectively driven by a motor to rotate;
the film release wheel is used for releasing a film to be electroplated into the first electroplating tank;
the first carrier wheel is used for enabling the reverse side of the film to be electroplated to be attached to the periphery of the wheel and move into the electrolyte, and is attached to the periphery of the wheel and move out of the electrolyte;
the second carrier wheel is used for enabling the front surface of the film to be electroplated to be attached to the periphery of the wheel and move into the electrolyte, and is attached to the periphery of the wheel and move out of the electrolyte;
the front-back conversion assembly is used for enabling the front side and the back side of the electroplating film from the first electroplating tank to face backwards and then enter the second electroplating tank for electroplating on the other side.
3. An ultra-thin film plating apparatus according to claim 2, wherein: the film conveying mechanism further comprises a first transition wheel, a second transition wheel, a third transition wheel and a fourth transition wheel;
the first transition wheel and the second transition wheel are respectively horizontally arranged above the first electroplating bath and positioned at two sides of the upper part of the first carrier wheel, and the first transition wheel and the second transition wheel are respectively used for guiding a film to be electroplated to move into the first electroplating bath and guiding an electroplated film to move out of the first electroplating bath;
the third transition wheel and the fourth transition wheel are respectively arranged above the second electroplating bath and positioned at two sides of the upper part of the second carrier wheel, and the third transition wheel and the fourth transition wheel are respectively used for guiding a film to be electroplated to move into the second electroplating bath and guiding an electroplated film to move out of the second electroplating bath.
4. An ultra-thin film plating apparatus according to claim 2, wherein: the front-back conversion assembly comprises a fixing frame positioned between the first electroplating tank and the second electroplating tank and a first conversion wheel arranged on the fixing frame, the height of the first conversion wheel is higher than the heights of the first carrier wheel and the second carrier wheel, and the first conversion wheel is used for supporting an electroplating film reversely folded after being moved out from the tail end of the first electroplating tank.
5. An ultra-thin film plating apparatus according to claim 4, wherein: the front-back conversion assembly further comprises a second conversion wheel and a third conversion wheel which are horizontally and fixedly arranged on the fixing frame, and the second conversion wheel and the third conversion wheel are positioned on two sides of the first conversion wheel and are lower than the first conversion wheel.
6. An ultra-thin film plating apparatus according to claim 2, wherein: the membrane is characterized by further comprising a first conducting mechanism and a second conducting mechanism, wherein the first conducting mechanism and the second conducting mechanism are respectively used for attracting ions to deposit on the membrane in a conducting mode.
7. An ultra-thin film plating apparatus according to claim 6, wherein: the first conductive mechanism comprises a first conductive synchronous belt and a plurality of first synchronous wheels, wherein the first conductive synchronous belt rotates circularly, one part of the first conductive synchronous belt is positioned in the first electroplating tank, the other part of the first conductive synchronous belt is positioned outside the first electroplating tank, the part of the first conductive synchronous belt, which is positioned in the first electroplating tank, surrounds and is close to the periphery of the lower part of the first carrier wheel, and the first conductive synchronous belt rotates circularly along with the rotation of the second carrier wheel;
the second conductive mechanism comprises a second conductive synchronous belt and a plurality of second synchronous wheels, the second conductive synchronous belt rotates circularly, one part of the second conductive synchronous belt is positioned in the second electroplating tank, the other part of the second conductive synchronous belt is positioned outside the second electroplating tank in the circulating rotation process, the part of the second conductive synchronous belt positioned in the second electroplating tank surrounds and is close to the periphery of the lower part of the second carrier wheel, and the second conductive synchronous belt rotates circularly along with the rotation of the second carrier wheel.
8. An ultra-thin film plating apparatus according to claim 7, wherein: first electrically conductive hold-in range sets up two, the electrically conductive hold-in range of second also sets up two, two first electrically conductive hold-in range is located respectively the axial both sides of first carrier wheel, two the electrically conductive hold-in range of second is located respectively the axial both sides of second carrier wheel.
9. An ultra-thin film plating apparatus according to claim 7, wherein: the first conductive synchronous belt and the second conductive synchronous belt respectively comprise a rubber layer and a metal conductive layer, and the metal conductive layer is opposite to the wheel periphery of the first carrier wheel or the second carrier wheel.
10. An ultra-thin film plating apparatus according to claim 1, wherein: the bottom end parts of the first electroplating bath and the second electroplating bath are respectively provided with a liquid inlet hole, two sides of the first electroplating bath and the second electroplating bath are respectively provided with an overflow hole, the overflow holes are communicated with a collecting box, and the collecting box is communicated with the first electroplating bath and the second electroplating bath through a water pump and a pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120540673.1U CN214937936U (en) | 2021-03-16 | 2021-03-16 | Ultrathin film electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120540673.1U CN214937936U (en) | 2021-03-16 | 2021-03-16 | Ultrathin film electroplating equipment |
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| Publication Number | Publication Date |
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| CN214937936U true CN214937936U (en) | 2021-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120540673.1U Active CN214937936U (en) | 2021-03-16 | 2021-03-16 | Ultrathin film electroplating equipment |
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| CN (1) | CN214937936U (en) |
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2021
- 2021-03-16 CN CN202120540673.1U patent/CN214937936U/en active Active
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