CN114164478A - Horizontal electroplating equipment - Google Patents
Horizontal electroplating equipment Download PDFInfo
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- CN114164478A CN114164478A CN202210014876.6A CN202210014876A CN114164478A CN 114164478 A CN114164478 A CN 114164478A CN 202210014876 A CN202210014876 A CN 202210014876A CN 114164478 A CN114164478 A CN 114164478A
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- roller
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- plating solution
- film
- positive conductive
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- 238000009713 electroplating Methods 0.000 title claims abstract description 22
- 238000007747 plating Methods 0.000 claims abstract description 99
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 68
- 239000010936 titanium Substances 0.000 claims abstract description 68
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 68
- 230000007246 mechanism Effects 0.000 claims abstract description 48
- 239000007788 liquid Substances 0.000 claims description 48
- 238000007599 discharging Methods 0.000 claims description 16
- 230000006835 compression Effects 0.000 abstract description 7
- 238000007906 compression Methods 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 19
- 239000010949 copper Substances 0.000 description 19
- 239000010409 thin film Substances 0.000 description 16
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 10
- 229910001431 copper ion Inorganic materials 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 239000002245 particle Substances 0.000 description 9
- 230000000149 penetrating effect Effects 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000012528 membrane Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000010073 coating (rubber) Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses horizontal electroplating equipment, which comprises an unreeling mechanism and a plating solution tank, wherein an upper row of positive conductive titanium baskets and a lower row of positive conductive titanium baskets are arranged in the plating solution tank, cathode edge conductive mechanisms are arranged on the left side and the right side of the upper row of positive conductive titanium baskets and the lower row of positive conductive titanium baskets, and the cathode edge conductive mechanisms clamp the edge of a film conveyed by the unreeling mechanism through an upper conductive belt and a lower conductive belt to form edge conduction and drive the film to move, so that the film passes through the space between the upper row of positive conductive titanium baskets and the lower row of positive conductive titanium baskets along a horizontal straight line direction. The invention can effectively solve the problems of more holes and larger hole diameter of the product by a mode of edge compression and electric conduction.
Description
Technical Field
The invention relates to the technical field of electroplating equipment, in particular to horizontal electroplating equipment.
Background
Electroplating is a process of plating a thin layer of metal or alloy on the surface of metal by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis so as to play a role in preventing metal oxidation (such as corrosion), improving wear resistance, conductivity and light reflection, enhancing the appearance and the like. With the development of modern industrial technology, the demand for film coating on the surface of a film substrate is increasing, and the film substrate is widely applied to the fields of high-performance automobile films, plasma television flat panel displays, touch screens, solar cells, flexible printed circuit boards (FPCs), Chip On Films (COFs) and the like.
In the existing electroplating equipment, electroplating is mostly carried out by adopting a mode of adding a cathode conductive roller and a plating solution tank. The method has the defects that the film base material is thin, the roll surface of the cathode conductive roll is easy to be plated with point-loaded particles in the electroplating process, the particles grow continuously under the action of current and are easy to pierce the film surface, so that the holes of the product are numerous, the diameter of the holes is large, and the quality of the product is influenced.
The above drawbacks are to be improved.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides horizontal electroplating equipment.
The technical scheme of the invention is as follows:
the horizontal electroplating equipment comprises an unwinding mechanism and a plating solution tank, wherein an upper row of positive conductive titanium baskets and a lower row of positive conductive titanium baskets are arranged in the plating solution tank, cathode edge conductive mechanisms are arranged on the left and right sides of the upper row of positive conductive titanium baskets and the lower row of positive conductive titanium baskets, and the edges of a film conveyed by the unwinding mechanism are clamped by the cathode edge conductive mechanisms through an upper conductive belt and a lower conductive belt to form edges which are conductive and drive the film to move, so that the film passes through the upper row of positive conductive titanium baskets and the lower row of positive conductive titanium baskets in the horizontal linear direction.
According to the invention of the scheme, the negative electrode conductive roller set is arranged between the unreeling mechanism and the plating solution tank, the front end in the plating solution tank is provided with the left positive electrode conductive titanium plate and the right positive electrode conductive titanium plate which are parallel to each other, the film passes through the negative electrode conductive roller set, enters the plating solution tank, and sequentially passes through the space between the left positive electrode conductive titanium plate and the right positive electrode conductive titanium plate, and the space between the upper row of positive electrode conductive titanium baskets and the lower row of positive electrode conductive titanium baskets.
Furthermore, the negative electrode conducting roller group comprises a plurality of negative electrode conducting rollers which are arranged at intervals up and down, and the film sequentially passes through the plurality of negative electrode conducting rollers and then enters the plating solution tank.
According to the invention of the scheme, a first passing roller and a flattening roller are sequentially arranged between the unwinding mechanism and the negative electrode conducting roller group, and the film sequentially passes through the first passing roller, the flattening roller and the negative electrode conducting roller group and enters the plating solution tank.
According to the invention of the scheme, the rear end of the plating solution tank is provided with the discharging liquid squeezing roller set, and the film passes through the discharging liquid squeezing roller set after passing between the upper row of positive electrode conductive titanium baskets and the lower row of positive electrode conductive titanium baskets.
Furthermore, ejection of compact crowded liquid roller set includes fixed roll, activity compression roller and ejection of compact crowded liquid cylinder, the activity compression roller with the fixed roll is parallel to each other, the expansion end of ejection of compact crowded liquid cylinder with the activity compression roller is connected and is driven the activity compression roller press to the fixed roll.
Furthermore, a second cross rod is arranged at the front end inside the plating solution tank, a third cross rod is arranged at the rear end inside the plating solution tank, and the film sequentially passes through the second cross rod, the upper row of positive conductive titanium baskets, the lower row of positive conductive titanium baskets and the third cross rod along the horizontal straight line direction.
According to the invention of the scheme, the front end in the plating solution tank is provided with the liquid inlet pipe, and the rear end in the plating solution tank is provided with the liquid outlet pipe.
According to the invention of the above scheme, a liquid receiving tank is arranged below the plating solution tank, and the liquid receiving tank is communicated with a liquid outlet of the plating solution tank.
Furthermore, full liquid reserved ports are arranged at four corners in the plating solution tank and communicated with the solution receiving tank.
According to the invention of the scheme, the cathode edge conductive mechanism comprises an upper conductive belt, a lower conductive belt, an upper conductive belt driving assembly, a lower conductive belt driving assembly, an upper conductive belt pressing assembly and a lower conductive belt pressing assembly, wherein the upper conductive belt and the lower conductive belt are arranged oppositely from top to bottom, the upper conductive belt driving assembly is connected with the upper conductive belt and drives the upper conductive belt to rotate, the upper conductive belt pressing assembly drives the lower end of the upper conductive belt to move downwards, presses against the lower conductive belt and tensions the upper conductive belt, the lower conductive belt driving assembly is connected with the lower conductive belt and drives the lower conductive belt to rotate, and the lower conductive belt pressing assembly drives the lower end of the lower conductive belt to move downwards and tensions the lower conductive belt.
Furthermore, the upper conductive belt driving assembly comprises an upper conductive belt pulley and an upper conductive belt driving motor which are arranged in an upper row and a lower row, the upper conductive belt pulley and the upper conductive belt driving motor which are arranged in the upper row are arranged on a first fixing plate, the upper conductive belt pulley which is arranged in the lower row is arranged on a second fixing plate, the upper conductive belt is sleeved on the upper conductive belt pulley which is arranged in the upper row and the lower row, and the upper conductive belt driving motor is connected with any one upper conductive belt pulley which is arranged in the upper row.
Furthermore, the lower conductive belt driving assembly comprises an upper row of lower conductive belt pulleys and a lower row of lower conductive belt driving motors, the upper row of lower conductive belt pulleys is mounted on the third fixing plate, the lower row of lower conductive belt pulleys and the lower conductive belt driving motors are mounted on the fourth fixing plate, the lower conductive belt is sleeved on the upper row of lower conductive belt pulleys, and the lower conductive belt driving motor is connected with any one lower conductive belt pulley.
Furthermore, the upper conductive belt pressing assembly comprises an upper pressing cylinder and a plurality of upper rubber coating pressing wheels which are arranged between the upper conductive belt pulleys in the lower row side by side, the upper pressing cylinder is installed on the first fixing plate, the plurality of upper rubber coating pressing wheels are installed on the second fixing plate, and the movable end of the upper pressing cylinder is connected with the second fixing plate and drives the second fixing plate to move up and down.
Furthermore, the lower conductive belt pressing assembly comprises a lower pressing cylinder and a plurality of lower rubber-coated pressing wheels arranged between the upper row of lower conductive belt pulleys side by side, the lower pressing cylinder is installed on a fifth fixing plate, the plurality of lower rubber-coated pressing wheels are installed on the third fixing plate, and the movable end of the lower pressing cylinder is connected with the fourth fixing plate and drives the fourth fixing plate to move up and down.
Furthermore, a first linear guide rod is arranged at the bottom of the fifth fixing plate, a first linear bearing is arranged on the fourth fixing plate, and the first linear bearing is sleeved outside the first linear guide rod.
Furthermore, the cathode edge conductive mechanism further comprises a film-penetrating lifting assembly, wherein the lifting end of the film-penetrating lifting assembly is connected with the upper conductive belt, the upper conductive belt driving assembly and the upper conductive belt pressing assembly, and drives the upper conductive belt, the upper conductive belt driving assembly and the upper conductive belt pressing assembly to move up and down.
The membrane penetrating lifting assembly comprises a membrane penetrating lifting cylinder, the membrane penetrating lifting cylinder is installed on a sixth fixing plate, and the movable end of the membrane penetrating lifting cylinder is connected with the first fixing plate and drives the first fixing plate to move up and down.
Furthermore, a second linear guide rod is arranged between the sixth fixing plate and the third fixing plate, a second linear bearing is arranged on the first fixing plate, a third linear bearing is arranged on the second fixing plate, and the second linear bearing and the third linear bearing are sleeved outside the second linear guide rod.
Furthermore, the cathode edge conducting mechanism further comprises a plurality of upper conducting slip rings and a plurality of lower conducting slip rings, the upper conducting slip rings are installed on the first fixing plate, the upper conducting slip rings are connected with upper conducting wheels through upper conducting rotating shafts, and the upper conducting wheels are in contact with the conducting layers of the upper conducting belts; the lower conductive slip rings are arranged below the fourth fixing plate and connected with lower conductive wheels through lower conductive rotating shafts, and the lower conductive wheels are in contact with the conductive layers of the lower conductive belts.
Furthermore, the conducting layer of the upper conducting belt is located at the inner side edge of the outer surface of the upper conducting belt, and the conducting layer of the upper conducting belt is located at the inner side edge of the outer surface of the lower conducting belt.
Furthermore, the cathode edge conducting mechanism further comprises an upper auxiliary cathode slot and a lower auxiliary cathode slot, the upper auxiliary cathode slot is mounted on the first fixing plate, openings for the upper conducting belt to pass through are formed in two sides of the upper auxiliary cathode slot, and an upper copper etching mechanism for eliminating copper plating particles on the surface of the conducting layer of the upper conducting belt is arranged in the upper auxiliary cathode slot; the lower auxiliary cathode slot is installed on the fourth fixing plate, openings for the lower conductive belt to pass through are formed in two sides of the upper auxiliary cathode slot, and a lower copper etching mechanism for eliminating copper plating particles on the surface of the conductive layer of the lower conductive belt is arranged in the upper auxiliary cathode slot.
The cathode edge conducting mechanism further comprises a clamping mechanism used for clamping the film, and the clamping mechanism is arranged at the film inlet of the upper conducting belt and the film inlet of the lower conducting belt.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the cathode current is transmitted to the plating solution through the upper and lower conductive belts of the cathode edge conductive mechanism to form a conductive closed ring body together with the upper row of anode conductive titanium baskets and the lower row of anode conductive titanium baskets, copper ions in the plating solution are uniformly covered on the film through the current, and the problems of multiple holes and larger hole diameter of a product can be effectively solved through the edge compression conductive mode;
2. by arranging the negative electrode conductive roller set, the left positive electrode conductive titanium plate and the right positive electrode conductive titanium plate, the film is pre-plated before being horizontally plated with copper in a plating solution, and partial copper ions cover the film, so that the copper plating effect of the film is better, the uniformity is higher, and holes are not generated in a product;
3. a discharging liquid squeezing roller set is arranged at the rear end of the plating solution tank, so that the copper-plated film is squeezed, and the residual plating solution on the film is squeezed out;
4. through setting up the feed liquor pipe at the inside front end in plating bath groove, set up the drain pipe at the inside rear end in plating bath groove, can be so that the concentration of copper ion in the plating bath keeps unchangeable, can make the inside plating bath of plating bath groove along the even flow of film moving direction again to make the copper-plating effect of film better, the homogeneity is higher.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is a schematic structural diagram of a cathode edge conduction mechanism according to the present invention;
FIG. 4 is a front view of a cathode edge conduction mechanism in accordance with the present invention;
FIG. 5 is a side view of a cathode edge conduction mechanism in accordance with the present invention;
FIG. 6 is an enlarged view of portion A of FIG. 2;
FIG. 7 is a schematic view showing the structure of a plating bath tank according to the present invention;
FIG. 8 is a plan view of the plating bath tank of the present invention.
In the context of the figures, it is,
1. an unwinding mechanism; 2. plating solution tanks; 201. a liquid full reserved opening; 3. an upper row of positive conductive titanium baskets; 4. a lower row of positive conductive titanium baskets; 5. a cathode edge conduction mechanism; 501. an upper conductive belt; 502. a lower conductive belt; 503. an upper conductive pulley; 504. an upper conductive belt driving motor; 505. a first fixing plate; 506. a second fixing plate; 507. a lower conductive pulley; 508. the lower conductive belt drives the motor; 509. a third fixing plate; 510. a fourth fixing plate; 511. an upper pressing cylinder; 512. coating a rubber-coated pinch roller; 513. a lower pressing cylinder; 514. lower rubber coating pinch roller; 515. a fifth fixing plate; 516. a first linear guide; 517. a first linear bearing; 518. a film-penetrating lifting cylinder; 519. a sixth fixing plate; 520. a second linear guide; 521. a second linear bearing; 522. a third linear bearing; 523. an upper conductive slip ring; 524. an upper conductive rotating shaft; 525. an upper conductive wheel; 526. a lower conductive slip ring; 527. a lower conductive rotating shaft; 528. a lower conductive wheel; 529. an upper auxiliary cathode channel; 530. a lower auxiliary cathode channel; 531. a clamping mechanism; 6. a negative electrode conducting roller set; 7. a left positive conductive titanium plate; 8. a right positive conductive titanium plate; 9. a first stick; 10. flattening rollers; 11. a discharging liquid squeezing roller set; 1101. a fixed roller; 1102. a movable press roller; 1103. a discharging liquid squeezing cylinder; 12. a second stick is crossed; 13. thirdly, passing through a stick; 14. a liquid inlet pipe; 15. a liquid outlet pipe; 16. a liquid receiving tank; 17. a film.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.
It will be understood that when an element is referred to as being "disposed on" or "secured to" or "mounted on" another element, it can be directly or indirectly disposed on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second", "third", "fourth", "fifth", "sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
Referring to fig. 1 to 2, an embodiment of the present invention provides a horizontal electroplating apparatus, including an unwinding mechanism 1 and a plating solution tank 2, wherein an upper row of positive conductive titanium baskets 3 and a lower row of positive conductive titanium baskets 4 are disposed in the plating solution tank 2, cathode edge conductive mechanisms 5 are disposed on left and right sides of the upper row of positive conductive titanium baskets 3 and the lower row of positive conductive titanium baskets 4, and the cathode edge conductive mechanisms 5 clamp edges of a film 17 conveyed by the unwinding mechanism 1 through an upper conductive belt and a lower conductive belt to form edge conduction and drive the film 17 to move, so that the film 17 passes through between the upper row of positive conductive titanium baskets 3 and the lower row of positive conductive titanium baskets 4 along a horizontal straight line direction. According to the invention, the cathode current is transmitted to the plating solution through the upper and lower conductive belts of the cathode edge conductive mechanism 5 to form a conductive closed loop with the upper row of the anode conductive titanium baskets 3 and the lower row of the anode conductive titanium baskets 4, copper ions in the plating solution are uniformly covered on the film 17 through the current, and the problems of multiple holes and larger hole diameter of a product can be effectively solved through the edge compression conductive mode.
Referring to fig. 3 to 5, the cathode edge conductive mechanism 5 includes an upper conductive belt 501, a lower conductive belt 502, an upper conductive belt driving assembly, a lower conductive belt driving assembly, an upper conductive belt pressing assembly, and a lower conductive belt pressing assembly, where the upper conductive belt 501 and the lower conductive belt 502 are disposed opposite to each other, the upper conductive belt driving assembly is connected to the upper conductive belt 501 and drives the upper conductive belt 501 to rotate, the upper conductive belt pressing assembly drives the lower end of the upper conductive belt 501 to move downward, press the lower conductive belt 502 and tension the upper conductive belt 501, the lower conductive belt driving assembly is connected to the lower conductive belt 502 and drives the lower conductive belt 502 to rotate, and the lower conductive belt pressing assembly drives the lower end of the lower conductive belt 502 to move downward and tension the lower conductive belt 502. Through last electrically conductive belt compress tightly subassembly and electrically conductive belt compress tightly the subassembly down, can play in the operation of film 17 and compress tightly film 17 edge, evenly transmit the effect that the negative pole electric current moved on film 17 and level and steady drive film 17 operation.
Referring to fig. 3 to 5, the upper conductive belt driving assembly includes an upper conductive belt driving motor 504 and upper and lower rows of upper conductive belt pulleys 503, the upper row of upper conductive belt pulleys 503 and the upper conductive belt driving motor 504 are mounted on a first fixing plate 505, the lower row of upper conductive belt pulleys 503 is mounted on a second fixing plate 506, the upper conductive belt 501 is sleeved on the upper and lower rows of upper conductive belt pulleys 503, and the upper conductive belt driving motor 504 is connected with any one of the upper conductive belt pulleys 503 on the upper row and drives the upper conductive belt pulley 503 to rotate, so as to drive the upper conductive belt 501 to rotate.
Referring to fig. 3 to 5, the lower conductive belt driving assembly includes a lower conductive belt driving motor 508 and upper and lower rows of lower conductive belt pulleys 507, the upper row of lower conductive belt pulleys 507 is mounted on a third fixing plate 509, the lower row of lower conductive belt pulleys 507 and the lower conductive belt driving motor 508 are mounted on a fourth fixing plate 510, the lower conductive belt 502 is sleeved on the upper and lower rows of lower conductive belt pulleys 507, and the lower conductive belt driving motor 508 is connected to any lower conductive belt pulley 507 in the lower row and drives the lower conductive belt pulley 507 to rotate, so as to drive the lower conductive belt 502 to rotate.
Referring to fig. 3 to 5, the upper conductive belt pressing assembly includes an upper pressing cylinder 511 and a plurality of upper rubber-covered pressing wheels 512 arranged between the upper conductive pulleys 503 in the lower row, the upper pressing cylinder 511 is mounted on the first fixing plate 505, the plurality of upper rubber-covered pressing wheels 512 are mounted on the second fixing plate 506, and a movable end of the upper pressing cylinder 511 is connected with the second fixing plate 506 and drives the second fixing plate 506 to move up and down. After the upper pressing cylinder 511 is started, the lower row of the upper conductive belt wheel 503 and the upper rubber-covered pressing wheel 512 are driven to move downwards by the second fixing plate 506, so that the lower end of the upper conductive belt 501 is driven to move downwards, press the lower conductive belt 502 and tension the upper conductive belt 501.
Referring to fig. 3 to 5, the lower conductive belt pressing assembly includes a lower pressing cylinder 513 and a plurality of lower rubber-covered pressing rollers 514 that are uniformly arranged between the upper row of lower conductive pulleys 507 side by side, the lower pressing cylinder 513 is mounted on a fifth fixing plate 515, the plurality of lower rubber-covered pressing rollers 514 are mounted on a third fixing plate 509, and a movable end of the lower pressing cylinder 513 is connected with a fourth fixing plate 510 and drives the fourth fixing plate 510 to move up and down. After the lower pressing cylinder 513 is started, the lower conductive belt wheel 507 in the lower row is driven to move downwards by the fourth fixing plate 510, so that the lower end of the lower conductive belt 502 is driven to move downwards, and the lower conductive belt 502 is tensioned. Because the upper rubber-coated pinch roller 512 and the lower rubber-coated pinch roller 514 are softer in texture, the edges of the thin film 17 can be uniformly pressed by the upper conductive belt 501 and the lower conductive belt 502, a buffering effect can be achieved, and the thin film 17 is prevented from being crushed.
Referring to fig. 3 to 5, in order to enable the downward pressing cylinder 513 to smoothly drive the fourth fixing plate 510 to move downward, a first linear guide 516 is disposed at the bottom of the fifth fixing plate 515, a first linear bearing 517 is disposed on the fourth fixing plate 510, and the first linear bearing 517 is sleeved outside the first linear guide 516, so that the fourth fixing plate 510 can move up and down along the first linear guide 516.
Referring to fig. 3 to 5, the cathode edge conductive mechanism 5 further includes a film-through lifting assembly, and a lifting end of the film-through lifting assembly is connected to the upper conductive belt 501, the upper conductive belt driving assembly, and the upper conductive belt pressing assembly, and drives the upper conductive belt 501, the upper conductive belt driving assembly, and the upper conductive belt pressing assembly to move up and down. When the film 17 is broken or is threaded for the first time, the upper conductive belt 501 and the lower conductive belt 502 are used for passing the film 17, and then the film threading lifting assembly integrally lifts the upper conductive belt 501, the upper conductive belt driving assembly and the upper conductive belt pressing assembly, so that a worker can finish the threaded film 17.
Referring to fig. 3 to 5, the penetrating film lifting assembly includes a penetrating film lifting cylinder 518, the penetrating film lifting cylinder 518 is installed on a sixth fixing plate 519, and a movable end of the penetrating film lifting cylinder 518 is connected to the first fixing plate 505 and drives the first fixing plate 505 to move up and down, so as to drive the second fixing plate 506 to move up and down, thereby driving the upper conductive belt 501, the upper conductive belt driving assembly and the upper conductive belt pressing assembly to move up and down.
Referring to fig. 3 to 5, in order to enable the transmembrane lifting cylinder 518 to smoothly drive the first fixing plate 505 to move up and down, the upper compressing cylinder 511 can smoothly drive the second fixing plate 506 to move up and down, a second linear guide rod 520 is disposed between the sixth fixing plate 519 and the third fixing plate 509, the first fixing plate 505 is provided with a second linear bearing 521, the second fixing plate 506 is provided with a third linear bearing 522, and the second linear bearing 521 and the third linear bearing 522 are both sleeved outside the second linear guide rod 520, so that the first fixing plate 505 and the second fixing plate 506 can move up and down along the second linear guide rod 520.
Referring to fig. 3 to 4, the cathode edge conductive mechanism 5 further includes a plurality of upper conductive slip rings 523 and a plurality of lower conductive slip rings 526, the plurality of upper conductive slip rings 523 are mounted on the first fixing plate 505, the upper conductive slip rings 523 are connected to the upper conductive wheel 525 through the upper conductive rotating shaft 524, and the upper conductive wheel 525 contacts with the conductive layer of the upper conductive belt 501; a plurality of lower conductive slip rings 526 are installed below the fourth fixing plate 510, the lower conductive slip rings 526 are connected to a lower conductive wheel 528 through a lower conductive rotating shaft 527, and the lower conductive wheel 528 is in contact with the conductive layer of the lower conductive belt 502. The upper conductive slip ring 523 transmits the negative current to the conductive layer of the upper conductive belt 501 through the upper conductive rotating shaft 524 and the upper conductive wheel 525, the lower conductive slip ring 526 transmits the negative current to the conductive layer of the lower conductive belt 502 through the lower conductive rotating shaft 527 and the lower conductive wheel 528, and further transmits the negative current to the film 17 through the conductive layers of the upper conductive belt 501 and the lower conductive belt 502.
Preferably, the conductive layer of the upper conductive belt 501 is located at the inner edge of the outer surface of the upper conductive belt 501, and the conductive layer of the upper conductive belt 501 is located at the inner edge of the outer surface of the lower conductive belt 502, so that the conductive layers of the upper conductive belt 501 and the lower conductive belt 502 are in contact with only the edge of the film 17.
Referring to fig. 3 to 4, the cathode edge conductive mechanism 5 further includes an upper auxiliary cathode groove 529 and a lower auxiliary cathode groove 530, the upper auxiliary cathode groove 529 is mounted on the first fixing plate 505, openings for the upper conductive belt 501 to pass through are provided on both sides of the upper auxiliary cathode groove 529, and an upper copper etching mechanism/copper etching liquid for removing copper plating particles on the surface of the conductive layer of the upper conductive belt 501 is provided in the upper auxiliary cathode groove 529; the lower auxiliary cathode groove 530 is installed on the fourth fixing plate 510, openings through which the lower conductive belt 502 passes are provided at both sides of the upper auxiliary cathode groove 529, and a lower copper etching mechanism/copper etching liquid for removing copper plating particles on the surface of the conductive layer of the lower conductive belt 502 is provided in the upper auxiliary cathode groove 529. In the electroplating process, the conducting layers of the upper conducting belt 501 and the lower conducting belt 502 can attract copper ions, copper plating particles are easy to plate and point-mounted, the copper plating particles continuously grow under the action of current and easily pierce the film surface at the edge of the thin film 17, and therefore the upper auxiliary cathode groove 529 is arranged on the traveling path of the upper conducting belt 501, the lower auxiliary cathode groove 530 is arranged on the traveling path of the lower conducting belt 502, and the copper plating particles on the surfaces of the conducting layers of the upper conducting belt 501 and the lower conducting belt 502 can be eliminated in time.
Referring to fig. 3 to 5, the cathode edge conductive mechanism 5 further includes a clamping mechanism 531 for clamping the thin film 17, the clamping mechanism 531 is disposed at the film inlets of the upper conductive belt 501 and the lower conductive belt 502, and the film surface of the thin film 17 is clamped by the film inlets of the upper conductive belt 501 and the lower conductive belt 502, so that the bad problem caused by the backward sliding of the thin film 17 can be prevented, and the thin film 17 is tensioned.
Referring to fig. 2 and 6, a negative conductive roller set 6 is arranged between the unwinding mechanism 1 and the plating solution tank 2, the negative conductive roller set 6 includes a plurality of negative conductive rollers arranged at intervals up and down, the front end inside the plating solution tank 2 is provided with a left positive conductive titanium plate 7 and a right positive conductive titanium plate 8 which are parallel to each other, and the film 17 sequentially passes through the plurality of negative conductive rollers and then enters the plating solution tank 2, and sequentially passes between the left positive conductive titanium plate 7 and the right positive conductive titanium plate 8, and sequentially passes between the upper row of positive conductive titanium baskets 3 and the lower row of positive conductive titanium baskets 4. The negative electrode conducting roller group 6 transfers the negative electrode current to the film 17, after the film 17 enters the plating solution, the negative electrode current is transferred to the plating solution to form a conductive closed ring body with the left positive electrode conducting titanium plate 7 and the right positive electrode conducting titanium plate 8, copper ions in the plating solution cover the film 17, the film 17 is pre-plated, and meanwhile, copper plating can be started only when the film 17 enters the plating solution, so that holes can not be generated in the product. Because the copper ions have fluidity in the plating solution, the copper ions have time difference when moving to the thin film 17, the thin film 17 is preplated before horizontal copper plating in the plating solution, and partial copper ions cover the thin film 17 first, so that the copper plating effect of the thin film 17 is better and the uniformity is higher.
Referring to fig. 1 and 2, a first passing roller 9 and a flattening roller 10 are sequentially disposed between the unwinding mechanism 1 and the negative electrode conducting roller set 6, and the film 17 sequentially passes through the first passing roller 9, the flattening roller 10 and the negative electrode conducting roller set 6 and enters the plating solution tank 2. The first roller 9 is used for controlling the tape path of the film 17 in a traction way, so that the film 17 can be smoothly docked with other equipment. The flattening roller 10 is used for flattening the film 17, and the film 17 is prevented from wrinkling to affect the product quality.
Referring to fig. 1 and 2, a discharging squeeze roller set 11 is disposed at the rear end of the plating bath tank 2, and after passing through between the upper row of positive conductive titanium baskets 3 and the lower row of positive conductive titanium baskets 4, the film 17 is squeezed by the discharging squeeze roller set 11, so as to squeeze the residual plating solution on the film 17. Specifically, the discharging squeeze roller group 11 includes a fixed roller 1101, a movable pressing roller 1102 and a discharging squeeze cylinder 1103, the movable pressing roller 1102 is parallel to the fixed roller 1101, and the movable end of the discharging squeeze cylinder 1103 is connected with the movable pressing roller 1102 and drives the movable pressing roller 1102 to press towards the fixed roller 1101. When the thin film 17 passes between the fixed roller 1101 and the movable pressing roller 1102, the discharging liquid squeezing cylinder 1103 is started to drive the movable pressing roller 1102 to press the fixed roller 1101, so that the thin film 17 is squeezed, and the plating solution remained on the thin film 17 is squeezed out.
Referring to fig. 2, 7 and 8, a second stick 12 is disposed at the front end of the plating solution tank 2, a third stick 13 is disposed at the rear end of the plating solution tank 2, and a film 17 sequentially passes through the second stick 12, the space between the upper row of positive conductive titanium baskets 3 and the lower row of positive conductive titanium baskets 4, and the third stick 13 along the horizontal straight line direction. The second through rod 12 and the third through rod 13 are used for controlling the tape-moving path of the film 17 in the plating solution in a traction manner, so that the film 17 can horizontally pass between the upper row of positive conductive titanium baskets 3 and the lower row of positive conductive titanium baskets 4 after entering the plating solution, and can be smoothly butted with other equipment.
Referring to fig. 2, 7 and 8, a liquid inlet pipe 14 is disposed at the front end of the interior of the plating solution tank 2, a liquid outlet pipe 15 is disposed at the rear end of the interior of the plating solution tank 2, and the plating solution continuously fed into the liquid inlet pipe 14 and the plating solution continuously discharged from the liquid outlet pipe 15, so that the concentration of copper ions in the plating solution is kept unchanged, and the plating solution in the interior of the plating solution tank 2 can uniformly flow along the moving direction of the thin film 17, thereby the copper plating effect of the thin film 17 is better and the uniformity is higher.
Referring to fig. 1 and 2, a liquid receiving tank 16 is disposed below the plating liquid tank 2, the liquid receiving tank 16 is communicated with a liquid outlet of the plating liquid tank 2, and the plating liquid in the plating liquid tank 2 can be discharged into the liquid receiving tank 16 through the liquid outlet. Meanwhile, the plating solution tank 2 is provided with a full solution reserving port 201 at four corners inside, and the full solution reserving port 201 is communicated with the solution receiving tank 16. When the height of the plating solution in the plating solution tank 2 reaches the height of the full solution reserved port 201, the plating solution higher than the full solution reserved port 201 flows into the solution receiving tank 16 along the full solution reserved port 201, and it is also possible to prevent the plating solution from overflowing the plating solution tank 2 and flowing to the outside of the device when the liquid inlet amount of the plating solution tank 2 is greater than the liquid discharge amount, which causes resource waste and affects the operation of the device.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
The invention is described above with reference to the accompanying drawings, which are illustrative, and it is obvious that the implementation of the invention is not limited in the above manner, and it is within the scope of the invention to adopt various modifications of the inventive method concept and technical solution, or to apply the inventive concept and technical solution to other fields without modification.
Claims (10)
1. The horizontal electroplating equipment is characterized by comprising an unreeling mechanism and a plating solution tank, wherein an upper row of positive conductive titanium baskets and a lower row of positive conductive titanium baskets are arranged in the plating solution tank, cathode edge conductive mechanisms are arranged on the left and right sides of the upper row of positive conductive titanium baskets and the lower row of positive conductive titanium baskets, and the edges of a film conveyed by the unreeling mechanism are clamped by the cathode edge conductive mechanisms through an upper conductive belt and a lower conductive belt to form edge conduction and drive the film to move, so that the film passes through the upper row of positive conductive titanium baskets and the lower row of positive conductive titanium baskets along a horizontal straight line direction.
2. The horizontal electroplating device according to claim 1, wherein a negative conductive roller group is arranged between the unreeling mechanism and the plating solution tank, the front end of the interior of the plating solution tank is provided with a left positive conductive titanium plate and a right positive conductive titanium plate which are parallel to each other, and the film passes through the negative conductive roller group, enters the plating solution tank, and sequentially passes between the left positive conductive titanium plate and the right positive conductive titanium plate, and between the upper row of positive conductive titanium baskets and the lower row of positive conductive titanium baskets.
3. The horizontal electroplating apparatus according to claim 2, wherein the negative electrode conducting roller group comprises a plurality of negative electrode conducting rollers which are arranged at intervals up and down, and the film sequentially passes through the plurality of negative electrode conducting rollers and then enters the plating solution tank.
4. The horizontal electroplating device according to claim 2, wherein a first roller and a flattening roller are sequentially arranged between the unwinding mechanism and the negative electrode conducting roller group, and the film sequentially passes through the first roller, the flattening roller and the negative electrode conducting roller group and enters the plating solution tank.
5. The horizontal electroplating apparatus according to claim 1, wherein a discharging squeeze roller set is arranged at the rear end of the plating solution tank, and the film passes through the discharging squeeze roller set after passing between the upper row of positive conductive titanium baskets and the lower row of positive conductive titanium baskets.
6. The horizontal electroplating device according to claim 5, wherein the discharging liquid squeezing roller group comprises a fixed roller, a movable pressing roller and a discharging liquid squeezing cylinder, the movable pressing roller and the fixed roller are parallel to each other, and the movable end of the discharging liquid squeezing cylinder is connected with the movable pressing roller and drives the movable pressing roller to press against the fixed roller.
7. The horizontal electroplating apparatus according to claim 1, wherein a second roller is arranged at the front end of the interior of the plating solution tank, a third roller is arranged at the rear end of the interior of the plating solution tank, and the film passes through the second roller, the upper row of positive conductive titanium baskets and the lower row of positive conductive titanium baskets and the third roller in sequence along the horizontal straight line direction.
8. The horizontal electroplating apparatus according to claim 1, wherein the plating bath tank is provided at an inner front end thereof with a liquid inlet pipe and at an inner rear end thereof with a liquid outlet pipe.
9. The horizontal plating apparatus according to claim 1, wherein a liquid receiving tank is provided below the plating liquid tank, and the liquid receiving tank communicates with a liquid discharge port of the plating liquid tank.
10. The horizontal electroplating apparatus according to claim 9, wherein a full liquid reserving port is arranged at four corners inside the plating solution tank, and the full liquid reserving port is communicated with the solution receiving tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210014876.6A CN114164478A (en) | 2022-01-07 | 2022-01-07 | Horizontal electroplating equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210014876.6A CN114164478A (en) | 2022-01-07 | 2022-01-07 | Horizontal electroplating equipment |
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| CN114164478A true CN114164478A (en) | 2022-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210014876.6A Pending CN114164478A (en) | 2022-01-07 | 2022-01-07 | Horizontal electroplating equipment |
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| CN (1) | CN114164478A (en) |
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| WO2024082492A1 (en) | 2022-10-18 | 2024-04-25 | 重庆金美新材料科技有限公司 | Electroplating bath having side wall plating solution drainage function and electroplating production line |
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