TWI461130B - Method of thin printed circuit board wet process consistency on the same carrier - Google Patents

Description

Method for consistently making a thin circuit board wet process with the same carrier

The invention relates to a method for consistently making a wet process of a thin circuit board with the same carrier, in particular to a method for continuously and automatically performing a wet process of a circuit board full wet process using the same frame as a carrier. .

According to the printed circuit board (PCB) process, there are "dry process" and "wet process". The "wet process" circuit board needs to be in contact with the liquid during the process. For example, in the development process after exposure, it must be The developing solution is sprayed on the circuit board, and the cleaning liquid is sprayed in the water washing unit. In addition, in the subsequent plating, stripping, etching, etc., the liquid must be contacted.

In terms of the manufacturing method of the board wet process, it can be roughly divided into two methods, horizontal production and vertical production. The so-called horizontal production, such as the wet process equipment for developing the circuit board disclosed in FIG. 10, comprising a feeding unit 11, a first developing unit 12, a second developing unit 13, a water washing unit 14, a drying unit 15, a drying unit 16, and a reclaiming unit 17, which are sequentially arranged. The circuit board is driven by the transport rollers 18 through the various units previously described.

However, there is sometimes a slippage between the transport roller 18 and the circuit board, which makes the advancement of the circuit board inaccurate, and sometimes causes problems such as a card or a stack. Moreover, when a liquid or a chemical is sprayed on a horizontal circuit board, it tends to remain on the circuit board, causing a commonly known "water effect". In other words, the horizontal machine causes two effects, one effect being The liquid discharge speed of the edge of the board is faster than that of the liquid at the center. The liquid sprayed to the center of the board needs to travel a long distance away from the board, so the liquid sprayed to the edge of the board has left the board at the same time. The liquid at the center has not yet left the circuit board and accumulated, causing the liquid at the center to be higher than the edge. The accumulated liquid has been used to cause a decrease in chemical reaction. The water accumulation caused by the above causes another effect. The flow profile formed by the liquid on the circuit board will further affect the entry of new liquid, resulting in the liquid at the edge being easy to penetrate due to the thin thickness, the fresh liquid on the circuit board is updated quickly, and the thickness at the center is thicker. The new liquid is less likely to enter the board, causing a drop in speed.

Then check that the printed circuit board's circuit is getting more and more precise. The way to use the roller to transport the circuit board will touch the circuit in the circuit board, which will easily cause damage to the circuit and affect the production yield of the circuit board.

Another method for manufacturing a printed circuit board in a vertical manner, such as the method used in the electroplating process, is to vertically fix a plurality of printed circuit boards in a matrix arrangement on a plating rack (Rack), and then borrow a crane. Move to each of the specified processing tanks and plating tanks for electroplating, that is, shift to the top of the processing tank, and then move the board vertically downwards to the processing tank. After a reaction time, move the board vertically upwards. Take it out of the processing tank. However, in general, the concentration or current of the agent at each location in the processing tank is not completely uniform, resulting in inconsistent chemical reactions or plating effects on each of the boards in the processing tank.

In the traditional wet process, the various processes from development, plating, stripping, etching, etc. are separate devices, for example, horizontal production in the development process, before the completion of the electroplating process, and In the process of transporting the board from the developing device to the plating equipment, whether it is transported by stacking or inserting the frame, there is a risk of scratching or bumping the board. If it is a soft board or a thin board, the risk will be more. Further, as shown in FIG. 2, it is a patent of M381635, which discloses that a frame 20 is used as a carrier for the thin plate 21 to perform an electroplating process; however, the frame of the frame has a large contact surface with the circuit board, and is easy to contact. Face 22 creates the problem of Tibetan syrup. If the frame is used in a single process or syrup, the volume may not have the problem of mutual contamination between the grooves and the grooves, so the structure of the frame 20 is not suitable for different processes, and at the same time has the aforementioned mutual The problem of contamination is therefore not ideal as a continuous process.

The wet process of the conventional circuit boards is to transfer the circuit board from the developing device to the plating equipment or to other equipment through manual means through a discontinuous device, thereby increasing the process cost and reducing the production capacity. In the transfer process, many external environmental factors are added, and the yield of printed circuit boards is also reduced.

Therefore, the traditional circuit board wet process still has some imperfections, especially in the process of soft board or thin board, there is much room for improvement.

The main purpose of the present invention is to provide a wet process for thin circuit boards by the same carrier, the frame is provided with a plurality of small flanges with respect to the positioning holes of the thin circuit board, and the positioning components are combined. And the contact area is small fixed to the positioning member to form a point contact, which has the difficulty of hiding the medicine in the thin circuit board, and the uniform distribution of the point contact is not easy to cause the mechanical pressure unevenness to break the thin circuit board or cause the copper foil circuit to be short-circuited. Or breakage, and the ability to evenly distribute copper on a thin circuit board during plating.

Another object of the present invention is to provide a wet process for thin circuit boards by the same carrier, which is mainly for wet process of developing, copper plating, stripping, etching, etc., on an automated stroke. And each circuit board is hung from the same frame to the completion of the above process, and is successively displaced by the crane to the designated processing tank, and the circuit is vertically immersed in a processing tank to make the circuit The board does not need to be transported between different processes, and has the advantages of continuous process and uniform chemical reaction or electroplating reaction of the circuit board.

A further object of the present invention is to provide a wet process for thin circuit boards by the same carrier, and the full wet process can be carried out by hanging circuit boards, which can avoid the pool effect and is suitable for thin circuit boards. The wet process automation not only saves space and cost, but also prevents damage to the precision circuit on the board and improves the board's yield and quality.

In order to achieve the above object, the technical means adopted by the present invention include:

a) providing a frame, which is a rectangular rigid frame composed of a conductive material, the inner frame edge of the frame is extended inwardly with a plurality of small flanges, and the small flange is provided with a conductive Sexual positioning piece;

b) providing a thin circuit board having a smaller outer shape than the inner frame edge of the frame, and the thin circuit board edge is provided with a positioning hole relative to the positioning member, and can be hung on the positioning member to make the thin shape The circuit board is flat and the edge thereof does not contact the inner frame edge of the frame, and only the periphery of the positioning hole is in point contact with the positioning member;

c) providing a plurality of fixing members fixed to the positioning member, and the contact surface of the surface corresponding to the thin circuit board is electrically conductive, and the surface of the thin circuit board is transmitted through the fixing member and the positioning member, thereby The frame is electrically connected;

d) providing a plurality of treatment tanks arranged in sequence and each of which is provided with a predetermined treatment liquid required for the wet process;

e) Providing a plurality of crane devices arranged above the plurality of processing tanks and reciprocally movable back and forth over the plurality of processing tanks, thereby moving the frame clamp to each of the designated processing tanks for wet processing.

According to a predecessor feature of the invention, the frame described in step a) is formed by a metal plate.

Moreover, the frame further includes a hanger, the hanger is made of a conductive material, and is provided with a plurality of clamps for gripping the frame, and the two sides are formed as contact portions.

Further, the processing tank described in the step d) includes: a plurality of developing tanks, a copper plating tank, a stripping tank, an etching tank and a stripping groove; and the top surfaces of the processing tanks are provided with V-shaped blocks, Both sides of the hanger are provided with contiguous contacts relative to the V-shaped block.

Further, the V-shaped block on both sides of the copper plating tank is connected with a power source, and when the contact portions of the hanger are spanned, the hanger can be electrically conductive and electrically connected to the clamp through the hanger. The frame conducts current from the positioning member and the fixing member of the frame to the thin circuit board to plate copper through holes in the thin circuit board.

In addition, the fixing member described in the step c) includes: an outer casing formed of an elastic material; a metal buckle is disposed at the bottom of the outer casing, and the center thereof is opposite to the positioning member; The buttonhole is clamped to the outer diameter thereof, and the metal buckle has a conductive contact surface extending on the surface of the thin circuit board.

In addition, the jacket system is composed of rubber, the metal buckle is made of metal, and the positioning member is formed by a pin perpendicular to the surface of the small flange, and the positioning hole of the circuit board is sleeved. hang.

By means of the above-mentioned technical means, the invention can effectively improve the problems of the prior art by the same carrier to make the thin circuit board wet process consistent. The wet process integrates development, copper plating, stripping and etching continuously. It saves the machine and labor of loading and unloading and reduces the dust attached to the transfer, which can improve the yield and save costs.

First, referring to FIG. 3 to FIG. 4, the method of the present invention for consistently making a thin circuit board wet process by the same carrier includes the following steps:

Step a), providing a frame 30, which is a rectangular rigid frame made of a conductive material, the frame inner edge 31 extends inwardly with a plurality of small flanges 32, and the small flange 32 The positioning member 33 is provided with a conductive member. In this embodiment, please refer to FIG. 4C at the same time. The frame 30 is formed by a metal plate, and the outer sides of the left and right sides of the frame extend outward. A step surface 34 is formed, which has good mechanical strength, and can be horizontally placed so that the step surface 34 can also be moved by the roller 35 on a horizontal machine table, and the effective area of the thin circuit board 40 does not contact any machine parts. In another embodiment, as shown in FIG. 8, it is a vertical machine, and the frame 30 further includes a hanger 80, which is composed of a conductive material. A plurality of clamps 81 for gripping the frame 30 are provided thereon, and the two sides are provided as contact portions 82, so that the frame can be applied to a horizontal or vertical machine.

Step b), please refer to FIG. 3 and FIG. 3A simultaneously, and provide a thin circuit board 40 having an outer shape smaller than the inner frame edge 31 of the frame 30, and the edge of the thin circuit board 40 is disposed relative to the positioning member 33. The positioning hole 41 can be hung on the positioning member 33, so that the thin circuit board 40 is flattened, and the edge thereof does not contact the inner frame edge 31 of the frame 30, only the circumference of the positioning hole 41 and the The positioning member 33 is in point contact. Further, in the present embodiment, the positioning member 33 is constituted by a pin perpendicular to the surface of the small flange 32, and the positioning hole 41 of the circuit board is hung by the sleeve, but is not limited thereto.

Step c), as shown in FIG. 3B and FIGS. 4A-4B, a plurality of fixing members 50 are provided on the positioning member 33, and the contact surfaces of the surfaces corresponding to the thin circuit board 40 are electrically conductive, and The surface of the thin circuit board 40 is transmitted through the fixing member 50 and the positioning member 33, and is electrically connected to the frame 30. In the embodiment, the fixing member 50 includes an outer casing 51 composed of an elastic material. a metal buckle 52 is disposed at the bottom of the outer casing 51, and has a button hole 521 that can be clamped at an outer diameter thereof with respect to the positioning member 33, and the metal buckle 52 has an extension pressing The conductive contact surface 522 of the surface of the thin circuit board 40. In a preferred embodiment, the outer casing 51 is made of rubber, and the metal buckle 52 is made of copper, but is not limited thereto.

For example, if the thin circuit board 40 is 415 X 511 mm, the size of the inner frame edge 31 of the frame may be 419 X 515 mm in size, so that the size of the inner frame edge 31 of the frame is larger than the size. The thin circuit board 40 is sized such that there is a gap D between the two, so that the edge of the thin circuit board 40 does not contact any object, and only the plurality of fixing members 50 and the small flange 32 mentioned above are used, and the positioning member (pin) is utilized. 33 is positioned to the thin circuit board 40 to provide a bonding effect between the three, so that the small-area plurality of fixing members 50 and the small flanges 32 are evenly distributed over a large area of the predetermined portion of the thin circuit board 40.

In the step d), as shown in FIG. 5 to FIG. 6 , a plurality of processing tanks 60 are provided, which are arranged in sequence and each of which is provided with a predetermined processing liquid required for the wet process. In the embodiment, the processing tank 60 mainly includes The plurality of developing tanks 62, the copper plating tanks 63, the stripping grooves 64, and the etching grooves 65 may include a buffer tank or a stripping groove 66. In addition, the processing tank 60 may be provided with a loading zone 61 and a blanking zone 67 before and after. Further, the plurality of processing tanks of the foregoing processes may further include a washing tank or a buffer tank, for example, developing and copper plating. One or several processing tanks between the stripping and etching processes may be used as a washing tank or a buffer tank, etc., as a cleaning or buffering process for process conversion, and are not described herein. Moreover, a V-shaped block 68 is disposed on the top surfaces of the two processing tanks 60, and the contact portions 82 on both sides of the hanger 80 are spanned. In this embodiment, the copper plating grooves 63 are on both sides. The V-shaped block 68 is connected to a power source. When the contact portions 82 of the hanger are spanned, the hanger 80 can be electrically connected and electrically connected to the frame 30 via the clamp 81 on the hanger 80. The current is conducted from the positioning member 33 of the frame 30 and the fixing member 50 to the thin circuit board 40, and the through hole on the thin circuit board 40 is subjected to a process of electroplating copper.

Step e), as shown in FIGS. 7A, 7B and 8 at the same time, a plurality of crane devices 70 are provided, which are arranged above the plurality of processing tanks 60, and can be reciprocally displaced back and forth over the plurality of processing tanks 60, thereby The frame 30 is gripped and moved to each of the designated processing tanks for wet processing. In the present embodiment, the crane apparatus 70 includes a set of rails 71 mounted on both sides of the plurality of processing tanks 60; a crane 72 The utility model is disposed on the group of rails 71, and has a power source 73 and a transmission member 74 thereon, so that the crane 72 can be displaced forward and backward on the rail 71; a crossbar 75 is attached to the crane 72, and driven by the transmission member 74, can be vertically raised and lowered in the crane 72, and the crossbar 75 can pick up the hanger 80 to vertically raise and lower in the designated processing tank. As for the detailed structure of the crane device 70, it belongs to the prior art, and is not a patent of the present invention.

In combination with the steps d) and e), the crane device 70 transfers the frame 30 to the loading zone 61 to fix the thin circuit board 40 by the above-mentioned steps a) to c), and sequentially moves in the wet process sequence. The immersion is carried out in each of the processing tanks 60, as follows: the developing tank 62, the copper plating tank 63, the stripping tank 64, the etching tank 65, and the buffer tank or the stripping tank 66 to the blanking area 67, which are exposed to the wet process. The processing is prior art, and the patents of the present invention are not described herein. The present invention resides in the use of the same frame 30 to convert the treatment tanks of various different syrups, because the frame 30 has the property of not hiding the syrup, and does not allow the syrup to be brought to other different syrup treatment tanks to cause mutual contamination, and the frame 30 is Automatic consistency for the same vehicle.

By means of the above-mentioned technical means, the invention can effectively improve the problem of the prior art by the method that the same carrier makes the thin circuit board wet process consistent, and has the following effects:

One. The frame 30 and the thin circuit board 40 are fixed in contact with each other by point contact, and the contact area between the two is reduced, and the syrup is not easily trapped, thereby solving the problem that the conventional circuit board cradle (Rack) is easy to hide the syrup. The tank is mixed with the treatment liquid of the tank while avoiding improper fixing to cause mechanical structural stress to impinge on the thin circuit board 40.

two. The degree of integration of the conventional process is quite difficult, because each process has different chemicals, and the Rack of the thin circuit board is easy to adhere to different syrups, which easily causes different chemical reactions to be mixed, and only the plating part needs Power is on, and the rack is not easy to use. Therefore, in the wet process of developing, copper plating, stripping, etching, etc., each of the thin circuit boards 40 is completed from the above-mentioned wet process to completion, and the frame 30 is free of conventional syrup. The problem has been solved, and the whole process of the thin circuit board 40 is hung by the same frame 30, and the V-shaped block 68 of any of the processing slots is provided with the power source to form the plating tank, thereby integrating each Process and form a continuous automatic consistency.

three. In the continuous automatic consistency of the stroke, and by the crane to be successively displaced to the designated processing tank, in the preferred embodiment of the present invention, the circuit board is vertically immersed in a processing tank, so that the circuit board is not required between different processes. Handling, with continuous process and uniform chemical reaction or electroplating reaction of the board.

four. In order to overcome the pool effect, the horizontal machine is mostly used to improve the pool effect by different methods such as nozzle pressure independent adjustment, swing spraying or compensation etching. The mechanism is not only complicated, but also the control is not easy. The frame 30 of the present invention has the thin circuit board 40 stretched flat, thereby reducing the pool effect caused by the horizontal process. If the solution is optimized, the vertical effect process is further avoided to avoid the pool effect. Moreover, the treatment liquid has a uniform reaction, and the uniformity of both sides is high, and the predetermined treatment liquid reacts quickly, so that the productivity is better than the horizontal type, and the predetermined treatment liquid 69 carries out less amount, which greatly reduces waste water discharge, saves water, saves energy and is environmentally friendly. .

In summary, the technical means disclosed in the present invention have the invention patents such as "novelty", "progressiveness", and "available for industrial use", and invite the bureau to give a patent to encourage the invention. German sense.

The drawings and the descriptions of the present invention are merely preferred embodiments of the present invention, and those skilled in the art, which are subject to the spirit of the present invention, should be included in the scope of the patent application.

30. . . Frame

31. . . Inner frame edge

32. . . Small flange

33. . . Positioning member

34. . . Step surface

40. . . Thin circuit board

41. . . Positioning hole

50. . . Fastener

51. . . Outer body

52. . . Metal buckle

521. . . Buckle hole

522. . . Conductive contact surface

60. . . Complex processing slot

61. . . Loading area

62. . . Developing tank

63. . . Copper plating tank

64. . . Stripping tank

65. . . Etch tank

66. . . Stripping slot

67. . . Cutting area

68. . . V block

69. . . Scheduled treatment fluid

70. . . Crane equipment

71. . . track

72. . . crane

73. . . Power source

74. . . Transmission member

75. . . Crossbar

80. . . Hanger

81. . . Fixture

82. . . Contact

D. . . gap

Figure 1 is a schematic view of a conventional horizontal wet process.

Figure 2 is a schematic illustration of a conventional frame.

Figure 3 is an exploded perspective view of the framework of the present invention.

Figure 3A is a cross-sectional view taken along line 3A-3A of Figure 3.

Figure 3B is a cross-sectional view taken along line 3B-3B of Figure 3.

Figure 4 is a schematic view of the assembly of the frame of the present invention.

Fig. 4A is an enlarged plan view showing a portion 4A of Fig. 4.

Figure 4B is a cross-sectional view taken along line 4B-4B of Figure 4A.

Figure 4C is a cross-sectional view taken along line 4C-4C of Figure 4;

Figure 5 is a schematic illustration of a plurality of processing tanks of the present invention.

Figure 6 is a view showing the state of use of the crane equipment of the present invention.

Fig. 7A is a view showing a state of use of the crane transfer substrate of the present invention.

Fig. 7B is a view showing a descending use state of the crane transfer substrate of the present invention.

Fig. 8 is a reference view showing the state of use of the crane transfer substrate to the different processing tanks of the present invention.

30. . . Frame

31. . . Inner frame edge

34. . . Step surface

40. . . Thin circuit board

50. . . Fastener

Claims (6)

A method for consistently making a thin circuit board wet process with the same carrier, the steps comprising: a) providing a frame, which is a rectangular rigid frame made of a conductive material, the frame side of the frame facing The inner extension is provided with a plurality of small flanges, and the small flange is provided with a conductive positioning member, and the frame further comprises a hanger, the hanger is composed of a conductive material. a plurality of clamps for gripping the frame are provided, and the two sides are provided as contact portions; b) providing a thin circuit board having a smaller outer shape than the inner frame edge of the frame, and the thin circuit board edge is opposite to the positioning The positioning member is provided with a positioning hole, which can be hung on the positioning member, so that the thin circuit board is flattened and the edge thereof does not contact the inner frame edge of the frame, and only the circumference of the positioning hole and the positioning member are Point contact; c) providing a plurality of fixing members fixed to the positioning member, and the contact surface of the surface corresponding to the thin circuit board is electrically conductive, and the surface of the thin circuit board is transmitted through the fixing member and the positioning member And electrically connected to the frame; d). providing complex processing And the predetermined processing liquid required for the wet process is respectively arranged in the tank, and the processing tank comprises: a plurality of developing tanks, a copper plating tank, a stripping tank, an etching tank and a stripping tank; and the processing tanks a V-shaped block is disposed on the top surface of the two sides, the two sides of the hanger are provided with a contact portion that can be spanned relative to the V-shaped block; and e) providing a plurality of crane devices arranged above the plurality of processing grooves The frame can be moved back and forth to the respective processing tanks for wet processing. The method of conforming the wet process of a thin circuit board by the same carrier as described in the first aspect of the patent application, wherein the frame described in the step a) is composed of a metal plate. The method of conforming the wet process of the thin circuit board by the same carrier as described in the first aspect of the patent application, wherein the V-shaped block on both sides of the copper plating tank is connected with a power source, and the two ends of the hanger are When the contact portion is spanned, the hanger can be electrically conductive, and electrically connected to the frame via a clamp on the hanger, so that current is conducted from the positioning member and the fixing member of the frame to the thin circuit board to The through holes on the thin circuit board are plated with copper. The method of conforming to the wet process of the thin circuit board by the same carrier as described in the first aspect of the patent application, wherein the fixing member in the step c) comprises: an outer casing, which is composed of an elastic material; a metal buckle is disposed on the bottom of the outer casing, and has a button hole at a center thereof opposite to the positioning member, and the metal buckle has an extension pressing on the surface of the thin circuit board Conductive contact surface. A method of conforming a wet process of a thin circuit board by the same carrier as described in claim 4, wherein the outer casing is made of rubber, and the metal buckle is made of copper. A method for conforming a wet process of a thin circuit board by the same carrier as described in claim 5, wherein the positioning member is perpendicular to The pin of the small flange surface is formed by a pin for the positioning hole of the circuit board to be hung.