CN114150359A

CN114150359A - Processing production line and processing production method of superconducting thin film

Info

Publication number: CN114150359A
Application number: CN202210010223.0A
Authority: CN
Inventors: 贾孟
Original assignee: Kunshan Xinmeiyuan Electronic Technology Co ltd
Current assignee: Kunshan Xinmeiyuan Electronic Technology Co ltd
Priority date: 2022-01-11
Filing date: 2022-01-11
Publication date: 2022-03-08

Abstract

The embodiment of the invention provides a processing production line and a processing production method of a superconducting thin film, wherein the production line comprises the following components: the device comprises an unwinding device, an electroplating device and a winding device; the plating apparatus includes: the electroplating bath body is provided with a plurality of upper and lower anode plates and a plurality of conductive parts; the upper and lower anode plates are used for providing anode electricity during electroplating; the conductive module is used for providing a cathode for the conductive film during electroplating. According to the embodiment of the invention, the upper and lower surfaces of the conductive film are simultaneously provided with the cathode electrodes through the plurality of conductive parts, so that double-surface electroplating of the conductive film is realized, and meanwhile, multiple times of double-surface electroplating of the conductive film can be realized through the plurality of upper and lower anode plates, so that the film coating efficiency is improved.

Description

Processing production line and processing production method of superconducting thin film

Technical Field

The invention relates to the technical field of conductive film preparation, in particular to a processing production line and a processing production method of a superconducting film.

Background

With the development of the technology, the requirement of coating the surface of the flexible thin film conductive film is greater and greater. In industrial production, water electroplating equipment is generally used for electroplating the flexible thin film conductive film, namely, water plating solution is prepared according to the requirements of various bodies and coatings, so that the flexible thin film conductive film can be completed in a short time through the water plating solution. In the conventional electroplating apparatus, a plurality of plating tanks for supplying an electroplating solution are generally provided, an anode is provided in the tank so as to face an electroplating surface functioning as a cathode, and the plurality of plating tanks are arranged side by side in a conveying direction of a flexible thin film conductive film; by controlling the amount of current applied to each plating tank so that the amount of current applied to each plating tank is increased in order of the supply of the conductive thin film, a uniform and satisfactory plated film can be continuously formed.

In the process of implementing the invention, the inventor finds that at least the following problems exist in the prior art: because current film plating equipment is not enough in the design, lead the easy copper plate that forms in electrical pillar surface, the copper plate punctures or the fish tail film, and the process roller is numerous simultaneously, and the roller height sets up and leads to tension control difficulty, the easy fold of flexible film or deformation easily to reduced the yields of conductive film product by a wide margin, seriously influenced enterprise's whole production efficiency.

Disclosure of Invention

In view of this, an embodiment of the present invention provides a processing line for a superconducting thin film, so as to solve the technical problem that the quality of current collector production is affected by plating a layer of metal crystals on a conductive roller in the prior art.

To achieve the above object, in a first aspect, the present invention provides a processing line for a superconducting thin film, the processing line including: the device comprises an unwinding device, an electroplating device and a winding device;

the plating apparatus includes: the electroplating bath comprises an electroplating bath body, and a plurality of upper and lower anode plates and a plurality of conductive parts which are arranged in the electroplating bath body;

the upper and lower anode plates are used for providing anode electricity during electroplating;

the conductive module is used for providing a cathode for the conductive film during electroplating.

In some possible embodiments, the plating apparatus further includes:

the electroplating bath body and the plurality of conductive parts are respectively arranged on the bracket;

the plating solution circulating groove body is arranged on the bracket, is positioned below the plating groove body and is used for receiving the plating solution leaked from the plating groove body;

and the liquid return pump is arranged inside the plating solution circulating groove body, a liquid return pipe is arranged on the liquid return pump, and the tail end of the liquid return pipe is arranged in the plating groove body and used for pumping the plating solution in the plating solution circulating groove body back to the plating groove body.

In some possible embodiments, the plurality of conductive portions are respectively arranged alternately with the plurality of upper and lower anode plates, wherein,

each pair of conductive parts comprises an upper conductive module and a lower conductive module, the upper conductive module and the lower conductive module are arranged in an up-and-down arrangement mode and aligned in the horizontal direction, and the upper conductive module and the lower conductive module are identical in structure.

In some possible embodiments, the upper conductive pattern and the lower conductive pattern each include: a driving wheel, a driven wheel, a conductive belt and one or more conductive wheels, wherein,

the driving wheel is arranged outside the electroplating bath body, the driven wheel is arranged in the electroplating bath of the electroplating bath body, the conductive belt is wrapped on the outer sides of the driving wheel and the driven wheel, and the driving wheel drives the driven wheel to rotate so as to drive the conductive belt to rotate at a certain speed;

the conductive wheel is in contact with the conductive band for electrically conducting the cathode to the conductive band;

the bottom of the electroplating bath body is provided with a plurality of holes, and the conductive belt in the lower conductive module penetrates out of the holes in the bottom of the electroplating bath body.

In some possible embodiments, the upper conductive pattern assembly and the lower conductive pattern assembly each further include:

a conductive wheel support for fixing the conductive wheel on the conductive part;

and the conductive slip ring is arranged on the outer side of the conductive wheel, is connected with the cathode of the power supply and is used for conducting the cathode of the power supply to the conductive wheel.

In some possible embodiments, the unwinding device comprises an unwinding roller and a first roller, which are arranged in sequence, and the first roller is used for guiding the film in the unwinding roller into the electroplating device;

the winding device comprises a second roller, a drying box, a third roller and a winding roller which are sequentially arranged, the second roller is used for passing through a film electroplated by the electroplating device and is led into the drying box, and the third roller is used for passing through a film dried by the drying box and is led into the winding roller.

In some possible embodiments, the production line further comprises:

the water washing device is arranged between the electroplating device and the winding device and is used for washing the electroplated film; the water washing device comprises:

the washing tank body is internally provided with washing liquid;

the first washing liquid inlet roller and the second washing liquid inlet roller are respectively arranged at the liquid inlet end and the liquid outlet end of the washing tank body;

the lower roller of the washing liquid is arranged inside the washing tank body;

the electroplated film is guided by the first washing liquid inlet roller, the second washing liquid inlet roller and the first washing liquid lower roller to form a V-shaped moving belt in the washing tank body;

and the plurality of spray pipes are arranged above the washing liquid and used for carrying out secondary washing on the washed film.

In some possible embodiments, the production line further comprises:

an anti-oxidation device disposed downstream of the water washing device, the anti-oxidation device comprising:

the anti-oxidation tank comprises an anti-oxidation tank body, wherein anti-oxidation liquid is arranged in the anti-oxidation tank body;

the anti-oxidation liquid inlet roller and the anti-oxidation liquid accumulation roller are respectively arranged at the liquid inlet end and the liquid outlet end of the anti-oxidation tank body;

the anti-oxidation liquid lower roller is arranged inside the anti-oxidation groove body;

and the washed film is guided by the antioxidant liquid inlet roller, the antioxidant liquid accumulating roller and the antioxidant liquid lower roller to form a V-shaped moving belt in the washing tank body.

In some possible embodiments, the production line further comprises:

and the transition groove is arranged between the water washing device and the antioxidant device and is used for preventing the water washing liquid in the water washing groove body from being mixed with the antioxidant liquid in the antioxidant groove body.

In a second aspect, the present invention provides a processing and production method of a superconducting thin film, the processing and production method being based on any one of the processing and production lines of the superconducting thin film, the processing and production method comprising the steps of:

unwinding a film to be produced by an unwinding device;

electroplating the film by an electroplating apparatus, comprising: the anode electrode is provided by a plurality of anode plates, the cathode electrode is provided for the conductive film by a plurality of conductive modules, and the film is electroplated by an electroplating circulating loop consisting of the electroplating solution, the conductive film and the plurality of anode plates in the electroplating bath body;

and rolling the electroplated film through a rolling device.

The technical scheme has the following beneficial technical effects:

the processing production line of the superconducting thin film provided by the embodiment of the invention comprises the following components: the device comprises an unwinding device, an electroplating device and a winding device; the plating apparatus includes: the electroplating bath body is provided with a plurality of upper and lower anode plates and a plurality of conductive parts; the upper and lower anode plates are used for providing anode electricity during electroplating; the conductive module is used for providing a cathode for the conductive film during electroplating. According to the embodiment of the invention, the upper and lower surfaces of the conductive film are simultaneously provided with the cathode electrodes through the plurality of conductive parts, so that double-surface electroplating of the conductive film is realized, and meanwhile, multiple times of double-surface electroplating of the conductive film can be realized through the plurality of upper and lower anode plates, so that the film coating efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a block diagram of a manufacturing line of a first superconducting thin film according to an embodiment of the present invention;

fig. 2 is a front view of an unwinding device according to an embodiment of the present invention;

FIG. 3 is a front view of an electroplating apparatus according to an embodiment of the present invention;

fig. 4 is a front view of a conductive module according to an embodiment of the invention;

FIG. 5 is a side view of an integrated structure of a conductive wheel, a conductive wheel support and a conductive slip ring according to an embodiment of the present invention;

fig. 6 is a front view of a winding device provided in an embodiment of the present invention;

FIG. 7 is a block diagram of a second superconducting thin film manufacturing line according to an embodiment of the present invention;

FIG. 8 is a front view of a water washing apparatus provided in an embodiment of the present invention;

FIG. 9 is a block diagram of a manufacturing line for a third superconducting thin film according to an embodiment of the present invention;

FIG. 10 is a front view of an anti-oxidant device provided in accordance with an embodiment of the present invention;

FIG. 11 is a front view of a water washing apparatus, an anti-oxidation apparatus and a transition tank according to an embodiment of the present invention;

fig. 12 is a flowchart of a method for processing and producing a superconducting thin film according to an embodiment of the present invention.

The reference numbers illustrate:

1. an unwinding device; 11. unwinding rollers; 12. a third roller passing;

2. an electroplating device; 20. a plating bath body; 21. Upper and lower anode plates; 22. a conductive portion; 23. a support; 24. a plating solution circulation tank body; 25. returning to the liquid pump; 251. a liquid return pipe; 221. an upper conductive module; 222. a lower conductive module; 2201. a driving wheel; 2202. a driven wheel; 2203. a conductive tape; 2204. A conductive wheel; 201. a hole is formed; 2205. a conductive wheel support; 2206. a conductive slip ring;

3. a winding device; 31. fourth roller passing; 32. a drying box; 33. fifth roller passing; 34. a wind-up roll;

4. a water washing device; 40. a rinsing bath body; 41. a first water wash liquid inlet roller; 42. a second water washing liquid inlet roller; 43. washing the lower roll with water; 44. a plurality of shower pipes;

5. an anti-oxidation device; 50. an oxidation resistant tank body; 51. an antioxidant liquid inlet roller; 52. an antioxidant tapping roller; 53. rolling the roller with antioxidant liquid;

6. a transition groove.

Detailed Description

Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

As shown in fig. 1, a processing line for a superconducting thin film according to an embodiment of the present invention includes: the device comprises an unwinding device 1, an electroplating device 2 and a winding device 3; the plating apparatus 2 includes: a plating bath body 20, and a plurality of upper and lower anode plates 21 and a plurality of conductive parts 22 which are arranged in the plating bath body 20; the upper and lower anode plates 21 are used for supplying anode electricity during electroplating; the conductive portions 22 are used to provide a cathode electrode to the conductive film at the time of electroplating. According to the embodiment of the invention, the plurality of conductive parts 22 simultaneously provide cathode electrodes for the upper surface and the lower surface of the conductive film, so that double-surface electroplating of the conductive film is realized, and meanwhile, the plurality of upper anode plates 21 and the plurality of lower anode plates 21 can realize multiple times of double-surface electroplating of the conductive film, so that the film coating efficiency is improved.

In some embodiments, as shown in fig. 3, the plating apparatus 2 further includes: the plating bath comprises a bracket 23, a plating bath circulating bath body 24 and a liquid return pump 25, wherein a plating bath body 20 and a plurality of conductive parts 22 are respectively arranged on the bracket 23; a plating solution circulating tank body 24 is provided on the support 23 and located below the plating tank body 20, for receiving the plating solution leaked from the plating tank body 20; and a liquid return pump 25 disposed inside the plating solution circulation tank body 24, wherein the liquid return pump 25 is provided with a liquid return pipe 251, and the end of the liquid return pipe 251 is disposed inside the plating tank body 20, for pumping the plating solution in the plating solution circulation tank body 24 back to the plating tank body 20. The embodiment of the invention can circulate the plating solution in the electroplating device 2 in real time in the electroplating process, ensures the concentration of metal ions in the plating solution in the production process, and improves the production quality of the superconducting thin film.

In some embodiments, as shown in fig. 3, a plurality of conductive portions 22 are respectively alternated with a plurality of upper and lower anode plates 21, wherein each pair of conductive portions 22 comprises: the upper conductive module 221 and the lower conductive module 222 are arranged in the upper and lower directions, a part of the upper conductive module 221 is arranged inside the electroplating bath body 20, a part of the upper conductive module 221 is arranged outside the electroplating bath body 20, a part of the lower conductive module 222 is arranged inside the electroplating bath body 20, a part of the lower conductive module 222 is arranged outside the electroplating bath body 20, cathode electrodes are provided for the upper surface and the lower surface of the thin film through the part inside the electroplating bath body 20, and the upper conductive module 221 and the lower conductive module 222 are identical in structure.

Specifically, as shown in fig. 4, the upper conductive module 221 and the lower conductive module 222 respectively include: the electroplating bath comprises a driving wheel 2201, a driven wheel 2202, a conductive belt 2203 and one or more conductive wheels 2204, wherein the driving wheel 2201 is arranged outside the electroplating bath body 20, the driven wheel 2202 is arranged in the electroplating bath of the electroplating bath body 20, the conductive belt 2203 is wrapped on the outer sides of the driving wheel 2201 and the driven wheel 2202, the driving wheel 2201 drives the driven wheel 2202 to rotate to drive the conductive belt 2203 to rotate at a certain speed, and in order to prevent the driven wheel 2202 from being plated with copper to puncture a film, the driven wheel 2202 is an insulating roller in the embodiment; conductive wheel 2204 is in contact with conductive band 2203 for electrically conducting the cathode to conductive band 2203; as shown in FIG. 3, a plurality of apertures 201 are formed in the bottom of the plating cell body 20, and the conductive strip 2203 of the lower conductive module 222 extends out of the apertures 201 of the bottom of the plating cell body 20. In addition, the plating solution in the plating tank body 20 leaks out to the plating solution circulation tank body 24 from the slits 201, and the plating solution in the plating solution circulation tank body 24 is re-pumped to the plating tank body 20 by the plating solution circulation tank body 24 through the liquid return pump 25, so that the plating solution in the plating tank body 20 is circulated, and the concentration of the plating solution in the plating tank body 20 is ensured.

In some embodiments, as shown in fig. 5, the upper conductive pattern 221 and the lower conductive pattern 222 further include: a conductor wheel mount 2205 and a conductor slip ring 2206, the conductor wheel mount 2205 being used to secure the conductor wheel 2204 to the conductive portion 22; the conductive slip ring 2206 is disposed outside the conductive wheel 2204, and the conductive slip ring 2206 is connected to the cathode of the power supply for electrically conducting the cathode of the power supply to the conductive wheel 2204.

During electroplating, the conductive slip ring 2206 is connected with the cathode of the power supply, the cathode is conducted to the conductive wheel 2204 through the conductive slip ring 2206, then the conductive wheel 2204 is contacted with the conductive band 2203, the cathode is conducted to the conductive band 2203, the conductive band 2203 is contacted with the conductive film in the electroplating solution after entering the electroplating solution, and the cathode is connected to the first surface and the second surface of the conductive film. According to the embodiment of the invention, the conductive roller in the traditional electroplating is replaced by the conductive belt 2203, so that the conductive roller is prevented from being punctured by copper plating. The width of the conductive strip 2203 is generally between 5mm and 300mm, the wider the conductive strip 2203 is, the larger the conductive area is, the better the conductive capability is, but since the conductive film part is clamped by the conductive strip 2203, after the production is completed, the conductive film part at the clamped part cannot be used as a finished product, the wider the conductive strip 2203 is, the larger the waste film generating amount is, and preferably, the width of the conductive strip 2203 is 75 mm.

In some embodiments, as shown in fig. 2, the unwinding device 1 may include: the unwinding roller 11 and the third roller 12, the third roller 12 is used for guiding or transmitting the conductive film in the unwinding roller 11 to the electroplating device 2, and the conductive film is prevented from entering the electroplating bath body 20 and being wrinkled, so that the production quality of the product is not affected.

In some embodiments, as shown in fig. 6, the winding device 3 may include: roller 31 is crossed to the fourth, stoving case 32, roller 33 and wind-up roll 34 are crossed to the fifth, roller 31 is crossed to the fourth is used for the leading-in stoving case 32 of conductive film after electroplating through electroplating device 2 electroplates, roller 33 is crossed to the fifth and is used for the leading-in wind-up roll 34 of thin after stoving case 32 dries, set up the roller through the both sides at stoving case 32, can ensure that conductive film becomes horizontality in stoving case 32, avoid stoving case 32 scraping conductive film, and avoid conductive film to be heated inhomogeneously in stoving case 32, improve the yields of product.

In some embodiments, as shown in fig. 7 and 8, the production line further comprises: the water washing device 4 is arranged between the electroplating device 2 and the winding device 3 and is used for washing the electroplated conductive film; the water washing device 4 includes: the washing device comprises a washing tank body 40, a first washing liquid inlet roller 41, a second washing liquid inlet roller 42, a washing liquid lower roller 43 and a plurality of spray pipes 44, wherein washing liquid is arranged in the washing tank body 40, the first washing liquid inlet roller 41 and the second washing liquid inlet roller 42 are respectively arranged at the liquid inlet end and the liquid outlet end of the washing tank body 40, and the washing liquid lower roller 43 is arranged inside the washing tank body 40, wherein the first washing liquid inlet roller 41 and the second washing liquid inlet roller 42 are positioned above the washing liquid, and the washing liquid lower roller 43 is arranged inside the washing liquid; the conductive film after electroplating is gone into the V-arrangement and is taken away in the wash bowl body 40 under the direction of first washing income liquid roller 41, second washing income liquid roller 42 and first wash bowl lower roll 43, can avoid conductive film to take place fold or warp at wash bowl body 40, can fully wash the plating bath of deriving on the conductive film, in addition, the top of wash bowl still is provided with a plurality of shower 44 and is used for carrying out the secondary to the conductive film after washing, fully washes the plating bath on the conductive film.

As shown in fig. 9 and 10, the production line further includes: anti-oxidant device 5, sets up at the rear end or the low reaches of water washing device 4, and anti-oxidant device 5 includes: the oxidation-resistant tank comprises an oxidation-resistant tank body 50, an oxidation-resistant liquid inlet roller 51, an oxidation-resistant liquid outlet roller 52 and an oxidation-resistant liquid lower roller 53, wherein oxidation-resistant liquid is arranged in the oxidation-resistant tank body 50, the oxidation-resistant liquid inlet roller 51 and the oxidation-resistant liquid outlet roller 52 are respectively arranged at the liquid inlet end and the liquid outlet end of the oxidation-resistant tank body 50, the oxidation-resistant liquid lower roller 53 is arranged inside the oxidation-resistant tank body 50, the oxidation-resistant liquid inlet roller 51 and the oxidation-resistant liquid outlet roller 52 are arranged above the oxidation-resistant liquid, and the oxidation-resistant liquid lower roller 53 is arranged inside the oxidation-resistant liquid; the washed conductive film is guided by the antioxidant liquid inlet roller 51, the antioxidant liquid outlet roller 52 and the antioxidant liquid lower roller 53 to form a V-shaped moving belt in the antioxidant groove body 50, so that the conductive film can be prevented from being folded or deformed in the antioxidant groove body 50, a layer of antioxidant film can be fully formed on the conductive film, and the conductive film is prevented from being oxidized by water vapor in the air to influence the product quality.

In some embodiments, as shown in fig. 11, the production line may further include: and the transition tank 6 is arranged between the washing device 4 and the anti-oxidation device 5 and is used for preventing the washing liquid in the washing tank body 40 from entering the anti-oxidation tank body 50.

The embodiment of the invention has the following beneficial effects:

according to the embodiment of the invention, the plurality of conductive parts 22 simultaneously provide cathode electrodes for the upper surface and the lower surface of the conductive film, so that double-surface electroplating of the conductive film is realized, and meanwhile, the plurality of upper anode plates 21 and the plurality of lower anode plates 21 can realize multiple times of double-surface electroplating of the conductive film, so that the film coating efficiency is improved;

the embodiment of the invention can circulate the plating solution in the plating device 2 in real time in the plating process, thereby ensuring the concentration of metal ions in the plating solution in the production process and improving the production quality of the ultrathin current collector;

in the embodiment of the invention, the conductive belt 2203 replaces a conductive roller in the traditional electroplating, so that the conductive roller is prevented from being plated with copper to puncture a conductive film;

according to the embodiment of the invention, the washing device 4 and the anti-oxidation device 5 are arranged to further wash and anti-oxidation process the produced conductive film, so that the yield of the conductive film is improved.

As shown in fig. 12, an embodiment of the present invention provides a processing and producing method of a superconducting thin film, the processing and producing method is based on any one of the processing lines of the superconducting thin film, and the processing and producing method includes the following steps:

s1, unwinding the film to be produced by the unwinding device 1;

s2, electroplating the film by the electroplating apparatus 2, including: anode is provided by a plurality of upper and lower anode plates 21, cathode is provided for the conductive film by a plurality of conductive parts 22, and the film is electroplated by an electroplating circulation loop consisting of the plating solution, the conductive film and the anode plates in the electroplating bath body 20;

and S3, rolling the electroplated film through the rolling device 4.

During electroplating, the conductive film to be produced is unreeled through the unreeling device 1, and is electroplated through the electroplating device 2, and during electroplating, anode electricity is provided through the upper anode plate 21 and the lower anode plate 21, and cathode electricity is provided through the conductive parts 22.

Specifically, during electroplating, the conductive slip ring 2206 in the upper conductive module 221 and the lower conductive module 222 is connected with the cathode of a power supply, the cathode is conducted to the conductive wheel 2204 through the conductive slip ring 2206, then the conductive wheel 2204 is contacted with the conductive band 2203, the conductive band 2203 is contacted with the conductive film in the electroplating solution after entering the electroplating solution, the cathode is connected to the first surface and the second surface of the conductive film, the cathode is provided for the first surface and the second surface of the conductive film, the upper and lower anode plates 21 and the electroplating solution in the electroplating bath body 20 form a plurality of electroplating circulation loops, the two surfaces of the conductive film are electroplated for multiple times, and the production efficiency of the superconducting film is improved.

The embodiment of the invention has the following beneficial effects:

In the description of the embodiment of the present invention, it should be noted that the number of the conductive pillars, the number of the steering rollers, and the number of the titanium blue pillars may be arbitrarily adjusted according to practical situations, and the present invention is not limited. The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein. The terms "upper, lower, inner and outer" and the like refer to orientations and positional relationships based on those shown in the drawings, and are used for convenience in describing and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms first, second, or third are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted, connected" and the like are to be understood broadly, for example: can be fixedly connected, detachably connected or integrally connected; they may be mechanically, electrically, or directly connected, or indirectly connected through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. A processing line for a superconducting thin film, comprising: the device comprises an unwinding device (1), an electroplating device (2) and a winding device (3);

the plating apparatus (2) includes: the electroplating bath comprises an electroplating bath body (20), and a plurality of upper and lower anode plates (21) and a plurality of conductive parts (22) which are arranged in the electroplating bath body (20);

the upper and lower anode plates (21) are used for providing anode electricity during electroplating;

the conductive module (22) is used for providing a cathode for the conductive film during electroplating.

2. A superconducting thin film processing line as claimed in claim 1, wherein said electroplating means (2) further comprises:

the electroplating bath body (20) and the plurality of conductive parts (22) are respectively arranged on the bracket (23);

a plating solution circulating tank body (24) which is arranged on the bracket (20), is positioned below the plating tank body (20) and is used for receiving the plating solution leaked from the plating tank body (20);

and the liquid return pump (25) is arranged inside the plating solution circulating groove body (24), a liquid return pipe (251) is arranged on the liquid return pump (25), and the tail end of the liquid return pipe (251) is arranged in the plating groove body (20) and is used for pumping the plating solution in the plating solution circulating groove body (24) back to the plating groove body (20).

3. A superconducting thin film processing line according to claim 2, wherein said plurality of conductive portions (22) are alternately arranged with said plurality of upper and lower anode plates (21), respectively,

each conductive part (22) comprises an upper conductive module (221) and a lower conductive module (222), the upper conductive module and the lower conductive module are arranged in an up-and-down layout mode and aligned along the horizontal direction, and the structures of the upper conductive module (221) and the lower conductive module (222) are the same.

4. A superconducting thin film processing line according to claim 3, wherein the upper conductive pattern (221) and the lower conductive pattern (222) respectively comprise: a driving wheel (2201), a driven wheel (2202), a conductive belt (2203) and one or more conductive wheels (2204), wherein,

the driving wheel (2201) is arranged outside the electroplating bath body (20), the driven wheel (2202) is arranged in a plating solution of the electroplating bath body (20), the conductive belt (2203) is wrapped on the outer sides of the driving wheel (221) and the driven wheel (222), and the driving wheel (2201) drives the driven wheel (2202) to rotate to drive the conductive belt (2203) to rotate at a certain speed;

the conductive wheel (2204) is in contact with the conductive band (2203) for electrically conducting a cathode to the conductive band (2203);

the electroplating bath comprises an electroplating bath body (20), wherein a plurality of holes (201) are formed in the bottom of the electroplating bath body (20), and a conductive belt (2203) in a lower conductive module (22) penetrates out of the holes (201) in the bottom of the electroplating bath body (20).

5. A superconducting thin film processing line according to claim 4, wherein the upper conductive pattern (221) and the lower conductive pattern (222) each further comprise:

a conductive wheel mount (2205) for securing the conductive wheel (2204) to the conductive portion (24);

a conductive slip ring (2206) disposed outside the conductive wheel (2204), the conductive slip ring (2206) being connected to a cathode of a power source for electrically conducting the cathode of the power source to the conductive wheel (2204).

6. A superconducting thin film processing line as claimed in any one of claims 1 to 5, wherein said unwinding device (1) comprises an unwinding roller (11) and a first passing roller (12) which are arranged in sequence, said first passing roller (12) is used for guiding the thin film in said unwinding roller (11) to said electroplating device (2);

the winding device (3) comprises a second passing roller (31), a drying box (32), a third passing roller (33) and a winding roller (34) which are sequentially arranged, the second passing roller (31) is used for passing through films electroplated by the electroplating device (2) are led into the drying box (32), and the third passing roller (33) is used for passing through the films dried by the drying box (32) are led into the winding roller (34).

7. A superconducting thin film processing line as claimed in claim 1, further comprising:

the water washing device (4) is arranged between the electroplating device (2) and the winding device (3) and is used for washing the electroplated film; the water washing device (4) comprises:

a rinsing bath body (40), wherein rinsing liquid is arranged in the rinsing bath body (40);

the first water washing liquid inlet roller (41) and the second water washing liquid inlet roller (42) are respectively arranged at the liquid inlet end and the liquid outlet end of the rinsing bath body (40);

a lower washing liquid roller (43) arranged inside the washing tank body (40);

the electroplated film is guided by the first washing liquid inlet roller (41), the second washing liquid inlet roller (42) and the first washing liquid lower roller (43) to form a V-shaped tape in the washing tank body (40);

and the plurality of spray pipes (44) are arranged above the washing liquid and are used for carrying out secondary washing on the washed film.

8. A superconducting thin film processing line as claimed in claim 7, further comprising:

an anti-oxidation device (5) disposed downstream of the water washing device (4), the anti-oxidation device (5) comprising:

the anti-oxidation tank comprises an anti-oxidation tank body (50), wherein anti-oxidation liquid is arranged in the anti-oxidation tank body (50);

an antioxidant liquid inlet roller (51) and an antioxidant liquid accumulating roller (52) which are respectively arranged at the liquid inlet end and the liquid outlet end of the antioxidant groove body (50);

an anti-oxidation liquid lower roller (53) arranged inside the anti-oxidation groove body (50);

and the washed film is subjected to V-shaped tape forming in the washing tank body (40) under the guidance of the antioxidant liquid inlet roller (51), the antioxidant liquid accumulating roller (52) and the antioxidant liquid lower roller (53).

9. A superconducting thin film processing line as claimed in claim 8, further comprising:

and the transition tank (6) is arranged between the washing device (4) and the anti-oxidation device (5) and is used for preventing the washing liquid in the washing tank body (40) from being mixed with the anti-oxidation liquid in the anti-oxidation tank body (50).

10. A method for manufacturing a superconducting thin film, wherein the method is based on the manufacturing line of a superconducting thin film according to any one of claims 1 to 9, and the method comprises the steps of:

the film to be produced is unreeled through an unreeling device (1);

the film is electroplated by an electroplating device (2), which comprises: anode is provided by a plurality of anode plates (21), cathode is provided for the conductive film by a plurality of conductive modules (22), and the film is electroplated by an electroplating circulation loop consisting of the plating solution, the conductive film and the plurality of anode plates in the electroplating bath body (20);

and the electroplated film is rolled up through a rolling device (4).