CN215947430U

CN215947430U - Water electroplating equipment

Info

Publication number: CN215947430U
Application number: CN202121309638.5U
Authority: CN
Inventors: 刘欣; 臧世伟
Original assignee: Chongqing Jinmei New Material Technology Co Ltd
Current assignee: Chongqing Jinmei New Material Technology Co Ltd
Priority date: 2021-06-11
Filing date: 2021-06-11
Publication date: 2022-03-04
Anticipated expiration: 2031-06-11

Abstract

The embodiment of the utility model provides a water electroplating device, which comprises: the feeding mechanism, the receiving mechanism and the plating bath are respectively used for feeding and receiving the film base material, the plating bath is used for electroplating the film base material, and the plating bath is internally provided with a main roller, a conductive copper strip and two arc anode plates with different radiuses. Through adopting electrically conductive copper strips and conducting ring to replace the electrically conductive of realizing the negative pole, the film substrate moves at insulating home roll surface with the speed through certain cornerite, the home roll surface does not produce the copper facing when the electrically conductive copper strips of cooperation realization film is electrically conductive, thereby avoid the puncture or the fish tail of copper facing to the face, mainly at home roll surface cladding motion in electroplating process through the film, can effectively reduce the tension that the face received, electrically conductive copper strips and film all are in the plating bath at whole electroplating process, the heat dissipation problem when having solved electrically conductive copper strips and membrane circular telegram, the problem of hole burning has been avoided.

Description

Water electroplating equipment

Technical Field

The utility model relates to the technical field of electroplating devices, in particular to water electroplating equipment.

Background

With the development of technology, the demand of coating on the surface of a flexible film substrate is more and more, and the flexible film substrate is usually electroplated by using hydroelectric plating equipment in industrial production, that is, in order to meet the needs of various bodies and plating layers, an aqueous plating solution is prepared so that a flexible film substrate can be completed in a short time by the aqueous plating solution, and in the electroplating apparatus in the prior art, a plurality of electroplating tanks for supplying the electroplating solution are generally provided, anodes are provided in the tanks so as to face a plating surface functioning as a cathode, the plurality of electroplating tanks are arranged side by side in the conveying direction of the flexible film substrate, and has a power supply part for supplying power to each electroplating bath and a continuous conveying and tensioning mechanism for the flexible film base material, by controlling the amount of current applied to each plating tank, the amount of current applied to each plating tank is increased in order of the supply of the flexible film substrate, and a uniform and satisfactory plated film can be continuously formed.

In the process of implementing the utility model, the inventor finds that at least the following problems exist in the prior art: because the current film plating equipment is not enough in the design, the surface of the conductive roller is easy to form a copper plating layer, the copper plating layer punctures or scratches the film, meanwhile, the film advances in a V shape from top to bottom, and the rollers are numerous, so that the tension is difficult to control, and the flexible film is easy to wrinkle or deform, thereby greatly reducing the yield of the conductive film product and seriously affecting the overall production efficiency of enterprises.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides a water electroplating device, which solves the problems that a copper-plated layer punctures or scratches a film, the tension is difficult to control, holes are easy to burn, and a flexible film is easy to wrinkle or deform and the production efficiency is influenced.

In view of the above, an object of an embodiment of the present invention is to provide a water electroplating apparatus, including:

the electroplating device comprises a plating solution tank, wherein the plating solution tank is used for electroplating the film base material, and a main roller, a conductive copper strip and two arc anode plates with different radiuses arranged on the outer side of the main roller are arranged in the plating solution tank;

the upper end and the lower end of the main roller are metal rings, the metal rings are connected through a plurality of metal supports, conductive copper strips are correspondingly arranged on the outer sides of the metal rings, and the conductive copper strips are partially contacted with the metal rings to form a uniform conductor.

Optionally, the electroplating device further comprises a plurality of rubber coating rollers, the rubber coating rollers are respectively arranged around the main roller and outside the plating bath, the thin film substrate and the conductive copper strip are guided by the rubber coating rollers to run on the main roller, and the main roller and the rubber coating rollers are both vertically arranged.

Optionally, the inner side surface of the metal ring is connected with the plurality of metal brackets respectively.

Optionally, the metal ring is welded on the inner side surface of the metal ring, and the plurality of metal supports are rigidly connected with the annular rack through screw threads.

Optionally, a plurality of liquid inlet pipes and a plurality of liquid return pipes are arranged in the plating solution tank, a plurality of spray holes are distributed on the liquid inlet pipes, plating solution flows in through the liquid inlet pipes and is sprayed out through the spray holes, the reacted plating solution enters the plating solution storage tank through the liquid return pipes, and the plating solution in the plating solution storage tank is pumped into the liquid inlet pipes through a diaphragm pump, so that circulation of the plating solution is realized.

Optionally, a washing tank is arranged behind the plating tank, and a washing tank inlet liquid upper compression roller, a washing tank inlet liquid lower compression roller, a washing tank outlet liquid upper compression roller, a washing tank outlet liquid lower compression roller and a washing tank outlet liquid lower roller are arranged in the washing tank;

the upper pressing roller for the inlet liquid of the washing pool is tightly attached to the surface of the lower pressing roller for the inlet liquid of the washing pool, the upper pressing roller for the outlet liquid of the washing pool is tightly attached to the surface of the lower pressing roller for the outlet liquid of the washing pool, and the film substrate passes through the upper pressing roller for the inlet liquid of the washing pool and the lower pressing roller for the inlet liquid of the washing pool, passes through the lower roller for the outlet liquid of the washing pool, and then passes through the upper pressing roller for the outlet liquid of the washing pool and the lower pressing roller for the outlet liquid of the washing pool;

and water overflow pools are respectively arranged on two sides of the washing pool.

Optionally, a washing tank liquid inlet pipe and a washing tank liquid outlet pipe are further arranged in the washing tank, a pure water storage tank is arranged below the washing tank, and the pure water storage tank is communicated with the washing tank liquid inlet pipe through a pipeline.

Optionally, an oxidation resistant pool is further arranged behind the washing pool, and an oxidation resistant pool liquid inlet upper compression roller, an oxidation resistant pool liquid inlet lower compression roller, an oxidation resistant pool liquid outlet upper compression roller, an oxidation resistant pool liquid outlet lower compression roller and an oxidation resistant pool liquid outlet roller are arranged in the oxidation resistant pool;

the anti-oxidation pond liquid inlet upper compression roller is tightly attached to the surface of the anti-oxidation pond liquid inlet lower compression roller, the anti-oxidation pond liquid outlet upper compression roller is tightly attached to the surface of the anti-oxidation pond liquid outlet lower compression roller, the film substrate passes through the anti-oxidation pond liquid inlet upper compression roller and the anti-oxidation pond liquid inlet lower compression roller, and passes through the anti-oxidation pond liquid outlet upper compression roller and the anti-oxidation pond liquid outlet lower compression roller;

and the two sides of the oxidation-resistant tank are respectively provided with an oxidation-resistant overflow tank.

Optionally, an antioxidant liquid inlet pipe and an antioxidant liquid outlet pipe are further arranged in the antioxidant pool, an antioxidant liquid storage pool is arranged below the antioxidant pool, and the antioxidant liquid storage pool is communicated with the antioxidant liquid inlet pipe.

Optionally, a discharging mechanism and a receiving mechanism are arranged on two sides of the plating bath (3), and both the discharging mechanism and the receiving mechanism comprise a tension control device and a belt flattening device, and are used for controlling the tension of the film substrate during discharging and receiving.

The technical scheme has the following beneficial effects:

the embodiment of the utility model cancels the structure of the conductive roller, adopts the conductive copper strip and the conductive ring to replace the realization of the conduction of the cathode, the film moves at the same speed on the surface of the insulated main roller through a certain wrap angle, and the conductive copper strip is matched to realize the conduction of the film and simultaneously the surface of the main roller does not generate copper plating, thereby avoiding the puncture or scratch of the film surface caused by the copper plating;

according to the embodiment of the utility model, the film mainly wraps and moves on the surface of the main roller in the electroplating process, so that the tension on the film surface can be effectively reduced, the conductive copper strip and the film are both in the plating solution in the whole electroplating process, the heat dissipation problem when the conductive copper strip and the film are electrified is effectively solved, and the hole burning problem is avoided;

the embodiment of the utility model solves the problem that the effective electroplating length of the film on the V-shaped routing path is small in the conventional scheme, realizes the maximum effective electroplating length on the shortest film routing length, shortens the occupied area length of equipment, adopts the design of the main roller, realizes the completion of the whole electroplating process in one electroplating tank, simplifies the structure of electroplating equipment and effectively improves the production efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of the overall structure of an electroplating apparatus according to an embodiment of the present invention;

FIG. 2 is a partially enlarged schematic view of a plating bath in the water electroplating apparatus according to the embodiment of the present invention;

FIG. 3 is a partial schematic view of a water washing bath and an antioxidant bath in the water electroplating apparatus according to the embodiment of the present invention.

The reference numbers illustrate:

1. a discharging mechanism; 2. a material receiving mechanism; 3. a plating solution tank; 4. a trough body, 5, a main roller; 6. a conductive copper strip; 7. an anode plate; 8. wrapping the rubber and passing the rubber through a roller; 9. a metal ring; 10. a liquid return pipe; 11. a plating solution overflow tank; 12. a water overflow tank; 13. a water washing pool; 14. an anti-oxidation overflow tank; 15. an anti-oxidation pool; 16. a plating solution storage pool; 17. a pure water storage pool; 18. an antioxidant liquid storage pool; 19. a tension control device; 20. a tape-feeding and flattening device; 21. a film substrate;

101. pressing rollers are arranged on the washing liquid in the washing pool; 102. the water washing pool is filled into the submerged compression roller; 103. washing the lower roller of the pool liquid; 104. the effluent of the washing pool is pressed onto a roller; 105. the effluent of the water washing pool is pressed into a roller; 106. the anti-oxidation pond enters the liquid upper compression roller; 107. the anti-oxidation pool enters a submerged compression roller; 108. a lower roller of the oxidation-resistant pool liquid; 109. discharging liquid from the oxidation resisting pool and pressing the liquid; 110. discharging the liquid from the anti-oxidation pool and pressing the liquid into a lower roller; 111. the anti-oxidation pool enters the liquid upper conductive roller; 112. and the anti-oxidation pool enters the submerged conductive roller.

Detailed Description

Features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order to avoid unnecessarily obscuring the present invention; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

As shown in fig. 1, an embodiment of the present invention provides a water electroplating apparatus, including: the device comprises a material discharging mechanism 1, a material receiving mechanism 2 and a plating bath 3, wherein the material discharging mechanism 1 and the material receiving mechanism 2 are used for discharging and discharging the film base material 21 respectively, and the plating bath 3 is used for electroplating the film base material 21; the plating bath 3 is internally provided with: the main roller 5, the conductive copper strip 6 and two arc anode plates 7 with different radiuses on the outer sides of the main roller 5; the upper end and the lower end of the main roller 5 are metal rings 9, the metal rings 9 are connected through a plurality of metal supports, conductive copper strips 6 are correspondingly arranged on the outer sides of the metal rings 9, the number of the conductive copper strips 6 corresponds to that of the metal rings 9 one by one, an interlayer structure is formed between the conductive copper strips 6 and the film base material 21, and the conductive copper strips 6 are partially contacted with the metal rings 9 to form a unified conductor. In the electroplating process, the metal ring 9 plays a role in cathode conduction, so that the metal ring is also called a conducting ring, so that the conducting copper strip 6 conducts electricity to one side of the film base material 21, and the conducting ring conducts electricity to the other side of the film base material 21.

Specifically, a main roller 5 with a large diameter is arranged in a groove body 4 of the plating bath 3, the diameter is about 2 meters, two arc-shaped anode plates 6 with different radiuses are arranged on the outer side of the main roller 5 and respectively correspond to the front side and the back side of the thin film substrate, the conductive copper strip 6 can move circularly on the main roller 5 through the guide of the plurality of rubber coating rollers 8, and during electroplating, the conductive copper strip 6 and the thin film substrate 21 can move on the main roller 5 through the guide of the different rubber coating rollers 8, so that the movement paths of the conductive copper strip 6 and the thin film substrate 21 are the same and do not interfere with each other.

The embodiment of the utility model cancels the structure of the conductive roller, adopts the conductive copper strip 6 and the conductive ring to replace the realization of the conduction of the cathode, and the film base material 21 moves at the same speed on the surface of the insulated main roller 5 through a certain wrap angle, and the conductive copper strip 6 is matched to realize the conduction of the film base material 21 and simultaneously the surface of the main roller 5 does not generate copper plating, thereby avoiding the puncture or scratch of the film surface caused by the copper plating.

In some embodiments, the conductive copper strip 6 has a certain structure and size, for example, the width of the conductive copper strip 6 is 100mm, and the thickness is 5mm, as a use case of the limit condition, the width can be increased appropriately to achieve a larger contact surface with the thin film, and the thickness can be increased appropriately to achieve better rigidity and processing precision. The conductive film has the characteristics of one conductive surface and three insulating surfaces, the size of the conductive film is the same as the width of the conductive ring in width, the conductive film can not completely cover the conductive ring in the incoming material size and the film penetrating path, and preferably only covers 1/2 or 2/3 of the width of the conductive ring, so that the conductive ring, the conductive film and the conductive copper strip 6 form a sandwich structure, and the conductive ring is in direct contact conduction with the conductive copper strip 6 in the area of the conductive ring which is not covered by the conductive film, so that the conductive ring and the conductive copper strip 6 can simultaneously and respectively conduct electricity to the front side and the back side of the conductive film.

In some embodiments, the main roller 5 has a cage structure, that is, the upper and lower ends of the cage structure are metal rings 9 (or rings made of titanium material) with a certain smoothness, the metal rings 9 have a certain width, preferably 200mm, and the inner side surfaces of the metal rings 9 at the upper and lower ends are connected through a plurality of metal brackets. The metal support is preferably made of copper (for example, copper bar), and the metal support and the metal ring 9 form a cage-shaped structure, that is, the main roller 5 is formed by connecting the metal rings 9 at the upper end and the lower end through the copper bar, the copper bar serves as the support of the cage-shaped structure and also serves as a connecting conductor of the upper metal ring 9 and the lower metal ring 9 to achieve the purpose of current distribution, and the inner side of the metal ring 9 is rotatably connected with a ring-shaped rack of the servo motor in a welding mode.

In some embodiments, the annular rack is welded on the inner side surface of the metal ring 9, the plurality of metal supports are rigidly connected with the annular rack through the thread teeth, preferably, the metal rings 9 at the upper end and the lower end can be respectively welded with an annular chain, the rotation of the main roller 5 can also be realized by welding a chain on one metal ring 9, here, it can be understood that the annular rack is concentric with the metal ring 9 on the inner side of the metal ring 9, the copper rod is on the inner side of the metal ring 9 and not on the same plane with the metal ring 9, and the copper rod is connected with the annular rack through the thread teeth, so that the rigidity of the cage-shaped structure can be increased. The rack has certain size and material characteristics, preferably titanium, and the material can be selected from stainless steel of SUS316L or higher specification as an alternative to ensure corrosion resistance and sufficient service life in the plating solution.

In some embodiments, the water electroplating equipment further comprises a plurality of rubber-coated over rollers 8, the rubber-coated over rollers 8 are respectively arranged around the main roller 5 and outside the plating bath 3, the thin film substrate 21 and the conductive copper strip 6 are guided by the rubber-coated over rollers 8 to run on the main roller 5, and the main roller 4 and the rubber-coated over rollers 8 are both vertically arranged, so that the problem that the effective electroplating length of the film on a V-shaped running path is small in the conventional scheme is solved, the maximum effective electroplating length is realized on the shortest running film length, and the occupied area length of the equipment is shortened.

Specifically, a plurality of small-diameter rubber-coated rollers 8 are designed at the electroplating inlet of the main roller 5 in a matching way, and the purpose of the small-diameter rubber-coated rollers 8 is to guide and control the film base material 21 to form a certain wrap angle according to a certain path and then to run on the large-diameter main roller 5; the outer side of the tank body 4 is also provided with a plurality of rubber coating rollers 8, the conductive copper strip 6 forms a certain wrap angle through the guiding of the rubber coating rollers 8 and circularly walks on the main roller 5 and the tank body 4, and it needs to be noted that the conductive copper strip 6 and the thin film base material 21 are attached to the electroplating main roller 5 under the action of different rubber coating rollers 8 and walk, so that the walking paths of the conductive copper strip 6 and the thin film base material 21 on the main roller 5 are not interfered with each other.

In some embodiments, a plurality of liquid inlet pipes and a plurality of liquid return pipes 10 are disposed in the plating bath 3, a plurality of spray holes are distributed on the liquid inlet pipes, the plating solution flows in through the liquid inlet pipes and is sprayed out through the spray holes, the reacted plating solution enters the plating solution storage pool 16 through the liquid return pipes 10, and the plating solution in the plating solution storage pool 16 is pumped into the liquid inlet pipes through a diaphragm pump to realize circulation of the plating solution.

In some embodiments, a rinsing bath 13 is disposed behind the plating bath 3, and a rinsing bath inlet upper press roll 101, a rinsing bath inlet lower press roll 102, a rinsing bath lower roll 103, a rinsing bath outlet upper press roll 104, and a rinsing bath outlet lower press roll 105 are disposed in the rinsing bath 13.

In some embodiments, the upper pressing roller 101 for washing tank inlet liquid is attached to the surface of the lower pressing roller 102 for washing tank inlet liquid, the upper pressing roller 104 for washing tank outlet liquid is attached to the surface of the lower pressing roller 105 for washing tank outlet liquid, and the film base material 21 passes through the space between the upper pressing roller 101 for washing tank inlet liquid and the lower pressing roller 102 for washing tank inlet liquid, passes through the lower pressing roller 103 for washing tank outlet liquid, and passes through the space between the upper pressing roller 104 for washing tank outlet liquid and the lower pressing roller 105 for washing tank outlet liquid; two sides of the washing tank 10 are respectively provided with a water overflow tank 12.

In some embodiments, a washing tank liquid inlet pipe and a washing tank liquid outlet pipe are further arranged in the washing tank 13, a pure water storage tank 17 is arranged below the washing tank 13, and the pure water storage tank 17 is communicated with the washing tank liquid inlet pipe through a pipeline.

In the embodiment of the utility model, the upper pressing roller 101 for the washing tank inlet liquid, the lower pressing roller 102 for the washing tank inlet liquid, the upper pressing roller 104 for the washing tank outlet liquid and the lower pressing roller 105 for the washing tank outlet liquid are used together to cut the film base material 21, and simultaneously, the plating solution in the plating tank 3 at the front end and the pure water in the pure water storage tank 17 are prevented from being mixed in the circulation process of the washing solution in the washing tank 13 and the pure water in the washing tank 13.

In some embodiments, an oxidation-resistant tank 15 is further disposed behind the rinsing tank 13, and an oxidation-resistant tank inlet upper press roller 106, an oxidation-resistant tank inlet lower press roller 107, an oxidation-resistant tank outlet lower press roller 108, an oxidation-resistant tank outlet upper press roller 109, and an oxidation-resistant tank outlet lower press roller 110 are disposed in the oxidation-resistant tank 15.

An upper antioxidant pool liquid inlet press roll 106 is tightly attached to the surface of the lower antioxidant pool liquid inlet press roll 107, an upper antioxidant pool liquid outlet press roll 109 is tightly attached to the surface of the lower antioxidant pool liquid outlet press roll 110, and the film substrate 21 passes through the position between the upper antioxidant pool liquid inlet press roll 106 and the lower antioxidant pool liquid inlet press roll 107, passes through the lower antioxidant pool liquid outlet roll 108, and then passes through the position between the upper antioxidant pool liquid outlet press roll 109 and the lower antioxidant pool liquid outlet press roll 110; and an anti-oxidation overflow tank 14 is respectively arranged at two sides of the anti-oxidation tank 15.

In some embodiments, an antioxidant liquid inlet pipe and an antioxidant liquid outlet pipe are further disposed in the antioxidant pool 15, and an antioxidant liquid storage pool is disposed below the antioxidant pool 15 and is communicated with the antioxidant liquid inlet pipe.

In the embodiment of the utility model, the anti-oxidation tank liquid inlet upper press roll 106, the anti-oxidation tank liquid inlet lower press roll 107, the anti-oxidation tank liquid outlet upper press roll 109 and the anti-oxidation tank liquid outlet lower press roll 110 are matched together to cut the film base material 21, and simultaneously, the anti-oxidation liquid in the anti-oxidation tank is prevented from being mixed with the pure water in the front washing tank 13 in the circulation process of the anti-oxidation tank and the anti-oxidation liquid storage tank.

In some embodiments, the anti-oxidation overflow tank 14 at the liquid inlet end of the anti-oxidation tank 15 is provided with an anti-oxidation tank liquid inlet upper conductive roller 111 and an anti-oxidation tank liquid inlet lower conductive roller 112, the anti-oxidation tank liquid inlet upper conductive roller 111 and the anti-oxidation tank liquid inlet lower conductive roller 112 are arranged side by side, and the film substrate 21 sequentially and reversely bypasses the anti-oxidation tank liquid inlet upper conductive roller 111 and the anti-oxidation tank liquid inlet lower conductive roller 112 to enter the anti-oxidation tank 15. In the embodiment of the present invention, the anti-oxidation effect of the film base material 21 can be further improved by providing the anti-oxidation tank liquid-inlet upper conductive roller 111 and the anti-oxidation tank liquid-inlet lower conductive roller 112.

In some embodiments, the discharging mechanism 1 and the receiving mechanism 2 each include a tension control device 19 and a belt flattening device 20 for controlling the tension of the film substrate 21 during discharging and receiving. All the rollers in the embodiment of the utility model are vertically arranged, so that the problem that the effective electroplating length of the film on the V-shaped routing path is small in the conventional scheme is solved, the maximum effective electroplating length is realized on the shortest film running length, and the occupied area length of equipment is shortened.

The embodiment of the utility model cancels the structure of the conductive roller, adopts the conductive copper strip and the conductive ring to replace the realization of the conduction of the cathode, the film moves at the same speed on the surface of the insulated main roller through a certain wrap angle, and the conductive copper strip is matched to realize the conduction of the film and simultaneously the surface of the main roller does not generate copper plating, thereby avoiding the puncture or scratch of the film surface caused by the copper plating; according to the embodiment of the utility model, the film mainly wraps and moves on the surface of the main roller in the electroplating process, so that the tension on the film surface can be effectively reduced, the conductive copper strip and the film are both in the plating solution in the whole electroplating process, the heat dissipation problem when the conductive copper strip and the film are electrified is effectively solved, and the hole burning problem is avoided; the embodiment of the utility model adopts the design of the main roller, realizes that the whole electroplating process is finished in one plating tank, simplifies the structure of electroplating equipment and effectively improves the production efficiency.

In the description of the present invention, it should be noted that the terms "upper, lower, inner and outer" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms first, second, or third are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The terms "mounted, connected and connected" in the present invention are to be understood broadly, unless otherwise explicitly specified or limited, for example: can be fixedly connected, detachably connected or integrally connected; they may be mechanically, electrically, or directly connected, or indirectly connected through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

While the utility model has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the utility model not be limited to the particular embodiments disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. A water electroplating apparatus, characterized by comprising: plating bath (3), be provided with home roll (5), electrically conductive copper strips (6) and set up two different convex anode plates (7) in the outside radius of home roll (5) in cell body (4) of plating bath (3), the upper and lower both ends of home roll (5) are metal ring (9), metal ring (9) are connected through a plurality of metal support, what the outside of metal ring (9) corresponds is provided with electrically conductive copper strips (6), electrically conductive copper strips (6) with the contact of metal ring (9) part forms unified conductor.

2. The water electroplating apparatus according to claim 1, wherein: the device is characterized by further comprising a plurality of rubber coating rollers (8), wherein the rubber coating rollers (8) are arranged on the periphery of the main roller (5) and on the outer side of the groove body (4) respectively, the film base material (21) and the conductive copper strip (6) are guided by the rubber coating rollers (8) to move on the main roller (5), and the main roller (5) and the rubber coating rollers (8) are arranged vertically.

3. The water electroplating apparatus according to claim 1, wherein: the inner side surface of the metal ring (9) is respectively connected with the plurality of metal brackets.

4. The water electroplating apparatus according to claim 3, wherein: the metal ring is characterized by further comprising an annular rack, the annular rack is welded on the inner side face of the metal ring (9), and the plurality of metal supports are rigidly connected with the annular rack through screw teeth.

5. The water electroplating apparatus according to any one of claims 1 to 4, wherein: the plating bath circulating system is characterized in that a plurality of liquid inlet pipes and a plurality of liquid return pipes (10) are arranged in the plating bath pool (3), a plurality of spray holes are distributed on the liquid inlet pipes, the plating bath flows in through the liquid inlet pipes and is sprayed out through the spray holes, the reacted plating bath enters the plating bath storage pool (16) through the liquid return pipes (10), and the plating bath in the plating bath storage pool (16) is pumped into the liquid inlet pipes through a magnetic pump, so that the circulation of the plating bath is realized.

6. The water electroplating apparatus according to claim 5, wherein: a washing tank (13) is arranged behind the plating tank (3), and a washing tank inlet upper pressing roller (101), a washing tank inlet lower pressing roller (102), a washing tank lower roller (103), a washing tank outlet upper pressing roller (104) and a washing tank outlet lower pressing roller (105) are arranged in the washing tank (13);

the upper pressing roller (101) for the inflow liquid of the washing pool is tightly attached to the surface of the lower pressing roller (102) for the inflow liquid of the washing pool, the upper pressing roller (104) for the outflow liquid of the washing pool is tightly attached to the surface of the lower pressing roller (105) for the outflow liquid of the washing pool, and the film base material (21) passes through the space between the upper pressing roller (101) for the inflow liquid of the washing pool and the lower pressing roller (102) for the inflow liquid of the washing pool, passes through the lower roller (103) for the outflow liquid of the washing pool, and passes through the space between the upper pressing roller (104) for the outflow liquid of the washing pool and the lower pressing roller (105) for the outflow liquid of the washing pool;

and water overflow pools (12) are respectively arranged on two sides of the washing pool (13).

7. The water electroplating apparatus according to claim 6, wherein: a washing tank liquid inlet pipe and a washing tank liquid outlet pipe are further arranged in the washing tank (13), a pure water storage tank (17) is arranged below the washing tank (13), and the pure water storage tank (17) is communicated with the washing tank liquid inlet pipe through a pipeline.

8. The water electroplating apparatus according to claim 7, wherein: an anti-oxidation pond (15) is further arranged behind the washing pond (13), and an anti-oxidation pond liquid inlet upper press roller (106), an anti-oxidation pond liquid inlet lower press roller (107), an anti-oxidation pond liquid outlet lower press roller (108), an anti-oxidation pond liquid outlet upper press roller (109) and an anti-oxidation pond liquid outlet lower press roller (110) are arranged in the anti-oxidation pond (15);

the anti-oxidation pond liquid inlet upper compression roller (106) is tightly attached to the surface of the anti-oxidation pond liquid inlet lower compression roller (107), the anti-oxidation pond liquid outlet upper compression roller (109) is tightly attached to the surface of the anti-oxidation pond liquid outlet lower compression roller (110), and the film base material (21) penetrates through the position between the anti-oxidation pond liquid inlet upper compression roller (106) and the anti-oxidation pond liquid inlet lower compression roller (107) and penetrates through the position between the anti-oxidation pond liquid outlet upper compression roller (109) and the anti-oxidation pond liquid outlet lower compression roller (110) after passing through the anti-oxidation pond liquid lower roller (108);

and the two sides of the anti-oxidation pond (15) are respectively provided with an anti-oxidation overflow pond (14).

9. The water electroplating apparatus according to claim 8, wherein: an antioxidant liquid inlet pipe and an antioxidant liquid outlet pipe are further arranged in the antioxidant pool (15), an antioxidant liquid storage pool (18) is arranged below the antioxidant pool (15), and the antioxidant liquid storage pool (18) is communicated with the antioxidant liquid inlet pipe.

10. The water electroplating apparatus according to claim 1, wherein: the device comprises a plating bath (3), and is characterized in that a discharging mechanism (1) and a receiving mechanism (2) are arranged on two sides of the plating bath (3), wherein the discharging mechanism (1) and the receiving mechanism (2) respectively comprise a tension control device (19) and a belt flattening device (20) and are used for controlling the tension of a film substrate (21) during discharging and receiving.