CN214991962U - Water electroplating equipment for electroplating processing of surface of flexible film substrate - Google Patents

Abstract

The utility model discloses a water and electricity plating equipment for processing is electroplated on flexible film substrate surface among the electroplating technology field, including being used for carrying out the plating bath of electroplating to the coating film, be equipped with insulating home roll in the plating bath, the coating film is worn out by the plating bath after bypassing the home roll, and the outside of home roll is equipped with conductive band, and conductive band hugs closely in the outside of the coating film of part, and the periphery of home roll is equipped with curved anode plate, and the interval has the space between anode plate and the home roll, anode plate and the anodal of electroplating the power be connected, and conductive band is connected with the negative pole of electroplating the power. The utility model overcomes the copper plating of conductive roller leads to the film to be punctured or the surface is easily produced the fold or the defect of deformation by fish tail, film among the traditional water electroplating equipment, has cancelled the structure of conductive roller to avoid the copper plating to puncture or the fish tail that produces the membrane face, simultaneously in electroplating process, the film cladding is on the main roller surface, effectively reduces the tension that the membrane face received.

Description

Water electroplating equipment for electroplating processing of surface of flexible film substrate

Technical Field

The utility model relates to an electroplate technical field, specific theory relates to a water electroplating device that is used for electroplating process of flexible film substrate surface.

Background

With the development of the technology, the demand of coating on the surface of the flexible film substrate is more and more increased. In industrial production, water electroplating equipment is generally used for electroplating the flexible film substrate, namely, a water plating solution is prepared according to the requirements of various bodies and coatings, so that the flexible film substrate can be finished in a short time by the water plating solution. In the conventional electroplating apparatus, a plurality of plating tanks for supplying an electroplating solution are generally provided, an anode is provided in the tank so as to face an electroplating surface functioning as a cathode, and the plurality of plating tanks are arranged side by side in a conveying direction of a flexible film substrate; the plating apparatus is provided with a power supply part for supplying power to each plating tank and a continuous conveying and tensioning mechanism for the flexible film base material, and the power supply amount of each plating tank is controlled to increase the power supply amount of each plating tank in turn according to the supply sequence of the flexible film base material, so that a uniform and good plating film can be formed continuously.

However, due to the design defects of the existing film plating equipment, a copper plating layer is easily formed on the surface of the conductive roller, the copper plating layer punctures or scratches the film, meanwhile, the film advances in an up-and-down V shape, and due to the numerous rollers, the tension is difficult to control, and the flexible film is easy to wrinkle or deform, so that the yield of the conductive film product is greatly reduced, and the overall production efficiency of an enterprise is seriously influenced.

The above-mentioned drawbacks are worth solving.

Disclosure of Invention

In order to overcome the defects of the prior art, the utility model provides a water electroplating device for electroplating the surface of a flexible film substrate.

The utility model discloses technical scheme as follows:

a water electroplating device for electroplating processing of the surface of a flexible film substrate comprises a plating solution pool for electroplating a plated film, and is characterized in that an insulated main roller is arranged in the plating solution pool, the plated film bypasses the main roller and then penetrates out of the plating solution pool, and a conductive belt is arranged on the outer side of the main roller and clings to the outer side of part of the plated film;

an arc anode plate is arranged on the periphery of the main roller, and a gap is formed between the anode plate and the main roller;

the anode plate is connected with the positive electrode of the electroplating power supply, and the conductive belt is connected with the negative electrode of the electroplating power supply.

According to the above scheme the utility model discloses, its characterized in that, the main roll include the main roll body and the cladding in the peripheral main roll rubber coating layer of main roll body.

According to the scheme, the utility model discloses its characterized in that, the conduction band is in the distance of walking outside the main roll is less than the coating film is in the distance of walking outside the main roll.

According to the scheme, the utility model discloses its characterized in that, the central angle that the anode plate corresponds is less than the coating film is in the central angle that the membrane distance corresponds is walked outward to the home roll.

According to the above scheme the utility model discloses, its characterized in that, be equipped with first home roll and second home roll in the plating bath pond, the coating film is walked around again behind the first home roll the second home roll, and by the plating bath pond is worn out.

Furthermore, a plurality of first rubber coating rollers are arranged in the plating solution pool, the first rubber coating rollers surround the periphery of the first main roller, and a first conductive belt sequentially surrounds the plurality of first rubber coating rollers to form a ring; and a plurality of second rubber coating passing rollers are arranged in the plating solution pool, the second rubber coating passing rollers surround the periphery of the second main roller, and a second conductive belt sequentially surrounds the plurality of second rubber coating passing rollers to form a ring.

The plating bath pool is internally provided with a plurality of liquid inlet pipes which are communicated with the plating bath pool through liquid inlet pipelines, and the plating bath pool is also provided with an overflow pipeline which is communicated with the plating bath pool through a liquid return pipe.

According to the above scheme the utility model discloses, its characterized in that, this water electroplating device still includes washing pond and anti-oxidant pond, the coating film by the plating bath pond passes through in proper order after wearing out the washing pond anti-oxidant pond.

Furthermore, a lower washing tank liquid roller is arranged inside the washing tank, and the coating film entering the washing tank bypasses the lower washing tank liquid roller and then penetrates out of the washing tank.

Furthermore, an anti-oxidation pond liquid lower roller is arranged inside the anti-oxidation pond, and a coated film entering the anti-oxidation pond bypasses the anti-oxidation pond liquid lower roller and then penetrates out of the anti-oxidation pond.

According to the scheme, the utility model has the advantages that the cathode is electrically conducted through the conductive belt, the structural design of the conductive roller is cancelled, the phenomenon that the conductive roller is punctured or scratched due to copper deposition during copper plating is avoided, meanwhile, the whole electroplating process can be realized in the plating bath, the structure of the whole water and electricity electroplating equipment is simplified, and the occupied space of the equipment is reduced; the utility model discloses a coating film reduces the coating film and electroplates the tension that the in-process face received at the main roll surface cladding motion for the coating film is evenly electroplated, avoids the coating film to produce fold or warp.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a plating bath portion of the present invention;

FIG. 3 is a schematic view of a lower surface coating portion of the coating bath;

FIG. 4 is a schematic view of the dashed box portion of FIG. 3;

FIG. 5 is a schematic view of the upper surface coating portion of the bath;

FIG. 6 is a schematic view of the reclaimed water washing tank and the oxidation resistant tank of the present invention;

fig. 7 is a schematic view of the middle rolling part of the present invention.

In the figure, 11-pay-off reel; 12-a material collecting roll;

20-film coating;

311-plating bath; 312-a bath storage pool; 313-an isopipe; 321-a first main roller; 3211-main roll body; 3212-main roller rubber coating layer; 322-a second main roller; 331-a first conductive strip; 332-a second conductive band; 341-first anode plate; 342-a second anode plate; 351-first wrapping glue and passing through rollers; 352-second wrapping glue and roller; 361-first liquid squeezing upper press roll; 362-first squeeze liquid lower roll;

411-a water washing tank; 412-a pure water storage tank; 42-washing the lower roller of the pool liquid; 431-a second liquid squeezing upper press roller; 432-a second squeeze liquid lower roll; 44-a shower head;

511-antioxidant pool; 512-antioxidant liquid storage pool; 52-anti-oxidation pond liquid lower roller; 531-third liquid squeezing upper press roll; 532-third liquid-squeezing lower roll;

60-baking oven;

71-a nip roll; 72-edge cutter.

Detailed Description

The invention is further described with reference to the following figures and embodiments:

as shown in figure 1, the water electroplating equipment for electroplating the surface of the flexible film substrate comprises a material discharging roll 11 and a material receiving roll 12, wherein the material discharging roll 11 discharges the non-electroplated coating film 20, and the material receiving roll 12 receives the electroplated coating film 20. The water electroplating equipment comprises a plating solution pool 311 with a built-in plating solution, a water washing pool 41 with a built-in pure water, an anti-oxidation pool 511 with a built-in anti-oxidation solution and an oven 60, wherein an unreeled coating film 20 sequentially passes through the plating solution pool 311, the water washing pool 41, the anti-oxidation pool 511 and the oven 60 and then is reeled on a material receiving reel 12, the plating solution pool 311 is used for electroplating the coating film 20, the water washing pool 41 is used for washing the electroplated coating film 20, the anti-oxidation pool 511 is used for carrying out anti-oxidation treatment on the electroplated coating film 20, and the oven 60 is used for baking and drying the coating film 20.

Preferably, all the rollers are horizontally and parallelly arranged along the traveling direction of the coating film 20, so that the tension of the coating film 20 is more uniform in the traveling process.

As shown in fig. 1 to 5, an insulating main roller with a large diameter is arranged in the plating solution tank 311, the plated film 20 passes through the plating solution tank 311 after bypassing the main roller, and a conductive band is arranged on the outer side of the main roller and clings to the outer side of part of the plated film 20 to realize the conduction of the plated film 20; the periphery of the main roller is provided with an arc anode plate, and a gap is arranged between the anode plate and the main roller. The anode plate is connected with the positive electrode of an electroplating power supply (not shown in the figure, the same below), the conductive belt is connected with the negative electrode of the electroplating power supply, so that the anode plate is used as an electroplating anode, the coating film connected with the conductive belt is used as an electroplating cathode, the plating solution is used as an electroplating medium, and the surface of the coating film is electroplated through an electroplating process.

The utility model discloses a conductive band replaces traditional conducting roller to realize the electrically conductive effect of negative pole, avoids conducting roller electrified production copper deposit in the design of traditional conducting roller, and then causes puncture or the fish tail of coating film. The utility model can effectively increase the electroplating length by forming the arc-shaped film-running path in the plating bath 311 through the plating film 20, solve the problem that the electroplating length of the V-shaped film-running path in the conventional solution is small, realize the maximum effective electroplating length on the film-running length of the opposite end, and reduce the occupied area length of the equipment; in addition, the surface of the main roller is electroplated, so that the electroplating process is in the plating solution, the heat dissipation problem when the conductive belt and the plated film are electrified is solved, and hole burning is avoided.

Preferably, the plating solution is a copper plating conductive solution for plating the plating film 20 with copper. The conductive belt is a conductive copper belt, so that new metal impurities can be prevented from being introduced.

Preferably, the conductive tape is positioned at the periphery of the edge of the plated film, and the part of the plated film covered by the conductive tape is cut off as a waste edge after the copper plating is finished. In this embodiment, 2 to 3 conductive bands are arranged in the plating bath 311, so that the plating film 20 is uniformly charged and plated with copper, and two copper plating films are formed after the plating film covered by the middle conductive band is trimmed.

Preferably, the circle center of the arc formed by the anode plate coincides with the circle center of the main roller, so that the distances between the arc formed by the anode plate and the surface of the main roller are equal, the potentials at all positions are equal when the plating film is plated, and the thickness of plated copper of the plating film is consistent.

The periphery of the main roller is provided with a plurality of rubber coating rollers with small diameters, and the rubber coating rollers are designed to ensure that the coating film 20 can form a certain wrap angle according to a certain path and can move on the main roller. In the invention, the distance of the conductive belt outside the main roller is less than the distance of the plated film outside the main roller (namely the central angle corresponding to the conductive belt on the surface of the main roller is less than the central angle corresponding to the plated film on the surface of the main roller), so that the plated film on the surface of the main roller is charged after being uniformly stressed, and the electroplating is ensured to be more uniform; the central angle corresponding to the anode plate is smaller than the central angle corresponding to the distance of the film coating outside the main roller, so that the uniform film coating can be carried out for electroplating, and the electroplating effect is ensured. Preferably, the central angle corresponding to the belt travelling distance of the conductive belt on the surface of the main roller is equal to the central angle corresponding to the anode plate, namely, the charged part of the coating can carry out electroplating reaction with the corresponding anode plate.

The plating bath 311 is internally provided with a first main roller 321 and a second main roller 322, and the plated film 20 bypasses the first main roller 321, reversely bypasses the second main roller 322 and passes out of the plating bath 311. Take first main roller 321 for the example to explain, the main roller includes main roller roll body 3211 and cladding in the peripheral main roller rubber coating layer 3212 of main roller roll body 3211, the utility model discloses well coating film 20 is through certain cornerite at the main roller surface with the main roller with fast motion, and metal ion can be avoided at the deposit on main roller surface to the cooperation conduction band, and then avoid the damage of main roller to the coating film.

Specifically, a first conductive strip 331 is arranged outside the first main roller 321, the first conductive strip 331 is closely attached to the plated film 20 on the surface of the first main roller 321, an arc-shaped first anode plate 341 is arranged on the periphery of the first main roller 321, and the first anode plate 341 is opposite to the first conductive strip 331 on the surface of the first main roller 321. Preferably, a plurality of first glue coating rollers 351 are arranged in the plating solution tank 311, the first glue coating rollers 351 surround the periphery of the first main roller 321, and the first conductive belt 331 sequentially bypasses the plurality of first glue coating rollers 351 to form a ring shape.

The first anode plate 341 is used as a plating anode, the plating surface which is in contact with the first conductive strip 331 and faces the first anode plate 341 is used as a plating cathode, and the plating solution is used as a medium to form a plating loop, so that the plating side which faces the first anode plate 341 is plated.

And a second conductive strip 332 is arranged on the outer side of the second main roller 322 corresponding to the first main roller 321, the second conductive strip 332 is closely attached to the plated film 20 on the surface of the second main roller 322, an arc-shaped second anode plate 342 is arranged on the periphery of the second main roller 322, and the second anode plate 342 is opposite to the second conductive strip 332 on the surface of the second main roller 322. Preferably, a plurality of second wrapping glue rollers 352 are arranged in the plating solution tank 311, the second wrapping glue rollers 352 surround the periphery of the second main roller 322, and the second conductive belt 332 sequentially bypasses the plurality of second wrapping glue rollers 352 to form a ring.

When the plated film 20 passes through the outer side of the second main roller 322, the surface of the first main roller 321, which faces the first anode plate 341, is attached to the surface of the second main roller 322, the surface of the first main roller 321, which is attached to the first main roller 321, corresponds to the second anode plate 342 on the second main roller 322, so that the second anode plate 342 is used as a plating anode, the surface of the plated film, which is in contact with the second conductive strip 332 and faces the second anode plate 342, is a plating cathode, and the plating solution is a medium, thereby forming a plating loop and further plating the plated film side facing the second anode plate 342.

In order to ensure the electroplating effect, the second anode plate 342 and the second conductive strip 332 corresponding to the second main roller 322 are correspondingly configured and arranged, and the tape running path corresponds to the first main roller 321.

In the present invention, the lower side of the plating bath 311 is provided with an overflow groove 313, the upper portion of the first conductive band 331 is located in the plating bath 311, the lower portion thereof is located in the overflow groove 313, and the plating bath overflowing from the plating bath 311 is collected through the overflow groove 313. In a preferred embodiment, the end of the first conductive band 331 passes through the bottom of the plating bath 311, enters the plating bath 311, is guided by the first glue coating roller 351, is attached to the first main roller 321 and the surface of the plated film 20, then passes through the top of the plating bath 311, and extends into the overflow groove 313 to form a loop with the other end of the first conductive band 331; the end of the second conductive band 332 extends into the plating bath 311 from the upper end of the plating bath 311, is guided by the second wrapping glue roller 352 and then is attached to the second main pipe 322 and the surface of the plated film 20, and then the end penetrates out of the plating bath 311 and is connected with the other end of the second conductive band 332 to form a loop.

The utility model, through the first main roller 321, the first conductive band 331 located at the periphery of the first main roller 321, and the first anode plate 341, enables the plating bath 311 to electroplate one side (lower side in this embodiment) of the plated film 20 facing the first anode plate 341; the plating solution tank 311 is enabled to plate one side (the upper side in the embodiment) of the plated film 20 facing the second anode plate 342 through the second main roller 322, the second conductive strip 332 positioned at the periphery of the second main roller 322 and the second anode plate 342; thereby completing the electroplating process of the upper side and the lower side of the coating film. Additionally, the utility model discloses a film is at the cladding motion on first main roll 321 and second main roll 322 surface, can effectively reduce the tension that the coating film face received, avoids flexible film to produce fold or warp, and then increases the yields of conductive film product.

A plurality of liquid inlet pipes (not shown in the figures, the same below) are arranged in the plating bath 311, the liquid inlet pipes are communicated with the plating solution storage pool 312 through liquid inlet pipes (the plating solution storage pool 312 is preferably arranged at the lower side of the plating bath 311), an overflow pipe (not shown in the figures, the same below) is also arranged on the plating bath 311, and the overflow pipe is communicated with the plating solution storage pool 312 through a liquid return pipe (not shown in the figures, the same below). The plating solution in the plating solution storage pool 312 flows into the plating solution pool through the liquid inlet pipe, and the reacted plating solution flows into the plating solution storage pool 312 through the overflow pipe, the liquid return pipe. Preferably, a plurality of spray holes (not shown in the figure, the same applies below) are uniformly distributed on the liquid inlet pipe, and the plating solution can uniformly enter the plating bath 311 through the spray holes, so that the concentration of the plating solution in the plating bath is ensured to be uniform, and the plating on the surface of the plated film is more uniform.

In order to realize circulation of the plating solution, a diaphragm pump and a filter (not shown in the figures) are arranged on the liquid inlet pipeline in the embodiment, and the diaphragm pump pumps the plating solution in the plating solution storage tank 312 into the liquid inlet pipe through the filter, so as to realize circulation of the plating solution. Preferably, the diaphragm pump and the liquid inlet pipe are connected with an electroplating power supply for adjusting the current density, the electroplating power supply is communicated with the control system, and the control system controls the current density of the electroplating pool by controlling the current magnitude of the electroplating power supply.

Preferably, a first liquid squeezing roller set is arranged at the liquid outlet end of the plating liquid tank 311, and the plating film 20 penetrating out of the plating liquid tank 311 is subjected to liquid cutting through the first liquid squeezing roller set. Specifically, the first squeeze roll group includes a first squeeze upper roll 361 and a first squeeze lower roll 362 which are in clearance fit, and the coating film 20 passes through between the first squeeze upper roll 361 and the first squeeze lower roll 362. The first squeeze upper roller 361 and the first squeeze lower roller 362 cooperate with each other so that the plating solution in the plating solution tank 311 circulates in the plating solution tank 311 and the plating solution storage tank 312 without mixing with pure water located at the rear side of the plating solution tank 311.

In this embodiment, a plating solution tank 211 is provided in the water electroplating apparatus, 2 main rollers (including a first main roller 321 and a second main roller 322) are provided in the plating solution tank 311, and the production speed of the electroplating apparatus is configured by increasing or decreasing the angle of the main roller diameter and the angle of the film-forming angle of the plated film on the main roller, the number of plates of the anode plate corresponding to the plated film, and the gradient configuration of the anode plate current. The greater the required production speed, the greater the main roll diameter.

As shown in fig. 1 and 6, along the coating processing line, a washing tank 41 is disposed at the rear side of the plating tank 311, a washing tank inlet pipe and a washing tank outlet pipe (both not shown) are disposed in the washing tank 41, the washing tank inlet pipe is communicated with a water outlet of the pure water storage tank 412 (the pure water storage tank 412 is preferably disposed at the lower side of the washing tank 41), and the washing tank outlet pipe is communicated with a water inlet of the pure water storage tank 412.

The lower washing tank liquid roller 42 is arranged in the washing tank 41 in this embodiment, the plated film entering the washing tank 41 bypasses the lower washing tank liquid roller 42 and then is discharged from the washing tank 41, and the plated film 20 after being plated bypasses the lower washing tank liquid roller 42, so that the plated film 20 positioned at the lower part of the washing tank liquid is in a V-shaped film running.

Preferably, the liquid outlet end of the washing tank 41 is provided with a second liquid squeezing roller set, and the plating film 20 which penetrates out of the washing tank 41 is subjected to liquid cutting through the second liquid squeezing roller set. Specifically, the second squeeze roll group comprises a second squeeze upper roll 431 and a second squeeze lower roll 432 which are in clearance fit, and the coating film 20 penetrates through the space between the second squeeze upper roll 431 and the second squeeze lower roll 432. The second squeeze upper roller 431 and the second squeeze lower roller 432 are matched with each other so that the pure water in the washing tank circulates in the washing tank 41 and the pure water storage tank 412 without being mixed with the antioxidant liquid at the rear side of the washing tank 41.

Preferably, a shower head 44 is provided in the rinsing bath 41, and the plating film passing through the rinsing bath 41 is rinsed by the shower head 44. Specifically, a pair of first spray headers is arranged on the front side of the lower liquid roller 42 of the washing tank, and the plated film passes through the first spray headers and is sprayed by the first spray headers and then extends to the lower liquid roller 42 of the washing tank; a pair of first lower washing tank liquid rollers is arranged at the rear side of the lower washing tank liquid rollers 42, and a coating film bypassing the lower washing tank liquid rollers 42 passes through the second spray header and is sprayed by the second spray header.

As shown in fig. 1 and 6, along the coating process line, an anti-oxidation tank 511 is disposed at the rear side of the washing tank 41, an anti-oxidation tank liquid inlet pipe and an anti-oxidation tank liquid outlet pipe (not shown) are disposed in the anti-oxidation tank 511, the anti-oxidation tank liquid inlet pipe is communicated with the water outlet of the anti-oxidation liquid storage tank 512, and the anti-oxidation tank liquid outlet pipe is communicated with the water inlet of the anti-oxidation liquid storage tank 512.

An anti-oxidation pond liquid lower roller 52 is arranged in the anti-oxidation pond 511, the coating film 20 entering the anti-oxidation pond 511 bypasses the anti-oxidation pond liquid lower roller 52 and then is discharged from the anti-oxidation pond 511, and the coating film 20 after washing bypasses the anti-oxidation pond liquid lower roller 52, so that the coating film at the lower part of the anti-oxidation pond liquid is in a V shape.

Preferably, a third liquid squeezing roller set is arranged at the liquid outlet end of the oxidation resisting pool 511, and the plating film 20 which penetrates out of the oxidation resisting pool 511 is subjected to liquid cutting through the third liquid squeezing roller set. Specifically, the third squeeze roll group includes a third squeeze upper roll 531 and a third squeeze lower roll 532 in clearance fit, and the coating film 20 passes through between the third squeeze upper roll 531 and the third squeeze lower roll 532. The third squeezing upper press roll 531 and the third squeezing lower press roll 532 are matched with each other, so that the antioxidant liquid in the antioxidant pool 511 circulates in the antioxidant pool 511 and the antioxidant liquid storage pool 512, and cannot overflow into the rear equipment.

The utility model discloses a washing pond 41 and anti-oxidant pond 511 have realized washing and anti-oxidant to coating film 20 respectively, can avoid the intermixing and influence between the various liquid simultaneously, and can realize the cyclic utilization of various liquid, have saved the liquid cost.

As shown in fig. 1 and 7, along the coating process line, an flattening roller 71 is disposed at the rear side of the oven 60, an edge trimmer 72 for trimming the edge of the coating with uneven thickness is disposed at the flattening roller 71, the edge trimmer 72 is used for trimming the coating covered by the conductive tape, and also can directly trim other portions to be trimmed, and the trimmed waste materials at the two sides of the coating are wound by a waste material winding roller (not shown).

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.

The above exemplary description of the present invention is made in conjunction with the accompanying drawings, and it is obvious that the present invention is not limited by the above manner, and various improvements made by the method concept and technical solution of the present invention or by directly applying the concept and technical solution of the present invention to other occasions without improvement are all within the protection scope of the present invention.

Claims (10)

1. A water electroplating device for electroplating processing of the surface of a flexible film substrate comprises a plating solution pool for electroplating a plated film, and is characterized in that an insulated main roller is arranged in the plating solution pool, the plated film bypasses the main roller and then penetrates out of the plating solution pool, and a conductive belt is arranged on the outer side of the main roller and clings to the outer side of part of the plated film;

an arc anode plate is arranged on the periphery of the main roller, and a gap is formed between the anode plate and the main roller;

the anode plate is connected with the positive electrode of the electroplating power supply, and the conductive belt is connected with the negative electrode of the electroplating power supply.

2. The water electroplating apparatus for electroplating processing on the surface of the flexible film substrate according to claim 1, wherein the main roller comprises a main roller body and a main roller rubber coating layer coated on the periphery of the main roller body.

3. The apparatus of claim 1, wherein the distance the conductive strip travels outside the main roller is less than the distance the coating travels outside the main roller.

4. The water electroplating apparatus according to claim 1, wherein the central angle of the anode plate is smaller than the central angle of the plating film at the distance from the main roller.

5. The water electroplating apparatus for electroplating processing on the surface of a flexible film substrate according to claim 1, wherein a first main roller and a second main roller are arranged in the plating solution tank, and the plated film bypasses the first main roller, reversely bypasses the second main roller and passes out of the plating solution tank.

6. The water electroplating equipment for electroplating processing on the surface of the flexible film substrate according to claim 5, wherein a plurality of first rubber coating rollers are arranged in the plating solution pool, the first rubber coating rollers surround the periphery of the first main roller, and a first conductive belt sequentially surrounds the plurality of first rubber coating rollers to form a ring shape; and a plurality of second rubber coating passing rollers are arranged in the plating solution pool, the second rubber coating passing rollers surround the periphery of the second main roller, and a second conductive belt sequentially surrounds the plurality of second rubber coating passing rollers to form a ring.

7. The water electroplating equipment for electroplating processing on the surface of the flexible film substrate as claimed in claim 1, wherein a plurality of liquid inlet pipes are arranged in the plating solution pool, the liquid inlet pipes are communicated with a plating solution storage pool through liquid inlet pipes, an overflow pipe is further arranged on the plating solution pool, and the overflow pipe is communicated with the plating solution storage pool through a liquid return pipe.

8. The water electroplating equipment for electroplating processing of the surface of the flexible film substrate as claimed in claim 1, further comprising a water washing pool and an anti-oxidation pool, wherein the plating film passes through the water washing pool and the anti-oxidation pool in sequence after passing out of the plating pool.

9. The water electroplating equipment for electroplating processing on the surface of the flexible film base material as claimed in claim 8, wherein the inside of the washing tank is provided with a washing tank submerged roller, and a coating entering the washing tank bypasses the washing tank submerged roller and then passes out of the washing tank.

10. The water electroplating apparatus for electroplating processing on the surface of a flexible film substrate according to claim 8, wherein an anti-oxidation pond submerged roller is arranged inside the anti-oxidation pond, and a coated film entering the anti-oxidation pond bypasses the anti-oxidation pond submerged roller and then passes out of the anti-oxidation pond.

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